GB2241186A - Anti-sputtercoating - Google Patents
Anti-sputtercoating Download PDFInfo
- Publication number
- GB2241186A GB2241186A GB9004212A GB9004212A GB2241186A GB 2241186 A GB2241186 A GB 2241186A GB 9004212 A GB9004212 A GB 9004212A GB 9004212 A GB9004212 A GB 9004212A GB 2241186 A GB2241186 A GB 2241186A
- Authority
- GB
- United Kingdom
- Prior art keywords
- composition
- component
- paste
- filler
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/224—Anti-weld compositions; Braze stop-off compositions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
- B23K2101/35—Surface treated articles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
- Paints Or Removers (AREA)
Abstract
Unwanted sputtering of metal when a hole is being drilled by a laser beam in a metal component is avoided by coating the component with a water-soluble paste containing sodium silicate and a thixotropic filler such as bentonite. Subsequently, the paste is easily washed off with water.
Description
IMPROVEMENTS IN OR RELATING TO LASER DRILLING OF
COMPONENTS
This invention concerns improvements in or relating to laser drilling of components. In particular, it relates to the laser drilling of cooling holes in nozzle guide vanes, turbine blades or similar components of an aircraft gas turbine engine which are subject to extreme heat when in use.
Such vanes or blades are provided with internal channels or cavities which communicate with the outside of the vane or blade by means of a plurality of cooling holes. The cooling holes are usually located along or adjacent an external edge of the vane or blade, but may also be found on external surfaces.
In use, cooling air is passed through the channels and exits through the holes to flow over the edge or surface that is to be cooled, and thus enable the component to operate in a temperature environment that may be above the melting point of the metal of which it is made.
Each cooling hole, which typically is a fraction of a millimeter in diameter, is drilled through the metal of the vane or blade by means of a laser beam, in a manner known in the art. However, the laser beam, in drilling the hole, may cause sputtering of the metal and splashing of small quantities of molten metal over the component being drilled, especially when striking through into the internal channel. These splashes of metal may impede air flow either through the channel or over the external edge or surface, or may block some of the air cooling holes.
It is known to coat, prior to laser drilling, the interior of a cavity in a vane or blade with an adherent coating such as PTFE. Such coatings are difficult to remove subsequently and usually involve the use of hazardous chemicals in a series of operations.
It is an object of the present invention to avoid the sputtering and splashing of the metal of the component being drilled by laser in a manner that is easy and economical to operate and which presents a minimum hazard to the operator.
According to a first aspect of the present invention there is provided a method of laser drilling a component so as to avoid sputtering of the material of the component, the method comprising forming an adherent coating on a surface of the component by applying to the surface a water-soluble paste containing as its active principle sodium silicate and permitting the paste to dry, drilling through the coating and the component with a laser beam to provide a hole through or into the component, and subsequently removing the coating.
The paste preferably also contains a thixotropic filler such as bentonite.
According to a second aspect of the invention there is provided a water-soluble anti-sputtering composition for application to a surface prior to laser drilling of the surface, the composition containing as its active principle sodium silicate.
The invention will now be described by with reference to the following non-limiting examples:
Example 1
An anti-sputter composition (composition "A") was prepared by mixing the following constituents,
sodium silicate soln 100 parts by weight
bentonite 22 parts by weight
wetting agent 1 part by weight
The sodium silicate solution was technical grade C112 made by Imperial Chemical Industries Plc and consisted of a 48.5% w/w solution of sodium silicate in water.
The bentonite (hydrated aluminium silicate) originate form Wyoming in Canada and was of grade -200 mesh to dust.
The wetting agent was Synperonic N made by Imperial
Chemical Industries Plc and consists of a 25% w/w aqueous solution of a non-ionic surfactant.
Example 2
An anti-sputter composition (composition "B") was prepared by mixing the following constituents,
sodium silicate soln 100 parts by weight
bentonite 104 parts by weight
wetting agent 1 part by weight.
The constituents were of the same substance and qualify as in Example 1.
