JP2002176091A - Substrate conveyance equipment and method therefor - Google Patents

Substrate conveyance equipment and method therefor

Info

Publication number
JP2002176091A
JP2002176091A JP2000373954A JP2000373954A JP2002176091A JP 2002176091 A JP2002176091 A JP 2002176091A JP 2000373954 A JP2000373954 A JP 2000373954A JP 2000373954 A JP2000373954 A JP 2000373954A JP 2002176091 A JP2002176091 A JP 2002176091A
Authority
JP
Japan
Prior art keywords
substrate
transport
unit
glass substrate
discharge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000373954A
Other languages
Japanese (ja)
Other versions
JP3756402B2 (en
Inventor
Kazuyoshi Suehara
和芳 末原
Hiroshi Nagate
弘 長手
Katsuhiko Nureda
克彦 濡田
Katsuyoshi Watanabe
勝義 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Holdings Corp
Hitachi Plant Technologies Ltd
Original Assignee
Hitachi Industries Co Ltd
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Industries Co Ltd, Fuji Photo Film Co Ltd filed Critical Hitachi Industries Co Ltd
Priority to JP2000373954A priority Critical patent/JP3756402B2/en
Priority to TW090129944A priority patent/TWI288426B/en
Priority to KR1020010076163A priority patent/KR100822328B1/en
Priority to SG200107589A priority patent/SG107570A1/en
Publication of JP2002176091A publication Critical patent/JP2002176091A/en
Application granted granted Critical
Publication of JP3756402B2 publication Critical patent/JP3756402B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Attitude Control For Articles On Conveyors (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To efficiently and intermittently convey a glass substrate when the grass substrate is discharged at fixed intervals. SOLUTION: The glass substrate 18 is floated by clean air that is discharged upward from an air float table 30, and both the side edge sections are supported by each of rollers 31 to 33 for conveyance. The glass substrate 18 is discharged from a discharge conveyance section 28 at a conveyance speed V1. When the rear end of the glass substrate 18 passes through a follow-up start center 35d, each glass substrate 18 in each of conveyance sections 25 to 27 starts follow-up conveyance at a faster follow-up speed V2 than the conveyance speed V1. By the follow-up conveyance, the interval of each glass substrate 18 in the discharge conveyance section 28 and a second stock conveyance section 27 becomes specific distance L2. Each glass substrate 18 reaches the conveyance speed V1 again, and the specific distance L2 is maintained. From the discharge conveyance section 28, the glass substrate 18 is successively discharged at the fixed interval (the distance L2).

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、基板搬送方法及び
装置に関し、更に詳しくは、大型の液晶表示パネルやプ
ラズマディスプレイパネルのガラス基板などの製造工程
に好適な基板搬送装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer method and apparatus, and more particularly, to a substrate transfer apparatus suitable for manufacturing a glass substrate of a large liquid crystal display panel or a plasma display panel.

【0002】[0002]

【従来の技術】液晶表示パネル(LCD)やプラズマデ
ィスプレイパネル(PDP)に使用するカラーフィルタ
は、透明なガラス基板上に赤色(R)、緑色(G)、青
色(B)の各色画素パターンと、黒色(K)のブラック
マトリックスとが形成されている。近年、LCDやPD
Pの大型化に伴って、このカラーフィルタに使用するガ
ラス基板も厚さが1mm〜10mmとかなり薄いにも関
わらず、幅や長さが1mあるいはそれ以上と大型化して
いる。
2. Description of the Related Art A color filter used for a liquid crystal display panel (LCD) or a plasma display panel (PDP) includes a pixel pattern of each color of red (R), green (G), and blue (B) on a transparent glass substrate. , Black (K) black matrix. Recently, LCD and PD
With the increase in the size of P, the glass substrate used for this color filter has also increased in width and length to 1 m or more, although it has a considerably small thickness of 1 mm to 10 mm.

【0003】カラーフィルタの製造方法としては、フイ
ルム転写方式が一般に知られている。フイルム転写方式
は、フイルム上に形成されている感光層を、感光層転写
機(以下、ラミネータという)により透明なガラス基板
上に転写(以下、ラミネートという)する。次に、露光
装置によって所定のパターンが形成されているマスクを
通して光を照射して感光層を露光する。露光後のガラス
基板は現像処理機により現像処理され、所望の画素パタ
ーンおよびブラックマトリックスが形成される。ガラス
基板は、一定間隔でラミネータに水平状態で供給され、
その下面の所定幅の周縁部を除いた転写面に対して感光
層がラミネートされる。
As a method for manufacturing a color filter, a film transfer system is generally known. In the film transfer method, a photosensitive layer formed on a film is transferred (hereinafter, referred to as a laminate) onto a transparent glass substrate by a photosensitive layer transfer machine (hereinafter, referred to as a laminator). Next, the photosensitive layer is exposed by irradiating light through a mask on which a predetermined pattern is formed by an exposure device. The exposed glass substrate is developed by a developing machine to form a desired pixel pattern and a black matrix. The glass substrate is supplied horizontally to the laminator at regular intervals,
A photosensitive layer is laminated on the transfer surface excluding the peripheral portion having a predetermined width on the lower surface.

【0004】ラミネータへのガラス基板の搬送装置とし
ては、例えば、特開平5−8833号公報に記載されて
いるような一対のウォーキングビームを用いてこれを上
下動および搬送方向に往復移動させてガラス基板を搬送
するものや、特開2000−264418号公報に記載
されているような可動機構の設けられた複数のパレット
を用いてこれらのパレット間でガラス基板を受け渡して
搬送するものや、特開2000−277587号公報に
記載されているようなロボットハンドを用いてガラス基
板を保持して搬送するものなどがある。
As a device for transporting a glass substrate to a laminator, for example, a pair of walking beams as described in Japanese Patent Application Laid-Open No. Hei 5-8833 is used to move the glass substrate up and down and reciprocate in the transport direction. One that transports a substrate, one that uses a plurality of pallets provided with a movable mechanism as described in JP-A-2000-264418, and that transfers and transports a glass substrate between these pallets, There is a method in which a glass substrate is held and transported using a robot hand as described in JP-A-2000-277587.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、上記し
たこれらの基板搬送装置では、ガラス基板を一定間隔で
排出する際に、間欠搬送を行う機械的な構造や制御が複
雑であったり、多サイズのガラス基板への対応のための
条件変更や制御が難しいという問題がある。
However, in the above-described substrate transfer apparatuses, when the glass substrates are discharged at regular intervals, the mechanical structure and control for intermittent transfer are complicated, and the size of the substrate is large. There is a problem that it is difficult to change or control conditions for handling a glass substrate.

【0006】本発明は、上記問題を解決するためになさ
れたものであり、シンプルな機構であり、ガラス基板を
一定間隔で排出する際に効率的に間欠搬送することがで
き、かつ多サイズのガラス基板への対応が容易に行える
基板搬送装置を提供することを目的とする。
The present invention has been made in order to solve the above-mentioned problem, and has a simple mechanism. The glass substrate can be efficiently intermittently conveyed when the glass substrate is discharged at regular intervals. It is an object of the present invention to provide a substrate transfer device that can easily handle a glass substrate.

【0007】[0007]

【課題を解決するための手段】上記目的を達成するため
に、本発明の基板搬送装置は、基板をラミロールに送り
込む基板搬送装置において、基板を受け取る受取搬送部
と、受取搬送部からの基板をストックし搬送するストッ
ク搬送部と、ストック搬送部からの基板を受け入れてラ
ミロールの基板送り速度に合わせた基板排出速度で基板
を排出する排出搬送部と、各搬送部における基板の位置
を検出する基板検出部と、基板検出部により排出搬送部
での基板排出を検出し、排出中の基板との間隔が所定値
となり且つ同じ基板排出速度となるように、ストック搬
送部、これに続いて受取搬送部から基板を送り出して追
いかけ搬送を行う制御部とを備えるものである。ラミロ
ールには、基板と感光層フイルムとが送り込まれ、感光
層フイルムは、基板への転写部分のカバーフイルムが剥
離された状態でラミロールに送られ、排出搬送部は、カ
バーフイルムの剥離部分の先端位置を基板の転写開始位
置に合わせて基板を排出するものである。
In order to achieve the above object, a substrate transport apparatus of the present invention is a substrate transport apparatus for feeding a substrate to a ram roll, comprising: a receiving transport section for receiving a substrate; A stock transport unit that stocks and transports, a discharge transport unit that receives a substrate from the stock transport unit and discharges the substrate at a substrate discharge speed that matches the substrate feed speed of the lami roll, and a substrate that detects the position of the substrate in each transport unit The detecting unit and the substrate detecting unit detect the discharge of the substrate in the discharging and conveying unit, and the stock conveying unit, and subsequently the receiving and conveying so that the interval between the substrates being discharged becomes a predetermined value and the same substrate discharging speed. And a control unit that sends out the substrate from the unit and performs chasing conveyance. The substrate and the photosensitive layer film are fed into the lami-roll, the photosensitive layer film is sent to the lami-roll with the cover film of the part to be transferred to the substrate being peeled off, and the discharging / transporting part is the leading end of the peeling part of the cover film. The substrate is discharged by adjusting the position to the transfer start position of the substrate.

