JP4419219B2 - 耐熱性樹脂組成物 - Google Patents

耐熱性樹脂組成物 Download PDF

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Publication number
JP4419219B2
JP4419219B2 JP22781499A JP22781499A JP4419219B2 JP 4419219 B2 JP4419219 B2 JP 4419219B2 JP 22781499 A JP22781499 A JP 22781499A JP 22781499 A JP22781499 A JP 22781499A JP 4419219 B2 JP4419219 B2 JP 4419219B2
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JP
Japan
Prior art keywords
bis
group
resistant resin
acid
carbon atoms
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP22781499A
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English (en)
Japanese (ja)
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JP2001049119A (ja
JP2001049119A5 (https=
Inventor
良治 奥田
真佐夫 富川
陽二 藤田
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Toray Industries Inc
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Toray Industries Inc
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Priority to JP22781499A priority Critical patent/JP4419219B2/ja
Publication of JP2001049119A publication Critical patent/JP2001049119A/ja
Publication of JP2001049119A5 publication Critical patent/JP2001049119A5/ja
Application granted granted Critical
Publication of JP4419219B2 publication Critical patent/JP4419219B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Formation Of Insulating Films (AREA)
JP22781499A 1999-08-11 1999-08-11 耐熱性樹脂組成物 Expired - Lifetime JP4419219B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22781499A JP4419219B2 (ja) 1999-08-11 1999-08-11 耐熱性樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22781499A JP4419219B2 (ja) 1999-08-11 1999-08-11 耐熱性樹脂組成物

Publications (3)

Publication Number Publication Date
JP2001049119A JP2001049119A (ja) 2001-02-20
JP2001049119A5 JP2001049119A5 (https=) 2006-09-07
JP4419219B2 true JP4419219B2 (ja) 2010-02-24

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ID=16866806

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22781499A Expired - Lifetime JP4419219B2 (ja) 1999-08-11 1999-08-11 耐熱性樹脂組成物

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JP (1) JP4419219B2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10145469B4 (de) * 2001-09-14 2006-07-06 Infineon Technologies Ag Poly-o-hydroxyamid und Verfahren zu seiner Weiterverarbeitung zu Polybenzoxazol
DE10145471A1 (de) * 2001-09-14 2003-04-17 Infineon Technologies Ag Fotosensitive Formulierung für Pufferschichten und Verwendungen dazu
JP4337481B2 (ja) * 2002-09-17 2009-09-30 東レ株式会社 ネガ型感光性樹脂前駆体組成物およびそれを用いた電子部品ならびに表示装置
KR101074173B1 (ko) 2004-03-31 2011-10-14 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 내열감광성 수지조성물, 해당 조성물을 이용한 패턴 제조방법 및 전자부품
US7524617B2 (en) * 2004-11-23 2009-04-28 E.I. Du Pont De Nemours And Company Low-temperature curable photosensitive compositions
TWI495404B (zh) * 2013-06-21 2015-08-01 Chi Mei Corp 軟性基板用組成物及軟性基板
JP6244871B2 (ja) * 2013-12-13 2017-12-13 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体樹脂組成物
TWI634135B (zh) 2015-12-25 2018-09-01 日商富士軟片股份有限公司 樹脂、組成物、硬化膜、硬化膜的製造方法及半導體元件

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JP2001049119A (ja) 2001-02-20

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