Example 3
An anti-sputter composition (composition "C") was prepared by mixing the following constituents,
sodium silicate soln 100 parts by weight
bentonite 104 parts by weight
wetting agent 1 part by weight.
The constituents were of the same substance and quality as in Example 1.
In experiments each anti-sputter composition A, B, C was applied in turn to a respective aircraft metal turbine vane by pasting, and allowed to dry. Holes were then laser drilled in each vane through its anti-sputter composition coating. The coatings were then washed off with pressurised jets of hot water, which process was carried out easily.
On inspection of the vanes it was seen that there was minimal sputtering of the metal surrounding the laser drilled holes.
Interior cavities of components may be similarly coated prior to laser drillng, but in these cases it may be necessary to dilute the anti-sputtering paste with water.
Composition ranges extending outside those exemplified may be used within the scope of the invention.
The examples show that the composition of the invention is easily applied to a component before laser drilling, and is equally easily removed after drilling by the application of pressurized hot water.
The composition of the invention further has low toxicity and cost, is nonflammable, and gives low contamination of the final product.
Claims (15)
1 A method of laser drilling a component so as to
avoid sputtering of the material of the
component, the method comprising forming an
adherent coating on a surface of the component by
applying to the surface a water-soluble paste
containing as its active principle sodium
silicate and permitting the paste to dry,
drilling through the coating and the component
with a laser beam to provide a hole through or
into the component, and subsequently removing the
coating.
2 A method as claimed in claim 1 wherein the paste
contains a thixotropic filler.
3 A method as claimed in claim 2 wherein the paste
contains 15 - 55% by weight of filler.
4 A method as claimed in claim 2 wherein the filler
is bentonite.
5 A method as claimed in claim 1 wherein the paste
contains a wetting agent.
6 A method as claimed in claim 1 wherein the
subsequent removal of the coating is by means of
the application of water.
7 A method as claimed in claim 1 wherein the
material of the component is a metal.
8 A water-soluble anti-sputtering composition for
application to a surface prior to laser drilling
of the surface, the composition containing as its
active principle sodium silicate.
9 A composition as claimed in claim 8 wherein the
composition is in the form of a paste when
applied.
10 A composition as claimed in claim 8 wherein the
composition contains a thixotropic filler.
11 A composition as claimed in claim 10 wherein the
filler is 15 - 55% by weight of the composition.
12 A composition as claimed in claim 10 wherein the
filler is bentonite.
13 A composition as claimed in claim 8 including a
wetting agent.
14 A method of laser drilling a component so as to
avoid sputtering of the material of the component
substantially as hereinbefore described with
reference to the examples.
15 A water-soluble anti-sputtering composition for
application to a surface prior to laser drilling
of the surface substantially as hereinbefore
described with reference to the examples.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9004212A GB2241186A (en) | 1990-02-24 | 1990-02-24 | Anti-sputtercoating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9004212A GB2241186A (en) | 1990-02-24 | 1990-02-24 | Anti-sputtercoating |
Publications (2)
Publication Number | Publication Date |
---|---|
GB9004212D0 GB9004212D0 (en) | 1990-04-18 |
GB2241186A true GB2241186A (en) | 1991-08-28 |
Family
ID=10671580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9004212A Withdrawn GB2241186A (en) | 1990-02-24 | 1990-02-24 | Anti-sputtercoating |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2241186A (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0761448A2 (en) * | 1995-08-28 | 1997-03-12 | Lexmark International, Inc. | Method of forming an inkjet printhead nozzle structure |
US5914060A (en) * | 1998-09-29 | 1999-06-22 | United Technologies Corporation | Method of laser drilling an airfoil |
