CN102802958B - 具有耐溶剂性的热喷墨印刷头 - Google Patents
具有耐溶剂性的热喷墨印刷头 Download PDFInfo
- Publication number
- CN102802958B CN102802958B CN201080028854.0A CN201080028854A CN102802958B CN 102802958 B CN102802958 B CN 102802958B CN 201080028854 A CN201080028854 A CN 201080028854A CN 102802958 B CN102802958 B CN 102802958B
- Authority
- CN
- China
- Prior art keywords
- barrier layer
- printing system
- inkjet printing
- printhead
- ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- 238000007641 inkjet printing Methods 0.000 title claims abstract description 21
- 239000002904 solvent Substances 0.000 title description 8
- 230000004888 barrier function Effects 0.000 claims abstract description 52
- 239000000463 material Substances 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 239000012530 fluid Substances 0.000 claims abstract description 28
- 229920001721 polyimide Polymers 0.000 claims abstract description 20
- 239000004642 Polyimide Substances 0.000 claims abstract description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 10
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 32
- 229920002120 photoresistant polymer Polymers 0.000 claims description 23
- 239000004593 Epoxy Substances 0.000 claims description 17
- 238000007639 printing Methods 0.000 claims description 16
- 239000003960 organic solvent Substances 0.000 claims description 14
- 238000010304 firing Methods 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000002318 adhesion promoter Substances 0.000 claims description 10
- 238000004891 communication Methods 0.000 claims description 10
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical group CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 7
- 239000008393 encapsulating agent Substances 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical group [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 230000008961 swelling Effects 0.000 claims description 4
- 150000001298 alcohols Chemical class 0.000 claims description 3
- 239000003518 caustics Substances 0.000 claims description 3
- 239000007822 coupling agent Substances 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 150000002576 ketones Chemical class 0.000 claims description 3
- 239000003880 polar aprotic solvent Substances 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- 239000004416 thermosoftening plastic Substances 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- KQWZYFLTZPFOAZ-UHFFFAOYSA-N benzyl(chloro)silane Chemical class Cl[SiH2]CC1=CC=CC=C1 KQWZYFLTZPFOAZ-UHFFFAOYSA-N 0.000 claims description 2
- FYDNFZPPZJDFRY-UHFFFAOYSA-K chromium(3+);2-methylprop-2-enoate Chemical class [Cr+3].CC(=C)C([O-])=O.CC(=C)C([O-])=O.CC(=C)C([O-])=O FYDNFZPPZJDFRY-UHFFFAOYSA-K 0.000 claims description 2
- 230000032798 delamination Effects 0.000 claims description 2
- 238000004090 dissolution Methods 0.000 claims description 2
- 150000002170 ethers Chemical class 0.000 claims description 2
- BUZRAOJSFRKWPD-UHFFFAOYSA-N isocyanatosilane Chemical class [SiH3]N=C=O BUZRAOJSFRKWPD-UHFFFAOYSA-N 0.000 claims description 2
- -1 methacrylic silanes Chemical class 0.000 claims description 2
- KQCGMVTVEQZXGM-UHFFFAOYSA-N oxolane-2,5-dione silane Chemical class [SiH4].O=C1CCC(=O)O1 KQCGMVTVEQZXGM-UHFFFAOYSA-N 0.000 claims description 2
- 229920000098 polyolefin Polymers 0.000 claims description 2
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims description 2
- 150000004756 silanes Chemical class 0.000 claims description 2
