TWI288426B - Substrate-transporting device and method - Google Patents

Substrate-transporting device and method Download PDF

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Publication number
TWI288426B
TWI288426B TW090129944A TW90129944A TWI288426B TW I288426 B TWI288426 B TW I288426B TW 090129944 A TW090129944 A TW 090129944A TW 90129944 A TW90129944 A TW 90129944A TW I288426 B TWI288426 B TW I288426B
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Taiwan
Prior art keywords
substrate
unit
transport
transfer
glass substrate
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TW090129944A
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Chinese (zh)
Inventor
Kazuyoshi Suehara
Hirosei Nagate
Katsuhiko Nureda
Katsuyoshi Watanabe
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Fujifilm Corp
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Publication of TWI288426B publication Critical patent/TWI288426B/en

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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Abstract

When the glass-substrates are moved out with a definite distance, they are intermittently transported efficiently. The glass-substrate 18 is floated up by means of clean air blown on the upper side from a table 30 floated by air, the transportation is carried out with the two-side edges of the substrate being supported in each roller 31, 32. The glass-substrates 18 are moved out from the transportation out section 28 with a transportation speed V1. When the rear-ends of the glass-substrate 18 pass through the starting-sensor 35d, the glass-substrates 18 in each transportation section 35-27 begin to be transported with a running speed V2 which is faster than the transportation speed V1. By means of such a running transportation, the distance of each glass-substrate 18 in the transportation-out section 28 and the second stock-transportation 27 becomes a determined distance L2. Each glass-substrate 18 will be in said transportation speed V1 again, and the determined distance L2 is kept. The glass-substrates 18 are sequentially moved out with a definite distance (L2) from the transportation-out section 28.

Description

1288426 -五、 發明說明 ( 1) [ 發 明 所 屬 技 術領域】 本 發 明 係 有 關基板搬送方法及其裝置,更 詳細 而言, 係 爲 適 用 於 大 型 之液晶顯示面板或是電漿顯示 面板之玻璃 基 板 等 製 造 工 程 之基板搬送裝置。 [ 習 知技 術 ] 使 用 於 液 晶 顯示面板(LCD)或是電漿顯示面板(PDP () 之 彩 色 濾 光 片 ,係爲於透明的玻璃基板上形成有紅色 (R ) 綠 色 ( G) 、藍色(B)之各色晝素圖案 、以 及黑色 ( K〕 之黑色矩陣(black matrix)。近年來 ,伴 隨著LCD 或 是 PDP 之 大 型化,使用於彩色濾光片之玻 璃基 板厚度 卻 也 Απτ 關 其 大 型 化而達到1mm〜10mm相當薄之 程度 ,寬度 或 是 長 度 以 達 到 1 m或以上之大型化。 彩色 濾 光片 之製造方法,於習知上係以薄 膜轉 印方式 〇 所 謂 的 薄 膜 轉 印方式,係爲將形成於薄膜上 之感 光層, 藉 由 感 光 層 轉 印 機(以下稱之爲疊層機(1 am i n a t or )) 而 轉 印 ( 以 下 稱 之爲疊層)於透明玻璃基板上 0其 次,通 過 藉 由 曝 光 裝 置 所形成預定之圖案、且以光照 射而 將感光 層 進 行 曝 光 〇 曝 光後之玻璃基板會藉由顯像處 理機 而顯像 處 理 J 進 而 形 成所要的畫素圖案及黑色矩陣。 