CN1246389C - 正型感光性树脂前驱体组合物及使用其的显示装置 - Google Patents

正型感光性树脂前驱体组合物及使用其的显示装置 Download PDF

Info

Publication number
CN1246389C
CN1246389C CNB011394781A CN01139478A CN1246389C CN 1246389 C CN1246389 C CN 1246389C CN B011394781 A CNB011394781 A CN B011394781A CN 01139478 A CN01139478 A CN 01139478A CN 1246389 C CN1246389 C CN 1246389C
Authority
CN
China
Prior art keywords
group
general formula
compound
expression
precursor composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB011394781A
Other languages
English (en)
Chinese (zh)
Other versions
CN1356356A (zh
Inventor
诹访充史
三好一登
富川真佐夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Publication of CN1356356A publication Critical patent/CN1356356A/zh
Application granted granted Critical
Publication of CN1246389C publication Critical patent/CN1246389C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/0226Quinonediazides characterised by the non-macromolecular additives
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/023Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CNB011394781A 2000-11-27 2001-11-27 正型感光性树脂前驱体组合物及使用其的显示装置 Expired - Lifetime CN1246389C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2000359401 2000-11-27
JP359401/2000 2000-11-27
JP2001122334A JP4665333B2 (ja) 2000-11-27 2001-04-20 ポジ型感光性樹脂前駆体組成物
JP122334/2001 2001-04-20

Publications (2)

Publication Number Publication Date
CN1356356A CN1356356A (zh) 2002-07-03
CN1246389C true CN1246389C (zh) 2006-03-22

Family

ID=26604615

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB011394781A Expired - Lifetime CN1246389C (zh) 2000-11-27 2001-11-27 正型感光性树脂前驱体组合物及使用其的显示装置

Country Status (6)

Country Link
US (1) US6593043B2 (https=)
EP (1) EP1209523B1 (https=)
JP (1) JP4665333B2 (https=)
KR (1) KR100788537B1 (https=)
CN (1) CN1246389C (https=)
TW (1) TW573216B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112022000006T5 (de) 2021-07-27 2023-03-23 Jilin Oled Optical And Electronic Materials Co., Ltd. Harzzusammensetzung, Harzfilm und Anzeigevorrichtung

