JP2002208763A5 - - Google Patents

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Publication number
JP2002208763A5
JP2002208763A5 JP2001344073A JP2001344073A JP2002208763A5 JP 2002208763 A5 JP2002208763 A5 JP 2002208763A5 JP 2001344073 A JP2001344073 A JP 2001344073A JP 2001344073 A JP2001344073 A JP 2001344073A JP 2002208763 A5 JP2002208763 A5 JP 2002208763A5
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JP
Japan
Prior art keywords
circuit board
via hole
inner via
reinforcing material
sectional area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001344073A
Other languages
English (en)
Japanese (ja)
Other versions
JP3587457B2 (ja
JP2002208763A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001344073A priority Critical patent/JP3587457B2/ja
Priority claimed from JP2001344073A external-priority patent/JP3587457B2/ja
Publication of JP2002208763A publication Critical patent/JP2002208763A/ja
Publication of JP2002208763A5 publication Critical patent/JP2002208763A5/ja
Application granted granted Critical
Publication of JP3587457B2 publication Critical patent/JP3587457B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2001344073A 2000-11-09 2001-11-09 回路基板とその製造方法 Expired - Fee Related JP3587457B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001344073A JP3587457B2 (ja) 2000-11-09 2001-11-09 回路基板とその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-341646 2000-11-09
JP2000341646 2000-11-09
JP2001344073A JP3587457B2 (ja) 2000-11-09 2001-11-09 回路基板とその製造方法

Publications (3)

Publication Number Publication Date
JP2002208763A JP2002208763A (ja) 2002-07-26
JP2002208763A5 true JP2002208763A5 (zh) 2004-10-28
JP3587457B2 JP3587457B2 (ja) 2004-11-10

Family

ID=26603641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001344073A Expired - Fee Related JP3587457B2 (ja) 2000-11-09 2001-11-09 回路基板とその製造方法

Country Status (1)

Country Link
JP (1) JP3587457B2 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4054269B2 (ja) 2003-03-20 2008-02-27 Ｔｄｋ株式会社 電子部品の製造方法および電子部品
WO2009031262A1 (ja) 2007-09-03 2009-03-12 Panasonic Corporation 配線基板
JP5284146B2 (ja) * 2008-03-13 2013-09-11 日本特殊陶業株式会社 多層配線基板、及びその製造方法
JP2011119611A (ja) * 2009-12-07 2011-06-16 Furukawa Electric Co Ltd:The 射出成形基板及び射出成形部品
JP2013157366A (ja) * 2012-01-27 2013-08-15 Kyocer Slc Technologies Corp 配線基板およびそれを用いた実装構造体
JP6301595B2 (ja) * 2013-06-14 2018-03-28 日本特殊陶業株式会社 配線基板、多層配線基板の製造方法
KR102149793B1 (ko) * 2013-10-24 2020-08-31 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판의 휨 제어방법
JP7128857B2 (ja) * 2020-06-02 2022-08-31 Ｆｉｃｔ株式会社 回路基板、回路基板の製造方法及び電子機器
DE112022003038T5 (de) * 2021-08-05 2024-04-04 Sumitomo Electric Industries, Ltd. Optikmodul, optikverbindungskabel und verfahren zum erzeugen eines optikmoduls

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