玻璃 基板係 爲 以 一 定 間 隔 以 水平狀態供給至疊層機,相對 於已 除去其 下 面 所 定 寬 度 周 緣部之轉印面而將感光層疊層 〇 傳 送 至 疊 層 機之玻璃基板搬送裝置,係有 如日 本專利 公 開 公 報 第 :平 5 — 883 3號中所記載,使用一 -3- -對: 工作桿 ( 1288426 •五、 發明說明 ( 2 : ) wo rk in g be am ) 使 其 上 下動 作及 朝搬 送 方 向 往 復 移 動 而用 以 做 送 玻 璃基板 ,或是如 日本 專利 公 開 1公報第 2000 一 264418 號 中 所託 i載, 使用設 :置有可動 機 構 之 複 數 個 貨 盤 而 在 該 等 貨 盤 間 用 以 傳 遞玻 璃基 板進 行 搬 送 之 物 5 亦 或 如 曰 本 專 利 公 開 公 報 第 2000 - - 277587 Wi 中 所 記 載 , 使 用 機 械 手 臂 以 保持玻 璃 基 板 進行 搬送 之物 0 [ 發 明 所 欲 解 決 之 問 題 ] 然 而 上 述 該 等 基 板 搬送 裝置 中, 在 將 玻 璃 基 板 以 — 定 間 隔 進 行 送 出 之 際 具 有進 行閒 歇搬 送 時 其 機 械 性的 構 造 或 控 制 係 爲 複 雜 而 使得 爲對 應多 種 尺 寸 之 玻 ,璃 基 板 J 其 條 件 變 更 或 是 控 制 係 爲困 難之 問題 0 本 發 明 係 爲 用 以 解 決 上述 問題 ,具 有 簡 易 的 機 構 5 而 以 一 定 的 間 隔 將 玻 璃 基 板 送出 之際 ,可 更 有 效 率 地 進 行 閒 歇 搬 送 且 其 目 的 係 爲 提供 一種 容易 地 對 應 多 種 尺 寸 的 玻 璃 基 板 之 基 板 搬 送 裝 置 〇 [ 解 決 問 題 之 手 段 ] 爲 達 成 上 述 g 的 5 本 發明 之基 板搬 送 裝 置 於 用 以 將 基 板 輸 送 至 疊 層 滾 筒 之 基 板搬 送裝 置中 5 係 爲 具 備 有 > 受 取 搬 送 部 5 係 用 以 接 收 基 板; 儲存 搬送 部 係 爲 用 以 儲 存 來 白 受 取 搬 送 部 之 基 板 而 進行 搬送 ,•送 出 搬 送 部 係 承 接 來 白 儲 存 搬 送 部 之 基 板 5 以配 合有 疊層 滾 筒 之 基 板 傳 送 速 度 之 基 板 送 出 速 度 而 送 出 基板 » 基 板檢 測 部 係 用 以 檢 測 基 板於 各 個 搬 送 部 之 位 置 •,控 制部 -4- ,藉 由 基 板 檢 測 部 檢 測 送[Technical Field] The present invention relates to a substrate transfer method and apparatus thereof, and more particularly to a glass substrate suitable for a large liquid crystal display panel or a plasma display panel. A substrate transfer device for manufacturing engineering. [Prior Art] A color filter used for a liquid crystal display panel (LCD) or a plasma display panel (PDP () is formed by forming a red (R) green (G), blue on a transparent glass substrate. (B) each color elemental pattern and black (K) black matrix. In recent years, with the enlargement of LCD or PDP, the thickness of the glass substrate used for the color filter is also Απτ The size is increased to a thickness of 1 mm to 10 mm, and the width or length is increased to 1 m or more. The method of manufacturing a color filter is conventionally a film transfer method called a film transfer. The method is to transfer a photosensitive layer formed on a film by a photosensitive layer transfer machine (hereinafter referred to as a laminator) (hereinafter referred to as lamination) on a transparent glass substrate. The second, the glass base after exposure and exposure of the photosensitive layer by a predetermined pattern formed by the exposure device and irradiated with light The desired pixel pattern and the black matrix are formed by the development process by the development processor. The glass substrate is supplied to the laminator in a horizontal state at regular intervals, and the peripheral portion of the width defined below is removed. The transfer surface is transferred to the glass substrate transfer apparatus of the laminating machine, and is described in Japanese Laid-Open Patent Publication No. Hei 5-883-3, using a 3--3-pair: working rod (1288426 • V. Inventive Note (2: ) wo rk in g be am ) to move it up and down and reciprocate in the direction of conveyance for use as a glass substrate, or as described in Japanese Patent Laid-Open Publication No. 2000-264418 The use of a plurality of pallets provided with a movable mechanism for transferring the glass substrate between the pallets 5 or as described in Japanese Patent Laid-Open Publication No. 2000-277587 Wi, The robot arm holds the glass substrate for transport [Problems to be Solved by the Invention] However, in the above-described substrate transfer apparatuses, when the glass substrates are fed at regular intervals, the mechanical structure or control system