JP2002257502A - 厚さ測定装置及び測定方法 - Google Patents

厚さ測定装置及び測定方法

Info

Publication number
JP2002257502A
JP2002257502A JP2001059587A JP2001059587A JP2002257502A JP 2002257502 A JP2002257502 A JP 2002257502A JP 2001059587 A JP2001059587 A JP 2001059587A JP 2001059587 A JP2001059587 A JP 2001059587A JP 2002257502 A JP2002257502 A JP 2002257502A
Authority
JP
Japan
Prior art keywords
measuring
sample
measurement
thickness
length
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001059587A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002257502A5 (https=
Inventor
Junichi Kushibiki
淳一 櫛引
Mototaka Arakawa
元孝 荒川
Ryoichi Okabe
亮一 岡部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP2001059587A priority Critical patent/JP2002257502A/ja
Priority to DE60232117T priority patent/DE60232117D1/de
Priority to US10/086,747 priority patent/US6725557B2/en
Priority to EP02004297A priority patent/EP1239259B1/en
Publication of JP2002257502A publication Critical patent/JP2002257502A/ja
Publication of JP2002257502A5 publication Critical patent/JP2002257502A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/02—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness
    • G01B5/06—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness
    • G01B5/061—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness height gauges

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • A Measuring Device Byusing Mechanical Method (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2001059587A 2001-03-05 2001-03-05 厚さ測定装置及び測定方法 Pending JP2002257502A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2001059587A JP2002257502A (ja) 2001-03-05 2001-03-05 厚さ測定装置及び測定方法
DE60232117T DE60232117D1 (de) 2001-03-05 2002-02-28 Verfahren zur Dickenmessung
US10/086,747 US6725557B2 (en) 2001-03-05 2002-02-28 Thickness measuring apparatus and method
EP02004297A EP1239259B1 (en) 2001-03-05 2002-02-28 Thickness measuring method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001059587A JP2002257502A (ja) 2001-03-05 2001-03-05 厚さ測定装置及び測定方法

Publications (2)

Publication Number Publication Date
JP2002257502A true JP2002257502A (ja) 2002-09-11
JP2002257502A5 JP2002257502A5 (https=) 2008-04-03

Family

ID=18919128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001059587A Pending JP2002257502A (ja) 2001-03-05 2001-03-05 厚さ測定装置及び測定方法

Country Status (4)

Country Link
US (1) US6725557B2 (https=)
EP (1) EP1239259B1 (https=)
JP (1) JP2002257502A (https=)
DE (1) DE60232117D1 (https=)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006153732A (ja) * 2004-11-30 2006-06-15 Dainippon Printing Co Ltd 接触式膜厚測定機およびその使用方法
US7124635B2 (en) 2004-08-06 2006-10-24 Tohoku University Evaluation method for coefficient of thermal expansion of ultra-low-expansion glass material
JP2007109847A (ja) * 2005-10-13 2007-04-26 Tokyo Seimitsu Co Ltd プローバ
JP2008064665A (ja) * 2006-09-08 2008-03-21 V Technology Co Ltd 光学的測長装置
JP2008292374A (ja) * 2007-05-25 2008-12-04 Asahi Kasei Chemicals Corp 微多孔膜の厚みの測定方法及びそれに用いる装置
JP2009147320A (ja) * 2007-11-21 2009-07-02 Horiba Ltd 検査装置
WO2010134687A3 (ko) * 2009-05-18 2011-04-07 Hwang Jinsung 자동차용 에어백커버의 테어라인 두께측정장치
CN103217134A (zh) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 一种应用于smt网板测量的夹持机构
CN113267153A (zh) * 2021-06-10 2021-08-17 淮安帝泰华懋精密科技有限公司 一种fpc板上钢片厚度检测工装及方法
JP2022066416A (ja) * 2018-03-02 2022-04-28 株式会社東京精密 形状測定装置

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1429142B1 (de) * 2002-12-11 2009-09-02 Ipsen International GmbH Verfahren zur Messung der von einem metallischen Werkstück bei einer thermochemischen Behandlung aufgenommenen Menge einer Komponente
JP4991365B2 (ja) * 2007-03-29 2012-08-01 カヤバ工業株式会社 寸法測定装置及び寸法測定方法
CN101551233B (zh) * 2008-04-01 2011-06-08 深圳富泰宏精密工业有限公司 工件尺寸检测装置
CN101673695B (zh) * 2008-09-08 2011-01-26 京元电子股份有限公司 裸晶粒双面检测设备
JP5021014B2 (ja) * 2009-10-30 2012-09-05 日本碍子株式会社 積層体の形成方法
USD696147S1 (en) * 2011-12-09 2013-12-24 Hon Hai Precision Industry Co., Ltd. Optical module for image measuring system
TW201346205A (zh) * 2012-01-13 2013-11-16 尼康股份有限公司 箱室裝置及隔熱板
SE537530C2 (sv) * 2013-04-26 2015-06-02 Plockmatic Int Ab Häftesframställningsmaskin med tjocklekssensor
CN103398688A (zh) * 2013-08-09 2013-11-20 昆山允可精密工业技术有限公司 一种表面高反薄板材厚度测量仪
CN104236423A (zh) * 2014-08-20 2014-12-24 成都市龙泉通惠实业有限责任公司 一种检测芯板厚度的装置
CN105222664B (zh) * 2015-09-24 2017-11-10 山东太古飞机工程有限公司 客改货飞机隔板结构盲区挠性测量工装
JP6990024B2 (ja) * 2016-12-22 2022-01-12 株式会社ミツトヨ 線膨張係数測定方法および測定装置
CN111141191A (zh) 2018-11-05 2020-05-12 康宁股份有限公司 用于确定产品的边缘部分的高度的方法和装置
CN111089705B (zh) * 2019-12-24 2021-08-31 南京宝凯通机械设备有限公司 一种光学镜片检测设备及检测方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62150102A (ja) * 1985-12-24 1987-07-04 Toshiba Corp 球体の寸法測定方法
JPH0255901A (ja) * 1988-08-22 1990-02-26 Sumitomo Electric Ind Ltd 厚み測定器
JPH06160015A (ja) * 1992-11-16 1994-06-07 Canon Inc 光学測定装置
US6014886A (en) * 1998-06-30 2000-01-18 Seh America, Inc. Gauge block holder apparatus
JP2000065506A (ja) * 1998-08-24 2000-03-03 Ngk Insulators Ltd 厚さ測定用治具
JP2001021304A (ja) * 1999-07-09 2001-01-26 Mitsutoyo Corp 変位測定装置

