JP2002221794A5 - - Google Patents
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- Publication number
- JP2002221794A5 JP2002221794A5 JP2001122334A JP2001122334A JP2002221794A5 JP 2002221794 A5 JP2002221794 A5 JP 2002221794A5 JP 2001122334 A JP2001122334 A JP 2001122334A JP 2001122334 A JP2001122334 A JP 2001122334A JP 2002221794 A5 JP2002221794 A5 JP 2002221794A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- general formula
- carbon atoms
- organic
- organic group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 125000000962 organic group Chemical group 0.000 description 17
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 10
- 125000004432 carbon atom Chemical group C* 0.000 description 9
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 8
- 125000003396 thiol group Chemical group [H]S* 0.000 description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 6
- 125000000542 sulfonic acid group Chemical group 0.000 description 6
- 125000001183 hydrocarbyl group Chemical group 0.000 description 5
- 239000002981 blocking agent Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 2
- 241000255925 Diptera Species 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- -1 naphthoquinonediazide compound Chemical class 0.000 description 2
- 229920005575 poly(amic acid) Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001122334A JP4665333B2 (ja) | 2000-11-27 | 2001-04-20 | ポジ型感光性樹脂前駆体組成物 |
| US09/985,059 US6593043B2 (en) | 2000-11-27 | 2001-11-01 | Composition of positive photosensitive resin precursor, and display device thereof |
| EP01127075.8A EP1209523B1 (en) | 2000-11-27 | 2001-11-14 | Composition of positive photosensitive resin precursor, and display device made thereof |
| TW90129112A TW573216B (en) | 2000-11-27 | 2001-11-23 | Composition of positive photosensitive resin precursor, and display device thereof |
| KR1020010073741A KR100788537B1 (ko) | 2000-11-27 | 2001-11-26 | 포지티브형 감광성 수지 전구체 조성물 및 그것을 이용한표시 장치 |
| CNB011394781A CN1246389C (zh) | 2000-11-27 | 2001-11-27 | 正型感光性树脂前驱体组合物及使用其的显示装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000359401 | 2000-11-27 | ||
| JP2000-359401 | 2000-11-27 | ||
| JP2001122334A JP4665333B2 (ja) | 2000-11-27 | 2001-04-20 | ポジ型感光性樹脂前駆体組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002221794A JP2002221794A (ja) | 2002-08-09 |
| JP2002221794A5 true JP2002221794A5 (https=) | 2008-05-29 |
| JP4665333B2 JP4665333B2 (ja) | 2011-04-06 |
Family
ID=26604615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001122334A Expired - Lifetime JP4665333B2 (ja) | 2000-11-27 | 2001-04-20 | ポジ型感光性樹脂前駆体組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6593043B2 (https=) |
| EP (1) | EP1209523B1 (https=) |
| JP (1) | JP4665333B2 (https=) |
| KR (1) | KR100788537B1 (https=) |
| CN (1) | CN1246389C (https=) |
| TW (1) | TW573216B (https=) |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4799740B2 (ja) * | 2001-01-17 | 2011-10-26 | 日東電工株式会社 | 配線回路基板用樹脂組成物、配線回路基板用基材および配線回路基板 |
| TW574620B (en) * | 2001-02-26 | 2004-02-01 | Toray Industries | Precursor composition of positive photosensitive resin and display device using it |