is complicated to perform the idle transport. The glass substrate of various sizes, the condition of the glass substrate J is changed or the control system is difficult. The present invention is to solve the above problems, and has a simple mechanism 5 to send the glass substrate at a certain interval, and more The purpose of the present invention is to provide a substrate transfer apparatus that can easily correspond to a plurality of sizes of glass substrates. [Means for Solving the Problem] In order to achieve the above-described g, the substrate transfer apparatus of the present invention is used for transporting substrates. 5 of the substrate transfer apparatus to the stacking drum is provided with > receiving and transporting section 5 The storage and transport unit is configured to store the substrate of the white receiving and transporting unit, and the transporting and transporting unit receives the substrate 5 of the white storage and transport unit to match the substrate transport speed of the laminated roller. The substrate is fed at a speed and the substrate is sent out. » The substrate detecting unit detects the position of the substrate at each of the conveying units. The control unit -4- is detected by the substrate detecting unit.

1288426 五、 發明說明 ( 3 : ) 出 搬 送 部 之 基 板 送 出 , 白 儲 存 搬 送 部 、 及接 下 來 白 受 取 搬 送 部 傳 出 基 板以 進 行 搬 送 使 得 與 送 出 中之 基 板 的 間 隔 成 爲 所 定 値 且 成 爲 相 同 之 基 板 送 出 速 度 〇於 疊 層 滾 筒 中 > 係 傳 送 有 基 板 與 感 光 層 薄 膜 等 , 感 光 層 薄膜 係 爲 以 剝 離 於 白 朝 基 板 轉 印 部 分 之 表 層 薄 膜 的 狀 態 下傳 送 至 疊 層 滾 筒 1 送 出 搬 送 部 1 則係 爲 將 表 層 薄 膜 之 剝 離部 分 的前 端 位 置 對 準 於 基 板 之 轉 印 開 始位 置 而 將 基: 板: 送出: 者 〇 各 個 搬 送 部 係 具 備 有 用 以 將 基 板 停止於各 個 搬 送 部 之 ίψ 止 感 知 器 最 佳係 爲 基 於 此 種 停 止 感知 器 之 基 板 檢 測 信 Ptfe 而 將 於 各 搬 送 部 之 基 板 進 行 定位 。此外 於 送 出 搬 送 部 中 係 設 置 有用 以 檢 查 送 出 基 板 之追 送開 始 感 知 器 當 追 送 開 始 感 知 器 檢 測 基 板 之 送 出 後 以 超越 基 板 送 出 速 度 之 速 度 下 傳 送 儲 存 搬 送 部 % 受 取 搬 送 部 之基 板以 追 送 搬 送 控 制 各 個 基 板 搬 送 部 使 得 與 先 刖 基 板的 間 隔 成 爲 所定 値 j 且 成 爲 基 板 送 出 速 度 者 係 爲 最 佳 〇 進一 步 而 言 > 於各 個 搬 送 部 於 基 板 搬 送 方 向 上 隔 離 所 定 間隔 設 置 上 游 側 基 板 檢 測 感 知 器 及 下 游 側 基 板 感 知 器 而 構成 防 止 追 撞 感 知 器 當 上 游 側 基 板 檢 測 感 知 器 由 無 基 板 變化 至 有 基 板 且 下 游 側 基 板 感 知 器 爲 有 基 板 時 即 判 定 爲有追 撞 的 可 能 性 最 佳 爲 停止 該 判 定 有 追 撞 可 能 性 之 上 游側 之 基 板 搬 送 於 基 板 受 取 部 設 置 有 用 以 檢 測 有 無 基 板 之存 貨 感 知 器 1 最 佳 爲 藉 由 存 貨 感 知 器 之 Μ \\ 基 板 信 號 而 接 收來 白 \ J一 刖 段作 業 程 序 之 基 板 Ο •5· 1288426 五、 發明說明 ( 4; ) 此 外 , 各 搬 送 部 係 由 支 撐 基 板 之 兩 側 緣 部 而 進行 旋 轉 之 傳 送 元 件 及 藉 由 吹 出 氣 體 使 由 該 傳 送 元 件所 支 撐之 基 板 的 中 央 部 浮 升 之 基 板浮起面板所 構 成 傳 送 元 件係以 基 板 之 寬 度 方 向 > 配 合 基 板 之 寬 度 尺 寸而 構 成 可 移 動 。進 一 步而 言 各 搬 送 部 係 由 支 撐 避 開 基 板 之 兩 側 緣 及 感 光層 薄 膜 之 轉 印 區 域 之 部 分 而 進 行 旋 轉 之 傳 送 元 件 所 構 成 ,傳 送 元件 係在 基 板 之 桌 度 方 向 以 配 合 避 開 轉 印 區 域 之 部 分的 而 構 成 位 置 可 移 動 〇 於各 個 搬 送 部 最 佳 爲 在與 搬 送 元件 間 設 置 有 夾 持 基 板 以 進 行 搬 送 之 夾 持 元 件 > 於 送 出 搬 出部 上 J 則 以 於 夾 持 元 件 附近 設 置 靠 邊 緣 件 , 使夾 持 元 件 成爲 夾 持 解 除 狀 態 而 進 行 基 板之 靠 '息 邊 者 爲 最 佳 0 又 設 置 複 數 個 儲 存 搬 送 部 於各 個 搬 送 部 設置 加 熱 器 將 各 個 基 板 預 熱 至 基 板 送 出 時的 巨 標 溫 度 最佳係 爲 > 在 受 取 搬 送 部 係 設 定 爲 較 標 溫 度 爲 低 之 溫 度 ,於 儲 存 搬 送 部 則 是 設 定 爲 用 以 達 到 巨 標 溫 度 之 爲 局 的 溫 度, 而 於 送 出 搬 送 部 則 設 定 爲 稍 微 較 標 溫 度 爲 闻 之 溫 度 ,且 最 佳 爲 J 將 設 置 於 各 個 搬 送 部 之 加 熱 器 分 爲 小 的 區 塊, 而在 每 個 塊 中 可 進 行其 溫 度 設 定 者 〇 另 外 , 本 發 明 之 基 板 搬 送 方 法 於用 以 將 基 板輸 送 至 疊 層 滾 筒 之 基 板 搬 送 方 法 中 5 係 爲 使 用 5 受 取 搬 送部 > 係用 以 接 收 基 板 9 儲 存 搬 送 部 係 爲 用 以 儲 存來 白 受取 WL Ml 送 部 之 基 板 而 進 行 搬 送 9 送 出 搬 送 部 係承 接 來 白 支撐 搬 搬 送 部 之 基 板 y 以 配 合 疊 層 滾 筒 之 基 -6- 板 傳 送 速 度 之 基 板送 出 速 度 1288426 五、 發明說明 (5) 而 送 出 基 板 ;基板檢測部,係用以檢測於各個搬送部 之 基 板 之 位 置 j 以及控制部,對應於以基板檢測部所檢測 的 基 板位 置 而 控 制各個搬送部;藉由基板檢測部檢測在送 出 搬 送 部 之 基 板 送出,自儲存搬送部、及接下來自受取搬 送 部 將 基 板 送 出 進行搬送,使得與送出中之基板的間隔成 爲 所 定 値 且 成 爲相同之基板送出速度。 [ 本 發 明 較 佳實施例之詳細說明】 第 1 圓 丨所示係爲設置有本發明之基板搬送裝置之疊 層 機 構 之 構 成 槪 略圖。疊層機構1 0係爲由預備加熱部11 熱 壓 著 部 12、 基層體薄膜供給部1 3、冷卻部1 4、剝離部 15 、 基 板 取 出 部16、以及後述之控制器(controller ) 17 所 構 成 , 如 第2圖所示,將感光層轉印至透明玻璃基; t反 18 之 周 緣 部 以 外的轉印區域TA。 玻 璃 基 板 1 8係爲藉由圖中爲示之機械手臂而被供 給 於 預 備 加 熱 部 1 1。於機械手臂之臂部本體上設置有吸附 襯 墊 〇 機 械 手 臂 係爲藉由該吸附襯墊而吸附玻璃基板1 8 之 背 面 ( 感 光 層 之非轉印面),藉以進行保持。之後,機 械 手 臂 便 將 表 面 (感光層之被轉印面)朝下側進行翻轉之 狀 態 , 而 將 該 玻 璃基板1 8供給於預備加熱部1 1。 預 備 加 熱 部1 1係爲由基板搬送裝置20與加熱器2 1 22 所 構 成 且 分別區隔成受取搬送部25、第1及第2儲 存 搬 送 部 26 > 27、與送出搬送部28。受取搬送部25係爲 承 接 來 白 機 械 手 臂的玻璃基板18搬送至下游側。玻璃基板 -7- 18 1288426 五、發明說明(6) 則經由第1及第2儲存搬送部26、27而被搬送至送出搬 送部28。玻璃基板1 8會在送出搬送部28等待,並且依據 由熱壓著部之指示而向後述之熱壓著部12之疊層滾筒對 組而被送出。 加熱器21、22係以包夾基板搬送裝置20之玻璃基板18 t搬送路的方式配置在上下方向,將所搬送之玻璃基板18 加熱至所定溫度。在此,加熱器可利用遠紅外線加熱器、 鎳鋁合金線加熱器、熱風加熱器。 加熱器21、22在受取搬送部25中,係爲用以抑制熱變 形而降低其設定溫度,且在第1及第2儲存搬送部26、27 中’爲使於短時間內可將玻璃基板形成至所定溫度而升高 其設定溫度,在送出搬送部28中,則爲使等待中的玻璃 基板1 8之溫度不致下降而僅僅調高設定溫度。例如,將 玻璃基板1 8加熱至1 1 (TC之際之各個設定溫度,係設爲, 加熱器 21a、22a 爲 100°C,加熱器 21b、22b 及 21c、22c 爲180°C,加熱器21d、22d則爲120°C。藉此,用以將玻 璃基板1 8在不致造成熱變形之短時間下而加熱至所定溫 度的同時,不須於等待中將該溫度降低。此外,加熱器2 1 、22之設定溫度並不僅限定於此,係爲對應基板尺寸或是 必要之所定溫度而進行適當的決定。另外,加熱器2 1、22 係爲將小尺寸的面發熱體並列所構成,且具備有個別的控 制器(未圖示)。從而,爲使玻璃基板18之溫度分布均 一化而有可能個別的變化其設定溫度,例如,可將極爲容 1288426 五、發明說明(7) 易冷卻之玻璃基板1 8之兩側面設定爲較高溫度。又,將 各個搬送部25〜28設定於最低停止時間,而形成可確實 的進行升溫至所定溫度。 基板搬送裝置20係如第3圖所示,係爲由空氣浮起座 台3 0、傳送滾輪3 1、附緣傳送滾輪3 2、靠邊滾輪3 3、夾 持滾輪3 4、感知器3 5〜3 9等所構成。玻璃基板1 8係爲由 傳送滾輪3 1以及附緣傳送滾輪32於兩側緣部所支撐而被 搬送。空氣浮起座台30係爲被配置成面對玻璃基板1 8之 下面’於其表面形成有多數的空氣吹出口 30a。藉以由該 吹出口 30a朝向玻璃基板18而吹出清潔的空氣,而使因 本身重量而撓曲之玻璃基板18的中央部向上浮起。 傳送滾輪3 1及附緣傳送滾輪32,係爲被配置在形成於 空氣浮起座台30之兩側部之切除部30b,且各自以可自由 旋轉的狀態所支撐的同時,在垂直於玻璃基板1 8之搬送 方向之方向上配合玻璃基板18之寬度尺寸而形成可移動 之狀態。各個傳送滾輪3 1、32係爲藉由脈衝馬達(ριι 1 s e mo t 〇 r ) 4 0而旋轉驅動,對應於後述之各個由感知器3 5〜 3 9所產生之基板檢測信號,經由馬達傳動裝置4 1而以控 制器1 7控制脈衝馬達40之驅動。此外,各個傳送滾輪3 1 、32係爲沿著切除部30b以配合玻璃基板18之寬度尺寸 而進行移動,而可對應於搬送多種尺寸之玻璃基板。 傳送滾輪3 1及附緣傳送滾輪♦ 32,係以接觸玻璃基板1 8 下面之兩側緣部進行旋轉的狀態下搬送玻璃基板1 8。此時 1288426 五、發明說明(8) ,雖然玻璃基板1 8之表面(感光層的被轉印面)係爲形成 於下側,但因各個傳送滾輪3 1、32接觸感光層未被轉印 之玻璃基板1 8之周緣部,故不致造成使感光層之轉印區 域TA之損傷、或是使麈埃附著。此外,附緣傳送滾輪32 之邊緣32a係爲用以作爲導引玻璃基板18之機能,而控 制玻璃基板1 8之寬度方向的位置。 於靠邊滾輪33上係設置有靠邊機構42。控制器1 7係爲 經由靠邊機構42,選擇性的在將靠邊滾輪33在接合於玻 璃基板1 8側面之矯正位置、以及自玻璃基板1 8分離之退 避位置之間進行設定。當靠邊滾輪33被裝置於矯正位置 之後,即進行玻璃基板1 8寬度方向之位置以及傾斜之修 正,以提昇玻璃基板1 8之直進精度。另外,爲了防止玻 璃基板18之破損,控制器17則會進行使在靠邊滾輪33 裝備於矯正位置之際,便會將後述之.夾持滾輪34裝設至 退避位置,當夾持滾輪34裝設至搬送位置之際,便會將 靠邊滾輪33裝設至退避位置之控制。 夾持滾輪34係爲以聚四氟乙烯(Teflon )所形成,且 設置有夾持機構43。控制器1 7係爲經由夾持機構43,選 擇性的將夾持滾輪34在與傳送滾輪3 1之間用以夾持玻璃 基板1 8之搬送位置、以及與玻璃基板1 8分離之退避位置 之間進行設定。以夾持滾輪34與傳送滾輪3 1之間而夾持 玻璃基板1 8之兩側緣部用以防止搬送時之玻璃基板1 8的 滑落。另外,爲了防止玻璃基板1 8之破損,將夾持滾輪 -10- 1288426 五、發明說明(9) 34向搬送位置設定之際,即將接觸玻璃基板is前,則慢 慢的使夾持滾輪3 4進行移動。又,當玻璃基板1 8由疊層 滾筒對組夾持之後,夾持滾輪3 4便會被設定至退避位置 。此外,在本實施例中,雖然夾持滾輪係以聚四氟乙烯( Teflon)形成,但是如果沒有機能上之問題,亦可使用其 他材料、或是更有彈性之橡膠系原料,例如,氟系橡膠、 矽樹脂橡膠等。 於空氣浮起座台30中央部所形成之切除部30c上,係 配置有由耐熱性反射式光纖式感知器所形成之感知器3 5〜 39。各個感知器35〜39係爲沿著玻璃基板18之搬送方向 所配置,且各自連接著控制器1 7 (未圖示)。