CN1246389C - 正型感光性树脂前驱体组合物及使用其的显示装置 - Google Patents
正型感光性树脂前驱体组合物及使用其的显示装置 Download PDFInfo
- Publication number
- CN1246389C CN1246389C CNB011394781A CN01139478A CN1246389C CN 1246389 C CN1246389 C CN 1246389C CN B011394781 A CNB011394781 A CN B011394781A CN 01139478 A CN01139478 A CN 01139478A CN 1246389 C CN1246389 C CN 1246389C
- Authority
- CN
- China
- Prior art keywords
- group
- general formula
- compound
- expression
- precursor composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000359401 | 2000-11-27 | ||
| JP359401/2000 | 2000-11-27 | ||
| JP2001122334A JP4665333B2 (ja) | 2000-11-27 | 2001-04-20 | ポジ型感光性樹脂前駆体組成物 |
| JP122334/2001 | 2001-04-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1356356A CN1356356A (zh) | 2002-07-03 |
| CN1246389C true CN1246389C (zh) | 2006-03-22 |
Family
ID=26604615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011394781A Expired - Lifetime CN1246389C (zh) | 2000-11-27 | 2001-11-27 | 正型感光性树脂前驱体组合物及使用其的显示装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6593043B2 (https=) |
| EP (1) | EP1209523B1 (https=) |
| JP (1) | JP4665333B2 (https=) |
| KR (1) | KR100788537B1 (https=) |
| CN (1) | CN1246389C (https=) |
| TW (1) | TW573216B (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112022000006T5 (de) | 2021-07-27 | 2023-03-23 | Jilin Oled Optical And Electronic Materials Co., Ltd. | Harzzusammensetzung, Harzfilm und Anzeigevorrichtung |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4799740B2 (ja) * | 2001-01-17 | 2011-10-26 | 日東電工株式会社 | 配線回路基板用樹脂組成物、配線回路基板用基材および配線回路基板 |
| TW574620B (en) * | 2001-02-26 | 2004-02-01 | Toray Industries | Precursor composition of positive photosensitive resin and display device using it |
| US7015256B2 (en) * | 2002-01-28 | 2006-03-21 | Jsr Corporation | Composition for forming photosensitive dielectric material, and transfer film, dielectric material and electronic parts using the same |
| WO2003100522A1 (en) * | 2002-05-29 | 2003-12-04 | Toray Industries, Inc. | Photosensitive resin composition and method for preparing heat-resistant resin film |
| US6887643B2 (en) | 2002-08-05 | 2005-05-03 | Toray Industries, Inc. | Photosensitive resin precursor composition |
| JP4360168B2 (ja) * | 2002-10-01 | 2009-11-11 | 東レ株式会社 | ポジ型感光性樹脂組成物 |
| US20040238846A1 (en) * | 2003-05-30 | 2004-12-02 | Georg Wittmann | Organic electronic device |
| CN100555078C (zh) | 2003-06-02 | 2009-10-28 | 东丽株式会社 | 感光树脂组合物及用其制备的电子元件和显示装置 |
| TWI360565B (en) * | 2003-07-09 | 2012-03-21 | Toray Industries | Photosensitive resin precursor composition |
| CN1816774B (zh) * | 2003-07-28 | 2010-08-04 | 日产化学工业株式会社 | 正型感光性树脂组合物 |
| TWI363249B (en) * | 2003-10-15 | 2012-05-01 | Fujifilm Electronic Materials | Novel photosensitive resin compositions |
| JP2005309032A (ja) * | 2004-04-21 | 2005-11-04 | Toray Ind Inc | ポジ型感光性樹脂組成物 |