- LCHWKMAWSZDQRD-UHFFFAOYSA-N silylformonitrile Chemical class [SiH3]C#N LCHWKMAWSZDQRD-UHFFFAOYSA-N 0.000 claims description 2
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical class NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 claims description 2
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical class S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 claims description 2
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 claims description 2
- 239000004831 Hot glue Substances 0.000 claims 2
- 229920006269 PPS film Polymers 0.000 claims 1
- DNXNYEBMOSARMM-UHFFFAOYSA-N alumane;zirconium Chemical compound [AlH3].[Zr] DNXNYEBMOSARMM-UHFFFAOYSA-N 0.000 claims 1
- 238000009832 plasma treatment Methods 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 238000005260 corrosion Methods 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 79
- 239000000976 ink Substances 0.000 description 76
- 239000010408 film Substances 0.000 description 41
- 239000004020 conductor Substances 0.000 description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 11
- 239000000126 substance Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 10
- 229910004490 TaAl Inorganic materials 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 239000010409 thin film Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 239000005380 borophosphosilicate glass Substances 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010931 gold Substances 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000005422 blasting Methods 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 229910016570 AlCu Inorganic materials 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229920001646 UPILEX Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005360 phosphosilicate glass Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17566—Ink level or ink residue control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1648—Production of print heads with thermal bend detached actuators
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14032—Structure of the pressure chamber
- B41J2/1404—Geometrical characteristics
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- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
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- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
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- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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- B41J2/01—Ink jet
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- B41J2/1623—Manufacturing processes bonding and adhesion
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
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- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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- B41J2/1632—Manufacturing processes machining
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- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
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- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
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- B41J2/1632—Manufacturing processes machining
- B41J2/1634—Manufacturing processes machining laser machining
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- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
