JP2002248777A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2002248777A5 JP2002248777A5 JP2002011197A JP2002011197A JP2002248777A5 JP 2002248777 A5 JP2002248777 A5 JP 2002248777A5 JP 2002011197 A JP2002011197 A JP 2002011197A JP 2002011197 A JP2002011197 A JP 2002011197A JP 2002248777 A5 JP2002248777 A5 JP 2002248777A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- thin film
- substrate
- slot
- depositing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/772752 | 2001-01-30 | ||
| US09/772,752 US6648732B2 (en) | 2001-01-30 | 2001-01-30 | Thin film coating of a slotted substrate and techniques for forming slotted substrates |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002248777A JP2002248777A (ja) | 2002-09-03 |
| JP2002248777A5 true JP2002248777A5 (enExample) | 2005-04-07 |
| JP4166476B2 JP4166476B2 (ja) | 2008-10-15 |
Family
ID=25096103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002011197A Expired - Fee Related JP4166476B2 (ja) | 2001-01-30 | 2002-01-21 | スロットをつけた基板の形成技術 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6648732B2 (enExample) |
| EP (2) | EP2000309A3 (enExample) |
| JP (1) | JP4166476B2 (enExample) |
| DE (1) | DE60229316D1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100335311B1 (ko) * | 1994-09-13 | 2002-11-14 | 주식회사 디피아이 | 내가스체킹성아크릴수지조성물을포함하는도료조성물 |
| US6648732B2 (en) * | 2001-01-30 | 2003-11-18 | Hewlett-Packard Development Company, L.P. | Thin film coating of a slotted substrate and techniques for forming slotted substrates |
| JP2004130579A (ja) * | 2002-10-09 | 2004-04-30 | Sony Corp | 液体吐出ヘッド、液体吐出装置及び液体吐出ヘッドの製造方法 |
| JP2004230770A (ja) * | 2003-01-31 | 2004-08-19 | Fuji Photo Film Co Ltd | インクジェットヘッド |
| US7594328B2 (en) * | 2003-10-03 | 2009-09-29 | Hewlett-Packard Development Company, L.P. | Method of forming a slotted substrate with partially patterned layers |
| US7784916B2 (en) * | 2006-09-28 | 2010-08-31 | Lexmark International, Inc. | Micro-fluid ejection heads with multiple glass layers |
| CN102802958B (zh) * | 2009-06-29 | 2015-11-25 | 录象射流技术公司 | 具有耐溶剂性的热喷墨印刷头 |
| US8382253B1 (en) | 2011-08-25 | 2013-02-26 | Hewlett-Packard Development Company, L.P. | Fluid ejection device and methods of fabrication |
| US8727499B2 (en) | 2011-12-21 | 2014-05-20 | Hewlett-Packard Development Company, L.P. | Protecting a fluid ejection device resistor |
| US9016836B2 (en) | 2013-05-14 | 2015-04-28 | Stmicroelectronics, Inc. | Ink jet printhead with polarity-changing driver for thermal resistors |
| US9016837B2 (en) | 2013-05-14 | 2015-04-28 | Stmicroelectronics, Inc. | Ink jet printhead device with compressive stressed dielectric layer |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2989046A (en) * | 1958-06-05 | 1961-06-20 | Paramount Pictures Corp | Method for drilling finished holes in glass |
| DE2604939C3 (de) | 1976-02-09 | 1978-07-27 | Ibm Deutschland Gmbh, 7000 Stuttgart | Verfahren zum Herstellen von wenigstens einem Durchgangsloch insbesondere einer Düse für Tintenstrahldrucker |
| US4239954A (en) * | 1978-12-11 | 1980-12-16 | United Technologies Corporation | Backer for electron beam hole drilling |
| US4894664A (en) | 1986-04-28 | 1990-01-16 | Hewlett-Packard Company | Monolithic thermal ink jet printhead with integral nozzle and ink feed |
| US4862197A (en) | 1986-08-28 | 1989-08-29 | Hewlett-Packard Co. | Process for manufacturing thermal ink jet printhead and integrated circuit (IC) structures produced thereby |
| IT1234800B (it) * | 1989-06-08 | 1992-05-27 | C Olivetti & C Spa Sede Via Je | Procedimento di fabbricazione di testine termiche di stampa a getto d'inchiostro e testine cosi' ottenute |