| CN100336137C (zh) * | 2002-01-28 | 2007-09-05 | 捷时雅株式会社 | 形成电介体的光敏组合物以及利用该组合物的电介体 |
| US7214455B2 (en) * | 2002-05-29 | 2007-05-08 | Toray Industries, Inc. | Photosensitive resin composition and process for producing heat-resistant resin film |
| US6887643B2 (en) * | 2002-08-05 | 2005-05-03 | Toray Industries, Inc. | Photosensitive resin precursor composition |
| JP4360168B2 (ja) * | 2002-10-01 | 2009-11-11 | 東レ株式会社 | ポジ型感光性樹脂組成物 |
| US20040238846A1 (en) * | 2003-05-30 | 2004-12-02 | Georg Wittmann | Organic electronic device |
| CN100555078C (zh) * | 2003-06-02 | 2009-10-28 | 东丽株式会社 | 感光树脂组合物及用其制备的电子元件和显示装置 |
| TWI360565B (en) * | 2003-07-09 | 2012-03-21 | Toray Industries | Photosensitive resin precursor composition |
| WO2005010615A1 (ja) * | 2003-07-28 | 2005-02-03 | Nissan Chemical Industries, Ltd. | ポジ型感光性樹脂組成物 |
| TWI363249B (en) * | 2003-10-15 | 2012-05-01 | Fujifilm Electronic Materials | Novel photosensitive resin compositions |
| JP2005309032A (ja) * | 2004-04-21 | 2005-11-04 | Toray Ind Inc | ポジ型感光性樹脂組成物 |
| EP1662319A3 (en) * | 2004-11-24 | 2009-05-27 | Toray Industries, Inc. | Photosensitive resin composition |
| KR100787352B1 (ko) * | 2005-02-23 | 2007-12-18 | 주식회사 하이닉스반도체 | 하드마스크용 조성물 및 이를 이용한 반도체 소자의 패턴형성 방법 |
| US8092861B2 (en) * | 2007-09-05 | 2012-01-10 | United Microelectronics Corp. | Method of fabricating an ultra dielectric constant (K) dielectric layer |
| KR100914063B1 (ko) * | 2007-11-30 | 2009-08-28 | 제일모직주식회사 | 포지티브형 감광성 수지 조성물 |
| KR100914064B1 (ko) * | 2008-03-19 | 2009-08-28 | 제일모직주식회사 | 포지티브형 감광성 수지 조성물 |
| CN102016718B (zh) * | 2008-05-07 | 2013-10-16 | 住友电木株式会社 | 正型感光性树脂组合物、固化膜、保护膜和绝缘膜以及使用它们的半导体装置和显示装置 |
| KR101023089B1 (ko) * | 2008-09-29 | 2011-03-24 | 제일모직주식회사 | 포지티브형 감광성 수지 조성물 |
| WO2010041795A1 (en) * | 2008-10-07 | 2010-04-15 | Cheil Industries Inc. | Positive photosensitive resin composition |
| KR101632965B1 (ko) * | 2008-12-29 | 2016-06-24 | 삼성디스플레이 주식회사 | 포토레지스트 조성물 및 박막 트랜지스터 기판의 제조 방법 |
| KR101333698B1 (ko) * | 2009-11-10 | 2013-11-27 | 제일모직주식회사 | 포지티브형 감광성 수지 조성물 |
| KR101333704B1 (ko) * | 2009-12-29 | 2013-11-27 | 제일모직주식회사 | 포지티브형 감광성 수지 조성물 |
| KR101818788B1 (ko) * | 2010-03-15 | 2018-01-15 | 닛산 가가쿠 고교 가부시키 가이샤 | 폴리아믹산에스테르와 폴리아믹산을 함유하는 액정 배향제 및 액정 배향막 |
| KR101816940B1 (ko) * | 2010-03-15 | 2018-01-09 | 닛산 가가쿠 고교 가부시키 가이샤 | 말단을 수식한 폴리아믹산에스테르 함유 액정 배향제, 및 액정 배향막 |
| JP5858987B2 (ja) | 2010-05-04 | 2016-02-10 | エルジー・ケム・リミテッド | ネガティブフォトレジスト組成物および素子のパターニング方法 |
| KR20120066923A (ko) | 2010-12-15 | 2012-06-25 | 제일모직주식회사 | 신규 페놀 화합물 및 이를 포함하는 포지티브형 감광성 수지 조성물 |
| KR101423539B1 (ko) | 2010-12-20 | 2014-07-25 | 삼성전자 주식회사 | 포지티브형 감광성 수지 조성물 |
| KR101400192B1 (ko) | 2010-12-31 | 2014-05-27 | 제일모직 주식회사 | 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자 |
| KR101400186B1 (ko) | 2010-12-31 | 2014-05-27 | 제일모직 주식회사 | 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자 |
| KR101600653B1 (ko) * | 2012-12-26 | 2016-03-07 | 제일모직주식회사 | 봉지용 조성물, 이를 포함하는 장벽층 및 이를 포함하는 봉지화된 장치 |
| KR102058651B1 (ko) | 2013-02-27 | 2019-12-24 | 삼성디스플레이 주식회사 | 포토레지스트 조성물 및 그를 이용한 표시 장치의 제조 방법 |