【0008】各搬送部は、基板を各搬送部に停止させる
停止センサを備え、この停止センサの基板検出信号に基
づき各搬送部に基板を位置決めすることが好ましい。ま
た、排出搬送部に、基板の排出を検出する追いかけ開始
センサを設け、追いかけ開始センサが基板の排出を検出
した後に、基板排出速度を超えた速度でストック搬送
部、受取搬送部の基板を送って追いかけ搬送し、先行基
板との間隔が所定値になり、且つ基板排出速度となるよ
うに、各基板搬送部を制御することが好ましい。さら
に、各搬送部に、基板搬送方向に所定間隔離して上流側
基板検出センサ及び下流側基板センサを設けて追突防止
センサを構成し、上流側基板検出センサが基板無しから
基板有りに変化したときに下流側基板センサが基板有り
のときに、追突可能性有りと判定して、この追突可能性
有りと判定した上流側の基板搬送を停止することが好ま
しく、基板受取部に基板の有無を検出する在荷センサを
設け、在荷センサの基板無し信号により前工程から基板
を受け取ることが好ましい。
It is preferable that each transport unit includes a stop sensor for stopping the substrate at each transport unit, and the substrate is positioned at each transport unit based on a substrate detection signal from the stop sensor. Further, a chase start sensor for detecting discharge of the substrate is provided in the discharge / conveyance unit, and after the chase start sensor detects the discharge of the substrate, the substrate of the stock conveyance unit and the reception / conveyance unit is transmitted at a speed exceeding the substrate discharge speed. It is preferable to control each substrate transport unit such that the substrate is transported in a chasing manner, the distance between the substrate and the preceding substrate becomes a predetermined value, and the substrate discharge speed. Further, in each transport unit, a rear-end collision prevention sensor is configured by providing an upstream substrate detection sensor and a downstream substrate sensor separated by a predetermined distance in the substrate transport direction, and when the upstream substrate detection sensor changes from the absence of the substrate to the presence of the substrate. When the downstream substrate sensor has a substrate, it is determined that there is a possibility of collision, and it is preferable to stop the transport of the substrate on the upstream side that is determined to have the possibility of collision, and to detect the presence or absence of the substrate in the substrate receiving unit. It is preferable to provide a loading sensor which receives the substrate from the previous process by the substrate absence signal of the loading sensor.

【0009】また、各搬送部を、基板の両側縁部を支持
して回転する送り部材と、この送り部材で支持された基
板の中央部を気体吹き出しにより浮上させる基板浮上パ
ネルとから構成し、送り部材は基板の幅方向で基板の幅
寸法に合わせて移動可能に構成されるものである。さら
に、各搬送部を、基板の両側縁部及び感光層フイルムの
転写エリアを避けた部分を支持して回転する送り部材か
ら構成し、送り部材は基板の幅方向で転写エリアを避け
た部分の位置に合わせて移動可能に構成されるものであ
る。各搬送部には、送り部材との間で基板を挟持して搬
送するニップ部材を設けることが好ましく、排出搬送部
には、ニップ部材の近傍に幅寄せ部材を設け、ニップ部
材をニップ解除状態にして基板の幅寄せを行うことが好
ましい。
[0009] Each of the transport sections is constituted by a feed member which rotates while supporting both side edges of the substrate, and a substrate floating panel which floats a central portion of the substrate supported by the feed member by blowing out gas. The feeding member is configured to be movable in the width direction of the substrate in accordance with the width dimension of the substrate. Further, each transport unit is constituted by a feed member which rotates while supporting the side edges of the substrate and a portion avoiding the transfer area of the photosensitive layer film, and the feed member corresponds to a portion avoiding the transfer area in the width direction of the substrate. It is configured to be movable in accordance with the position. It is preferable that each transport unit is provided with a nip member that transports the substrate while sandwiching the substrate between the transport member and the discharge transport unit. It is preferable to adjust the width of the substrate.

【0010】さらに、ストック搬送部を複数個設け、各
搬送部にヒータを設けて各基板を基板排出時の目標温度
まで予熱し、受取搬送部では目標温度よりも低めの設定
にし、ストック搬送部では目標温度に達するように高め
の設定にし、排出搬送部では目標温度より少し高めの設
定にすることが好ましく、各搬送部に設けたヒータを小
さくブロック分けし各ブロック毎に温度設定を可能にす
ることが好ましい。
Further, a plurality of stock transfer sections are provided, a heater is provided in each transfer section, and each substrate is preheated to a target temperature at the time of substrate discharge, and the receiving transfer section is set at a lower temperature than the target temperature. It is preferable to set the temperature higher to reach the target temperature, and to set it slightly higher than the target temperature in the discharge / transport section.The heater provided in each transport section is divided into small blocks, and the temperature can be set for each block. Is preferred.

【0011】また、本発明の基板搬送方法は、基板をラ
ミロールに送り込む基板搬送方法において、基板を受け
取る受取搬送部と、受取搬送部からの基板をストックし
搬送するストック搬送部と、ストック搬送部からの基板
を受け入れてラミロールの基板送り速度に合わせた基板
排出速度で基板を排出する排出搬送部と、各搬送部にお
ける基板の位置を検出する基板検出部と、基板検出部で
検出した基板の位置に応じて各搬送部を制御する制御部
とを用い、基板検出部により排出搬送部での基板排出を
検出し、排出中の基板との間隔が所定値となり且つ同じ
基板排出速度となるように、ストック搬送部、これに続
いて受取搬送部から基板を送り出して追いかけ搬送を行
うものである。
Further, according to the substrate transport method of the present invention, in a substrate transport method for transporting a substrate to a lami roll, a receiving transport section for receiving a substrate, a stock transport section for stocking and transporting the substrate from the receive transport section, a stock transport section A discharge transport unit that receives a substrate from the substrate and discharges the substrate at a substrate discharge speed that matches the substrate feed speed of the ram roll, a substrate detection unit that detects the position of the substrate in each transport unit, and a substrate detection unit that detects the substrate A control unit that controls each transfer unit according to the position, a substrate detection unit detects discharge of the substrate in the discharge transfer unit, and a distance between the discharge substrate and the discharge substrate becomes a predetermined value and the same substrate discharge speed. Then, the substrate is sent out from the stock transport unit and subsequently the receiving / transporting unit to perform the chase transport.

【0012】[0012]

【発明の実施の形態】図1は、本発明の基板搬送装置が
設けられたラミネータの構成を示す概略図である。ラミ
ネータ10は、予備加熱部11、熱圧着部12、積層体
フイルム供給部13、冷却部14、剥離部15、基板取
り出し部16、後述するコントローラ17から構成され
ており、図2に示すように、透明なガラス基板18の周
縁部を除いた転写エリアTAに感光層を転写する。
FIG. 1 is a schematic diagram showing the configuration of a laminator provided with a substrate transfer device according to the present invention. The laminator 10 includes a pre-heating unit 11, a thermocompression unit 12, a laminated film supply unit 13, a cooling unit 14, a peeling unit 15, a substrate take-out unit 16, and a controller 17, which will be described later, as shown in FIG. Then, the photosensitive layer is transferred to a transfer area TA excluding the peripheral portion of the transparent glass substrate 18.

【0013】ガラス基板18は図示しないロボットハン
ドによって予備加熱部11に供給される。ロボットハン
ドのハンド本体には吸着パッドが設けられている。ロボ
ットハンドは、この吸着パッドによってガラス基板18
の裏面(感光層の非転写面)を吸着し、これを保持す
る。そして、ロボットハンドは、表面(感光層の被転写
面)を下側に向けた裏返し状態にして、このガラス基板
18を予備加熱部11に供給する。
The glass substrate 18 is supplied to the preheating unit 11 by a robot hand (not shown). The hand body of the robot hand is provided with a suction pad. The robot hand uses the suction pad to move the glass substrate 18.
(The non-transfer surface of the photosensitive layer) is adsorbed and held. Then, the robot hand supplies the glass substrate 18 to the preheating unit 11 with the surface (the surface to which the photosensitive layer is to be transferred) turned upside down.

【0014】予備加熱部11は、基板搬送装置20とヒ
ータ21,22とから構成されており、受取搬送部25
と第1及び第2ストック搬送部26,27と排出搬送部
28とにそれぞれ区画されている。受取搬送部25は、
ロボットハンドからガラス基板18を受け取って下流側
に搬送する。ガラス基板18は、第1及び第2ストック
搬送部26,27を経て排出搬送部28まで搬送され
る。ガラス基板18は排出搬送部28で待機し、熱圧着
部12からの指示によって後述する熱圧着部12のラミ
ロール対に向かって送り出される。
The pre-heating unit 11 includes a substrate transfer device 20 and heaters 21 and 22.
, And first and second stock transport units 26 and 27 and a discharge transport unit 28. The receiving and transporting unit 25 includes:
The glass substrate 18 is received from the robot hand and transferred to the downstream side. The glass substrate 18 is transported to the discharge transport unit 28 via the first and second stock transport units 26 and 27. The glass substrate 18 waits in the discharge / conveyance section 28 and is sent out to a later-described pair of ram rolls of the thermocompression section 12 according to an instruction from the thermocompression section 12.