| EP1662319A3 (en) * | 2004-11-24 | 2009-05-27 | Toray Industries, Inc. | Photosensitive resin composition |
| KR100787352B1 (ko) * | 2005-02-23 | 2007-12-18 | 주식회사 하이닉스반도체 | 하드마스크용 조성물 및 이를 이용한 반도체 소자의 패턴형성 방법 |
| US8092861B2 (en) * | 2007-09-05 | 2012-01-10 | United Microelectronics Corp. | Method of fabricating an ultra dielectric constant (K) dielectric layer |
| KR100914063B1 (ko) * | 2007-11-30 | 2009-08-28 | 제일모직주식회사 | 포지티브형 감광성 수지 조성물 |
| KR100914064B1 (ko) * | 2008-03-19 | 2009-08-28 | 제일모직주식회사 | 포지티브형 감광성 수지 조성물 |
| JP5246607B2 (ja) * | 2008-05-07 | 2013-07-24 | 住友ベークライト株式会社 | ポジ型感光性樹脂組成物、硬化膜、保護膜及び絶縁膜、並びにそれを用いた半導体装置及び表示体装置 |
| KR101023089B1 (ko) * | 2008-09-29 | 2011-03-24 | 제일모직주식회사 | 포지티브형 감광성 수지 조성물 |
| WO2010041795A1 (en) * | 2008-10-07 | 2010-04-15 | Cheil Industries Inc. | Positive photosensitive resin composition |
| KR101632965B1 (ko) * | 2008-12-29 | 2016-06-24 | 삼성디스플레이 주식회사 | 포토레지스트 조성물 및 박막 트랜지스터 기판의 제조 방법 |
| KR101333698B1 (ko) * | 2009-11-10 | 2013-11-27 | 제일모직주식회사 | 포지티브형 감광성 수지 조성물 |
| KR101333704B1 (ko) * | 2009-12-29 | 2013-11-27 | 제일모직주식회사 | 포지티브형 감광성 수지 조성물 |
| CN102893208B (zh) * | 2010-03-15 | 2015-07-08 | 日产化学工业株式会社 | 含有聚酰胺酸酯和聚酰胺酸的液晶取向剂以及液晶取向膜 |
| CN102893206B (zh) * | 2010-03-15 | 2015-04-01 | 日产化学工业株式会社 | 包含对末端进行了修饰的聚酰胺酸酯的液晶取向剂及液晶取向膜 |
| JP5858987B2 (ja) | 2010-05-04 | 2016-02-10 | エルジー・ケム・リミテッド | ネガティブフォトレジスト組成物および素子のパターニング方法 |
| KR20120066923A (ko) | 2010-12-15 | 2012-06-25 | 제일모직주식회사 | 신규 페놀 화합물 및 이를 포함하는 포지티브형 감광성 수지 조성물 |
| KR101423539B1 (ko) | 2010-12-20 | 2014-07-25 | 삼성전자 주식회사 | 포지티브형 감광성 수지 조성물 |
| KR101400186B1 (ko) | 2010-12-31 | 2014-05-27 | 제일모직 주식회사 | 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자 |
| KR101400192B1 (ko) | 2010-12-31 | 2014-05-27 | 제일모직 주식회사 | 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자 |
| KR101600653B1 (ko) * | 2012-12-26 | 2016-03-07 | 제일모직주식회사 | 봉지용 조성물, 이를 포함하는 장벽층 및 이를 포함하는 봉지화된 장치 |
| KR102058651B1 (ko) | 2013-02-27 | 2019-12-24 | 삼성디스플레이 주식회사 | 포토레지스트 조성물 및 그를 이용한 표시 장치의 제조 방법 |
| KR101700994B1 (ko) * | 2013-07-01 | 2017-01-31 | 주식회사 엘지화학 | 광활성 물질의 분리방법 |
| KR102241784B1 (ko) * | 2013-10-23 | 2021-04-16 | 닛산 가가쿠 가부시키가이샤 | 액정 배향제, 액정 배향막, 및 액정 표시 소자 |
| US9477148B1 (en) | 2015-05-26 | 2016-10-25 | Industrial Technology Research Institute | Polymer, method for preparing the same, and a photosensitive resin composition thereof |
| CN111630454B (zh) * | 2018-01-29 | 2023-07-14 | 富士胶片株式会社 | 感光性树脂组合物、树脂、固化膜、层叠体、固化膜的制造方法及半导体器件 |
| CN117897453A (zh) * | 2021-08-18 | 2024-04-16 | 日东电工株式会社 | 聚酰亚胺前体组合物、聚酰亚胺树脂、以及电路基板 |
| CN114316263B (zh) * | 2022-01-17 | 2023-02-03 | 深圳职业技术学院 | 交联型聚酰胺酸酯、其制备方法、包含其的聚酰亚胺组合物及聚酰亚胺树脂膜的制备方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69128187T2 (de) * | 1990-09-28 | 1998-03-26 | Toshiba Kawasaki Kk | Fotoempfindliche Harzzusammensetzung zum Herstellen eines Polyimidfilmmusters und Verfahren zum Herstellen eines Polyimidfilmmusters |