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- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17596—Ink pumps, ink valves
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
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- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14387—Front shooter
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/11—Embodiments of or processes related to ink-jet heads characterised by specific geometrical characteristics
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Abstract
一种喷墨印刷系统,包括印刷头,该印刷头与墨料储存器处于流体连通,并且具有多个孔以及对应的多个相关联的喷射室。该印刷头包括基底以及布置在该基底上的阻挡层。该阻挡层部分地限定了多个流体通道以及这多个喷射室。该阻挡层包括选自基于环氧树脂的光致抗蚀剂材料以及基于甲基丙烯酸甲酯的光致抗蚀剂材料中的一种材料。在该基底之上布置了孔板。该孔板包括与这些喷射室处于流体连通的这多个孔。该孔板包括选自聚酰亚胺和镍中的一种材料。
Description
背景技术:
本发明总体上涉及热喷墨印刷头。更具体地,本发明涉及一种对有机溶剂具有耐性的热喷墨印刷头。
用于将热喷墨印刷头及其电气部件互连到印刷系统控制器上的一种已知结构是带式自动结合的(TAB)互连电路。与热喷墨印刷头一起使用的TAB互连电路在美国专利号4,989,317、4,944,850和5,748,209中进行了披露。TAB电路可以通过使用用于支撑金属导体如镀金的铜的一种柔性聚酰亚胺基底而进行制造。可以使用已知的制造方法如“两层式方法”或“三层式方法”来制造这些用于TAB导体电路的部件,包括器件窗口、接触垫片以及内部导线。此外,将模切的绝缘膜施加在TAB电路的导体侧上以便将这些接触垫片和轨迹(traces)与附连该TAB电路的墨盒壳体绝缘。
将该印刷头相对于接触垫片间隔开而附连到TAB电路上,并且该轨迹提供了接触垫片与印刷头电气部件之间的电连接。当将TAB电路(包括印刷头在内)附连至喷墨盒上时,TAB电路的印刷头部分被附连在该墨盒的与墨料供应装置处于流体连通的一侧上。TAB的具有接触垫片的这个部分被附连到该墨盒壳体的相邻一侧上,该侧典型地被布置为垂直于墨盒壳体的与印刷头所附接的侧面。这些接触垫片设置在该墨盒壳体上,用于与印刷系统上的电导线对齐,由此使印刷头与执行印刷命令的印刷系统控制器进行电互连。
典型的热喷墨印刷头本质上是具有薄膜结构的硅芯片/基底,如电阻加热器,以及对供给加热器的功率脉冲进行切换的对应晶体管的阵列。该印刷头还可以包括其他部件,如提供印刷头特征的编码信息的识别电路,以及用于使这些加热器点火(firing)的多路复用的静电放电部件或电子逻辑元件。在形成芯片上的这些膜结构和电路之后,在这些薄膜结构上形成墨料阻挡层,并且将其蚀刻或以其他方式进行处理,以制造多个墨料流动通道和墨料室。已知的墨料流动通道和墨料室构造在美国专利号4,794,410和4,882,595中进行了披露。此外,通过使用已知的切割技术(如喷砂)切割出一条穿过印刷头的中间部分的槽缝来形成墨料槽缝。这个槽缝完成了墨料流动的网络,并且使印刷头与墨料供应装置处于流体连通。
具有多个孔的喷嘴板连接在该墨料阻挡层上,由此使每个孔与对应的墨料室对齐;并且对于每个墨料室,都具有相关联的加热器和晶体管。当功率脉冲按照印刷命令而传递至印刷头时,这些电阻加热器将墨料室中的墨料加热,而在该室中制造一个或多个压力气泡,这迫使墨料以小液滴形式喷射穿过对应的孔而到达印刷介质上。
这些电阻加热器以及喷嘴板中的对应的孔已经根据印刷头的取向而排列成至少两列或两行。单行中的加热器和喷嘴相对于彼此偏置设置,并且这些列中的每一列都相对于彼此竖直地或水平地偏置。使用加热器和喷嘴的这种类型的设置来使一列中的加热器之间的串扰最小化,这种串扰可能造成墨料液滴的点火不良(misfiring)。已经提供了多路复用驱动电路来控制点火时间,使得一列中的相邻加热器并不同时被点火,以便将点火的加热器之间的串扰最小化。多路复用还可以减小电路中信号线的数目以及完成这些电路所需的面积,由于来自挠性电路上的其他电气部件的拥挤,该面积成为了一种额外的益处。
发明内容:
一种喷墨印刷系统的实施方案包括与墨料储存器处于流体连同的印刷头。该印刷头包括多个喷嘴以及多个相关联的墨料喷射室,每个喷射室与控制相应加热器的多个晶体管驱动器中的对应的晶体管驱动器相关联。该加热器响应印刷命令信号而启动,并且从该室中将墨料液滴喷射出,并穿过这些喷嘴到达印刷介质上。与该印刷头电连通的控制器产生这些印刷命令信号,这些信号标示出这些有待启动的晶体管驱动器和加热器,并且标示出这些晶体管驱动器和加热器相对彼此的启动顺序,以便完成印刷操作。
在一个实施方案中,一种喷墨印刷系统包括印刷头,该印刷头与墨料储存器处于流体连通,并且具有多个孔以及对应的多个相关联的喷射室。该印刷头包括基底以及布置在该基底上的阻挡层。该阻挡层部分地限定了多个流体通道以及这多个喷射室。该阻挡层包括选自基于环氧树脂的光致抗蚀剂材料以及基于甲基丙烯酸甲酯的光致抗蚀剂材料中的一种材料。在该基底上布置了孔板。该孔板包括与这些喷射室处于流体连通的这多个孔。该孔板包括选自聚酰亚胺和镍的一种材料。
该印刷头可以附连到一种带式自动结合的(TAB)挠性电路的一端上,在其上远离印刷头之处具有电互连件。在一个实施方案中,该TAB挠性电路被安装在喷墨印刷盒的鼻形部上,并且该电互连件相对于印刷头成锐角布置。
附图说明:
参照在附图中展示的本发明的具体实施方案,将对以上简要说明的本发明进行更具体的说明。应理解,这些附图仅描绘了本发明的典型实施方案并且因此不应视为对其范围进行限制,本发明将借助这些附图进行更为确切和详细的说明和解释。
图1是一种带式自动结合(TAB)挠性电路的一个示意性透视图。
图2是上面安装了该TAB挠性电路的印刷墨盒的透视图,示出了该TAB挠性电路的电互连件。
图3是上面安装了该TAB挠性电路的印刷墨盒的透视图,示出了该TAB挠性电路的印刷头。
图4是与该TAB挠性电路一起使用的印刷头的示意性电路布局。
图5是具有墨料槽缝、多个墨料流体通道、多个喷射室和带有喷嘴的喷嘴板的印刷头的立面局部示意图。
图6是沿图5的线6-6截取的印刷头的截面视图。
图7是该印刷头的局部的透视截面图。
图8是该印刷头的立面的截面示意图,示出了该印刷头的多个电路部件和层。
图9A是本发明的一个实施方案的电互连件的截面视图。
图9B是本发明的另一个实施方案的电互连件的截面视图。
图10是喷射室的一个实施方案的俯视图。
图11是图10的喷射室的一个侧视图。
具体实施方式:
现在详细参考与本发明一致的实施方案,其实施例在附图中进行了展示。在任何可能之处,贯穿这些附图使用相同的附图标记,并且它们指代相同或相似的部分。虽然下面是参照热喷墨印刷机来对本发明进行说明,但本发明并不受限于此,并且可以结合到利用其他技术(如压电传感器)的其他喷墨印刷系统中来喷射墨料。如在此使用的,术语“喷嘴”应指代在印刷头盖板上形成的孔,墨料穿过这些孔被喷射出来,和/或还应包括该印刷头的这些的孔以及其他部件,如墨料从其中被喷射出来的喷射室。此外,所描述的用于喷墨印刷系统的系统以及方法并不限于使用安装在墨盒壳体(可以是或可以不是一次性的墨盒)上的印刷头组件所进行的应用。本发明可以与永久安装在印刷系统中的印刷头一起使用,并且提供了对印刷而言必要的墨料供应装置。因此术语“墨盒”可以仅包括永久安装的印刷头和/或包括印刷头与墨料来源的组合。
