JP2003007661A - 平面加工装置及び平面加工方法 - Google Patents
平面加工装置及び平面加工方法Info
- Publication number
- JP2003007661A JP2003007661A JP2002140537A JP2002140537A JP2003007661A JP 2003007661 A JP2003007661 A JP 2003007661A JP 2002140537 A JP2002140537 A JP 2002140537A JP 2002140537 A JP2002140537 A JP 2002140537A JP 2003007661 A JP2003007661 A JP 2003007661A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- work
- grinding
- holding means
- processing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000003754 machining Methods 0.000 title abstract description 9
- 238000000227 grinding Methods 0.000 claims abstract description 223
- 238000005498 polishing Methods 0.000 claims abstract description 211
- 238000005530 etching Methods 0.000 claims abstract description 68
- 239000004744 fabric Substances 0.000 claims abstract description 48
- 238000004140 cleaning Methods 0.000 claims abstract description 38
- 230000008569 process Effects 0.000 claims description 26
- 238000005192 partition Methods 0.000 claims description 14
- 238000003672 processing method Methods 0.000 claims description 11
- 230000007246 mechanism Effects 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 3
- 238000000638 solvent extraction Methods 0.000 claims description 3
- 230000003068 static effect Effects 0.000 claims description 3
- 239000004575 stone Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 122
- 239000007788 liquid Substances 0.000 description 23
- 239000011148 porous material Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 6
- 239000012530 fluid Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000001962 electrophoresis Methods 0.000 description 2
- 238000007710 freezing Methods 0.000 description 2
- 230000008014 freezing Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005247 gettering Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002140537A JP2003007661A (ja) | 1999-01-06 | 2002-05-15 | 平面加工装置及び平面加工方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11-1317 | 1999-01-06 | ||
| JP131799 | 1999-01-06 | ||
| JP2002140537A JP2003007661A (ja) | 1999-01-06 | 2002-05-15 | 平面加工装置及び平面加工方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32143299A Division JP2000254857A (ja) | 1999-01-06 | 1999-11-11 | 平面加工装置及び平面加工方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006145755A Division JP4553868B2 (ja) | 1999-01-06 | 2006-05-25 | 平面加工装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003007661A true JP2003007661A (ja) | 2003-01-10 |
| JP2003007661A5 JP2003007661A5 (https=) | 2004-07-22 |
Family
ID=26334527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002140537A Pending JP2003007661A (ja) | 1999-01-06 | 2002-05-15 | 平面加工装置及び平面加工方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003007661A (https=) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007276093A (ja) * | 2006-04-12 | 2007-10-25 | Disco Abrasive Syst Ltd | 研削装置 |
| JP2008053421A (ja) * | 2006-08-24 | 2008-03-06 | Micro Materials Japan:Kk | ウェーハ再生用ウェーハパターン研削機及び研削方法 |
| JP2012076171A (ja) * | 2010-09-30 | 2012-04-19 | Disco Corp | 加工装置 |
| JP2013086244A (ja) * | 2011-10-21 | 2013-05-13 | Disco Corp | 研削装置 |
| JP2013255952A (ja) * | 2012-06-11 | 2013-12-26 | Disco Corp | 研削装置 |
| US10173296B2 (en) | 2015-09-30 | 2019-01-08 | Tokyo Seimitsu Co., Ltd. | Grinding machine |