| GB2241186A (en) | 1990-02-24 | 1991-08-28 | Rolls Royce Plc | Anti-sputtercoating |
| US5105588A (en) * | 1990-09-10 | 1992-04-21 | Hewlett-Packard Company | Method and apparatus for simultaneously forming a plurality of openings through a substrate |
| US5703631A (en) | 1992-05-05 | 1997-12-30 | Compaq Computer Corporation | Method of forming an orifice array for a high density ink jet printhead |
| JP3196796B2 (ja) | 1992-06-24 | 2001-08-06 | セイコーエプソン株式会社 | インクジェット記録ヘッドのノズル形成方法 |
| US5308442A (en) | 1993-01-25 | 1994-05-03 | Hewlett-Packard Company | Anisotropically etched ink fill slots in silicon |
| BE1007894A3 (nl) * | 1993-12-20 | 1995-11-14 | Philips Electronics Nv | Werkwijze voor het vervaardigen van een plaat van niet-metallisch materiaal met een patroon van gaten en/of holten. |
| JPH08267753A (ja) * | 1995-03-29 | 1996-10-15 | Brother Ind Ltd | ノズルの製造方法 |
| US5658471A (en) | 1995-09-22 | 1997-08-19 | Lexmark International, Inc. | Fabrication of thermal ink-jet feed slots in a silicon substrate |
| JP3984689B2 (ja) | 1996-11-11 | 2007-10-03 | キヤノン株式会社 | インクジェットヘッドの製造方法 |
| US6238269B1 (en) * | 2000-01-26 | 2001-05-29 | Hewlett-Packard Company | Ink feed slot formation in ink-jet printheads |
| FR2811588B1 (fr) * | 2000-07-13 | 2002-10-11 | Centre Nat Rech Scient | Tete d'injection et de dosage thermique, son procede de fabrication et systeme de fonctionnalisation ou d'adressage la comprenant |
| US6648732B2 (en) * | 2001-01-30 | 2003-11-18 | Hewlett-Packard Development Company, L.P. | Thin film coating of a slotted substrate and techniques for forming slotted substrates |
-
2001
- 2001-01-30 US US09/772,752 patent/US6648732B2/en not_active Expired - Fee Related
-
2002
- 2002-01-21 DE DE60229316T patent/DE60229316D1/de not_active Expired - Lifetime
- 2002-01-21 EP EP08075640A patent/EP2000309A3/en not_active Withdrawn
- 2002-01-21 JP JP2002011197A patent/JP4166476B2/ja not_active Expired - Fee Related
- 2002-01-21 EP EP02250377A patent/EP1226947B1/en not_active Expired - Lifetime
-
2003
- 2003-10-03 US US10/679,097 patent/US6945634B2/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2002248777A5 (enExample) | ||
| US20080203531A1 (en) | Semiconductor device and manufacturing method thereof | |
| KR101669382B1 (ko) | 반도체 장치 및 반도체 장치의 제조 방법 | |
| JP4708407B2 (ja) | キャパシタ内蔵型印刷回路基板及びその製造方法 | |
| JP5175256B2 (ja) | 静電容量式タッチパネル及びその製造方法 | |
| CN1725396B (zh) | 薄膜型多层陶瓷电容器及其制造方法 | |
| US10483345B2 (en) | Electronic component embedded substrate | |
| KR20160001026A (ko) | 기판 내장용 적층 세라믹 전자부품, 그 제조방법 및 적층 세라믹 전자부품 내장형 인쇄회로기판 | |
| CN102354590B (zh) | 一种精密电流感测元件及制造方法 | |
| US20150102464A1 (en) | Capacitor with hole structure and manufacturing method thereof | |
| JP2009509319A5 (enExample) | ||
| WO2009032575A3 (en) | Semiconductor device having reduced single bit fails and a method of manufacture thereof | |
| US10395842B2 (en) | Thin film capacitor and manufacturing method thereof | |
| JP2012243998A (ja) | チップ状電子部品 | |
| JP7427380B2 (ja) | 積層型電子部品および積層型電子部品の製造方法 | |
| JP2010040771A5 (enExample) | ||
| US20170338042A1 (en) | Thin-film capacitor and method of manufacturing the same | |
| CN1413429A (zh) | 多层印刷电路布线板及其制造方法 | |
| CN102420105B (zh) | 铜大马士革工艺金属-绝缘层-金属电容制造工艺及结构 | |
| KR20140011766A (ko) | 홀 구조를 갖는 커패시터 및 그 제조방법 | |
| TWI332247B (en) | Semiconductor device and production method therefor | |
| JP4049124B2 (ja) | 半導体装置の製造方法 | |
| JP2004140198A (ja) | 半導体装置およびその製造方法 | |
| JP4101241B2 (ja) | スパッタリングにより形成された端面電極層を含むコンデンサおよびその製造方法 | |
| JP2000269010A (ja) | チップ抵抗器の製造方法及びチップ抵抗器 |