【0015】ヒータ21,22は、基板搬送装置20の
ガラス基板18の搬送路を挟むように上下方向で配置さ
れており、搬送されるガラス基板18を所定温度に加熱
する。ヒータとしては遠赤外線ヒータ、ニクロム線ヒー
タ、熱風ヒータ等を利用することができる。
The heaters 21 and 22 are arranged vertically so as to sandwich the transfer path of the glass substrate 18 of the substrate transfer device 20, and heat the transferred glass substrate 18 to a predetermined temperature. As the heater, a far-infrared heater, a nichrome wire heater, a hot air heater, or the like can be used.

【0016】ヒータ21,22は、受取搬送部25では
熱変形を抑えるために設定温度を低く、第1及び第2ス
トック搬送部26,27では短時間でガラス基板18が
所定温度になるように設定温度を高く、排出搬送部28
では待機中にガラス基板18の温度が下がらないように
僅かに設定温度を高くする。例えば、ガラス基板18を
110℃に加熱する際の各設定温度は、ヒータ21a,
22aが100℃、ヒータ21b,22b及び21c,
22cが180℃、ヒータ21d,22dが120℃と
する。これにより、ガラス基板18は、熱変形すること
なく短時間で所定温度に加熱されるとともに、待機中に
その温度が下がることはない。なお、ヒータ21,22
の設定温度は、これに限られず、基板サイズや必要な所
定温度に応じて適宜決定される。また、ヒータ21,2
2は小サイズの面発熱体を並べて構成しており、個別に
コントローラ(図示せず)を備えている。したがって、
ガラス基板18の温度分布均一化のため設定温度を個別
に変えることも可能で、例えば冷えやすいガラス基板1
8の両サイドを高めに設定することもできる。さらに、
各搬送部25〜28では最低停止時間が設定してあり、
所定温度までの昇温が確実に行われるようになってい
る。
The heaters 21 and 22 are set at a low temperature in the receiving / transporting section 25 to suppress thermal deformation, and in the first and second stock transporting sections 26 and 27, the glass substrate 18 is brought to a predetermined temperature in a short time. If the set temperature is high,
Then, the set temperature is slightly increased so that the temperature of the glass substrate 18 does not decrease during standby. For example, each set temperature when the glass substrate 18 is heated to 110 ° C.
22a is 100 ° C., heaters 21b, 22b and 21c,
The temperature of the heater 22d is set to 180 ° C, and the heaters 21d and 22d are set to 120 ° C. Thereby, the glass substrate 18 is heated to a predetermined temperature in a short time without being thermally deformed, and the temperature does not decrease during standby. The heaters 21 and 22
Is not limited to this, and is appropriately determined according to the substrate size and the required predetermined temperature. In addition, heaters 21 and
Numeral 2 is configured by arranging small-sized surface heating elements, and is individually provided with a controller (not shown). Therefore,
It is also possible to individually change the set temperature in order to make the temperature distribution of the glass substrate 18 uniform.
It is also possible to set both sides of 8 higher. further,
The minimum stop time is set in each of the transport units 25 to 28,
The temperature is reliably increased to a predetermined temperature.

【0017】基板搬送装置20は、図3に示すように、
エア浮上テーブル30、送りローラ31、つば付送りロ
ーラ32、幅寄せローラ33、ニップローラ34、セン
サ35〜39等から構成される。ガラス基板18は、送
りローラ31及びつば付送りローラ32に両側縁部を支
持されて搬送される。エア浮上テーブル30は、ガラス
基板18の下面と対面するように配置されており、その
表面にはエアの吹き出し口30aが多数形成されてい
る。この吹き出し口30aからガラス基板18に向けて
クリーンなエアを吹き出すことで、自重により撓んだガ
ラス基板18の中央部を浮上させる。
As shown in FIG. 3, the substrate transfer device 20
It comprises an air floating table 30, a feed roller 31, a feed roller 32 with a flange, a width approach roller 33, a nip roller 34, sensors 35 to 39, and the like. The glass substrate 18 is conveyed with both side edges supported by a feed roller 31 and a feed roller 32 with a flange. The air floating table 30 is arranged so as to face the lower surface of the glass substrate 18, and a large number of air outlets 30a are formed on the surface thereof. By blowing clean air from the outlet 30a toward the glass substrate 18, the central portion of the glass substrate 18 bent by its own weight floats.

【0018】送りローラ31及びつば付送りローラ32
は、エア浮上ステージ30の両側部に形成された切り欠
き部30bに配置されており、それぞれ回転自在に支持
されるとともに、ガラス基板18の搬送方向に対して直
交する向きにガラス基板18の幅寸法に合わせて移動可
能とされている。各送りローラ31,32はパルスモー
タ40により回転駆動され、後述する各センサ35〜3
9からの基板検出信号に応じて、モータドライバ41を
介してコントローラ17がパルスモータ40の駆動を制
御する。また、各送りローラ31,32は、切り欠き部
30bに沿ってガラス基板18の幅寸法に合わせて移動
することで、多サイズのガラス基板の搬送に対応するこ
とができる。
Feed roller 31 and feed roller 32 with flange
Are arranged in cutouts 30 b formed on both sides of the air floating stage 30, respectively, are rotatably supported, and have a width of the glass substrate 18 in a direction orthogonal to the direction in which the glass substrate 18 is conveyed. It can be moved according to the dimensions. Each of the feed rollers 31 and 32 is rotationally driven by a pulse motor 40, and each of the sensors 35 to 3 to be described later.
The controller 17 controls the driving of the pulse motor 40 via the motor driver 41 according to the substrate detection signal from the controller 9. Further, each of the feed rollers 31 and 32 can be adapted to transport a multi-size glass substrate by moving along the cutout portion 30b according to the width of the glass substrate 18.

【0019】送りローラ31及びつば付送りローラ32
は、ガラス基板18の下面の両側縁部に接触し、回転す
ることでガラス基板18を搬送する。このとき、ガラス
基板18の表面(感光層の被転写面)が下側となってい
るが、各送りローラ31,32は感光層が転写されない
ガラス基板18の周縁部に接触するので、感光層の転写
エリアTAに損傷を与えたり、塵埃を付着させることは
ない。また、つば付ローラ32のつば32aは、ガラス
基板18のガイドとして機能し、ガラス基板18の幅方
向の位置を規制する。
Feed roller 31 and feed roller 32 with brim
Contacts the both side edges of the lower surface of the glass substrate 18 and conveys the glass substrate 18 by rotating. At this time, although the surface of the glass substrate 18 (the surface to which the photosensitive layer is transferred) is on the lower side, each of the feed rollers 31 and 32 comes into contact with the periphery of the glass substrate 18 on which the photosensitive layer is not transferred. The transfer area TA is not damaged or dust is attached. The flange 32a of the flanged roller 32 functions as a guide for the glass substrate 18 and regulates the position of the glass substrate 18 in the width direction.

【0020】幅寄せローラ33には、幅寄せ機構42が
設けられている。コントローラ17は幅寄せ機構42を
介して、幅寄せローラ33をガラス基板18の側面に当
接する矯正位置と、ガラス基板18から離間する退避位
置との間で選択的にセットする。幅寄せローラ33が矯
正位置にセットされると、ガラス基板18の幅方向の位
置及び傾きの修正が行われ、ガラス基板18の直進精度
が上がる。なお、ガラス基板18の破損防止のために、
コントローラ17は幅寄せローラ33を矯正位置へセッ
トする際には後述のニップローラ34を退避位置にセッ
トし、ニップローラ34を搬送位置にセットする際には
幅寄せローラ33を退避位置にセットするように制御を
行う。
The width adjusting roller 33 is provided with a width adjusting mechanism 42. The controller 17 selectively sets the width adjustment roller 33 between the correction position where the width adjustment roller 33 contacts the side surface of the glass substrate 18 and the retreat position where the width adjustment roller 33 is separated from the glass substrate 18 via the width adjustment mechanism 42. When the width adjustment roller 33 is set at the correction position, the position and the inclination of the glass substrate 18 in the width direction are corrected, and the straight traveling accuracy of the glass substrate 18 is increased. In order to prevent the glass substrate 18 from being damaged,
The controller 17 sets a nip roller 34 to be described later to a retract position when setting the width adjusting roller 33 to the correction position, and sets the width adjusting roller 33 to the retract position when setting the nip roller 34 to the transport position. Perform control.

【0021】ニップローラ34はテフロン(登録商標)
で形成されており、ニップ機構43が設けられている。
コントローラ17はニップ機構43を介して、ニップロ
ーラ34を送りローラ31との間でガラス基板18を狭
持する搬送位置と、ガラス基板18と離間する退避位置
との間で選択的にセットする。ニップローラ34と送り
ローラ31との間でガラス基板18の両側縁部を挟持す
ることで、搬送時のガラス基板18のスリップを防止す
る。なお、ガラス基板18の破損防止のために、ニップ
ローラ34を搬送位置へセットする際にはガラス基板1
8と接触する直前でゆっくりとニップローラ34を移動
させる。また、ガラス基板18がラミロール対に狭持さ
れると、ニップローラ34は退避位置にセットされる。
さらに、本実施形態ではニップローラをテフロンで形成
しているが、機能上問題がなければ他の材料や、より弾
性のあるゴム系の素材、例えばフッ素系ゴム、シリコン
ゴム等を用いて形成してもよい。
The nip roller 34 is made of Teflon (registered trademark).
And a nip mechanism 43 is provided.
The controller 17 selectively sets, via the nip mechanism 43, the nip roller 34 between a transport position where the glass substrate 18 is held between the feed roller 31 and a retracted position where the glass substrate 18 is separated from the glass substrate 18. By sandwiching both side edges of the glass substrate 18 between the nip roller 34 and the feed roller 31, slippage of the glass substrate 18 during transport is prevented. In order to prevent the glass substrate 18 from being damaged, when setting the nip roller 34 to the transfer position, the glass substrate 1
The nip roller 34 is slowly moved just before contact with the nip roller 8. When the glass substrate 18 is held between the pair of ram rolls, the nip roller 34 is set to the retracted position.
Furthermore, in the present embodiment, the nip roller is formed of Teflon, but if there is no problem in function, it is formed by using another material or a more elastic rubber material, for example, fluorine rubber, silicon rubber, or the like. Is also good.