US5928534A (en) * | 1998-09-29 | 1999-07-27 | United Technologies Corporation | Method for reducing void volumes in cavities for laser drilling |
US6120131A (en) * | 1995-08-28 | 2000-09-19 | Lexmark International, Inc. | Method of forming an inkjet printhead nozzle structure |
US6139303A (en) * | 1998-11-20 | 2000-10-31 | United Technologies Corporation | Fixture for disposing a laser blocking material in an airfoil |
US6177038B1 (en) | 1998-11-20 | 2001-01-23 | United Technologies Corporation | Method for orienting an airfoil for processing and for forming a mask for the airfoil |
US6224361B1 (en) | 1998-11-20 | 2001-05-01 | United Technologies Corportion | Tool for disposing laser blocking material in an airfoil |
US6251315B1 (en) * | 1998-11-20 | 2001-06-26 | United Technologies Corporation | Method for disposing a laser blocking material on the interior of an airfoil |
US6323456B1 (en) | 1995-08-28 | 2001-11-27 | Lexmark International, Inc. | Method of forming an ink jet printhead structure |
US6329633B1 (en) * | 1998-11-20 | 2001-12-11 | United Technologies Corporation | Method and material for processing a component for laser machining |
EP1226947A1 (en) * | 2001-01-30 | 2002-07-31 | Hewlett-Packard Company | Thin film coating of a slotted substrate and techniques for forming slotted substrates |
US8232205B2 (en) | 2009-08-25 | 2012-07-31 | Corning Incorporated | Methods of manufacturing a honeycomb extrusion die |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1370253A (en) * | 1972-04-20 | 1974-10-16 | Rolls Royce | Method of brazing |
GB1394463A (en) * | 1972-06-21 | 1975-05-14 | Rolls Royce | Method of protecting a surface |
-
1990
- 1990-02-24 GB GB9004212A patent/GB2241186A/en not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1370253A (en) * | 1972-04-20 | 1974-10-16 | Rolls Royce | Method of brazing |
GB1394463A (en) * | 1972-06-21 | 1975-05-14 | Rolls Royce | Method of protecting a surface |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6120131A (en) * | 1995-08-28 | 2000-09-19 | Lexmark International, Inc. | Method of forming an inkjet printhead nozzle structure |
EP0761448A3 (en) * | 1995-08-28 | 1997-10-22 | Lexmark Int Inc | Method of forming an inkjet printhead nozzle structure |
US6323456B1 (en) | 1995-08-28 | 2001-11-27 | Lexmark International, Inc. | Method of forming an ink jet printhead structure |
EP0761448A2 (en) * | 1995-08-28 | 1997-03-12 | Lexmark International, Inc. | Method of forming an inkjet printhead nozzle structure |
US5928534A (en) * | 1998-09-29 | 1999-07-27 | United Technologies Corporation | Method for reducing void volumes in cavities for laser drilling |
US5914060A (en) * | 1998-09-29 | 1999-06-22 | United Technologies Corporation | Method of laser drilling an airfoil |
US6139303A (en) * | 1998-11-20 | 2000-10-31 | United Technologies Corporation | Fixture for disposing a laser blocking material in an airfoil |
US6177038B1 (en) | 1998-11-20 | 2001-01-23 | United Technologies Corporation | Method for orienting an airfoil for processing and for forming a mask for the airfoil |
US6224361B1 (en) | 1998-11-20 | 2001-05-01 | United Technologies Corportion | Tool for disposing laser blocking material in an airfoil |
US6251315B1 (en) * | 1998-11-20 | 2001-06-26 | United Technologies Corporation | Method for disposing a laser blocking material on the interior of an airfoil |
US6329633B1 (en) * | 1998-11-20 | 2001-12-11 | United Technologies Corporation | Method and material for processing a component for laser machining |
EP1226947A1 (en) * | 2001-01-30 | 2002-07-31 | Hewlett-Packard Company | Thin film coating of a slotted substrate and techniques for forming slotted substrates |
US6648732B2 (en) | 2001-01-30 | 2003-11-18 | Hewlett-Packard Development Company, L.P. | Thin film coating of a slotted substrate and techniques for forming slotted substrates |
EP2000309A3 (en) * | 2001-01-30 | 2009-12-16 | Hewlett-Packard Company | Thin film coating of a slotted substrate and techniques for forming slotted substrates |
US8232205B2 (en) | 2009-08-25 | 2012-07-31 | Corning Incorporated | Methods of manufacturing a honeycomb extrusion die |
Also Published As
Publication number | Publication date |
---|---|
GB9004212D0 (en) | 1990-04-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |