JP2002222782A5 - - Google Patents

Download PDF

Info

Publication number
JP2002222782A5
JP2002222782A5 JP2001371089A JP2001371089A JP2002222782A5 JP 2002222782 A5 JP2002222782 A5 JP 2002222782A5 JP 2001371089 A JP2001371089 A JP 2001371089A JP 2001371089 A JP2001371089 A JP 2001371089A JP 2002222782 A5 JP2002222782 A5 JP 2002222782A5
Authority
JP
Japan
Prior art keywords
protective film
metal
forming agent
film forming
chemical mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001371089A
Other languages
English (en)
Japanese (ja)
Other versions
JP4263397B2 (ja
JP2002222782A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001371089A priority Critical patent/JP4263397B2/ja
Priority claimed from JP2001371089A external-priority patent/JP4263397B2/ja
Publication of JP2002222782A publication Critical patent/JP2002222782A/ja
Publication of JP2002222782A5 publication Critical patent/JP2002222782A5/ja
Application granted granted Critical
Publication of JP4263397B2 publication Critical patent/JP4263397B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2001371089A 1998-08-31 2001-12-05 金属用研磨液 Expired - Lifetime JP4263397B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001371089A JP4263397B2 (ja) 1998-08-31 2001-12-05 金属用研磨液

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP24561698 1998-08-31
JP10-245616 1998-12-10
JP35118898 1998-12-10
JP10-351188 1998-12-10
JP2001371089A JP4263397B2 (ja) 1998-08-31 2001-12-05 金属用研磨液

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2000568110A Division JP3337464B2 (ja) 1998-08-31 1999-08-31 金属用研磨液及び研磨方法

Related Child Applications (7)

Application Number Title Priority Date Filing Date
JP2004356962A Division JP2005150757A (ja) 1998-08-31 2004-12-09 金属用研磨液及び研磨方法
JP2004356961A Division JP4448435B2 (ja) 1998-08-31 2004-12-09 金属用研磨液及び研磨方法
JP2007038635A Division JP4448522B2 (ja) 1998-08-31 2007-02-19 金属用研磨液及び研磨方法
JP2007038631A Division JP4448521B2 (ja) 1998-08-31 2007-02-19 金属用研磨液及び研磨方法
JP2007038634A Division JP2007142466A (ja) 1998-08-31 2007-02-19 金属用研磨液及び研磨方法
JP2007038630A Division JP4448520B2 (ja) 1998-08-31 2007-02-19 金属用研磨液及び研磨方法
JP2007038626A Division JP4448519B2 (ja) 1998-08-31 2007-02-19 金属用研磨液及び研磨方法

Publications (3)

Publication Number Publication Date
JP2002222782A JP2002222782A (ja) 2002-08-09
JP2002222782A5 true JP2002222782A5 (enExample) 2005-05-26
JP4263397B2 JP4263397B2 (ja) 2009-05-13

Family

ID=27333376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001371089A Expired - Lifetime JP4263397B2 (ja) 1998-08-31 2001-12-05 金属用研磨液

Country Status (1)

Country Link
JP (1) JP4263397B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7186653B2 (en) * 2003-07-30 2007-03-06 Climax Engineered Materials, Llc Polishing slurries and methods for chemical mechanical polishing
JP2018092960A (ja) * 2015-04-03 2018-06-14 Jsr株式会社 洗浄用組成物および洗浄方法
JP7133414B2 (ja) * 2018-09-20 2022-09-08 株式会社フジミインコーポレーテッド 研磨用組成物

Similar Documents

Publication Publication Date Title
JP4074434B2 (ja) 半導体の製造に適した構造化ウェハを修正するための加工液およびその方法
TWI248970B (en) Tantalum barrier removal solution
KR100653797B1 (ko) 반도체 장치의 제조 방법
JP4253141B2 (ja) 化学機械研磨用スラリおよび半導体装置の製造方法
JP2010114446A5 (enExample)
WO2015122072A1 (ja) 半導体ウェーハの製造方法
JP2001185515A5 (enExample)
JP7144146B2 (ja) タングステンのための化学機械研磨法
TW200540240A (en) Chemical-mechanical polishing composition and method for using the same
JPWO2004030062A1 (ja) 研磨剤組成物、その製造方法及び研磨方法
JP4756814B2 (ja) ルテニウムｃｍｐ用溶液及びこれらを利用するルテニウムパターン形成方法
JP2002222782A5 (enExample)
JP4719204B2 (ja) 化学機械研磨用スラリおよび半導体装置の製造方法
TWI256415B (en) Slurry for chemical mechanical polishing
JP2008270826A (ja) 研磨液及び研磨方法
JP2002155268A (ja) 化学的機械的研磨用スラリ及び半導体装置の製造方法
CN102816529A (zh) 一种利于抛光后清洗的钨化学机械抛光液
JP2004079968A5 (enExample)
JP2017063173A5 (enExample)
JP2017063173A (ja) 半導体基板を研磨する方法
JP4713767B2 (ja) 洗浄液および半導体装置の製造方法
JP4555990B2 (ja) 半導体金属膜用ｃｍｐ研磨液および基体の研磨方法
CN104451691A (zh) 一种适用于低下压力的铜化学机械精抛光液
JP2001068437A (ja) 金属用研磨液及び研磨方法
JP2001020087A (ja) 銅の化学機械研磨用水系分散体