【0022】エア浮上テーブル30の中央部に形成され
た切り欠き部30cには、耐熱性反射式光ファイバー式
センサからなるセンサ35〜39が配置される。各セン
サ35〜39は、ガラス基板18の搬送方向に沿って配
置されており、それぞれコントローラ17に接続されて
いる(図示せず)。そして、ガラス基板18を検出する
とそれぞれ基板検出信号をコントローラ17に送出す
る。コントローラ17は、各センサ35〜39からの基
板検出信号に基づいて、ガラス基板18の位置を特定し
て搬送を制御する。
In the notch 30c formed at the center of the air levitation table 30, sensors 35 to 39, which are heat-resistant reflective optical fiber sensors, are arranged. Each of the sensors 35 to 39 is arranged along the transport direction of the glass substrate 18 and is connected to the controller 17 (not shown). When the glass substrate 18 is detected, a substrate detection signal is sent to the controller 17. The controller 17 controls the conveyance by specifying the position of the glass substrate 18 based on the substrate detection signals from the sensors 35 to 39.

【0023】図4は、各搬送部25〜28における各ロ
ーラ31〜34及び各センサ35〜39の配置位置を示
すものである。在荷センサ35a〜35dは、各搬送部
25〜28のガラス基板18の有無を検出する。排出搬
送部28の在荷センサ35aがオンになると、熱圧着部
12で感光層の転写の準備が行われる。そして、熱圧着
部12から送り込み開始信号が送出されると後述するラ
ミロール対への投入速度に合わせた搬送速度V1でガラ
ス基板18を送り出す。また、受取搬送部25の在荷セ
ンサ35c,35dのどちらか一方がオンになっている
ときは、ロボットハンドが受取搬送部25にガラス基板
18を供給することはなく、ガラス基板18が二重に載
置されることはない。在荷センサ35c,35dが2個
ともオフになると、次のガラス基板18がロボットハン
ドにより供給される。
FIG. 4 shows the arrangement positions of the rollers 31 to 34 and the sensors 35 to 39 in the transport sections 25 to 28. The presence sensors 35a to 35d detect the presence or absence of the glass substrate 18 in each of the transport units 25 to 28. When the presence sensor 35a of the discharge / conveyance unit 28 is turned on, the thermocompression bonding unit 12 prepares for transfer of the photosensitive layer. Then, when a sending start signal is sent from the thermocompression bonding section 12, the glass substrate 18 is sent out at a transfer speed V1 in accordance with a feeding speed to a lami roll pair described later. When one of the presence sensors 35c and 35d of the receiving / transporting unit 25 is turned on, the robot hand does not supply the glass substrate 18 to the receiving / transporting unit 25, and the glass substrate 18 is Will not be placed on the When both of the presence sensors 35c and 35d are turned off, the next glass substrate 18 is supplied by the robot hand.

【0024】停止センサ36a〜36dは、各搬送部2
5〜28の下流側端部に設けられており、その位置にガ
ラス基板18が達してオンするとガラス基板18の搬送
を停止する。排出搬送部28では、停止センサ35aの
位置にガラス基板18の先端が達すると搬送を停止す
る。また、他の搬送部25〜27では、その搬送部より
下流側の搬送部にガラス基板18が有る場合に、各停止
センサ35b〜35dの位置にガラス基板18の先端が
達すると、その搬送部でガラス基板18の搬送を停止す
る。
Each of the stop sensors 36a to 36d
The glass substrates 18 are provided at downstream end portions of Nos. 5 to 28. When the glass substrate 18 reaches the position and is turned on, the conveyance of the glass substrate 18 is stopped. When the leading end of the glass substrate 18 reaches the position of the stop sensor 35a, the discharge and transport unit 28 stops the transport. In addition, in the other transfer units 25 to 27, when the glass substrate 18 is located in the transfer unit downstream of the transfer unit and the tip of the glass substrate 18 reaches the position of each of the stop sensors 35b to 35d, the transfer unit Then, the conveyance of the glass substrate 18 is stopped.

【0025】ニップセンサ37a〜37hは、各ニップ
ローラ34の近傍に設けられており、その位置にガラス
基板18の先端が達すると、それぞれに対応するニップ
ローラ34が搬送位置にセットされる。また、ガラス基
板18の後端がニップローラ34を通過する際には、後
端の通過前にそれぞれに対応するニップローラ34が退
避位置にセットされる。
The nip sensors 37a to 37h are provided in the vicinity of the nip rollers 34. When the tip of the glass substrate 18 reaches that position, the corresponding nip rollers 34 are set at the transport position. When the rear end of the glass substrate 18 passes through the nip roller 34, the corresponding nip roller 34 is set to the retracted position before passing the rear end.

【0026】追送開始センサ38は、第2ストック搬送
部28の停止センサ36bから距離L1だけ離して設け
られている。排出搬送部28からガラス基板18が熱圧
着部12に送り出されて、その後端が追送開始センサ3
8を通過すると追送開始センサ38がオフになる。追送
開始センサ38がオフになると、受取搬送部25、第1
及び第2ストック搬送部26,27にあるガラス基板1
8が搬送速度V1よりも速い追送速度V2でそれぞれ追
いかけ搬送を開始する。
The additional feed start sensor 38 is provided at a distance L1 from the stop sensor 36b of the second stock transport section 28. The glass substrate 18 is sent out from the discharging / conveying unit 28 to the thermocompression bonding unit 12, and the trailing end of the glass substrate 18
8, the feed start sensor 38 is turned off. When the additional feed start sensor 38 is turned off, the receiving and transporting unit 25, the first
And the glass substrate 1 in the second stock transfer units 26 and 27
8 starts the chase conveyance at the additional transport speed V2 higher than the transport speed V1.

【0027】追いかけ搬送は、追送時間Tだけ行われ
る。追送速度V2及び追送時間Tは各基板サイズに応じ
て条件出しを行って、熱圧着部12に各ガラス基板18
の間隔が所定の距離L2(図3参照)でガラス基板18
が供給されるように適宜設定されている。これにより、
追送時間Tが経過すると、排出搬送部28から送り出さ
れたガラス基板18と第2ストック搬送部28にあった
ガラス基板18との間隔は所定の距離L2となる。そし
て、追送時間Tが経過した後は、追いかけ搬送したガラ
ス基板18も搬送速度V1になって、所定の距離L2を
保持したまま熱圧着部12に向かって搬送される。
The follow-up transport is performed for the additional transport time T. The additional speed V2 and additional time T are determined according to the size of each substrate, and the glass substrate 18
At a predetermined distance L2 (see FIG. 3).
Is set appropriately so as to be supplied. This allows
After the lapse of the additional feeding time T, the distance between the glass substrate 18 sent from the discharge conveyance unit 28 and the glass substrate 18 in the second stock conveyance unit 28 becomes a predetermined distance L2. After the elapse of the additional transport time T, the glass substrate 18 that has been chased and transported also reaches the transport speed V1 and is transported toward the thermocompression bonding unit 12 while maintaining the predetermined distance L2.

【0028】このように、熱圧着部12の直前に位置す
る排出搬送部28においてガラス基板18の間隔を所定
の距離L2に調整するので、熱圧着部12に精度良く一
定の間隔でガラス基板18を順次供給することができ
る。また、熱圧着部12の直前でガラス基板18の間隔
を調整するので、排出搬送部28に到達するまでの搬送
でズレが生じても問題ない。さらに、各搬送部25〜2
8で定位置停止するので、受取搬送部25へのガラス基
板18の投入時間間隔のバラツキや基板サイズに関わら
ず、熱圧着部12に精度良く一定の間隔でガラス基板1
8を順次供給することができる。なお、追送速度V2を
速くすることで、追いかけ搬送距離を短くすることがで
き、これに伴って基板搬送装置全体の小型化が図れる。
As described above, the interval between the glass substrates 18 is adjusted to the predetermined distance L2 in the discharge / conveyance section 28 located immediately before the thermocompression bonding section 12, so that the glass substrates 18 can be precisely and regularly attached to the thermocompression bonding section 12. Can be sequentially supplied. In addition, since the interval between the glass substrates 18 is adjusted immediately before the thermocompression bonding section 12, there is no problem even if a deviation occurs in the conveyance until the glass substrate 18 reaches the discharge conveyance section 28. Further, each transport unit 25-2
8, the glass substrate 1 is accurately fixed to the thermocompression bonding section 12 at a constant interval regardless of the variation in the time interval of the loading of the glass substrate 18 into the receiving and transporting section 25 and the substrate size.
8 can be supplied sequentially. By increasing the additional transport speed V2, the follow-up transport distance can be reduced, and the size of the entire substrate transport apparatus can be reduced accordingly.