| US10421172B2 (en) | 2015-12-01 | 2019-09-24 | Tokyo Seimitsu Co. Ltd. | Processing device |
| US11141830B2 (en) | 2016-09-28 | 2021-10-12 | Tokyo Seimitsu Co., Ltd | Method for setting processing device |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6076959A (ja) * | 1983-09-30 | 1985-05-01 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPS6181846U (https=) * | 1984-11-02 | 1986-05-30 | ||
| JPS63169209A (ja) * | 1986-12-29 | 1988-07-13 | Niigata Eng Co Ltd | 自動バリ取り装置 |
| JPS641840U (https=) * | 1987-06-23 | 1989-01-09 | ||
| JPH0529288A (ja) * | 1991-07-18 | 1993-02-05 | Mitsubishi Materials Corp | 化合物半導体ウエハの研磨方法 |
| JPH05226308A (ja) * | 1992-02-18 | 1993-09-03 | Sony Corp | 半導体ウエハの裏面処理方法及びその装置 |
| JPH06338484A (ja) * | 1993-05-27 | 1994-12-06 | Shin Etsu Handotai Co Ltd | シリコンウエーハの製造方法、およびその装置 |
| JPH0740239A (ja) * | 1993-08-02 | 1995-02-10 | Sony Corp | 研削研磨装置及び方法 |
| JPH08153695A (ja) * | 1994-11-30 | 1996-06-11 | Nkk Corp | 研磨方法およびこれに用いる研磨装置並びに研磨仕上げ装置 |
| JPH10166264A (ja) * | 1996-12-12 | 1998-06-23 | Okamoto Kosaku Kikai Seisakusho:Kk | 研磨装置 |
| JPH10303152A (ja) * | 1997-04-28 | 1998-11-13 | Nec Corp | 自動研磨装置 |
-
2002
- 2002-05-15 JP JP2002140537A patent/JP2003007661A/ja active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6076959A (ja) * | 1983-09-30 | 1985-05-01 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPS6181846U (https=) * | 1984-11-02 | 1986-05-30 | ||
| JPS63169209A (ja) * | 1986-12-29 | 1988-07-13 | Niigata Eng Co Ltd | 自動バリ取り装置 |
| JPS641840U (https=) * | 1987-06-23 | 1989-01-09 | ||
| JPH0529288A (ja) * | 1991-07-18 | 1993-02-05 | Mitsubishi Materials Corp | 化合物半導体ウエハの研磨方法 |
| JPH05226308A (ja) * | 1992-02-18 | 1993-09-03 | Sony Corp | 半導体ウエハの裏面処理方法及びその装置 |
| JPH06338484A (ja) * | 1993-05-27 | 1994-12-06 | Shin Etsu Handotai Co Ltd | シリコンウエーハの製造方法、およびその装置 |
| JPH0740239A (ja) * | 1993-08-02 | 1995-02-10 | Sony Corp | 研削研磨装置及び方法 |
| JPH08153695A (ja) * | 1994-11-30 | 1996-06-11 | Nkk Corp | 研磨方法およびこれに用いる研磨装置並びに研磨仕上げ装置 |
| JPH10166264A (ja) * | 1996-12-12 | 1998-06-23 | Okamoto Kosaku Kikai Seisakusho:Kk | 研磨装置 |
| JPH10303152A (ja) * | 1997-04-28 | 1998-11-13 | Nec Corp | 自動研磨装置 |
Non-Patent Citations (3)
| Title |
|---|
| 辻薦, 精密洗浄技術, JPN4006004966, pages 16 - 17, ISSN: 0000722003 * |
| 辻薦, 精密洗浄技術, JPNX006034352, pages 16 - 17, ISSN: 0000759816 * |
| 辻薦, 精密洗浄技術, JPNX006060021, pages 16 - 17, ISSN: 0000798651 * |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007276093A (ja) * | 2006-04-12 | 2007-10-25 | Disco Abrasive Syst Ltd | 研削装置 |
| JP2008053421A (ja) * | 2006-08-24 | 2008-03-06 | Micro Materials Japan:Kk | ウェーハ再生用ウェーハパターン研削機及び研削方法 |
| JP2012076171A (ja) * | 2010-09-30 | 2012-04-19 | Disco Corp | 加工装置 |
| JP2013086244A (ja) * | 2011-10-21 | 2013-05-13 | Disco Corp | 研削装置 |
| JP2013255952A (ja) * | 2012-06-11 | 2013-12-26 | Disco Corp | 研削装置 |
| US10173296B2 (en) | 2015-09-30 | 2019-01-08 | Tokyo Seimitsu Co., Ltd. | Grinding machine |
| US10421172B2 (en) | 2015-12-01 | 2019-09-24 | Tokyo Seimitsu Co. Ltd. | Processing device |
| US11141830B2 (en) | 2016-09-28 | 2021-10-12 | Tokyo Seimitsu Co., Ltd | Method for setting processing device |
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