且,檢測出 玻璃基板18後,便會分別將基板檢測信號送出至控制器 17。控制器17係爲基於由各個感知器35〜39所發出之基 板檢測信號,控制將玻璃基板1 8之位置於特定的搬送。 第4圖係爲顯示於各個搬送部25〜28之各個滾輪31〜 34以及各個感知器35〜39之配置位置。存貨感知器35a 〜3 5d係爲用以檢測各個搬送部25〜28之玻璃基板18之 有無。當送出搬送部28之存貨感知器35a切換爲ON後, 便在熱壓著部1 2進行感光層之轉印的準備。接著,將由 熱壓著部1 2送出送入開始訊號之後,便以配合對後述疊 層對組滾筒之投入速度的送出速度VI送出玻璃基板18。 此外,受取搬送部25之存貨感知器35c、3 5d任何一方形 成爲ON時,機械手臂便不會供給玻璃基板1 8至受取搬送 -11- 1288426 五、發明說明(1〇) 部25,而不至將玻璃基板1 8雙重載置。當存貨感知器 3 5c、35d兩者均形成爲OFF時,便由機械手臂供給接下來 的玻璃基板1 8。 停止感知器36a〜36d係爲設置在各個搬送部25〜28之 下游側端部,當玻璃基板1 8到達該位置而形成爲ON,便 停止玻璃基板1 8之搬送。送出搬送部28中,當玻璃基板 18之前端到達至停止感知器35a的位置時便停止搬送。另 外,於其他搬送部25〜27中,藉由該搬送部而於下游側 之搬送部有玻璃基板1 8之情況下,玻璃基板1 8之前端到 達各個停止感知器35b〜35d之位置時,便停止於該搬送 部之玻璃基板1 8的搬送。 夾持感知器3 7 a〜3 7 h係爲設置在各個夾持滾輪3 4之附 近,當玻璃基板1 8到達該位置後,便將各自對應之夾持 滾輪34設定在至搬送位置。此外,當玻璃基板18之後端 通過夾持滾輪3 4之際,於後端通過前便將各自對應之夾 持滾輪3 4設定在退避位置。 追送開始感知器38係爲設置在距第2儲存搬送部28之 停止感知器36b僅有L1之距離。由送出搬送部28將玻璃 基板1 8送至於熱壓著部1 2 ’當其後端通過追送開始感知 器38之後,追送開始感知器38便會形成爲OFF。當追送 開始感知器3 8形成爲OFF後,位於受取搬送部2 5、第1 及第2儲存搬送部26、27之玻璃基板18便會以較送出速 度V 1更快之追送速度V2分別開始追送搬送。 -12- 1288426 五、發明說明(11) 追送搬送係爲僅在追送時間T進行。追送速度V2及追 送時間T,係爲對應各個基板尺寸而進行條件提出,於熱 壓著部1 2各個玻璃基板1 8之間隔係適當的設定成以所定 的距離L2 (參照第3圖)供給玻璃基板18。藉此,經過 追送時間T之後,便將由送出搬送部28所送出的玻璃基 板1 8、與位於第2支撐搬送部28之玻璃基板1 8之間的間 隔定成爲所定的距離L2。且,經過追送時間T之後,已追 送搬送之玻璃基板1 8亦成爲送出速度V1,持續保持所定 之距離L2並朝熱壓著部1 2搬送。 如此,便可將位於熱壓著部1 2前送出搬送部28上的玻 璃基板1 8之間隔調整成所定的距離L2,故可於熱壓著部 1 2可以精度優良且一定之間隔依照順序供給玻璃基板1 8 。另外,因爲調整位於熱壓著部1 2前方玻璃基板之間隔 ,故到達送出搬送部28爲止的搬送下,即使滑動產生也 不會有問題。進一步而言,因爲停止在各個搬送部25〜28 之指定位置,故無關於朝受取搬送部25之玻璃基板1 8投 入時間的間隔不均或是基板的尺寸,而可於熱壓著部1 2 以精度優良且一定的間隔下依照順序供給玻璃基板1 8。此 外,利用將追送速度V2加快,而可縮短追送之搬送距離 ,伴隨於此而可達到將基板搬送裝置整體小型化之目標。 防止追撞感知器39a〜39f以及停止感知器36b、36 c, 係爲防止上游側之玻璃基板1 8追撞所搬送下游側的玻璃 基板1 8,而檢測前後玻璃基板1 8之間隔是否相距所定距 -13- 1288426 五、發明說明(12) 離L2。各個感知器39a與39b、39c與39d、36b與39e、 3 6 c與3 9 f係分別形成爲一對,且分別被設定在所定的距 離L2。在一對感知器之中,上游側之感知器在由無玻璃基 板而變化爲有玻璃基板時,且下游側之感知器爲具有玻璃 基板的情況下,顯示前後玻璃基板1 8之間隔成爲在所定 之距離L2以下,且停止正在追送搬送的玻璃基板丨8之搬 送。搬送在前面之下游側的基板1 8,前後玻璃基板1 8之 間隔成爲所定距離L2後,再次開始追送搬送的玻璃基板 1 8之搬送。此時的搬送速度,係爲配合朝疊層滾筒對組的 投入速度之送出速度VI。 於第1圖中,熱壓著部1 2係爲由疊層滾筒對組50及支 持滾筒5 1所構成者。疊層滾筒對組50,係爲由配置在上 下方向之疊層滾筒50a、50b所構成,且在該等疊層滾筒 50a、50b中係內藏有加熱器。疊層滾筒對組50係爲藉由 夾持玻璃基板18與積層體薄膜52以進行搬送,而將積層 體薄膜52以熱壓著而貼覆至玻璃基板1 8。支持滾筒5 1係 以接觸於疊層滾筒50a、50b而從動旋轉的方式來構成, 以抑制疊層滾筒50a、50b之撓曲,且可藉由均一的力量 進行熱壓著。另外,於基板搬送裝置20與熱壓著部12之 間,亦設置有與前述空氣浮起座台30相同構成之空氣浮 起座台5 3。藉此可將玻璃基板1 8保持於水平,且於將玻 璃基板1 8投入於疊層滾筒對組50之際,可防止玻璃基板 18之中央部的撓曲而與下側之疊層滾筒50a有所衝突。 -14- 1288426 五、發明說明(13) 積層體薄膜供給部1 3,係爲由積層體薄膜滾輪54之裝 設軸5 4 a、半截止切斷器(h a 1 f c u t t e r ) 5 5、表層薄膜剝 離部56、反張力滾輪57等所構成者。該積層體薄膜供給 部13係爲將表層薄膜52c自積層體薄膜滾輪54剝離,以 將感光層朝上的狀態下將基底薄膜52b供給至疊層滾筒對 組50。 積層體薄膜52係爲於基底薄膜52b經由圖中未顯示之 補助層、中間層等而將感光層52a —層層的設置,又,於 感光層52a之上方係層層設有表層薄膜52c、基底薄膜 5 2b之其他方面爲帶電防止層等。 半截止切斷器55係爲配合玻璃基板1 8之長度,將積層 體薄膜52進行半截止切斷。該半截止切斷係指切斷表層 薄膜52c、感光層52a,而不切斷基底薄膜5 2b。 表層薄膜剝離部56,係爲將形成至玻璃基板1 8貼付面 之遭到半截止切斷部分的表層薄膜52c自積層體薄膜52 剝離。該剝離層係爲將自黏著帶滾筒56a所拉出的黏著帶 56c,藉由按壓滾輪56b而進行貼付至表層薄膜52c,貼付 於該表層薄膜52c之黏著帶56c係爲被捲取至帶捲取軸 56d而用以進行回收。此外,相對形成於位在玻璃基板1 8 與玻璃基板18之間的積層體薄膜52,該表層膜薄52c係 不致剝離而殘留。 在熱壓著部1 2上,將半截止切斷線通過所定位置後, 將送入開始信號送出至基板搬送裝置20。藉此’以進行將 -15- 1288426 五、發明說明(14) 玻璃基板18與半截止切斷線的位置對準之狀態下,於玻 璃基板18貼付上積層體薄膜52之感光層52a。並且,基 底薄膜52b亦隨著玻璃基板18的移動而朝疊層滾筒對組 50的傳送方向向下游側傳送。 冷卻部1 4係爲由冷卻風吹出板60、及搬送滾輪6 1所構 成者。冷卻風吹出板60,係將通過HEPA過濾器自與清潔 的冷卻風朝向玻璃基板1 8吹出,而將以搬送滾輪6 1所搬 送的玻璃基板1 8之溫度冷卻至約略室溫(30°C以下)。 剝離部1 5係爲由剝離滾輪62、及基底薄膜捲取機構63 所構成,且用以將基底薄膜52b自玻璃基板18剝離,將 該基底薄膜62b於回收軸63a捲取成滾輪狀。