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4799740B2 (ja) * 2001-01-17 2011-10-26 日東電工株式会社 配線回路基板用樹脂組成物、配線回路基板用基材および配線回路基板
TW574620B (en) * 2001-02-26 2004-02-01 Toray Industries Precursor composition of positive photosensitive resin and display device using it
US7015256B2 (en) * 2002-01-28 2006-03-21 Jsr Corporation Composition for forming photosensitive dielectric material, and transfer film, dielectric material and electronic parts using the same
WO2003100522A1 (en) * 2002-05-29 2003-12-04 Toray Industries, Inc. Photosensitive resin composition and method for preparing heat-resistant resin film
US6887643B2 (en) 2002-08-05 2005-05-03 Toray Industries, Inc. Photosensitive resin precursor composition
JP4360168B2 (ja) * 2002-10-01 2009-11-11 東レ株式会社 ポジ型感光性樹脂組成物
US20040238846A1 (en) * 2003-05-30 2004-12-02 Georg Wittmann Organic electronic device
CN100555078C (zh) 2003-06-02 2009-10-28 东丽株式会社 感光树脂组合物及用其制备的电子元件和显示装置
TWI360565B (en) * 2003-07-09 2012-03-21 Toray Industries Photosensitive resin precursor composition
CN1816774B (zh) * 2003-07-28 2010-08-04 日产化学工业株式会社 正型感光性树脂组合物
TWI363249B (en) * 2003-10-15 2012-05-01 Fujifilm Electronic Materials Novel photosensitive resin compositions
JP2005309032A (ja) * 2004-04-21 2005-11-04 Toray Ind Inc ポジ型感光性樹脂組成物
EP1662319A3 (en) * 2004-11-24 2009-05-27 Toray Industries, Inc. Photosensitive resin composition
KR100787352B1 (ko) * 2005-02-23 2007-12-18 주식회사 하이닉스반도체 하드마스크용 조성물 및 이를 이용한 반도체 소자의 패턴형성 방법
US8092861B2 (en) * 2007-09-05 2012-01-10 United Microelectronics Corp. Method of fabricating an ultra dielectric constant (K) dielectric layer
KR100914063B1 (ko) * 2007-11-30 2009-08-28 제일모직주식회사 포지티브형 감광성 수지 조성물
KR100914064B1 (ko) * 2008-03-19 2009-08-28 제일모직주식회사 포지티브형 감광성 수지 조성물
JP5246607B2 (ja) * 2008-05-07 2013-07-24 住友ベークライト株式会社 ポジ型感光性樹脂組成物、硬化膜、保護膜及び絶縁膜、並びにそれを用いた半導体装置及び表示体装置
KR101023089B1 (ko) * 2008-09-29 2011-03-24 제일모직주식회사 포지티브형 감광성 수지 조성물
WO2010041795A1 (en) * 2008-10-07 2010-04-15 Cheil Industries Inc. Positive photosensitive resin composition
KR101632965B1 (ko) * 2008-12-29 2016-06-24 삼성디스플레이 주식회사 포토레지스트 조성물 및 박막 트랜지스터 기판의 제조 방법
KR101333698B1 (ko) * 2009-11-10 2013-11-27 제일모직주식회사 포지티브형 감광성 수지 조성물
KR101333704B1 (ko) * 2009-12-29 2013-11-27 제일모직주식회사 포지티브형 감광성 수지 조성물
CN102893208B (zh) * 2010-03-15 2015-07-08 日产化学工业株式会社 含有聚酰胺酸酯和聚酰胺酸的液晶取向剂以及液晶取向膜
CN102893206B (zh) * 2010-03-15 2015-04-01 日产化学工业株式会社 包含对末端进行了修饰的聚酰胺酸酯的液晶取向剂及液晶取向膜
JP5858987B2 (ja) 2010-05-04 2016-02-10 エルジー・ケム・リミテッド ネガティブフォトレジスト組成物および素子のパターニング方法
KR20120066923A (ko) 2010-12-15 2012-06-25 제일모직주식회사 신규 페놀 화합물 및 이를 포함하는 포지티브형 감광성 수지 조성물
KR101423539B1 (ko) 2010-12-20 2014-07-25 삼성전자 주식회사 포지티브형 감광성 수지 조성물
KR101400186B1 (ko) 2010-12-31 2014-05-27 제일모직 주식회사 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자
KR101400192B1 (ko) 2010-12-31 2014-05-27 제일모직 주식회사 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자
KR101600653B1 (ko) * 2012-12-26 2016-03-07 제일모직주식회사 봉지용 조성물, 이를 포함하는 장벽층 및 이를 포함하는 봉지화된 장치
KR102058651B1 (ko) 2013-02-27 2019-12-24 삼성디스플레이 주식회사 포토레지스트 조성물 및 그를 이용한 표시 장치의 제조 방법
KR101700994B1 (ko) * 2013-07-01 2017-01-31 주식회사 엘지화학 광활성 물질의 분리방법
KR102241784B1 (ko) * 2013-10-23 2021-04-16 닛산 가가쿠 가부시키가이샤 액정 배향제, 액정 배향막, 및 액정 표시 소자
US9477148B1 (en) 2015-05-26 2016-10-25 Industrial Technology Research Institute Polymer, method for preparing the same, and a photosensitive resin composition thereof
CN111630454B (zh) * 2018-01-29 2023-07-14 富士胶片株式会社 感光性树脂组合物、树脂、固化膜、层叠体、固化膜的制造方法及半导体器件
CN117897453A (zh) * 2021-08-18 2024-04-16 日东电工株式会社 聚酰亚胺前体组合物、聚酰亚胺树脂、以及电路基板
CN114316263B (zh) * 2022-01-17 2023-02-03 深圳职业技术学院 交联型聚酰胺酸酯、其制备方法、包含其的聚酰亚胺组合物及聚酰亚胺树脂膜的制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69128187T2 (de) * 1990-09-28 1998-03-26 Toshiba Kawasaki Kk Fotoempfindliche Harzzusammensetzung zum Herstellen eines Polyimidfilmmusters und Verfahren zum Herstellen eines Polyimidfilmmusters
JP3064579B2 (ja) * 1991-01-17 2000-07-12 株式会社東芝 パターン形成方法
DE59208963D1 (de) * 1991-05-07 1997-11-20 Siemens Ag Hochwärmebeständige Positivresists und Verfahren zur Herstellung hochwärmebeständiger Reliefstrukturen
KR0134753B1 (ko) * 1993-02-26 1998-04-18 사토 후미오 폴리아미드산 조성물
JP3460212B2 (ja) 1994-08-12 2003-10-27 Jsr株式会社 感放射線性樹脂組成物
DE69740011D1 (de) * 1996-02-26 2010-11-11 Idemitsu Kosan Co Organisches elektrolumineszentes element und verfahren zur herstellung desselben
JPH09319082A (ja) * 1996-05-27 1997-12-12 Hitachi Ltd ポジ型感光性樹脂組成物及びそれを用いた電子装置
JP4186250B2 (ja) * 1997-12-01 2008-11-26 東レ株式会社 感光性耐熱性樹脂前駆体組成物
US6376151B1 (en) * 1998-04-15 2002-04-23 Asahi Kasei Kabushiki Kaisha Positive resist composition
DE69922155T2 (de) 1998-09-09 2005-12-08 Toray Industries, Inc. Vorläufer einer photoempfindlichen harzzusammensetzung und verfahren zu dessen herstellung
US6177225B1 (en) * 1998-10-01 2001-01-23 Arch Specialty Chemicals, Inc. Photosensitive resin compositions
JP3426531B2 (ja) * 1998-10-30 2003-07-14 日立化成デュポンマイクロシステムズ株式会社 感光性重合体組成物、レリーフパターンの製造法及び電子部品
ATE366952T1 (de) 1999-06-01 2007-08-15 Toray Industries Positiv arbeitende lichtempfindliche polyimidvorstufen-zusammensetzung
JP4250841B2 (ja) * 1999-12-20 2009-04-08 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、パタ−ンの製造法および電子部品
TW574620B (en) * 2001-02-26 2004-02-01 Toray Industries Precursor composition of positive photosensitive resin and display device using it