本披露涉及一种由提供了对溶剂基墨料具有耐受性的材料构成的热喷墨印刷头。具体地,这些印刷头部件包括多种材料以及表面处理,它们提供了一种印刷头组件,其在数月或数年地暴露于强溶剂中时并不显著地溶解、层离、收缩、溶胀或以其他方式变形。具体地,该系统优选能够将一种基于有机溶剂的墨料保存至少六个月的时期,优选至少12个月,而同时维持该印刷系统的全部功能。该系统还优选地能够在至少三个月的使用期内印刷基于有机溶剂的墨料,而同时维持全部功能。优选地,使用基于有机溶剂的墨料并不会在所指定的时期内造成这些印刷头材料的任何将实质上影响系统印刷性能的溶解、层离、收缩或溶胀。考虑用于该印刷系统的有机溶剂包括酮类,尤其是甲基乙基酮、丙酮以及环己酮;醇类,尤其是乙醇;酯类;极性无质子溶剂,以及它们的组合。
该热喷墨印刷头可以结合带式自动结合的(TAB)挠性电路。关于图1,示出了TAB挠性电路10,该挠性电路包括在挠性电路10的末端上的印刷头11以及用于与印刷系统进行电连接的远侧的电互连件12。TAB挠性电路10(包括印刷头11和电互连件12在内)优选地被安装在如图2和3所示的喷墨盒13上。该墨盒13包括鼻形部分14,印刷头11和电互连件12被安装在其上。在图2和3所示的实施方案中,鼻形部14可以具有其上附连了印刷头11的第一表面15以及其上附连了电互连件12的第二表面16,其中电互连件12相对于印刷头11成锐角布置。TAB挠性电路10,如下面更详细地解释的,优选是两层系统,包括支撑用于电连接到印刷控制器(未示出)上的电接触垫片42的膜基底,以及提供从这些接触垫片42到印刷头11的电连接的轨迹47和内部导线43。
关于图4、5、6和7,展示了印刷头11的示意性布局和截面图。印刷头11包括硅芯片基底14,其上形成了多个薄膜结构46,这些薄膜结构提供了电阻加热器18以及对供给电阻加热器18的功率脉冲进行切换的对应的NMOS驱动器19的阵列。墨料槽缝20的中心在印刷头11上,以便从固定在墨盒壳体13A中的本体墨料来源中将墨料经由多个流体通道22供应至多个点火室(firing chamber)21。如下面更详细地解释的,在这些薄膜结构46上形成了墨料阻挡层35,并且该层被蚀刻而形成了流体网络,该网络包括这些流体通道22和点火室21。喷嘴板23连接到该墨料阻挡层35上,并且包括多个喷嘴24,其中每个喷嘴24与点火室21相关联,用于响应来自印刷系统控制器(未示出)的印刷命令而以小液滴形式喷射墨料。
参见图4,以上标示的内部导线43(图1)连接到沿着印刷头11的周长布置的多个结合垫片48上。此外,可以在印刷头11上提供识别电路49,用于标记关于印刷头特征的编码信息。而且,可以提供多个基底加热器50来在开始印刷操作之前将墨料预热。
图8中示出了印刷头11的一个截面视图,并且提供了印刷头11的这些薄膜半导体装置的详细展示,包括这些驱动器/晶体管19以及电阻加热器18。这些半导体装置和电子电路是使用真空沉积技术和照相平版印刷术在该硅芯片基底14上制造的。芯片基底14优选是一种n型硅晶片。在将被这些晶体管19占据的区域之外的芯片14表面上施加含二氧化硅的、有图案的场氧化层25,这些晶体管包括漏极28、源极29和门极区域27。层25可以通过湿氧化物或化学气相沉积(CVD)来热生长二氧化硅而形成。此外,在这些晶体管19的门极区域27顶部形成了氧化物层和多晶硅导体51。一种内层电介质26,包括多层氧化物膜,例如低压化学气相沉积氧化物层、化学气相沉积氧化物层、磷硅酸盐玻璃层以及硼磷硅玻璃(“BPSG”)层,被沉积在基底14的、除晶体管19的源极29和漏极28区域之外的所有区域上。
美国专利号5, 774,148披露了一种内层电介质,该内层电介质在CVD氧化物顶部具有BPSG;然而,已知BPSG易于出现热冲击疲劳。此外,这些加工工具和制造工艺要求特殊的注意。在本主题发明的印刷头11中,使用等离子体增强的或低压的化学气相压力工艺在BPSG的顶部沉积了额外的氧化物层。该额外的氧化物层与BPSG相比是更耐热应力的。在美国专利申请公开号U.S. 20060238576 A1中披露了一种类似的结构。
这些电阻加热器18制造在NMOS驱动器或晶体管19的顶部。这些电阻加热器18包括热阻挡层30、电阻性膜31、导体层32、钝化层33、汽蚀保护层34以及在顶部形成了结合垫片48的Au层36。该阻挡层30包括沉积在该ILD层26上的TiN膜。该电阻性膜31优选包括沉积在TiN阻挡层30上的TaAl层;并且该导体32优选包括沉积在TaAl电阻性膜31上的AlCu膜。TiN阻挡层30、电阻性膜31和导体32是使用溅射沉积工艺沉积的,并接着根据印刷头11的预定设计而通过光刻法来蚀刻。接着在相同的掩蔽步骤中将TiN阻挡层30、TaAl电阻性膜31和导体32三者以光刻法一起形成图案,使得该TiN阻挡层被置于ILD层26与TaAl电阻性膜31之间并且完全在TaAl电阻性膜31下面延伸。此外,该TiN阻挡层与这些晶体管19的源极27和漏极28处于直接接触中。
TaAl电阻性膜31相对于晶体管19的源极27和漏极28的布置与美国专利号5,122,812中披露的构型不相同,该专利披露了与晶体管部件处于直接接触的电阻性膜。在本发明中,该TiN阻挡膜30在TaAl电阻性膜31的所有区域下方延伸,使得电阻性膜31不与晶体管19的部件相接触,或者不是沉积在后者上。此外,TiN阻挡层30用作电阻性膜31下面的热冲击阻挡层,该电阻性膜用作该点火室18的加热器。TiN阻挡物30具有比电阻性膜31更高的薄层电阻,以确保大部分电脉冲功率被引导穿过电阻性膜31。此外,TiN阻挡膜30具有比ILD层26更高的热传导率;因此,TiN阻挡物30用作在点火过程中由它以及电阻性膜31所产生的热量的热量扩散层。
通过使用湿式蚀刻工艺将TaAl电阻性膜31顶部的AlCu导体32局部溶解,从而将其上布置有点火室21的加热器区域暴露出来,该湿式蚀刻工艺允许导体32在与TaAl电阻性膜30的接点处是锥形的,如图8中所示。该钝化层33包括氮化硅和碳化硅层,优选是通过PECVD沉积在导体32顶部。接着将该包括钽(Ta)层的汽蚀层34优选通过溅射沉积而沉积在钝化层33上。
如以上描述的,墨料流动网络包括墨料槽缝20以及流体通道22以便将墨料从本体来源引导至这些点火室21。在这些NMOS驱动器或晶体管19以及电阻加热器18之上形成了墨料阻挡层35。为了与典型地用于高性能工业墨料的强有机溶剂如酮类,尤其是甲基乙基酮、丙酮和环己酮;醇类,尤其是乙醇;酯类;醚类;极性无质子溶剂,以及它们的组合一起使用,可以使用一种基于环氧/酚醛清漆树脂或基于甲基丙烯酸甲酯的负型光致抗蚀剂。基于环氧/酚醛清漆树脂的光致抗蚀剂的一个实例是SU-8
3000 BX,由MicroChem Corporation制造。基于环氧/酚醛清漆的光致抗蚀剂的另一个实例是PerMX
3000,由DuPont制造。基于甲基丙烯酸甲酯的光致抗蚀剂的一个实例是Ordyl
PR100丙烯酸干膜,由Toyko Ohka Kogyo制造。该墨料阻挡层35被层叠在整个模口表面上,包括晶体管19、电阻加热器18、流体通道22和墨料槽缝20。提供带有墨料流动网络(包括这些流体通道22和点火室21)的掩膜,并且穿过该掩膜将光致抗蚀剂暴露于紫外光源中。照射水平可以根据用于阻挡层35的材料类型而变化。例如,用于SU-8 3000光致抗蚀剂的照射水平可以是在从约150
mJ至约250 mJ的范围内。用于PerMX
3000光致抗蚀剂的照射水平可以是在从约300 mJ至约500 mJ的范围内。用于PR100光致抗蚀剂的照射水平可以是在从约65 mJ至约200
mJ的范围内。照射之后,在高压洗涤步骤中使用一种溶剂使该阻挡层35和流体构造显影,该溶剂去除了未暴露的聚合物,留下了所希望的结构。
墨料阻挡层35的厚度、以及这些点火室21和流体通道22的尺寸可以根据印刷需求而变化。关于图6和7,展示了一种代表性的流体通道22以及具有一种类似于期满的美国专利号4,794,410中所披露的三壁21A构型的点火室21。在一个优选实施方案中,这些电阻加热器18的边缘与这些点火室21的壁21A间隔开约25 μm或更小。
