JP2002198411A - 圧力制御方法、搬送装置およびクラスタツール - Google Patents

圧力制御方法、搬送装置およびクラスタツール

Info

Publication number
JP2002198411A
JP2002198411A JP2000395263A JP2000395263A JP2002198411A JP 2002198411 A JP2002198411 A JP 2002198411A JP 2000395263 A JP2000395263 A JP 2000395263A JP 2000395263 A JP2000395263 A JP 2000395263A JP 2002198411 A JP2002198411 A JP 2002198411A
Authority
JP
Japan
Prior art keywords
chamber
transfer chamber
cassette
transfer
exhaust
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000395263A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002198411A5 (https=
Inventor
Hiroshi Koizumi
浩 小泉
Takashi Asakawa
崇 浅川
Toshimitsu Aoki
利光 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2000395263A priority Critical patent/JP2002198411A/ja
Priority to PCT/JP2001/011338 priority patent/WO2002052638A1/ja
Publication of JP2002198411A publication Critical patent/JP2002198411A/ja
Publication of JP2002198411A5 publication Critical patent/JP2002198411A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2000395263A 2000-12-26 2000-12-26 圧力制御方法、搬送装置およびクラスタツール Pending JP2002198411A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000395263A JP2002198411A (ja) 2000-12-26 2000-12-26 圧力制御方法、搬送装置およびクラスタツール
PCT/JP2001/011338 WO2002052638A1 (fr) 2000-12-26 2001-12-25 Procede de regulation de pression, dispositif de transfert, et outil en grappe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000395263A JP2002198411A (ja) 2000-12-26 2000-12-26 圧力制御方法、搬送装置およびクラスタツール

Publications (2)

Publication Number Publication Date
JP2002198411A true JP2002198411A (ja) 2002-07-12
JP2002198411A5 JP2002198411A5 (https=) 2008-02-14

Family

ID=18860753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000395263A Pending JP2002198411A (ja) 2000-12-26 2000-12-26 圧力制御方法、搬送装置およびクラスタツール

Country Status (2)

Country Link
JP (1) JP2002198411A (https=)
WO (1) WO2002052638A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004140153A (ja) * 2002-10-17 2004-05-13 Matsushita Electric Ind Co Ltd プラズマ処理装置及びプラズマ処理方法
WO2012042800A1 (ja) * 2010-09-28 2012-04-05 株式会社アルバック ロードロック装置、排気制御装置及びロードロック装置の動作方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4451076B2 (ja) * 2003-04-16 2010-04-14 東京エレクトロン株式会社 真空処理装置
CN111120281B (zh) * 2018-10-31 2021-07-09 北京北方华创微电子装备有限公司 共享干泵系统的控制方法以及共享干泵系统

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62142791A (ja) * 1985-12-18 1987-06-26 Anelva Corp 真空処理装置
JPH05259098A (ja) * 1992-03-11 1993-10-08 Tokyo Electron Ltd 真空排気方法
JPH07211761A (ja) * 1994-01-21 1995-08-11 Tokyo Electron Ltd 処理装置内の被処理体の搬送方法
JPH07321047A (ja) * 1994-05-23 1995-12-08 Tokyo Electron Ltd 真空処理装置
JPH10275848A (ja) * 1996-11-18 1998-10-13 Applied Materials Inc デュアル・ブレード・ロボット
JP2000232071A (ja) * 1999-02-09 2000-08-22 Kokusai Electric Co Ltd 基板処理方法および基板処理装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5855681A (en) * 1996-11-18 1999-01-05 Applied Materials, Inc. Ultra high throughput wafer vacuum processing system
JPH10270527A (ja) * 1997-03-21 1998-10-09 Ulvac Japan Ltd 複合型真空処理装置
JPH11204508A (ja) * 1998-01-09 1999-07-30 Toshiba Corp 半導体装置の製造方法及び半導体製造装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62142791A (ja) * 1985-12-18 1987-06-26 Anelva Corp 真空処理装置
JPH05259098A (ja) * 1992-03-11 1993-10-08 Tokyo Electron Ltd 真空排気方法
JPH07211761A (ja) * 1994-01-21 1995-08-11 Tokyo Electron Ltd 処理装置内の被処理体の搬送方法
JPH07321047A (ja) * 1994-05-23 1995-12-08 Tokyo Electron Ltd 真空処理装置
JPH10275848A (ja) * 1996-11-18 1998-10-13 Applied Materials Inc デュアル・ブレード・ロボット
JP2000232071A (ja) * 1999-02-09 2000-08-22 Kokusai Electric Co Ltd 基板処理方法および基板処理装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004140153A (ja) * 2002-10-17 2004-05-13 Matsushita Electric Ind Co Ltd プラズマ処理装置及びプラズマ処理方法
WO2012042800A1 (ja) * 2010-09-28 2012-04-05 株式会社アルバック ロードロック装置、排気制御装置及びロードロック装置の動作方法
JP5493005B2 (ja) * 2010-09-28 2014-05-14 株式会社アルバック ロードロック装置、排気制御装置及びロードロック装置の動作方法

Also Published As

Publication number Publication date
WO2002052638A1 (fr) 2002-07-04

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