| JP3064579B2 (ja) * | 1991-01-17 | 2000-07-12 | 株式会社東芝 | パターン形成方法 |
| DE59208963D1 (de) * | 1991-05-07 | 1997-11-20 | Siemens Ag | Hochwärmebeständige Positivresists und Verfahren zur Herstellung hochwärmebeständiger Reliefstrukturen |
| KR0134753B1 (ko) * | 1993-02-26 | 1998-04-18 | 사토 후미오 | 폴리아미드산 조성물 |
| JP3460212B2 (ja) | 1994-08-12 | 2003-10-27 | Jsr株式会社 | 感放射線性樹脂組成物 |
| DE69740011D1 (de) * | 1996-02-26 | 2010-11-11 | Idemitsu Kosan Co | Organisches elektrolumineszentes element und verfahren zur herstellung desselben |
| JPH09319082A (ja) * | 1996-05-27 | 1997-12-12 | Hitachi Ltd | ポジ型感光性樹脂組成物及びそれを用いた電子装置 |
| JP4186250B2 (ja) * | 1997-12-01 | 2008-11-26 | 東レ株式会社 | 感光性耐熱性樹脂前駆体組成物 |
| US6376151B1 (en) * | 1998-04-15 | 2002-04-23 | Asahi Kasei Kabushiki Kaisha | Positive resist composition |
| DE69922155T2 (de) | 1998-09-09 | 2005-12-08 | Toray Industries, Inc. | Vorläufer einer photoempfindlichen harzzusammensetzung und verfahren zu dessen herstellung |
| US6177225B1 (en) * | 1998-10-01 | 2001-01-23 | Arch Specialty Chemicals, Inc. | Photosensitive resin compositions |
| JP3426531B2 (ja) * | 1998-10-30 | 2003-07-14 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性重合体組成物、レリーフパターンの製造法及び電子部品 |
| ATE366952T1 (de) | 1999-06-01 | 2007-08-15 | Toray Industries | Positiv arbeitende lichtempfindliche polyimidvorstufen-zusammensetzung |
| JP4250841B2 (ja) * | 1999-12-20 | 2009-04-08 | 日立化成デュポンマイクロシステムズ株式会社 | ポジ型感光性樹脂組成物、パタ−ンの製造法および電子部品 |
| TW574620B (en) * | 2001-02-26 | 2004-02-01 | Toray Industries | Precursor composition of positive photosensitive resin and display device using it |
-
2001
- 2001-04-20 JP JP2001122334A patent/JP4665333B2/ja not_active Expired - Lifetime
- 2001-11-01 US US09/985,059 patent/US6593043B2/en not_active Expired - Lifetime
- 2001-11-14 EP EP01127075.8A patent/EP1209523B1/en not_active Expired - Lifetime
- 2001-11-23 TW TW90129112A patent/TW573216B/zh not_active IP Right Cessation
- 2001-11-26 KR KR1020010073741A patent/KR100788537B1/ko not_active Expired - Lifetime
- 2001-11-27 CN CNB011394781A patent/CN1246389C/zh not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112022000006T5 (de) | 2021-07-27 | 2023-03-23 | Jilin Oled Optical And Electronic Materials Co., Ltd. | Harzzusammensetzung, Harzfilm und Anzeigevorrichtung |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4665333B2 (ja) | 2011-04-06 |
| KR20020041302A (ko) | 2002-06-01 |
| KR100788537B1 (ko) | 2007-12-24 |
| EP1209523B1 (en) | 2015-08-26 |
| EP1209523A3 (en) | 2003-09-24 |
| TW573216B (en) | 2004-01-21 |
| US20020090564A1 (en) | 2002-07-11 |
| CN1356356A (zh) | 2002-07-03 |
| JP2002221794A (ja) | 2002-08-09 |
| EP1209523A2 (en) | 2002-05-29 |
| US6593043B2 (en) | 2003-07-15 |
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
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| CX01 | Expiry of patent term |
Granted publication date: 20060322 |