图10和11展示了另一种代表性的流体通道22和点火室21。阻挡层35的构造限定了将墨料从墨料槽缝20传递至点火室21的多个特征。可以对阻挡层35的尺寸进行选择,使得能够得到最佳的运行参数,如在给定的抛射距离范围内的运行频率和印刷品质。在一个优选实施方案中,孔板23具有约50 μm的厚度A;墨料阻挡层35具有约35 μm的厚度B;孔24具有约35至45 μm、优选38至42 μm的直径C;该电阻器具有在65 μm与75 μm之间、优选68 μm与73 μm之间的长度D;这些流体通道22具有约30 μm的长度E以及约50 μm的宽度F;并且这些室21可能是约50 μm x 50 μm至约80 μm x 80 μm。
由于基于有机溶剂的墨料与水性墨料相比不同的特性,已发现应该对基于溶剂的墨料使用一种与用于水性墨料的不相同的流动构造。具体地,基于溶剂的墨料产生了比水性墨料更小的气泡。为了增大气泡的尺寸和速度,可以使用比用于水性墨料的更大的电阻器18。具体地,该电阻器的长度与孔的直径之比是大于对水性墨料所使用的。电阻器长度D与孔直径C之比优选是在1.7与2.1之间。
使用之前描述的应用于基底14的照相平版印刷术步骤来在该带有预定尺寸的墨料槽缝20的临时光致抗蚀剂层中形成开口,并且因此暴露出基底14。所暴露的、旨在用于墨料槽缝20的区域在用于形成墨料槽缝20的喷砂步骤之前被去掉了任何膜。接着使用一台X-Y扫描喷砂机器将基底14一次喷砂一侧以形成墨料槽缝20。这个步骤与美国专利号6,648,732中披露的技术不同,该专利披露了包括在芯片基底上形成多个薄膜层的工序,并且穿过这多个薄膜层在墨料槽缝区域内形成了墨料槽缝,以在喷砂工序过程中防止碎屑。根据本发明的实施方案,从旨在用于墨料槽缝20的这些区域中将形成了电阻加热器18和晶体管19的膜去除,使得芯片基底14直接暴露于喷砂作用。
可以使用双侧喷砂过程来形成墨料槽缝20。之后,如以上描述来形成电阻加热器18和晶体管19并将其蚀刻,穿过该芯片基底14形成该墨料槽缝20。在该晶片或芯片基底17的两侧上层叠有单一的光敏性厚膜或光致抗蚀剂。这个过程与美国专利号6,757,973中所披露的技术不同,该专利披露了结合有一种双光致抗蚀剂层的技术。
参见图5、6和7来讨论喷嘴板23和喷嘴24的设置。使用热结合步骤将具有喷嘴24(也称为“孔”或“喷嘴孔”)阵列的如以上描述的聚酰亚胺喷嘴板23机械地并且化学地结合到该墨料阻挡层35上。该喷嘴板的表面可以被处理,以物理地和/或化学地对此光滑的、非反应性的表面进行改性,由此增强物理接触和化学结合。化学处理(如苛性碱或氨蚀刻)通过将表面层化学改性为更具反应性的官能团而起作用。高能量的表面处理用高能原子或分子来轰击该表面。已知化学蚀刻和高能量的表面处理均改变了表面的化学和物理性质。
为了与以上描述的强有机溶剂和以上描述的阻挡层一起使用,可以使用一种氧等离子体蚀刻的聚酰亚胺材料。可以使用的聚酰亚胺的实例是以Kapton
®、Kaptrex和Upilex
®的名称出售的。除氧等离子体蚀刻之外,可以用于聚酰亚胺膜的表面处理包括铬原子轰击或苛性碱蚀刻。替代地,可以使用镀金的镍基孔板。
这些喷嘴24中的每一个都与一个对应的电阻加热器18和点火室21对齐。喷嘴板23与墨料阻挡层35结合而形成点火室21,这与美国专利号5,907,333、6,045,214和6,371,600中披露的印刷头不同,这些专利将这些流体通道和点火室整合成该喷嘴板的一部分。此外,电阻加热器的导体与喷嘴板并不像美国专利号5,291,226中所披露的那样是一个整体。
喷嘴板23可以由一卷以连续方式加工的原聚酰亚胺膜来制造,其方式是使该薄膜通过掩膜引导的激光切割站以穿过该薄膜而切割/钻出这些喷嘴孔24。然后使这卷薄膜穿过助黏附剂浴来对其进行处理。也可以对该喷嘴板材料应用其他的表面处理。在将该膜清洁和干燥之后,从这个卷中冲压出单独的喷嘴板。一般,可以在该材料处于卷的形式时或者在形成单独的喷嘴板之后对喷嘴板材料进行处理。然而,优选将喷嘴板的处理与组装到印刷头之间的时间段最小化,以避免材料特性的任何退化。
关于本发明的一个实施方案,印刷头11上的电阻加热器18的阵列以及喷嘴板23上的喷嘴24包括跨过印刷头11上约½英寸距离的两个行/列。取决于印刷头11的取向,可以将这些喷嘴24安排成多个列或行。出于对本发明的一个实施方案进行说明的目的并且参照图5,将喷嘴24安排成两列51和52。每列喷嘴24包括六十四个喷嘴以提供两百四十点每英寸的分辨率(“240 dpi”)。在各个喷嘴列51和52中,相邻的喷嘴24是相对于彼此水平偏置的。此外,如虚线36所示,列51中的喷嘴24相对于另一列52中的喷嘴24竖直地偏置开。在以印刷头11为中心的半个直线英寸区域中,每列包括六十四(64)个喷嘴。每列中的喷嘴可以彼此竖直地间隔开1/120英寸的距离d1。列51中的喷嘴24相对于第二列52中的喷嘴24竖直地偏置开距离d2或1/240英寸,以实现240 dpi的竖直点密度。该印刷头11可以产生的墨料液滴所具有的体积能提供与相邻印刷点的某种重叠。例如,所选择的体积可以在印刷介质上产生直径约106 μm至约150 μm的墨料点,其中目标直径为约125 μm至130 μm、相邻液滴之间的重叠为12 μm。利用这些选定的体积,在一个实施方案中,任何一个喷嘴20可以点火的最大频率是约7.2 kHz,但更高的频率是有可能的。
将喷嘴板23组装到墨料阻挡层35上在某些方面与美国专利号4,953,287中披露的热结合方法相同。在第一个步骤中,将喷嘴板23和阻挡层35目测对齐,并且通过在升高的温度下在喷嘴板23的不同点处施加压力来使用热压缩方法使之粘在一起。这可以对每个喷嘴板23单独地进行。接着使多个喷嘴板23再次经历热压缩过程,其中对喷嘴板23的所有区域都施加预定时间的、升高温度下的恒定压力。这个过程可以在单个步骤中在多个喷嘴板23上进行。在喷嘴板23已经紧固到阻挡层35上之后,使整个印刷头11 在200°C至250°C范围内的温度下加热约2小时,以固化该阻挡层35。
还可以使用助黏附剂来改进喷嘴板23与阻挡层35之间、以及基底14与阻挡层35之间的结合。使用助黏附剂(也称为偶联剂)是一种改进界面粘附性的方法。然而,寻找一种在具体应用中有效的助黏附剂可能是一项挑战。在选择一种适当的助黏附剂时考虑了关键的阻挡层/孔板界面的表面化学。该助黏附剂可以选自:甲基丙烯酸硅烷、铬甲基丙烯酸酯络合物、锆铝偶联剂(zircoaluminate)、氨基硅烷、巯基硅烷、氰基硅烷、异氰酸基硅烷、四烷基钛酸酯、四烷氧基钛酸酯、氯苄基硅烷、氯化的聚烯烃、二氢咪唑硅烷、琥珀酸酐硅烷、乙烯基硅烷、脲基硅烷以及环氧硅烷。
现在对TAB 10的制造进行说明。TAB 10可以使用多种已知用来形成两层或三层挠性电路的方法来进行制造。该三层式挠性电路包括聚酰亚胺薄膜层37(在图9B中示出),该层通过粘合剂层39而层叠在铜层38上。将该聚酰亚胺层37穿孔或冲孔以形成这些链轮洞40以及接触垫片洞41。接着对铜层38施加照相平版印刷术工序以形成包括这些接触垫片42的TAB导体电路,这些接触垫片建立了到印刷系统、到这些轨迹47以及内部导线43上的电连接,这些轨迹和内部导线建立了到印刷头11的电路上的电连接。可以在这些铜层38上丝网印刷耐溶剂的环氧/酚醛清漆树脂、聚酰亚胺或甲基丙烯酸甲酯的层44,以提供电绝缘并且保护免于化学侵蚀。替代地,可以使用模切的热塑性膜如EAA膜来提供电绝缘和化学保护,并且提供用于将TAB电路附接到鼻形部上的装置。使用已知的镀层或电镀工序来使TAB
10的聚酰亚胺层37侧上暴露出的铜区域经历镀金。
对于图9A所示的两层式TAB 10,使用已知的技术如化学气相沉积或电镀而在聚酰亚胺层37上沉积铬结系层。接着将铜层电镀到铬上并接着进行图案蚀刻以形成导体电路38。然后在使用一种照相平版印刷术掩膜技术来建立这些触点洞41的排列以及用于内部导线43的窗口之后,对该聚酰亚胺层37进行蚀刻。如以上描述地施加该绝缘/保护层44并镀金以完成这个过程。该两层式TAB 10的优点是它不使用粘合剂层,因为粘合剂层会被有机溶剂溶解。