| KR101700994B1 (ko) * | 2013-07-01 | 2017-01-31 | 주식회사 엘지화학 | 광활성 물질의 분리방법 |
| WO2015060366A1 (ja) * | 2013-10-23 | 2015-04-30 | 日産化学工業株式会社 | 液晶配向剤、液晶配向膜、及び液晶表示素子 |
| US9477148B1 (en) | 2015-05-26 | 2016-10-25 | Industrial Technology Research Institute | Polymer, method for preparing the same, and a photosensitive resin composition thereof |
| WO2019146611A1 (ja) * | 2018-01-29 | 2019-08-01 | 富士フイルム株式会社 | 感光性樹脂組成物、樹脂、硬化膜、積層体、硬化膜の製造方法、半導体デバイス |
| CN115685681B (zh) | 2021-07-27 | 2025-05-20 | 吉林奥来德光电材料股份有限公司 | 树脂组合物、树脂膜及显示器件 |
| WO2023021961A1 (ja) * | 2021-08-18 | 2023-02-23 | 日東電工株式会社 | ポリイミド前駆体組成物、ポリイミド樹脂、および回路基板 |
| CN114316263B (zh) * | 2022-01-17 | 2023-02-03 | 深圳职业技术学院 | 交联型聚酰胺酸酯、其制备方法、包含其的聚酰亚胺组合物及聚酰亚胺树脂膜的制备方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0478321B1 (en) * | 1990-09-28 | 1997-11-12 | Kabushiki Kaisha Toshiba | Photosenstive resin composition for forming polyimide film pattern and method of forming polyimide film pattern |
| JP3064579B2 (ja) * | 1991-01-17 | 2000-07-12 | 株式会社東芝 | パターン形成方法 |
| EP0512339B1 (de) * | 1991-05-07 | 1997-10-15 | Siemens Aktiengesellschaft | Hochwärmebeständige Positivresists und Verfahren zur Herstellung hochwärmebeständiger Reliefstrukturen |
| KR0134753B1 (ko) * | 1993-02-26 | 1998-04-18 | 사토 후미오 | 폴리아미드산 조성물 |
| JP3460212B2 (ja) * | 1994-08-12 | 2003-10-27 | Ｊｓｒ株式会社 | 感放射線性樹脂組成物 |
| KR100500078B1 (ko) * | 1996-02-26 | 2005-07-18 | 이데미쓰 고산 가부시키가이샤 | 유기 전자 발광 소자 및 그의 제조방법 |
| JPH09319082A (ja) * | 1996-05-27 | 1997-12-12 | Hitachi Ltd | ポジ型感光性樹脂組成物及びそれを用いた電子装置 |
| JP4186250B2 (ja) * | 1997-12-01 | 2008-11-26 | 東レ株式会社 | 感光性耐熱性樹脂前駆体組成物 |
| WO1999054787A1 (fr) * | 1998-04-15 | 1999-10-28 | Asahi Kasei Kogyo Kabushiki Kaisha | Composition de resine photosensible positive |
| EP1037112B1 (en) * | 1998-09-09 | 2004-11-24 | Toray Industries, Inc. | Positive photosensitive resin precursor composition and process for producing the same |
| US6177225B1 (en) * | 1998-10-01 | 2001-01-23 | Arch Specialty Chemicals, Inc. | Photosensitive resin compositions |
| JP3426531B2 (ja) * | 1998-10-30 | 2003-07-14 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性重合体組成物、レリーフパターンの製造法及び電子部品 |
| EP1132773B1 (en) * | 1999-06-01 | 2007-07-11 | Toray Industries, Inc. | Positive-type photosensitive polyimide precursor composition |
| JP4250841B2 (ja) * | 1999-12-20 | 2009-04-08 | 日立化成デュポンマイクロシステムズ株式会社 | ポジ型感光性樹脂組成物、パタ−ンの製造法および電子部品 |
| TW574620B (en) * | 2001-02-26 | 2004-02-01 | Toray Industries | Precursor composition of positive photosensitive resin and display device using it |
-
2001
- 2001-04-20 JP JP2001122334A patent/JP4665333B2/ja not_active Expired - Lifetime
- 2001-11-01 US US09/985,059 patent/US6593043B2/en not_active Expired - Lifetime
- 2001-11-14 EP EP01127075.8A patent/EP1209523B1/en not_active Expired - Lifetime
- 2001-11-23 TW TW90129112A patent/TW573216B/zh not_active IP Right Cessation
- 2001-11-26 KR KR1020010073741A patent/KR100788537B1/ko not_active Expired - Lifetime
- 2001-11-27 CN CNB011394781A patent/CN1246389C/zh not_active Expired - Lifetime
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