回收軸63a 係爲藉由未圖示之捲取馬達而被旋轉驅動。該捲取馬達係 由力矩所控制,而將疊層滾筒對組50以後的基底薄膜52b 之張力保持於一定,用以避免在基底薄膜52b產生鬆弛。 於剝離部1 5之下游側,係設置有由空氣浮起座台65所 形成之基板取出部16。該空氣浮起座台65,係與預備加 熱部1 1之空氣浮起座台30爲相同所構成之。由剝離部1 5 所送出的玻璃基板1 8,矽藉由未圖示之機械手臂以吸附其 上面用以取出。 其次,將就上述構成之作用進行說明。藉由機械手臂將 第1枚的玻璃基板1 8投入於受取搬送部25後,該玻璃基 板18便會依據第1儲存搬送部26、第2儲存搬送部27、 送出搬送部28之順序搬送,且藉由加熱器、22加熱至 -16- 1288426 五、發明說明(15) 所定之溫度。當玻璃基板18之前端到達致送出搬送部之 停止感知器36a後,便停止搬送。其後,第2枚、第3枚 、第4枚之玻璃基板1 8將依順序投入、搬送,且分別在 各個搬送部25〜27之停止感知器36b〜36d的位置停止。 於熱壓著部1 2中,疊層滾筒對組50旋轉以傳送積層體 薄膜52,當積層體薄膜52之半截止切斷線來到所定位置 之後,便將送入開始信號朝基板搬送裝置20送出。基板 搬送裝置20係藉由該送入開始信號之輸入,以配合朝疊 層滾筒對組50之投入速度之送出速度VI由送出搬送部28 將第1枚的玻璃基板1 8送出。當玻璃基板1 8之後端通過 追送開始感知器38後,第2枚的玻璃基板1 8便會以較送 出速度VI更爲快的追送速度V2開始追送搬送。經過追送 時間T後,第2枚的玻璃基板1 8亦是以送出速度VI所搬 送。此時,第1枚的玻璃基板18與第2枚的玻璃基板18 之間的間隔,係成爲所定之距離L2。 以下,第3枚、第4枚之玻璃基板18同樣地,以較送 入至疊層滾筒對組5 0之玻璃基板1 8的送出速度V1更快 之追送速度V2進行追送,且使送入至疊層滾筒對組50 之玻璃基板1 8之間的間隔成爲所定之距離L2後,朝疊層 滾筒對組50送入。此外,將停止於受取搬送部25之玻璃 基板18搬送至下游側,當存貨感知器35c、35d兩個均形 成爲OFF後,機械手臂便會投入接下來的玻璃基板1 8,重 複與上述相同之玻璃基板1 8的搬送。 -17- 1288426 五、發明說明(16) 疊層滾筒對組50,係爲進行將玻璃基板18及半截止切 斷線之間的位置對準之狀態下,於玻璃基板1 8上以熱壓 著貼付積層體薄膜52之感光層52a。玻璃基板18,係在 冷卻部1 8冷卻至約略室溫之後,以剝離部1 5將基底薄膜 5 2b剝離。如此,透明之玻璃基板1 8的下面(表面)之轉 印區域TA上便被轉印有感光層。之後,玻璃基板1 8便會 送出至基板取出部1 8,藉由機械手臂吸附其上面(背面) 用以取出。 另外,在上述實施型態中,於全部的傳送滾輪雖係連接 脈衝馬達而旋轉驅動,然,亦可必須對應在每個區塊中配 置馬達,而將滾輪以皮帶驅動的方法、或是無驅動源而可 自由旋轉的自由滾輪、趨勢(tendency)驅動滾輪、或力 矩馬達驅動滾輪而組合配置,此外,傳送滾輪等的安裝間 隔,爲安定地搬送多尺寸的玻璃基板以較短者爲佳。又, 充分確保傳送滾輪與剝離基板之間的摩擦,而不至擔心搬 送時之玻璃基板的滑落便亦可無須設置夾持滾輪,在此情 況下,在形成容易控制之搬送系列的同時,以可減少發生 塵埃的顧慮。並且,雖然在受取搬送部、第1及第2儲存 搬送部上使用附緣傳送滾輪,但是如第5圖所示,亦可使 用與送出搬送部相同之傳送滾輪7 1及限制玻璃基板1 8之 寬度方向的位置的導引滾輪72,而進行玻璃基板18之搬 送及導引。在上述實施型態中,雖將在送出搬送部之各個 玻璃基板的間隔調整成爲所定之距離L2,然,如第6圖所 -18- 1288426 五、發明說明(17) 示,亦可於送出搬送部之下游側端部,在禁止玻璃基板18 搬送之停止位置與容許搬送之退避位置之間,設置以可自 由移動之抵止部85,藉由該抵止部85的移動,而調整基 板搬送之時點使得供給至熱壓著部12之各個玻璃基板18 的間隔成爲所定之距離L2。在此情況下,將追送搬送後之 各玻璃基板1 8之間隔成爲較所定之距離L2爲更短的距離 L3 ° 在上述實施型態中,雖係以傳送滾輪支撐玻璃基板之兩 側緣部,然,如第7圖所示,於1枚的玻璃基板18以一 定的間隔隔開而形成有複數轉印面TA的情況下、或是將 非轉印面之背面朝向下側用以將其支撐的情況下,亦可將 複數之傳送滾輪9 1配置於支撐軸90上用以支撐玻璃基板 1 8。此外,亦可任意的設定配置傳送滾輪9 1之間隔、個 數,而可對應多種尺寸的玻璃基板。又,搬送基板雖係爲 玻璃基板,然本發明並不僅限定於此,亦可由金屬或樹脂 等其他素材所形成者。 【發明之效果】 如上所述,根據本發明之基板搬送裝置,因具備受取搬 送部,係用以承接基板;儲存搬送部,係用以儲存來自受 取搬送部的基板而進行搬送;送出搬送部,係承接來自儲 存搬送部傳來的基板,以配給疊層滾筒的基板送出速度, 而將基板送出;基板檢測部,係用以檢測出於各個搬送部 之基板位置;以及控制部,藉由該基板檢測部以檢測出位 -19- 1288426 五、發明說明(18) 於送出搬送部的基板送出,自儲存搬送部、以及接下來自 受取搬送部將基板送出進行追送搬送’使得與送出中的基 板的間隔成爲所定値,且成爲相同之基板送出速度’所以 可以簡單的機構將玻璃基板以一定的間隔進行有效率的搬 送。此外,以可容易的對應於多尺寸之玻璃基板。 此外,根據本發明之基板搬送方法,因係爲藉由基板檢 測部來檢測在送出搬送的基板送出,自儲存搬送部、以及 接下來自受取搬送部將基板送出進行追送搬送使得與送出 中的基板的間隔成爲所定値,且成爲相同之基板送出速度 ,故可以同樣簡單的機構將玻璃基板以一定的間隔進行有 效率的搬送。 圖式簡單說明 第1圖所示係本發明所實施之感光層轉印之槪略圖。 第2圖所示係玻璃基板之感光層轉印面之平面圖。 第3圖所示係基板搬送裝置之槪略立體圖。 第4圖所示係基板搬送裝置之感知器裝設位置之平面圖。 第5圖所示係第2實施例之基板搬送裝置之槪略立體圖。 第6圖所示係第3實施例之基板搬送裝置之槪略立體圖。 第7圖所示係第4實施例之基板搬送裝置之槪略立體圖。 【圖式符號說明】 10 ·· 疊層機構 17 ·· 控制器 18 , 98 : 玻璃基板 -20- 1288426 五、發明說明(19) 20,70,80 :基板搬送裝置 25 : 受取搬送部 26 : 第1儲存搬送部 27 : 第2儲存搬送部 28 : 送出搬送部 30,53,65 :空氣浮起座台 31,71,81,91 :傳送滾輪 32 : 附緣傳送滾輪 33,83 : 靠邊滾輪 34,84 : 35 : 36 : 3 7 ·· 38 : 39 : 40 : 41 : 42 : 43 : 5 0 ·· 夾持滾輪 存貨感知器 停止感知器 夾持感知器 追送開始感知器 防止追撞感知器 脈衝馬達 馬達驅動部 靠邊機構 夾持機構 疊層滾筒對組 52: 積層體薄膜 •21 -1288426 V. EMBODIMENT OF THE INVENTION (3: ) The substrate of the transport unit is delivered, and the white storage transport unit and the subsequent white transport unit transport the substrate