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US2352571A (en) * 1942-03-21 1944-06-27 Goodrich Co B F Thickness-measuring apparatus
GB577231A (en) 1944-03-21 1946-05-09 Stanislaw Richard Kiliszek Improvements in and relating to precision linear-dimension measuring instruments
US2412665A (en) 1944-05-27 1946-12-17 Western Electric Co Measuring apparatus
FR2603982A1 (fr) 1986-09-11 1988-03-18 Dynafer Sa Palpeur de mesure de dimensions
WO1991007683A1 (en) 1989-11-09 1991-05-30 Insystems, Inc. Specimen review station
US4989031A (en) * 1990-01-29 1991-01-29 Nikon Corporation Projection exposure apparatus
US5307149A (en) * 1992-08-14 1994-04-26 Elwin M. Beaty Method and apparatus for zero force part placement
DE69634030T2 (de) * 1995-10-13 2005-05-19 Kitano Engineering Co., Ltd., Komatsushima Drehender Haltetisch, mit Stift, zum darauf Festhalten und Drehen einer Informationsscheibe
US5923408A (en) * 1996-01-31 1999-07-13 Canon Kabushiki Kaisha Substrate holding system and exposure apparatus using the same
US6151792A (en) * 1997-03-05 2000-11-28 Olec Corporation Registration system and method
AT411304B (de) * 1997-06-18 2003-11-25 Sez Ag Träger für scheibenförmige gegenstände, insbesondere silizium-wafer
WO1999012194A1 (en) 1997-08-29 1999-03-11 Nikon Corporation Temperature adjusting method and aligner to which this method is applied
JPH11210109A (ja) * 1998-01-28 1999-08-03 Nikon Corp 空調装置、隔壁及び露光装置
US6219931B1 (en) * 1998-03-10 2001-04-24 Northrop Grumman Corporation Target base for a measuring system
US6286685B1 (en) * 1999-03-15 2001-09-11 Seh America, Inc. System and method for wafer thickness sorting
JP2000311933A (ja) * 1999-04-27 2000-11-07 Canon Inc 基板保持装置、基板搬送システム、露光装置、塗布装置およびデバイス製造方法ならびに基板保持部クリーニング方法
US6496248B2 (en) * 2000-12-15 2002-12-17 Nikon Corporation Stage device and exposure apparatus and method
US6896929B2 (en) * 2001-08-03 2005-05-24 Applied Materials, Inc. Susceptor shaft vacuum pumping

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62150102A (ja) * 1985-12-24 1987-07-04 Toshiba Corp 球体の寸法測定方法
JPH0255901A (ja) * 1988-08-22 1990-02-26 Sumitomo Electric Ind Ltd 厚み測定器
JPH06160015A (ja) * 1992-11-16 1994-06-07 Canon Inc 光学測定装置
US6014886A (en) * 1998-06-30 2000-01-18 Seh America, Inc. Gauge block holder apparatus
JP2000065506A (ja) * 1998-08-24 2000-03-03 Ngk Insulators Ltd 厚さ測定用治具
JP2001021304A (ja) * 1999-07-09 2001-01-26 Mitsutoyo Corp 変位測定装置

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7124635B2 (en) 2004-08-06 2006-10-24 Tohoku University Evaluation method for coefficient of thermal expansion of ultra-low-expansion glass material
JP2006153732A (ja) * 2004-11-30 2006-06-15 Dainippon Printing Co Ltd 接触式膜厚測定機およびその使用方法
JP2007109847A (ja) * 2005-10-13 2007-04-26 Tokyo Seimitsu Co Ltd プローバ
JP2008064665A (ja) * 2006-09-08 2008-03-21 V Technology Co Ltd 光学的測長装置
JP2008292374A (ja) * 2007-05-25 2008-12-04 Asahi Kasei Chemicals Corp 微多孔膜の厚みの測定方法及びそれに用いる装置
JP2009147320A (ja) * 2007-11-21 2009-07-02 Horiba Ltd 検査装置
WO2010134687A3 (ko) * 2009-05-18 2011-04-07 Hwang Jinsung 자동차용 에어백커버의 테어라인 두께측정장치
CN103217134A (zh) * 2012-01-19 2013-07-24 昆山思拓机器有限公司 一种应用于smt网板测量的夹持机构
JP2022066416A (ja) * 2018-03-02 2022-04-28 株式会社東京精密 形状測定装置
JP7255074B2 (ja) 2018-03-02 2023-04-11 株式会社東京精密 形状測定装置
CN113267153A (zh) * 2021-06-10 2021-08-17 淮安帝泰华懋精密科技有限公司 一种fpc板上钢片厚度检测工装及方法

Also Published As

Publication number Publication date
DE60232117D1 (de) 2009-06-10
EP1239259A1 (en) 2002-09-11
EP1239259B1 (en) 2009-04-29
US20020152625A1 (en) 2002-10-24
US6725557B2 (en) 2004-04-27

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