【0029】追突防止センサ39a〜39f及び停止セ
ンサ36b,36cは、搬送される下流側のガラス基板
18に上流側のガラス基板18が追突することを防止す
るために、前後のガラス基板18の間隔が所定の距離L
2離れているか否かを検出する。各センサは、39aと
39b、39cと39d、36bと39e、36cと3
9fがそれぞれ一対になっており、それぞれ所定の距離
L2にセットされている。一対のセンサのうち、上流側
のセンサがガラス基板無しからガラス基板有りに変化し
たときに、下流側のセンサがガラス基板有りである場合
には、前後のガラス基板18の間隔が所定の距離L2以
下になっていることを示し、追いかけ搬送していたガラ
ス基板18の搬送が停止される。先行する下流側のガラ
ス基板18が搬送されて、前後のガラス基板18の間隔
が所定の距離L2となると、再び追いかけ搬送していた
ガラス基板18の搬送が再開される。このときの搬送速
度は、ラミロール対への投入速度に合わせた搬送速度V
1である。
The rear-end collision prevention sensors 39a to 39f and the stop sensors 36b and 36c are provided to prevent the upstream-side glass substrate 18 from colliding with the downstream-side glass substrate 18 to be conveyed. Is a predetermined distance L
It is detected whether or not they are separated by two. Each sensor is 39a and 39b, 39c and 39d, 36b and 39e, 36c and 3
9f are paired, and are each set to a predetermined distance L2. When the upstream sensor of the pair of sensors changes from the absence of the glass substrate to the presence of the glass substrate, and the downstream sensor has the glass substrate, the distance between the front and rear glass substrates 18 is a predetermined distance L2. This indicates that the transfer of the glass substrate 18 that has been being chased and conveyed is stopped. When the preceding glass substrate 18 on the downstream side is conveyed and the distance between the front and rear glass substrates 18 becomes a predetermined distance L2, the conveyance of the glass substrate 18 that has been chasing and conveyed again is restarted. The transport speed at this time is a transport speed V that matches the feeding speed to the lami roll pair.
It is one.

【0030】図1において、熱圧着部12は、ラミロー
ル対50とバックアップローラ51とから構成されてい
る。ラミロール対50は、上下方向で配置したラミロー
ル50a,50bから構成されており、これらラミロー
ル50a,50bにはヒータが内蔵されている。ラミロ
ール対50はガラス基板18と積層体フイルム52とを
挟持して搬送することにより、ガラス基板18へ積層体
フイルム52を熱圧着して貼り付ける。バックアップロ
ーラ51は、ラミロール50a,50bに接触して従動
回転するように構成されており、ラミロール50a,5
0bの撓みを抑えて、均一な力による熱圧着を可能にす
る。また、基板搬送装置20と熱圧着部12との間に
も、前述のエア浮上テーブル30と同じ構成のエア浮上
テーブル53が設けられている。これによりガラス基板
18を水平に保ち、ラミロール対50へガラス基板18
を投入する際にガラス基板18の中央部が撓んで下側の
ラミロール50aと衝突することを防止する。
In FIG. 1, the thermocompression bonding section 12 is composed of a pair of Rami rolls 50 and a backup roller 51. The Lami roll pair 50 is composed of Lami rolls 50a and 50b arranged in the vertical direction, and these Rami rolls 50a and 50b have a built-in heater. The lami-roll pair 50 sandwiches and transports the glass substrate 18 and the laminated film 52, thereby bonding the laminated film 52 to the glass substrate 18 by thermocompression bonding. The backup roller 51 is configured to contact and rotate with the Lami rolls 50a, 50b.
Ob is suppressed, and thermocompression bonding with uniform force is enabled. An air levitation table 53 having the same configuration as the above-described air levitation table 30 is provided between the substrate transfer device 20 and the thermocompression bonding section 12. As a result, the glass substrate 18 is kept horizontal, and the glass substrate 18 is
The center portion of the glass substrate 18 is prevented from being bent when the glass substrate 18 is supplied, and colliding with the lower ram roll 50a.

【0031】積層体フイルム供給部13は、積層体フイ
ルムロール54の取付軸54a、ハーフカッタ55、カ
バーフイルム剥離部56、バックテンションローラ57
等から構成されている。この積層体フイルム供給部13
は、積層体フイルムロール54からカバーフイルム52
cを剥がして、感光層を上に向けた状態でベースフイル
ム52bをラミロール対50に供給する。
The laminated film supply unit 13 includes a mounting shaft 54a of the laminated film roll 54, a half cutter 55, a cover film peeling unit 56, and a back tension roller 57.
And so on. This laminated film supply unit 13
The cover film 52 is moved from the laminate film roll 54 to the cover film 52.
Then, the base film 52b is supplied to the ramirole pair 50 with the photosensitive layer facing upward.

【0032】積層体フイルム52は、ベースフイルム5
2bに図示しない補助層、中間層などを介して感光層5
2aが層設されており、更に感光層52aの上にはカバ
ーフイルム52c、ベースフイルム52bの他方の面に
は帯電防止層などが層設されている。
The laminated film 52 is composed of a base film 5
2b, a photosensitive layer 5 via an auxiliary layer, an intermediate layer and the like (not shown).
2a, a cover film 52c is provided on the photosensitive layer 52a, and an antistatic layer is provided on the other surface of the base film 52b.

【0033】ハーフカッタ55は、ガラス基板18の長
さに合わせて、積層体フイルム52をハーフカットす
る。このハーフカットでは、カバーフイルム52c、感
光層52aが切断され、ベースフイルム52bは切断さ
れることがない。
The half cutter 55 cuts the laminated film 52 in half according to the length of the glass substrate 18. In this half cut, the cover film 52c and the photosensitive layer 52a are cut, and the base film 52b is not cut.

【0034】カバーフイルム剥離部56は、ガラス基板
18への貼付面となるハーフカットされた部分のカバー
フイルム52cを積層体フイルム52から剥離する。こ
の剥離は、粘着テープロール56aから引き出された粘
着テープ56cを押さえローラ56bによりカバーフイ
ルム52cへ貼り付けて行われ、このカバーフイルム5
2cが貼りついた粘着テープ56cはテープ巻取り軸5
6dに巻き取られ回収される。また、ガラス基板18と
ガラス基板18との間に位置することになる積層体フイ
ルム52に対しては、そのカバーフイルム52cが剥離
されずに残される。
The cover film peeling section 56 peels the half-cut cover film 52c, which is the surface to be attached to the glass substrate 18, from the laminate film 52. This peeling is performed by sticking the adhesive tape 56c pulled out from the adhesive tape roll 56a to the cover film 52c by the pressing roller 56b.
The adhesive tape 56c to which 2c is attached is a tape winding shaft 5.
It is wound and collected by 6d. Further, the cover film 52c of the laminated film 52 which is to be located between the glass substrates 18 is left without being peeled off.

【0035】熱圧着部12では、ハーフカット線が所定
の位置を通過すると基板搬送装置20に送り込み開始信
号を送出する。これにより、ガラス基板18とハーフカ
ット線との位置合わせが行われた状態で、ガラス基板1
8に積層体フイルム52の感光層52aが貼り付けられ
る。そして、ベースフイルム52bもガラス基板18の
移動に伴いラミロール対50の送り方向下流側に送られ
る。
In the thermocompression bonding section 12, when the half-cut line passes through a predetermined position, a sending start signal is sent to the substrate transfer device 20. Thus, the glass substrate 1 is aligned with the glass substrate 18 and the half-cut line.
8, the photosensitive layer 52a of the laminated film 52 is attached. Then, the base film 52b is also sent to the downstream side in the feed direction of the pair of Rami rolls 50 as the glass substrate 18 moves.

【0036】冷却部14は、冷却風吹き出しボード60
と、搬送ローラ61とから構成されている。冷却風吹き
出しボード60は、HEPAフィルタを通過したクリー
ンな冷却風をガラス基板18に向けて吹き出して、搬送
ローラ61で搬送されているガラス基板18の温度をほ
ぼ室温(30℃以下)に冷やす。
The cooling unit 14 is provided with a cooling air blowing board 60
And a transport roller 61. The cooling air blowing board 60 blows clean cooling air that has passed through the HEPA filter toward the glass substrate 18 to cool the temperature of the glass substrate 18 being conveyed by the conveying rollers 61 to almost room temperature (30 ° C. or lower).

【0037】剥離部15は剥離ローラ62及びベースフ
イルム巻取り機構63から構成されており、ガラス基板
18からベースフイルム52bを剥離し、このベースフ
イルム62bを回収軸63aにロール状に巻き取る。回
収軸63aは図示しない巻取りモータによって回転駆動
される。この巻取りモータはトルク制御されており、ラ
ミロール対50以降のベースフイルム52bの張力を一
定に保持して、ベースフイルム52bに弛みが発生しな
いようにしている。
The peeling section 15 is composed of a peeling roller 62 and a base film winding mechanism 63. The peeling section 15 peels the base film 52b from the glass substrate 18, and winds the base film 62b in a roll around a collecting shaft 63a. The collection shaft 63a is driven to rotate by a winding motor (not shown). The take-up motor is torque-controlled so as to keep the tension of the base film 52b after the pair of Rami rolls 50 constant so that the base film 52b does not loosen.