to transport the substrate so that the distance between the substrate and the substrate being delivered is the same. The conveyance speed is in the stacking drum. The substrate and the photosensitive layer film are conveyed, and the photosensitive layer film is conveyed to the laminating roller 1 in a state in which the surface layer film is peeled off from the transfer portion of the white substrate. In the case where the front end position of the peeling portion of the surface film is aligned with the transfer start position of the substrate, the base: plate: delivery: Each of the transfer portions has a function to stop the substrate from being stopped at each of the transfer portions. Preferably, the substrate is detected on the substrate of each transport unit based on the substrate detection signal Ptfe of the stop sensor. Further, in the delivery and transport unit, a tracking start sensor for checking the delivery substrate is provided, and after the delivery start sensor detects the substrate, the substrate is transported at a speed exceeding the substrate feed speed. It is preferable that the transfer and control of each of the substrate transfer portions is such that the distance from the precursor substrate is a predetermined value and the substrate transfer speed is further. Further, the upstream transfer substrate is disposed at a predetermined interval in the substrate transfer direction. Detecting the sensor and the downstream substrate sensor to form a collision avoidance sensor. When the upstream substrate detection sensor changes from no substrate to a substrate and the downstream substrate sensor has a substrate, it is determined that there is a possibility of collision. It is preferable to stop the determination that the substrate on the upstream side of the possibility of collision is transported to the substrate. The inventory sensor 1 that is used to detect the presence or absence of the substrate is optimally received by the inventory sensor \\ the substrate signal Ο J J 作业 作业 作业 作业 \ J Ο Ο Ο Ο Ο Ο 884 884 884 884 884 884 884 884 884 884 884 884 884 884 884 884 884 884 884 884 884 884 884 884 884 884 Further, each of the transporting portions is a transporting member that is rotated by the both side edges of the supporting substrate, and a transporting member that is raised by the substrate floating portion of the substrate supported by the transporting member by blowing the gas. It is movable in the width direction of the substrate and the width dimension of the substrate. Further, each of the transporting portions is constituted by a transporting member that supports a portion that avoids both sides of the substrate and the transfer region of the photosensitive layer film, and the transporting member is in the direction of the substrate of the substrate to avoid the transfer. The position of the portion of the region is movable, and the respective transporting portions are preferably sandwiching members that are provided with a sandwiching substrate between the transporting members for transporting. > The feeding and unloading portions are provided in the vicinity of the clamping members. When