JP2003027280A5 - - Google Patents

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Publication number
JP2003027280A5
JP2003027280A5 JP2001218343A JP2001218343A JP2003027280A5 JP 2003027280 A5 JP2003027280 A5 JP 2003027280A5 JP 2001218343 A JP2001218343 A JP 2001218343A JP 2001218343 A JP2001218343 A JP 2001218343A JP 2003027280 A5 JP2003027280 A5 JP 2003027280A5
Authority
JP
Japan
Prior art keywords
plating
substrate
space
unit
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001218343A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003027280A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001218343A priority Critical patent/JP2003027280A/ja
Priority claimed from JP2001218343A external-priority patent/JP2003027280A/ja
Priority to US10/483,883 priority patent/US20040237896A1/en
Priority to TW091115893A priority patent/TW554396B/zh
Priority to PCT/JP2002/007247 priority patent/WO2003009343A2/en
Priority to CNB028143809A priority patent/CN1280872C/zh
Priority to KR10-2004-7000624A priority patent/KR20040017306A/ko
Publication of JP2003027280A publication Critical patent/JP2003027280A/ja
Publication of JP2003027280A5 publication Critical patent/JP2003027280A5/ja
Pending legal-status Critical Current

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JP2001218343A 2001-07-18 2001-07-18 めっき装置 Pending JP2003027280A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2001218343A JP2003027280A (ja) 2001-07-18 2001-07-18 めっき装置
US10/483,883 US20040237896A1 (en) 2001-07-18 2002-07-17 Plating apparatus
TW091115893A TW554396B (en) 2001-07-18 2002-07-17 Plating apparatus
PCT/JP2002/007247 WO2003009343A2 (en) 2001-07-18 2002-07-17 Plating apparatus
CNB028143809A CN1280872C (zh) 2001-07-18 2002-07-17 电镀装置
KR10-2004-7000624A KR20040017306A (ko) 2001-07-18 2002-07-17 도금장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001218343A JP2003027280A (ja) 2001-07-18 2001-07-18 めっき装置

Publications (2)

Publication Number Publication Date
JP2003027280A JP2003027280A (ja) 2003-01-29
JP2003027280A5 true JP2003027280A5 (https=) 2005-04-07

Family

ID=19052532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001218343A Pending JP2003027280A (ja) 2001-07-18 2001-07-18 めっき装置

Country Status (6)

Country Link
US (1) US20040237896A1 (https=)
JP (1) JP2003027280A (https=)
KR (1) KR20040017306A (https=)
CN (1) CN1280872C (https=)
TW (1) TW554396B (https=)
WO (1) WO2003009343A2 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3979464B2 (ja) * 2001-12-27 2007-09-19 株式会社荏原製作所 無電解めっき前処理装置及び方法
US7128823B2 (en) 2002-07-24 2006-10-31 Applied Materials, Inc. Anolyte for copper plating
TWI265216B (en) * 2003-04-18 2006-11-01 Applied Materials Inc Multi-chemistry plating system
JP4295032B2 (ja) * 2003-07-22 2009-07-15 大日本スクリーン製造株式会社 めっき装置
US7531634B2 (en) * 2004-12-03 2009-05-12 University Of Pittsburgh Bladder matrix protein peptides and methods of detection of bladder cancer
JP4519037B2 (ja) * 2005-08-31 2010-08-04 東京エレクトロン株式会社 加熱装置及び塗布、現像装置
KR100809594B1 (ko) 2006-09-12 2008-03-04 세메스 주식회사 척킹부재 및 이를 포함하는 스핀헤드
KR101367898B1 (ko) * 2007-05-17 2014-02-26 위순임 플라즈마 감금 장벽 및 이를 구비한 기판 처리 시스템 및방법
KR20110051588A (ko) * 2009-11-10 2011-05-18 삼성전자주식회사 기판 도금 장치 및 방법
GB201021326D0 (en) * 2010-12-16 2011-01-26 Picofluidics Ltd Electro chemical deposition apparatus
US20140220777A1 (en) * 2013-02-05 2014-08-07 International Business Machines Corporation Processing system for combined metal deposition and reflow anneal for forming interconnect structures
KR102697922B1 (ko) * 2019-01-09 2024-08-22 삼성전자주식회사 원자층 증착 장치 및 이를 이용한 박막 형성 방법
TWI748524B (zh) * 2019-09-17 2021-12-01 日商國際電氣股份有限公司 基板冷卻單元，基板處理裝置，半導體裝置的製造方法及程式
CN113097096A (zh) * 2019-12-23 2021-07-09 盛美半导体设备(上海)股份有限公司 半导体设备
US12152312B2 (en) 2021-02-25 2024-11-26 Ebara Corporation Plating apparatus and air bubble removing method of plating apparatus
JP7732126B1 (ja) * 2024-07-04 2025-09-01 株式会社荏原製作所 めっき装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5565034A (en) * 1993-10-29 1996-10-15 Tokyo Electron Limited Apparatus for processing substrates having a film formed on a surface of the substrate
DE19544328B4 (de) * 1994-11-29 2014-03-20 Ebara Corp. Poliervorrichtung
US6921467B2 (en) * 1996-07-15 2005-07-26 Semitool, Inc. Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
TW405158B (en) * 1997-09-17 2000-09-11 Ebara Corp Plating apparatus for semiconductor wafer processing
WO1999045170A1 (fr) * 1998-03-02 1999-09-10 Ebara Corporation Dispositif de placage de substrat
CA2352160A1 (en) * 1998-11-28 2000-06-08 Acm Research, Inc. Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
US6267853B1 (en) * 1999-07-09 2001-07-31 Applied Materials, Inc. Electro-chemical deposition system
US6660139B1 (en) * 1999-11-08 2003-12-09 Ebara Corporation Plating apparatus and method
JP3556882B2 (ja) * 2000-05-10 2004-08-25 東京エレクトロン株式会社 塗布現像処理システム
KR100800531B1 (ko) * 2000-06-30 2008-02-04 가부시키가이샤 에바라 세이사꾸쇼 구리 도금액, 도금 방법 및 도금 장치
JP3284496B2 (ja) * 2000-08-09 2002-05-20 株式会社荏原製作所 めっき装置及びめっき液除去方法
KR100798437B1 (ko) * 2000-12-04 2008-01-28 가부시키가이샤 에바라 세이사꾸쇼 기판처리방법
JP2002212786A (ja) * 2001-01-17 2002-07-31 Ebara Corp 基板処理装置
JP2002220692A (ja) * 2001-01-24 2002-08-09 Ebara Corp めっき装置及び方法
KR20020092444A (ko) * 2001-02-23 2002-12-11 가부시키 가이샤 에바라 세이사꾸쇼 구리-도금 용액, 도금 방법 및 도금 장치

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