【0038】剥離部15の下流側には、エア浮上テーブ
ル65からなる基板取り出し部16が設けられている。
このエア浮上テーブル65は、予備加熱部11のエア浮
上テーブル30と同様に構成されている。剥離部15か
ら送り出されたガラス基板18は、図示しないロボット
ハンドによってその上面を吸着されて取り出される。
On the downstream side of the peeling section 15, a substrate take-out section 16 composed of an air floating table 65 is provided.
The air levitation table 65 is configured similarly to the air levitation table 30 of the preliminary heating unit 11. The upper surface of the glass substrate 18 sent out from the peeling section 15 is sucked by a robot hand (not shown) and is taken out.

【0039】次に、上記構成の作用について説明する。
ロボットハンドにより受取搬送部25に1枚目のガラス
基板18が投入されると、このガラス基板18は、第1
ストック搬送部26、第2ストック搬送部27、排出搬
送部28の順に搬送され、ヒータ21,22により所定
の温度に加熱される。ガラス基板18の先端が排出搬送
部の停止センサ36aに達すると搬送が停止する。その
後、2枚目、3枚目、4枚目のガラス基板18が順次投
入、搬送されて、各搬送部25〜27の停止センサ36
b〜36dの位置でそれぞれ停止する。
Next, the operation of the above configuration will be described.
When the first glass substrate 18 is put into the receiving and transporting unit 25 by the robot hand, the first glass substrate 18
The sheet is transported in the order of the stock transport section 26, the second stock transport section 27, and the discharge transport section 28, and is heated to a predetermined temperature by the heaters 21 and 22. When the tip of the glass substrate 18 reaches the stop sensor 36a of the discharge / transport section, the transport is stopped. Thereafter, the second, third, and fourth glass substrates 18 are sequentially loaded and transported, and the stop sensors 36 of the transport units 25 to 27 are transported.
It stops at the positions of b to 36d.

【0040】熱圧着部12では、ラミロール対50が回
転して積層体フイルム52を送り、積層体フイルム52
のハーフカット線が所定の位置にくると、送り込み開始
信号を基板搬送装置20に送出する。基板搬送装置20
は、この送り込み開始信号の入力により、ラミロール対
50への投入速度に合わせた搬送速度V1で排出搬送部
28から1枚目のガラス基板18を送り出す。ガラス基
板18の後端が追送開始センサ38を通過すると、2枚
目のガラス基板18が搬送速度V1よりも速い追送速度
V2で追いかけ搬送を開始する。追送時間Tが経過する
と2枚目のガラス基板18も搬送速度V1で搬送され
る。このとき、1枚目のガラス基板18と2枚目のガラ
ス基板18との間隔は、所定の距離L2になっている。
In the thermocompression bonding section 12, the lami-roll pair 50 rotates to feed the laminated film 52, and the laminated film 52
When the half-cut line reaches a predetermined position, a sending start signal is sent to the substrate transfer device 20. Substrate transfer device 20
Sends out the first glass substrate 18 from the discharge / conveyance unit 28 at the conveyance speed V1 that matches the speed of feeding into the pair of Rami rolls 50 in response to the input of the feeding start signal. When the rear end of the glass substrate 18 passes through the additional feed start sensor 38, the second glass substrate 18 starts chasing and transporting at an additional transport speed V2 higher than the transport speed V1. After the additional transport time T has elapsed, the second glass substrate 18 is also transported at the transport speed V1. At this time, the distance between the first glass substrate 18 and the second glass substrate 18 is a predetermined distance L2.

【0041】以下、3枚目、4枚目のガラス基板18も
同様に、ラミロール対50に送り込まれるガラス基板1
8の搬送速度V1よりも速い追送速度V2で追送し、ラ
ミロール対50に送り込まれるガラス基板18との間隔
を所定の距離L2にしてからラミロール対50へ送り込
まれる。また、受取搬送部25に停止していたガラス基
板18が下流側に搬送され、在荷センサ35c,35d
が2個ともオフになるとロボットハンドが次のガラス基
板18を投入し、上記と同様のガラス基板18の搬送を
繰り返す。
Hereinafter, the third and fourth glass substrates 18 are similarly placed on the glass substrate
8 is fed at a feed speed V2 higher than the transfer speed V1 and the distance between the glass substrate 18 fed to the pair of Rami rolls 50 is set to a predetermined distance L2 before being sent to the Rami roll pair 50. Further, the glass substrate 18 that has been stopped by the receiving and transporting unit 25 is transported to the downstream side, and the presence sensors 35c and 35d.
Are turned off, the robot hand throws in the next glass substrate 18 and repeats the transfer of the same glass substrate 18 as described above.

【0042】ラミロール対50は、ガラス基板18とハ
ーフカット線との位置合わせが行われた状態で、ガラス
基板18に積層体フイルム52の感光層52aを熱圧着
して貼り付ける。ガラス基板18は、冷却部14でほぼ
室温に冷やされてから、剥離部15でベースフイルム5
2bが剥離される。こうして、透明なガラス基板18の
下面(表面)の転写エリアTAに感光層が転写される。
この後、ガラス基板18は基板取り出し部16に送り出
され、ロボットハンドによってその上面(裏面)を吸着
されて取り出される。
In the state where the alignment between the glass substrate 18 and the half-cut line is performed, the photosensitive layer 52 a of the laminated film 52 is bonded to the glass substrate 18 by thermocompression bonding. The glass substrate 18 is cooled to approximately room temperature in the cooling unit 14 and then the base film 5
2b is peeled off. Thus, the photosensitive layer is transferred to the transfer area TA on the lower surface (front surface) of the transparent glass substrate 18.
Thereafter, the glass substrate 18 is sent out to the substrate take-out section 16, and its upper surface (back surface) is sucked and taken out by the robot hand.

【0043】なお、上記実施形態では、全ての送りロー
ラにパルスモータを接続して回転駆動しているが、ブロ
ック毎にモータを配置してローラをベルト駆動する方法
や駆動源の無い回転自在なフリーローラや、テンデンシ
ー駆動ローラやトルクモータ駆動ローラを必要に応じて
組み合わせて配置してもよく、また送りローラ等の取付
間隔は、多サイズのガラス基板を安定して搬送するため
短い方がよい。また、送りローラとガラス基板との摩擦
が十分に確保され、搬送時のガラス基板のスリップの懸
念がなければニップローラを設けなくてもよく、この場
合には搬送系の制御が容易になるとともに、塵埃発生の
懸念も減少する。さらに、受取搬送部、第1及び第2ス
トック搬送部でつば付送りローラを用いているが、図5
に示すように、排出搬送部と同様の送りローラ71と、
ガラス基板18の幅方向の位置を規制するガイドローラ
72とを用いてガラス基板18の搬送及びガイドを行っ
てもよい。
In the above-described embodiment, a pulse motor is connected to all the feed rollers to rotate them. However, a motor is arranged for each block to drive the rollers in a belt, or a rotatable roller without a drive source. A free roller, a tension drive roller, and a torque motor drive roller may be arranged in combination as necessary, and the mounting interval of the feed roller and the like is preferably shorter in order to stably transfer a multi-size glass substrate. . Further, the friction between the feed roller and the glass substrate is sufficiently ensured, and there is no need to provide a nip roller if there is no concern about slippage of the glass substrate during transfer.In this case, the control of the transfer system becomes easy, Concerns about dust generation are also reduced. Further, a feed roller with a flange is used in the receiving and conveying section, and the first and second stock conveying sections.
As shown in the figure, a feed roller 71 similar to the discharge conveyance section,
The glass substrate 18 may be transported and guided using a guide roller 72 that regulates the position of the glass substrate 18 in the width direction.

【0044】上記実施形態では、排出搬送部で各ガラス
基板の間隔が所定の距離L2となるように調整している
が、図6に示すように、排出搬送部の下流側端部にガラ
ス基板18の搬送を禁止する係止位置と搬送を許容する
退避位置との間で移動自在なストッパー85を設け、こ
のストッパー85の移動によって熱圧着部12へ供給す
る各ガラス基板18の間隔が所定の距離L2となるよう
に基板搬送のタイミングを調整してもよい。この場合に
は、追いかけ搬送後の各ガラス基板18の間隔が所定の
距離L2よりも短い距離L3となるようにする。
In the above-described embodiment, the distance between the glass substrates is adjusted to be a predetermined distance L2 in the discharge / conveyance unit. However, as shown in FIG. A stopper 85 is provided which is movable between a locking position where the transfer of the glass substrate 18 is prohibited and a retracted position where the transfer of the glass substrate 18 is allowed. The substrate transfer timing may be adjusted to be the distance L2. In this case, the interval between the glass substrates 18 after the chasing transport is set to a distance L3 shorter than the predetermined distance L2.