参见图1,该TAB挠性电路10包括多个电接触垫片42以及内部导线43。此外,该导体电路还包括外围的多个镀铜的汇流条45以及从接触垫片42到汇流条45而确定路径的多个电极(未示出)。在与印刷头11相邻的区域处,这些内部导线43的路径是从汇流条45到在印刷头11上的结合垫片48。在一个实施方案中,该TAB 10是七十毫米宽,因此在TAB 10上有足够的空间来将这些电极引导至外围的汇流条45,如在TAB挠性电路的制造中典型地进行的。这种导体布局与美国专利号4,944,850、4,989,317和5,748,209中披露的、由于拥挤的导体部局而结合有桥接技术的那些布局不相同。
可以使用一种封装剂来保护这些将TAB挠性电路10连接到印刷头上的金属导线。还可以使用一种封装剂来保护TAB挠性电路10的其他区域。该封装剂应该经受住在有机溶剂中的暴露而不溶胀或损失对碳化硅、金、铜以及聚酰亚胺的粘附性。总体上,该封装剂材料优选是一种快速固化的基于环氧树脂的粘合剂体系,该体系是针对稳健的耐化学性以及对工程塑料和硅薄膜的粘附性而设计的。Emerson
& Cuming LA3032-78是一种优选的封装剂,因为它在暴露于有机溶剂墨料中时展现了不显著的溶胀并且具有良好的对聚酰亚胺的粘附性。还可以使用Emerson
& Cuming A316-48或GMT Electronic
Chemicals B-1026E。
该TAB挠性电路10可以用热熔性结合膜如3M Corporation制造的一种(3M结合膜#406)而附接到该鼻形部分14上。在一个实施方案中,该结合膜被用于将TAB挠性电路10上的聚酰亚胺和金属粘到鼻形部分14的PPS材料上。该结合膜可以是乙烯丙烯酸共聚物(EAA)的单层,并且也可以用于提供电保护和化学保护。也可以使用直接热熔接与粘合剂的组合来将TAB挠性电路附接到鼻形部分14上。
可以使用粘合剂将印刷头11附接到墨盒壳体13A上。该粘合剂应该能够经受住在有机溶剂中的暴露,并且像之前描述的封装剂材料一样,可以是一种快速固化的基于环氧树脂的粘合剂体系,该体系是针对稳健的耐化学性以及对工程塑料和硅薄膜的粘附性而设计的。Emerson
& Cuming E-3032是一种合适的粘合剂。其他适当的粘合剂包括Loctite
190794、Loctite 190665、以及Master Bond 10HT。
虽然已经在此显示并说明了本发明的优选实施方案,但很明显,此类实施方案仅是以举例的方式提供并且无任何限制作用。本领域的普通技术人员在不背离本发明的传授内容的情况下将想到许多变体、改变和替换。因此,所预期的是在所附权利要求书的全部精神和范围内来对本发明进行解释。
Claims (17)
1.一种喷墨印刷系统,包括:
印刷头,该印刷头与墨料储存器处于流体连通,并且具有多个孔以及对应的多个相关联的喷射室,该印刷头包括:
基底;
布置在该基底上的阻挡层,该阻挡层部分地限定了多个流体通道以及该多个喷射室,其中该阻挡层包括选自基于环氧树脂的光致抗蚀剂材料以及基于甲基丙烯酸甲酯的光致抗蚀剂材料中的一种材料;
布置在该基底之上的孔板,该孔板包括与这些喷射室处于流体连通的该多个孔,其中该孔板包括选自聚酰亚胺和镍中的一种材料;而且该孔板的表面用一种方法进行了处理,该方法选自O2等离子体处理、铬原子轰击、以及苛性碱蚀刻;以及,
还包括助黏附剂,其布置在该阻挡层与该孔板之间;
其中该系统能够将基于有机溶剂的墨料储存至少六个月的时期,该有机溶剂选自酮类、醇类、酯类、醚类、极性无质子溶剂以及它们的组合,在这至少六个月的时期中,印刷头材料的任何溶解、层离、收缩、或溶胀都不会实质地影响该系统的印刷性能。
2.如权利要求1所述的喷墨印刷系统,其中该有机溶剂是选自MEK、乙醇、丙酮、以及环己酮。
3.如权利要求1所述的喷墨印刷系统,其中该阻挡层包括SU-8环氧树脂。
4.如权利要求1所述的喷墨印刷系统,其中该阻挡层包括PerMX环氧树脂。
5.如权利要求1所述的喷墨印刷系统,其中该阻挡层包括Ordyl丙烯酸类光致抗蚀剂材料。
6.如权利要求1所述的喷墨印刷系统,其中该助黏附剂包括选自以下各项中的一种材料:甲基丙烯酸硅烷、铬甲基丙烯酸酯络合物、锆铝偶联剂、氨基硅烷、巯基硅烷、氰基硅烷、异氰酸基硅烷、四烷基钛酸酯、四烷氧基钛酸酯、氯苄基硅烷、氯化的聚烯烃、二氢咪唑硅烷、琥珀酸酐硅烷、乙烯基硅烷、脲基硅烷以及环氧硅烷。
7.如权利要求1所述的喷墨印刷系统,进一步包括助黏附剂,其布置在该阻挡层与该基底之间。
8.如权利要求1所述的喷墨印刷系统,其中该印刷头通过基于环氧树脂的粘合剂而安装到墨盒上。
9.如权利要求8所述的喷墨印刷系统,其中该基于环氧树脂的粘合剂是Emerson & Cuming E3032。
10.如权利要求1所述的喷墨印刷系统,其中该印刷头设置在墨盒上,该喷墨印刷系统进一步包括设置在该墨盒上的带式自动结合的挠性电路。
11.如权利要求10所述的喷墨印刷系统,其中该带式自动结合的挠性电路包括一种基于聚酰亚胺的材料。
12.如权利要求10所述的喷墨印刷系统,其中该带式自动结合的挠性电路通过热塑的热熔性粘合剂而热熔接到该墨盒上。
13.如权利要求12所述的喷墨印刷系统,其中该粘合剂是选自EAA和PPS膜。
14.如权利要求10所述的喷墨印刷系统,其中该带式自动结合的挠性电路的至少一部分由电子等级的环氧树脂封装剂所封装。
15.一种用于制备印刷头系统的方法,该印刷头系统包括印刷头,该印刷头与墨料储存器处于流体连通,并且具有多个孔以及对应的多个相关联的喷射室,该方法包括:
提供基底;
将一种光致抗蚀剂材料布置在该基底上,其中该光致抗蚀剂材料是选自基于环氧树脂的光致抗蚀剂材料以及基于甲基丙烯酸甲酯的光致抗蚀剂材料;
提供UV光源;
在该UV光源与该光致抗蚀剂材料之间提供掩模;
将该光致抗蚀剂材料暴露于该UV光源,以便使该光致抗蚀剂材料聚合在该基底上形成阻挡层,该阻挡层部分地限定了多个流体通道以及该多个喷射室;并且
将孔板附接在该基底之上,该孔板包括与这些喷射室处于流体连通的该多个孔,其中该孔板包括选自聚酰亚胺和镍中的一种材料;其中,
在附接该孔板之前,在该阻挡层与该孔板之间提供助黏附剂。
16.如权利要求15所述的方法,进一步包括,使用基于环氧树脂的粘合剂将该印刷头安装到墨盒上。
17.如权利要求15所述的方法,进一步包括,使用热塑的热熔性粘合剂将带式自动结合的挠性电路热熔接到墨盒上。
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PCT/US2010/040135 WO2011008485A2 (en) | 2009-06-29 | 2010-06-28 | A thermal inkjet print head with solvent resistance |
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Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8960886B2 (en) | 2009-06-29 | 2015-02-24 | Videojet Technologies Inc. | Thermal inkjet print head with solvent resistance |
US20120091121A1 (en) * | 2010-10-19 | 2012-04-19 | Zachary Justin Reitmeier | Heater stack for inkjet printheads |
US8870345B2 (en) * | 2012-07-16 | 2014-10-28 | Xerox Corporation | Method of making superoleophobic re-entrant resist structures |
EP3129440B1 (en) | 2014-04-10 | 2021-06-16 | 3M Innovative Properties Company | Adhesion promoting and/or dust suppression coating |
