JP2002176242A5 - - Google Patents

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Publication number
JP2002176242A5
JP2002176242A5 JP2000369753A JP2000369753A JP2002176242A5 JP 2002176242 A5 JP2002176242 A5 JP 2002176242A5 JP 2000369753 A JP2000369753 A JP 2000369753A JP 2000369753 A JP2000369753 A JP 2000369753A JP 2002176242 A5 JP2002176242 A5 JP 2002176242A5
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JP
Japan
Prior art keywords
copper foil
etching
copper
alloy layer
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000369753A
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English (en)
Japanese (ja)
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JP2002176242A (ja
JP4592936B2 (ja
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Priority to JP2000369753A priority Critical patent/JP4592936B2/ja
Priority claimed from JP2000369753A external-priority patent/JP4592936B2/ja
Publication of JP2002176242A publication Critical patent/JP2002176242A/ja
Publication of JP2002176242A5 publication Critical patent/JP2002176242A5/ja
Application granted granted Critical
Publication of JP4592936B2 publication Critical patent/JP4592936B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2000369753A 2000-12-05 2000-12-05 電子回路用銅箔及び電子回路の形成方法 Expired - Lifetime JP4592936B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000369753A JP4592936B2 (ja) 2000-12-05 2000-12-05 電子回路用銅箔及び電子回路の形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000369753A JP4592936B2 (ja) 2000-12-05 2000-12-05 電子回路用銅箔及び電子回路の形成方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010131709A Division JP5043154B2 (ja) 2010-06-09 2010-06-09 電子回路用銅箔及び電子回路の形成方法

Publications (3)

Publication Number Publication Date
JP2002176242A JP2002176242A (ja) 2002-06-21
JP2002176242A5 true JP2002176242A5 (cg-RX-API-DMAC7.html) 2009-08-27
JP4592936B2 JP4592936B2 (ja) 2010-12-08

Family

ID=18839747

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000369753A Expired - Lifetime JP4592936B2 (ja) 2000-12-05 2000-12-05 電子回路用銅箔及び電子回路の形成方法

Country Status (1)

Country Link
JP (1) JP4592936B2 (cg-RX-API-DMAC7.html)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003051673A (ja) * 2001-08-06 2003-02-21 Mitsui Mining & Smelting Co Ltd プリント配線板用銅箔及びそのプリント配線板用銅箔を用いた銅張積層板
JP4941204B2 (ja) * 2007-09-27 2012-05-30 日立電線株式会社 プリント配線板用銅箔及びその表面処理方法
EP2373134A1 (en) 2008-12-26 2011-10-05 JX Nippon Mining & Metals Corporation Rolled copper foil or electrolytic copper foil for electronic circuit, and method for forming electronic circuit using the rolled copper foil or electrolytic copper foil
CN102265711B (zh) * 2008-12-26 2014-11-05 吉坤日矿日石金属株式会社 电子电路用的压延铜箔或电解铜箔及使用它们形成电子电路的方法
KR101229617B1 (ko) 2008-12-26 2013-02-04 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 전자 회로의 형성 방법
US20110259848A1 (en) * 2008-12-26 2011-10-27 Jx Nippon Mining & Metals Corporation Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit Using Same
US20110300401A1 (en) 2009-01-29 2011-12-08 Jx Nippon Mining & Metals Corporation Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit using same
WO2010147059A1 (ja) * 2009-06-18 2010-12-23 Jx日鉱日石金属株式会社 電子回路及びその形成方法並びに電子回路形成用銅張積層板
SG181906A1 (en) * 2010-01-15 2012-07-30 Jx Nippon Mining & Metals Corp Electronic circuit, method for forming same, and copper clad laminate for forming electronic circuit
JP5367613B2 (ja) * 2010-02-12 2013-12-11 Ｊｘ日鉱日石金属株式会社 プリント配線板用銅箔
JP5079883B2 (ja) * 2010-03-30 2012-11-21 Ｊｘ日鉱日石金属株式会社 耐加熱変色及びエッチング性に優れたプリント配線板用銅箔及びそれを用いた積層体
JP5702942B2 (ja) * 2010-03-30 2015-04-15 Jx日鉱日石金属株式会社 エッチング性に優れたプリント配線板用銅箔及びそれを用いた積層体
JP5232823B2 (ja) * 2010-03-30 2013-07-10 Ｊｘ日鉱日石金属株式会社 エッチング性に優れたプリント配線板用銅箔及びそれを用いた積層体
JP5406099B2 (ja) * 2010-03-30 2014-02-05 Ｊｘ日鉱日石金属株式会社 エッチング性に優れたプリント配線板用銅箔及び積層体
JP5312412B2 (ja) 2010-08-06 2013-10-09 三洋電機株式会社 コンテンツ再生装置
CN103222349A (zh) 2010-11-12 2013-07-24 吉坤日矿日石金属株式会社 柔性层压基板上的电路形成方法
JP5558437B2 (ja) * 2011-08-24 2014-07-23 Ｊｘ日鉱日石金属株式会社 プリント配線板用銅箔及びそれを用いた積層板
TW201519712A (zh) * 2011-09-30 2015-05-16 Jx Nippon Mining & Metals Corp 印刷配線板用銅箔及使用其之積層板
JP6111017B2 (ja) 2012-02-03 2017-04-05 Ｊｘ金属株式会社 プリント配線板用銅箔及びそれを用いた積層体、プリント配線板及び電子部品
JP6304829B2 (ja) * 2013-03-05 2018-04-04 三井金属鉱業株式会社 レーザー加工用銅箔、キャリア箔付レーザー加工用銅箔、銅張積層体及びプリント配線板の製造方法
WO2016093799A1 (en) 2014-12-09 2016-06-16 Intel Corporation Microelectronic substrates having copper alloy conductive route structures
TWI593548B (zh) 2015-01-09 2017-08-01 Jx Nippon Mining & Metals Corp Attached to the metal substrate
CN105018985B (zh) * 2015-08-10 2018-07-31 灵宝华鑫铜箔有限责任公司 一种减少电解铜箔侧蚀现象的表面处理工艺
JP7183582B2 (ja) * 2018-06-19 2022-12-06 凸版印刷株式会社 ガラス配線基板
CN109788654A (zh) * 2018-12-17 2019-05-21 盐城维信电子有限公司 一种提高蚀刻因子的柔性线路板的制作方法
EP4317532A4 (en) 2021-03-25 2025-07-09 Namics Corp LAMINATE MANUFACTURING PROCESS
EP4319494A1 (en) 2021-03-25 2024-02-07 Namics Corporation Laminate for wiring board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04284690A (ja) * 1991-03-13 1992-10-09 Furukawa Saakitsuto Foil Kk 多層プリント配線板内層回路用銅箔及びその製造方法
JPH0681172A (ja) * 1992-09-01 1994-03-22 Hitachi Cable Ltd 微細パターンの形成方法
JPH07297544A (ja) * 1994-04-21 1995-11-10 Hitachi Chem Co Ltd プリント配線板の製造法
JP2000269619A (ja) * 1999-03-16 2000-09-29 Reiko Co Ltd データ通信用アンテナ回路基板製造用フイルム及びデータ通信用アンテナ回路基板

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