【0045】上記実施形態では、ガラス基板の両側縁部
を送りローラで支持しているが、図7に示すように、1
枚のガラス基板18に一定の間隔を開けて複数の転写面
TAが形成されている場合や非転写面である裏面が下側
に向いてこれを支持する場合には、複数の送りローラ9
1を支持軸90上に配置してガラス基板18を支持して
もよい。なお、送りローラ91を配置する間隔、個数は
任意に設定でき、多サイズのガラス基板に対応すること
ができる。また、搬送する基板をガラス基板としている
が、本発明はこれに限られず、金属や樹脂など他の素材
で形成されたものでもよい。
In the above embodiment, both side edges of the glass substrate are supported by the feed roller, but as shown in FIG.
In the case where a plurality of transfer surfaces TA are formed at regular intervals on a single glass substrate 18 or when the back surface, which is a non-transfer surface, faces downward and supports it, a plurality of feed rollers 9 are provided.
1 may be arranged on the support shaft 90 to support the glass substrate 18. In addition, the interval and the number of the feed rollers 91 can be set arbitrarily, and can correspond to a multi-size glass substrate. Although the substrate to be transported is a glass substrate, the present invention is not limited to this, and may be formed of another material such as metal or resin.

【0046】[0046]

【発明の効果】以上のように、本発明の基板搬送装置に
よれば、基板を受け取る受取搬送部と、受取搬送部から
の基板をストックし搬送するストック搬送部と、ストッ
ク搬送部からの基板を受け入れてラミロールの基板送り
速度に合わせた基板排出速度で基板を排出する排出搬送
部と、各搬送部における基板の位置を検出する基板検出
部と、この基板検出部により排出搬送部での基板排出を
検出し、排出中の基板との間隔が所定値となり且つ同じ
基板排出速度となるように、ストック搬送部、これに続
いて受取搬送部から基板を送り出して追いかけ搬送を行
う制御部とを備えているので、シンプルな機構でガラス
基板を一定間隔で効率的に搬送することができる。ま
た、多サイズのガラス基板への対応が容易にできる。
As described above, according to the substrate transfer apparatus of the present invention, the receiving and transferring section for receiving the substrate, the stock transferring section for storing and transferring the substrate from the receiving and transferring section, and the substrate from the stock transferring section. And a discharge unit that discharges the substrate at a substrate discharge speed that matches the substrate feed speed of the lami-roll, a substrate detection unit that detects the position of the substrate in each of the transfer units, and a substrate detection unit that discharges the substrate. A stock transport unit, and then a control unit that sends out the substrate from the receiving and transporting unit and performs a chasing transport so that the interval between the substrate and the substrate being discharged is a predetermined value and the same substrate discharging speed is detected. Since the glass substrate is provided, the glass substrate can be efficiently transported at a constant interval by a simple mechanism. Further, it is possible to easily cope with a multi-size glass substrate.

【0047】また、本発明の基板搬送方法によれば、基
板検出部により排出搬送部での基板排出を検出し、排出
中の基板との間隔が所定値となり且つ同じ基板排出速度
となるように、ストック搬送部、これに続いて受取搬送
部から基板を送り出して追いかけ搬送を行うようにした
ので、同様にシンプルな機構でガラス基板を一定間隔で
効率的に搬送することができる。
Further, according to the substrate transporting method of the present invention, the substrate detecting unit detects the discharge of the substrate in the discharging and transporting unit, and sets the distance between the substrate and the substrate being discharged to a predetermined value and the same substrate discharging speed. Since the substrate is sent out from the stock transport unit and subsequently the receiving and transporting unit to perform the chasing transport, the glass substrate can be efficiently transported at a constant interval by a simple mechanism.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明を実施した感光層転写機の概略図であ
る。
FIG. 1 is a schematic view of a photosensitive layer transfer machine embodying the present invention.

【図2】ガラス基板の感光層転写面を示す平面図であ
る。
FIG. 2 is a plan view showing a photosensitive layer transfer surface of a glass substrate.

【図3】基板搬送装置の概略を示す斜視図である。FIG. 3 is a perspective view schematically showing a substrate transfer device.

【図4】基板搬送装置のセンサ取付位置を示す平面図で
ある。
FIG. 4 is a plan view showing a sensor mounting position of the substrate transfer device.

【図5】第2実施形態の基板搬送装置の概略を示す斜視
図である。
FIG. 5 is a perspective view schematically showing a substrate transfer device according to a second embodiment.

【図6】第3実施形態の基板搬送装置の概略を示す斜視
図である。
FIG. 6 is a perspective view schematically illustrating a substrate transfer device according to a third embodiment.

【図7】第4実施形態の基板搬送装置の概略を示す平面
図である。
FIG. 7 is a plan view schematically showing a substrate transfer device according to a fourth embodiment.

【符号の説明】[Explanation of symbols]

10 ラミネータ 17 コントローラ 18,98 ガラス基板 20,70,80 基板搬送装置 25 受取搬送部 26 第1ストック搬送部 27 第2ストック搬送部 28 排出搬送部 30,53,65 エア浮上テーブル 31,71,81,91 送りローラ 32 つば付送りローラ 33,83 幅寄せローラ 34,84 ニップローラ 35 在荷センサ 36 停止センサ 37 ニップセンサ 38 追送開始センサ 39 追突防止センサ 40 パルスモータ 41 モータドライバ 42 幅寄せ機構 43 ニップ機構 50 ラミロール対 52 積層体フイルム Reference Signs List 10 Laminator 17 Controller 18, 98 Glass substrate 20, 70, 80 Substrate transfer device 25 Receiving transfer unit 26 First stock transfer unit 27 Second stock transfer unit 28 Discharge transfer unit 30, 53, 65 Air floating table 31, 71, 81 , 91 feed roller 32 feed roller with brim 33, 83 width shift roller 34, 84 nip roller 35 stock sensor 36 stop sensor 37 nip sensor 38 additional feed start sensor 39 rear impact prevention sensor 40 pulse motor 41 motor driver 42 width adjuster 43 nip mechanism 50 Rami roll vs. 52 laminated film

───────────────────────────────────────────────────── フロントページの続き (72)発明者 長手 弘 静岡県富士宮市大中里200番地 富士写真 フイルム株式会社内 (72)発明者 濡田 克彦 山口県下松市東豊井794番地 日立テクノ エンジニアリング株式会社笠戸事業所内 (72)発明者 渡辺 勝義 山口県下松市東豊井794番地 日立テクノ エンジニアリング株式会社笠戸事業所内 Fターム(参考) 3F081 AA10 AA22 BC04 BC07 BD08 BD11 BD15 BF12 BF23 CC08 CC12 CE13 DA02 DA10 DA12 EA09 EA10 FB01 FB02 FB05 FB06 5F031 CA05 GA08 GA36 GA37 GA53 GA62 JA17 JA19 JA22 MA37 MA38 PA16  ──────────────────────────────────────────────────続 き Continuing on the front page (72) Hiroshi Nagashi, Fuji Photo Film Co., Ltd., 200, Onakasato, Fujinomiya City, Shizuoka Prefecture In-house (72) Inventor Katsuyoshi Watanabe 794 Higashi-Toyoi, Kudamatsu City, Yamaguchi Prefecture Hitachi Techno Engineering Co., Ltd.Kasado Office F-term (reference) 3F081 AA10 AA22 BC04 BC07 BD08 BD11 BD15 BF12 BF23 CC08 CC12 CE13 DA02 DA10 DA12 EA09 EA10 FB01 FB02 FB05 FB06 5F031 CA05 GA08 GA36 GA37 GA53 GA62 JA17 JA19 JA22 MA37 MA38 PA16

Claims (13)