US9808812B2 (en) * | 2014-06-20 | 2017-11-07 | The Procter & Gamble Company | Microfluidic delivery system |
US9434165B2 (en) * | 2014-08-28 | 2016-09-06 | Funai Electric Co., Ltd. | Chip layout to enable multiple heater chip vertical resolutions |
US11578222B2 (en) | 2015-09-15 | 2023-02-14 | Videojet Technologies Inc. | High adhesion TIJ ink |
US10864719B2 (en) | 2016-02-24 | 2020-12-15 | Hewlett-Packard Development Company, L.P. | Fluid ejection device including integrated circuit |
EP3947576A1 (en) | 2019-04-30 | 2022-02-09 | Videojet Technologies, Inc. | Industrial thermal inkjet inks |
CN114506077B (zh) * | 2021-12-28 | 2024-07-05 | 杭州捷诺飞生物科技股份有限公司 | 一种热泡式阵列微滴打印喷头、打印设备及其打印方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6161923A (en) * | 1998-07-22 | 2000-12-19 | Hewlett-Packard Company | Fine detail photoresist barrier |
Family Cites Families (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4794410A (en) | 1987-06-02 | 1988-12-27 | Hewlett-Packard Company | Barrier structure for thermal ink-jet printheads |
US4953287A (en) | 1987-07-01 | 1990-09-04 | Hewlett-Packard Company | Thermal-bonding process and apparatus |
US4882595A (en) | 1987-10-30 | 1989-11-21 | Hewlett-Packard Company | Hydraulically tuned channel architecture |
US4989317A (en) | 1988-11-21 | 1991-02-05 | Hewlett-Packard Company | Method for making tab circuit electrical connector supporting multiple components thereon |
US4944850A (en) | 1989-12-18 | 1990-07-31 | Hewlett-Packard Company | Tape automated bonded (tab) circuit and method for making the same |
US5291226A (en) | 1990-08-16 | 1994-03-01 | Hewlett-Packard Company | Nozzle member including ink flow channels |
JPH04161341A (ja) * | 1990-10-25 | 1992-06-04 | Fuji Xerox Co Ltd | インクジェット記録ヘッドの製造方法 |
US5122812A (en) | 1991-01-03 | 1992-06-16 | Hewlett-Packard Company | Thermal inkjet printhead having driver circuitry thereon and method for making the same |
JP3118039B2 (ja) * | 1991-10-29 | 2000-12-18 | キヤノン株式会社 | インク滴噴射記録ヘッド及びそれを用いる記録方法 |
JPH06226977A (ja) * | 1993-02-01 | 1994-08-16 | Ricoh Co Ltd | インクジェットヘッド |
US5748209A (en) | 1994-10-31 | 1998-05-05 | Hewlett-Packard Company | Thermal ink jet tab circuit having a plurality of trace groups wherein adjacent traces in each group are staggered |
DE69625002T2 (de) * | 1995-08-28 | 2003-07-31 | Lexmark International Inc., Greenwich | Verfahren zum Bilden einer Düsenstruktur für einen Tintenstrahldruckkopf |
US5774148A (en) | 1995-10-19 | 1998-06-30 | Lexmark International, Inc. | Printhead with field oxide as thermal barrier in chip |
US5859655A (en) | 1995-10-30 | 1999-01-12 | International Business Machines Corporation | Photoresist for use in ink jet printers and other micro-machining applications |
US6162589A (en) * | 1998-03-02 | 2000-12-19 | Hewlett-Packard Company | Direct imaging polymer fluid jet orifice |
US6155674A (en) * | 1997-03-04 | 2000-12-05 | Hewlett-Packard Company | Structure to effect adhesion between substrate and ink barrier in ink jet printhead |
US6045214A (en) | 1997-03-28 | 2000-04-04 | Lexmark International, Inc. | Ink jet printer nozzle plate having improved flow feature design and method of making nozzle plates |
US5907333A (en) | 1997-03-28 | 1999-05-25 | Lexmark International, Inc. | Ink jet print head containing a radiation curable resin layer |
US6145963A (en) * | 1997-08-29 | 2000-11-14 | Hewlett-Packard Company | Reduced size printhead for an inkjet printer |
