JP4166476B2 - スロットをつけた基板の形成技術 - Google Patents

スロットをつけた基板の形成技術 Download PDF

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Publication number
JP4166476B2
JP4166476B2 JP2002011197A JP2002011197A JP4166476B2 JP 4166476 B2 JP4166476 B2 JP 4166476B2 JP 2002011197 A JP2002011197 A JP 2002011197A JP 2002011197 A JP2002011197 A JP 2002011197A JP 4166476 B2 JP4166476 B2 JP 4166476B2
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JP
Japan
Prior art keywords
layer
substrate
thin film
slot
depositing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002011197A
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English (en)
Japanese (ja)
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JP2002248777A (ja
JP2002248777A5 (enExample
Inventor
ロバート・エイ・プグリース・ジュニア
マーク・エイチ・マッケンジー
トーマス・イー・ペティット
ビクトリオ・エイ・チャヴァリア
スティーブン・ピー・ストーム
アレン・エイチ・スミス
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HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of JP2002248777A publication Critical patent/JP2002248777A/ja
Publication of JP2002248777A5 publication Critical patent/JP2002248777A5/ja
Application granted granted Critical
Publication of JP4166476B2 publication Critical patent/JP4166476B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1631Manufacturing processes photolithography
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1601Production of bubble jet print heads
    • B41J2/1603Production of bubble jet print heads of the front shooter type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1626Manufacturing processes etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1632Manufacturing processes machining
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1642Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1646Manufacturing processes thin film formation thin film formation by sputtering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
JP2002011197A 2001-01-30 2002-01-21 スロットをつけた基板の形成技術 Expired - Fee Related JP4166476B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/772752 2001-01-30
US09/772,752 US6648732B2 (en) 2001-01-30 2001-01-30 Thin film coating of a slotted substrate and techniques for forming slotted substrates

Publications (3)

Publication Number Publication Date
JP2002248777A JP2002248777A (ja) 2002-09-03
JP2002248777A5 JP2002248777A5 (enExample) 2005-04-07
JP4166476B2 true JP4166476B2 (ja) 2008-10-15

Family

ID=25096103

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002011197A Expired - Fee Related JP4166476B2 (ja) 2001-01-30 2002-01-21 スロットをつけた基板の形成技術

Country Status (4)

Country Link
US (2) US6648732B2 (enExample)
EP (2) EP2000309A3 (enExample)
JP (1) JP4166476B2 (enExample)
DE (1) DE60229316D1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100335311B1 (ko) * 1994-09-13 2002-11-14 주식회사 디피아이 내가스체킹성아크릴수지조성물을포함하는도료조성물
US6648732B2 (en) * 2001-01-30 2003-11-18 Hewlett-Packard Development Company, L.P. Thin film coating of a slotted substrate and techniques for forming slotted substrates
JP2004130579A (ja) * 2002-10-09 2004-04-30 Sony Corp 液体吐出ヘッド、液体吐出装置及び液体吐出ヘッドの製造方法
JP2004230770A (ja) * 2003-01-31 2004-08-19 Fuji Photo Film Co Ltd インクジェットヘッド
US7594328B2 (en) * 2003-10-03 2009-09-29 Hewlett-Packard Development Company, L.P. Method of forming a slotted substrate with partially patterned layers
US7784916B2 (en) * 2006-09-28 2010-08-31 Lexmark International, Inc. Micro-fluid ejection heads with multiple glass layers
CN102802958B (zh) * 2009-06-29 2015-11-25 录象射流技术公司 具有耐溶剂性的热喷墨印刷头
US8382253B1 (en) 2011-08-25 2013-02-26 Hewlett-Packard Development Company, L.P. Fluid ejection device and methods of fabrication
US8727499B2 (en) 2011-12-21 2014-05-20 Hewlett-Packard Development Company, L.P. Protecting a fluid ejection device resistor
US9016836B2 (en) 2013-05-14 2015-04-28 Stmicroelectronics, Inc. Ink jet printhead with polarity-changing driver for thermal resistors
US9016837B2 (en) 2013-05-14 2015-04-28 Stmicroelectronics, Inc. Ink jet printhead device with compressive stressed dielectric layer

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2989046A (en) * 1958-06-05 1961-06-20 Paramount Pictures Corp Method for drilling finished holes in glass
DE2604939C3 (de) 1976-02-09 1978-07-27 Ibm Deutschland Gmbh, 7000 Stuttgart Verfahren zum Herstellen von wenigstens einem Durchgangsloch insbesondere einer Düse für Tintenstrahldrucker
US4239954A (en) * 1978-12-11 1980-12-16 United Technologies Corporation Backer for electron beam hole drilling
US4894664A (en) 1986-04-28 1990-01-16 Hewlett-Packard Company Monolithic thermal ink jet printhead with integral nozzle and ink feed
US4862197A (en) 1986-08-28 1989-08-29 Hewlett-Packard Co. Process for manufacturing thermal ink jet printhead and integrated circuit (IC) structures produced thereby
IT1234800B (it) * 1989-06-08 1992-05-27 C Olivetti & C Spa Sede Via Je Procedimento di fabbricazione di testine termiche di stampa a getto d'inchiostro e testine cosi' ottenute
GB2241186A (en) 1990-02-24 1991-08-28 Rolls Royce Plc Anti-sputtercoating
US5105588A (en) * 1990-09-10 1992-04-21 Hewlett-Packard Company Method and apparatus for simultaneously forming a plurality of openings through a substrate
US5703631A (en) 1992-05-05 1997-12-30 Compaq Computer Corporation Method of forming an orifice array for a high density ink jet printhead
JP3196796B2 (ja) 1992-06-24 2001-08-06 セイコーエプソン株式会社 インクジェット記録ヘッドのノズル形成方法
US5308442A (en) 1993-01-25 1994-05-03 Hewlett-Packard Company Anisotropically etched ink fill slots in silicon
BE1007894A3 (nl) * 1993-12-20 1995-11-14 Philips Electronics Nv Werkwijze voor het vervaardigen van een plaat van niet-metallisch materiaal met een patroon van gaten en/of holten.
JPH08267753A (ja) * 1995-03-29 1996-10-15 Brother Ind Ltd ノズルの製造方法
US5658471A (en) 1995-09-22 1997-08-19 Lexmark International, Inc. Fabrication of thermal ink-jet feed slots in a silicon substrate
JP3984689B2 (ja) 1996-11-11 2007-10-03 キヤノン株式会社 インクジェットヘッドの製造方法
US6238269B1 (en) * 2000-01-26 2001-05-29 Hewlett-Packard Company Ink feed slot formation in ink-jet printheads
FR2811588B1 (fr) * 2000-07-13 2002-10-11 Centre Nat Rech Scient Tete d'injection et de dosage thermique, son procede de fabrication et systeme de fonctionnalisation ou d'adressage la comprenant
US6648732B2 (en) * 2001-01-30 2003-11-18 Hewlett-Packard Development Company, L.P. Thin film coating of a slotted substrate and techniques for forming slotted substrates

Also Published As

Publication number Publication date
EP2000309A3 (en) 2009-12-16
EP1226947A1 (en) 2002-07-31
US6945634B2 (en) 2005-09-20
JP2002248777A (ja) 2002-09-03
US20040067319A1 (en) 2004-04-08
DE60229316D1 (de) 2008-11-27
EP2000309A2 (en) 2008-12-10
US6648732B2 (en) 2003-11-18
US20020102918A1 (en) 2002-08-01
EP1226947B1 (en) 2008-10-15

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