JP2001049119A5 - - Google Patents
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- Publication number
- JP2001049119A5 JP2001049119A5 JP1999227814A JP22781499A JP2001049119A5 JP 2001049119 A5 JP2001049119 A5 JP 2001049119A5 JP 1999227814 A JP1999227814 A JP 1999227814A JP 22781499 A JP22781499 A JP 22781499A JP 2001049119 A5 JP2001049119 A5 JP 2001049119A5
- Authority
- JP
- Japan
- Prior art keywords
- heat
- precursor
- resistant resin
- structural unit
- general formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000002243 precursor Substances 0.000 description 12
- 229920006015 heat resistant resin Polymers 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 5
- 150000004985 diamines Chemical class 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 125000000962 organic group Chemical group 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 239000004693 Polybenzimidazole Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 125000005462 imide group Chemical group 0.000 description 1
- 125000002971 oxazolyl group Chemical group 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 229920002577 polybenzoxazole Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22781499A JP4419219B2 (ja) | 1999-08-11 | 1999-08-11 | 耐熱性樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22781499A JP4419219B2 (ja) | 1999-08-11 | 1999-08-11 | 耐熱性樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001049119A JP2001049119A (ja) | 2001-02-20 |
| JP2001049119A5 true JP2001049119A5 (https=) | 2006-09-07 |
| JP4419219B2 JP4419219B2 (ja) | 2010-02-24 |
Family
ID=16866806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22781499A Expired - Lifetime JP4419219B2 (ja) | 1999-08-11 | 1999-08-11 | 耐熱性樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4419219B2 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10145469B4 (de) * | 2001-09-14 | 2006-07-06 | Infineon Technologies Ag | Poly-o-hydroxyamid und Verfahren zu seiner Weiterverarbeitung zu Polybenzoxazol |
| DE10145471A1 (de) * | 2001-09-14 | 2003-04-17 | Infineon Technologies Ag | Fotosensitive Formulierung für Pufferschichten und Verwendungen dazu |
| JP4337481B2 (ja) * | 2002-09-17 | 2009-09-30 | 東レ株式会社 | ネガ型感光性樹脂前駆体組成物およびそれを用いた電子部品ならびに表示装置 |
| KR101074173B1 (ko) | 2004-03-31 | 2011-10-14 | 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 | 내열감광성 수지조성물, 해당 조성물을 이용한 패턴 제조방법 및 전자부품 |
| US7524617B2 (en) * | 2004-11-23 | 2009-04-28 | E.I. Du Pont De Nemours And Company | Low-temperature curable photosensitive compositions |
| TWI495404B (zh) * | 2013-06-21 | 2015-08-01 | Chi Mei Corp | 軟性基板用組成物及軟性基板 |
| JP6244871B2 (ja) * | 2013-12-13 | 2017-12-13 | 日立化成デュポンマイクロシステムズ株式会社 | ポリイミド前駆体樹脂組成物 |
| TWI634135B (zh) | 2015-12-25 | 2018-09-01 | 日商富士軟片股份有限公司 | 樹脂、組成物、硬化膜、硬化膜的製造方法及半導體元件 |
-
1999
- 1999-08-11 JP JP22781499A patent/JP4419219B2/ja not_active Expired - Lifetime
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