US6179413B1 (en) * | 1997-10-31 | 2001-01-30 | Hewlett-Packard Company | High durability polymide-containing printhead system and method for making the same |
US6371600B1 (en) | 1998-06-15 | 2002-04-16 | Lexmark International, Inc. | Polymeric nozzle plate |
JP2001010056A (ja) * | 1998-12-29 | 2001-01-16 | Canon Inc | 液体吐出ヘッド、液体吐出方法、および液体吐出記録装置 |
JP3757699B2 (ja) * | 1999-09-08 | 2006-03-22 | コニカミノルタホールディングス株式会社 | インクジェットヘッド及びその製造方法 |
JP2002025948A (ja) * | 2000-07-10 | 2002-01-25 | Canon Inc | ウエハーの分割方法、半導体デバイス、および半導体デバイスの製造方法 |
KR20020009828A (ko) | 2000-07-27 | 2002-02-02 | 윤종용 | 잉크 젯 프린트 헤드의 비아홀 형성방법 |
US6386679B1 (en) * | 2000-11-08 | 2002-05-14 | Eastman Kodak Company | Correction method for continuous ink jet print head |
JP2002205407A (ja) * | 2001-01-10 | 2002-07-23 | Canon Inc | インクジェットヘッド |
US6648732B2 (en) | 2001-01-30 | 2003-11-18 | Hewlett-Packard Development Company, L.P. | Thin film coating of a slotted substrate and techniques for forming slotted substrates |
US20030052947A1 (en) * | 2001-09-14 | 2003-03-20 | Lin Chen-Hua | Structure of an inkjet printhead chip and method for making the same |
EP1297959A1 (en) * | 2001-09-28 | 2003-04-02 | Hewlett-Packard Company | Inkjet printheads |
KR100396559B1 (ko) * | 2001-11-05 | 2003-09-02 | 삼성전자주식회사 | 일체형 잉크젯 프린트헤드의 제조 방법 |
US6805431B2 (en) * | 2002-12-30 | 2004-10-19 | Lexmark International, Inc. | Heater chip with doped diamond-like carbon layer and overlying cavitation layer |
KR100474423B1 (ko) * | 2003-02-07 | 2005-03-09 | 삼성전자주식회사 | 버블 잉크젯 프린트 헤드 및 그 제조방법 |
US7240991B2 (en) * | 2004-03-09 | 2007-07-10 | Hewlett-Packard Development Company, L.P. | Fluid ejection device and manufacturing method |
KR20060025876A (ko) * | 2004-09-17 | 2006-03-22 | 삼성전자주식회사 | 잉크젯 프린터 헤드 및 그 제조방법 |
JP2006168233A (ja) * | 2004-12-17 | 2006-06-29 | Canon Inc | 液体吐出ヘッドおよびインクジェット記録装置 |
US8167393B2 (en) * | 2005-01-14 | 2012-05-01 | Cabot Corporation | Printable electronic features on non-uniform substrate and processes for making same |
JP2006218671A (ja) * | 2005-02-09 | 2006-08-24 | Ricoh Co Ltd | 液体吐出ヘッド及び画像形成装置 |
TWI250938B (en) | 2005-04-25 | 2006-03-11 | Int United Technology Co Ltd | Inkjet printhead chip |
JP4976739B2 (ja) * | 2006-04-25 | 2012-07-18 | キヤノン株式会社 | 記録ヘッド、およびその製造方法 |
JP5264123B2 (ja) * | 2007-08-31 | 2013-08-14 | キヤノン株式会社 | 液体吐出ヘッド |
JP2012506781A (ja) * | 2008-11-10 | 2012-03-22 | シルバーブルック リサーチ ピーティワイ リミテッド | ヒータの酸化物成長を阻止するために駆動パルスが増加するプリントヘッド |
-
2010
- 2010-06-28 WO PCT/US2010/040135 patent/WO2011008485A2/en active Application Filing
- 2010-06-28 SG SG2011094992A patent/SG177312A1/en unknown
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- 2010-06-28 CN CN201080028854.0A patent/CN102802958B/zh active Active
- 2010-06-28 US US12/824,424 patent/US8454149B2/en active Active
- 2010-06-29 TW TW099121284A patent/TWI534014B/zh active
-
2013
- 2013-04-30 US US13/874,067 patent/US8733900B2/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6161923A (en) * | 1998-07-22 | 2000-12-19 | Hewlett-Packard Company | Fine detail photoresist barrier |
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US20130257989A1 (en) | 2013-10-03 |
EP2448760B1 (en) | 2015-02-11 |
TW201107144A (en) | 2011-03-01 |
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EP2448760A4 (en) | 2013-03-20 |
CN102802958A (zh) | 2012-11-28 |
KR101682416B1 (ko) | 2016-12-05 |
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US8733900B2 (en) | 2014-05-27 |
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