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112022000006T5 (de) 2021-07-27 2023-03-23 Jilin Oled Optical And Electronic Materials Co., Ltd. Harzzusammensetzung, Harzfilm und Anzeigevorrichtung

Also Published As

Publication number Publication date
JP4665333B2 (ja) 2011-04-06
KR20020041302A (ko) 2002-06-01
KR100788537B1 (ko) 2007-12-24
EP1209523B1 (en) 2015-08-26
EP1209523A3 (en) 2003-09-24
TW573216B (en) 2004-01-21
US20020090564A1 (en) 2002-07-11
CN1356356A (zh) 2002-07-03
JP2002221794A (ja) 2002-08-09
EP1209523A2 (en) 2002-05-29
US6593043B2 (en) 2003-07-15

Similar Documents

Publication Publication Date Title
CN1246389C (zh) 正型感光性树脂前驱体组合物及使用其的显示装置
CN1457454A (zh) 正型感光性树脂前体组合物以及使用它的显示装置
CN1245665C (zh) 正感光性聚酰亚胺树脂组合物
CN102292675B (zh) 正型感光性树脂组合物
JP6225445B2 (ja) ドライエッチング用フォトレジスト、それを用いたレリーフパターンおよび発光素子の製造方法
CN108431135B (zh) 树脂组合物、树脂的制造方法、树脂膜的制造方法和电子设备的制造方法
JP6252174B2 (ja) ポジ型感光性樹脂組成物、それを用いた硬化膜を含む半導体装置の製造方法
CN1267501C (zh) 感光性树脂前体组合物
CN1860414A (zh) 正型感光性树脂组合物、图案的制造方法及电子部件
CN100347609C (zh) 正性光敏树脂组合物、制备正性光敏树脂组合物的方法及半导体设备
CN1656427A (zh) 感光性树脂组合物和耐热性树脂膜的制造方法
JP6780501B2 (ja) 耐熱性樹脂組成物、耐熱性樹脂膜の製造方法、層間絶縁膜または表面保護膜の製造方法、および電子部品または半導体部品の製造方法
CN1165980A (zh) 正型光敏树脂组合物和使用它的半导体装置
CN1782875A (zh) 感光性树脂组合物
CN1577088A (zh) 感光性树脂前体组合物
CN1246738C (zh) 正型感光性树脂前体及其制造方法
CN1609133A (zh) 聚酰胺树脂、正型感光性树脂组合物、图案状树脂膜的制造方法、半导体装置和显示元件及制法
JP2003005369A (ja) ポジ型感光性樹脂前駆体組成物
JP5712658B2 (ja) ポジ型感光性樹脂組成物
JP6808928B2 (ja) 感光性樹脂組成物
TW202244611A (zh) 感光性樹脂組成物、硬化物、顯示裝置、有機el顯示裝置及半導體裝置
TWI711648B (zh) 基板的製造方法及使用其的發光元件的製造方法
JP5206214B2 (ja) ポジ型感光性樹脂組成物
JP2010243748A (ja) 感光性樹脂組成物および耐熱性樹脂膜の製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20060322