【特許請求の範囲】[Claims] 【請求項1】 基板をラミロールに送り込む基板搬送装
置において、 前記基板を受け取る受取搬送部と、 前記受取搬送部からの基板をストックし搬送するストッ
ク搬送部と、 前記ストック搬送部からの基板を受け入れて前記ラミロ
ールの基板送り速度に合わせた基板排出速度で基板を排
出する排出搬送部と、 各搬送部における前記基板の位置を検出する基板検出部
と、 前記基板検出部により前記排出搬送部での基板排出を検
出し、排出中の基板との間隔が所定値となり且つ同じ基
板排出速度となるように、ストック搬送部、これに続い
て受取搬送部から基板を送り出して追いかけ搬送を行う
制御部とを備えたことを特徴とする基板搬送装置。
1. A substrate transport apparatus for feeding a substrate to a ram roll, a receiving / transporting section for receiving the substrate, a stock transporting section for stocking and transporting the substrate from the receiving / transporting section, and receiving a substrate from the stock transporting section. A discharge transport unit that discharges the substrate at a substrate discharge speed that matches the substrate feed speed of the lami-roll, a substrate detection unit that detects the position of the substrate in each transport unit, A stock transport unit, and a control unit that sends out the substrate from the receiving / transporting unit and performs chasing transport so that the interval between the substrate and the substrate being discharged is a predetermined value and the same substrate discharging speed is detected. A substrate transport device comprising:
【請求項2】 前記ラミロールには、基板と感光層フイ
ルムとが送り込まれ、前記感光層フイルムは、前記基板
への転写部分のカバーフイルムが剥離された状態でラミ
ロールに送られ、前記排出搬送部は、前記カバーフイル
ムの剥離部分の先端位置を前記基板の転写開始位置に合
わせて基板を排出することを特徴とする請求項1記載の
基板搬送装置。
2. A substrate and a photosensitive layer film are fed into the lami-roll, and the photosensitive layer film is sent to the lami-roll with the cover film of a portion to be transferred to the substrate being peeled off, and the discharge / transport section 2. The substrate transport apparatus according to claim 1, wherein the substrate is discharged by adjusting a leading end position of a peeling portion of the cover film to a transfer start position of the substrate.
【請求項3】 前記各搬送部は前記基板を各搬送部に停
止させる停止センサを備え、この停止センサの基板検出
信号に基づき各搬送部に基板を位置決めすることを特徴
とする請求項1または2記載の基板搬送装置。
3. The transport unit according to claim 1, further comprising a stop sensor for stopping the substrate at each transport unit, and positioning the substrate at each transport unit based on a substrate detection signal of the stop sensor. 3. The substrate transfer device according to 2.
【請求項4】 前記排出搬送部に、前記基板の排出を検
出する追いかけ開始センサを設け、追いかけ開始センサ
が基板の排出を検出した後に、前記基板排出速度を超え
た速度で前記ストック搬送部、受取搬送部の基板を送っ
て追いかけ搬送し、先行基板との間隔が前記所定値にな
り、且つ前記基板排出速度となるように、各基板搬送部
を制御することを特徴とする請求項3記載の基板搬送装
置。
4. A chase start sensor for detecting discharge of the substrate is provided in the discharge / conveyance unit, and after the chase start sensor detects discharge of the substrate, the stock conveyance unit at a speed exceeding the substrate discharge speed. 4. The method according to claim 3, wherein each of the substrate transport units is controlled so that the substrate of the receiving and transporting unit is sent and chased and transported, and a distance between the substrate and the preceding substrate becomes the predetermined value and the substrate discharging speed. Substrate transfer equipment.
【請求項5】 前記各搬送部に、基板搬送方向に所定間
隔離して上流側基板検出センサ及び下流側基板センサを
設けて追突防止センサを構成し、前記上流側基板検出セ
ンサが基板無しから基板有りに変化したときに下流側基
板センサが基板有りのときに、追突可能性有りと判定し
て、この追突可能性有りと判定した上流側の基板搬送を
停止することを特徴とする請求項4記載の基板搬送装
置。
5. A rear-end collision prevention sensor comprising an upstream substrate detection sensor and a downstream substrate sensor which are separated from each other by a predetermined distance in a substrate transport direction in each of the transport units, and wherein the upstream substrate detection sensor determines whether the substrate has no substrate. 5. The method according to claim 4, wherein when the downstream substrate sensor is changed to "exist", when the downstream substrate sensor has the substrate, it is determined that there is a possibility of collision, and the upstream substrate transfer determined to be possible of the collision is stopped. The substrate transfer device according to any one of the preceding claims.
【請求項6】 前記基板受取部に基板の有無を検出する
在荷センサを設け、在荷センサの基板無し信号により前
工程から基板を受け取ることを特徴とする請求項1ない
し5いずれか1つ記載の基板搬送装置。
6. The substrate receiving unit according to claim 1, further comprising a presence sensor for detecting the presence or absence of the substrate, wherein the substrate is received from a previous process by a substrate absence signal of the presence sensor. The substrate transfer device according to any one of the preceding claims.
【請求項7】 前記各搬送部を、前記基板の両側縁部を
支持して回転する送り部材と、前記送り部材で支持され
た基板の中央部を気体吹き出しにより浮上させる基板浮
上パネルとから構成し、前記送り部材は基板の幅方向で
基板の幅寸法に合わせて移動可能に構成されていること
を特徴とする請求項1ないし6いずれか1つ記載の基板
搬送装置。
7. Each of the transport units includes a feed member that rotates while supporting both side edges of the substrate, and a substrate floating panel that floats a central portion of the substrate supported by the feed member by blowing out gas. 7. The substrate transport apparatus according to claim 1, wherein the feed member is configured to be movable in a width direction of the substrate in accordance with a width dimension of the substrate.
【請求項8】 前記各搬送部を、前記基板の両側縁部及
び前記感光層フイルムの転写エリアを避けた部分を支持
して回転する送り部材から構成し、前記送り部材は基板
の幅方向で転写エリアを避けた部分の位置に合わせて移
動可能に構成されていることを特徴とする請求項2ない
し6いずれか1つ記載の基板搬送装置。
8. Each of the transport sections is constituted by a feed member which rotates while supporting the side edges of the substrate and portions avoiding the transfer area of the photosensitive layer film, wherein the feed members are arranged in the width direction of the substrate. 7. The substrate transfer device according to claim 2, wherein the substrate transfer device is configured to be movable in accordance with a position of a portion avoiding the transfer area.
【請求項9】 前記各搬送部には、前記送り部材との間
で基板を挟持して搬送するニップ部材を設けたことを特
徴とする請求項7記載の基板搬送装置。
9. The substrate transfer apparatus according to claim 7, wherein each of the transfer units is provided with a nip member for holding the substrate between the transfer member and the transfer member.
【請求項10】 前記排出搬送部には、前記ニップ部材
の近傍に幅寄せ部材を設け、前記ニップ部材をニップ解
除状態にして前記基板の幅寄せを行うことを特徴とする
請求項9記載の基板搬送装置。
10. The discharge conveyance section according to claim 9, wherein a width shifting member is provided near the nip member, and the width of the substrate is shifted while the nip member is released. Substrate transfer device.
【請求項11】 前記ストック搬送部を複数個設け、前
記各搬送部にヒータを設けて各基板を基板排出時の目標
温度まで予熱し、前記受取搬送部では前記目標温度より
も低めの設定にし、前記ストック搬送部では前記目標温
度に達するように高めの設定にし、前記排出搬送部では
前記目標温度より少し高めの設定にしたことを特徴とす
る請求項1ないし10いずれか1つ記載の基板搬送装
置。
11. A method according to claim 11, wherein a plurality of stock transport units are provided, and a heater is provided in each of the transport units to preheat each substrate to a target temperature at the time of discharging the substrate. The substrate according to any one of claims 1 to 10, wherein the stock transport unit is set to be higher than the target temperature so as to reach the target temperature, and the discharge transport unit is set to be slightly higher than the target temperature. Transport device.
【請求項12】 前記各搬送部に設けたヒータを小さく
ブロック分けし、各ブロック毎に温度設定を可能にした
ことを特徴とする請求項11記載の基板搬送装置。
12. The substrate transfer apparatus according to claim 11, wherein the heater provided in each of said transfer units is divided into small blocks, and a temperature can be set for each block.
【請求項13】 基板をラミロールに送り込む基板搬送
方法において、 前記基板を受け取る受取搬送部と、前記受取搬送部から
の基板をストックし搬送するストック搬送部と、前記ス
トック搬送部からの基板を受け入れて前記ラミロールの
基板送り速度に合わせた基板排出速度で基板を排出する
排出搬送部と、各搬送部における前記基板の位置を検出
する基板検出部と、前記基板検出部で検出した前記基板
の位置に応じて各搬送部を制御する制御部とを用い、 前記基板検出部により前記排出搬送部での基板排出を検
出し、排出中の基板との間隔が所定値となり且つ同じ基
板排出速度となるように、ストック搬送部、これに続い
て受取搬送部から基板を送り出して追いかけ搬送を行う
ことを特徴とする基板搬送方法。
13. A substrate transport method for transporting a substrate to a lami roll, comprising: a receiving / transporting section for receiving the substrate; a stock transporting section for stocking and transporting the substrate from the receiving / transporting section; and receiving a substrate from the stock transporting section. A discharge transport unit that discharges a substrate at a substrate discharge speed corresponding to the substrate feed speed of the lami-roll, a substrate detection unit that detects a position of the substrate in each transport unit, and a position of the substrate detected by the substrate detection unit And a control unit that controls each transfer unit in accordance with the above. The substrate detection unit detects discharge of the substrate in the discharge transfer unit, and a distance between the discharge substrate and the discharge substrate becomes a predetermined value and the same substrate discharge speed. Thus, the substrate transport method is characterized in that the substrate is transported from the stock transport unit and subsequently the receiving and transporting unit to carry out chasing transport.
JP2000373954A 2000-12-08 2000-12-08 Substrate transfer apparatus and method Expired - Fee Related JP3756402B2 (en)

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TW090129944A TWI288426B (en) 2000-12-08 2001-12-04 Substrate-transporting device and method
KR1020010076163A KR100822328B1 (en) 2000-12-08 2001-12-04 Apparatus for conveying a board and method thereof
SG200107589A SG107570A1 (en) 2000-12-08 2001-12-06 Substrate feeding device and method

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KR101707929B1 (en) * 2012-10-04 2017-02-17 히라따기꼬오 가부시키가이샤 Transport system, and control method
KR101284665B1 (en) * 2012-12-11 2013-07-10 주식회사 쓰리디플러스 Carrying apparatus for substrate
JP3183651U (en) * 2013-03-13 2013-05-30 揚博科技股▲ふん▼有限公司 Full flat circuit board processing and transportation equipment
CN110937793A (en) * 2019-12-25 2020-03-31 中国建材国际工程集团有限公司 Glass dynamic grouping control system and method for float glass production line
CN110937793B (en) * 2019-12-25 2022-08-02 中国建材国际工程集团有限公司 Glass dynamic grouping control system and method for float glass production line

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KR20020046160A (en) 2002-06-20
JP3756402B2 (en) 2006-03-15
SG107570A1 (en) 2004-12-29
KR100822328B1 (en) 2008-04-16

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