the holding member is in the unclamped state, the substrate is optimally placed on the substrate. A plurality of storage and transport units are provided, and a heater is provided in each of the transport units to preheat each substrate to the substrate. The maximum temperature of the giant standard is > The temperature at which the receiving and conveying unit is set to be lower than the standard temperature is set to be used for the storage and transportation unit. The temperature of the giant standard is the local temperature, and the delivery and delivery unit is set to a temperature slightly higher than the standard temperature, and it is optimal that J is divided into small blocks for each of the conveyors, and each is In the case of the substrate transfer method of the present invention, the substrate transfer method of the present invention is used in the substrate transfer method for transporting the substrate to the stacking roll. 5 is used to receive the transfer unit> to receive the substrate 9 for storage. The transport unit is configured to store the substrate on which the WL M1 feed unit is to be taken, and to transport the substrate y. The transfer unit is configured to receive the substrate y of the white support transport unit to feed the substrate at the base-6-plate transport speed of the stacking drum. Speed 1288426 V. The invention (5) sends out the substrate; the substrate detecting unit detects the position j of the substrate of each of the transport units and the control unit, and corresponds to the substrate detected by the substrate detecting unit. The substrate detecting unit detects the substrate feeding in the feeding and conveying unit, and the substrate is fed and transported from the storage and transport unit and then from the receiving and transporting unit, so that the interval between the substrate and the substrate being fed is determined. And it becomes the same substrate delivery speed. [Detailed Description of Preferred Embodiments of the Present Invention] The first circle is a schematic configuration of a stacking mechanism provided with the substrate transfer apparatus of the present invention. The lamination mechanism 10 is a hot-pressing portion 12, a base film supply portion 13, a cooling portion 14, a peeling portion 15, a substrate take-out portion 16, and a controller (to be described later) 17 to be prepared by the preliminary heating portion 11. As shown in Fig. 2, the photosensitive layer is transferred to a transparent glass base; a transfer region TA other than the peripheral portion of the t-18. The glass substrate 18 is supplied to the preheating portion 1 1 by means of a robot arm as shown. An arm pad is disposed on the arm body of the robot arm. The robot arm is configured to hold the back surface of the glass substrate 18 (non-transfer surface of the photosensitive layer) by the suction pad. Thereafter, the mechanical arm flips the surface (the transfer surface of the photosensitive layer) downward, and the glass substrate 18 is supplied to the preliminary heating unit 1 1 . The preheating unit 1 1 is composed of the substrate transfer device 20 and the heater 2 1 22 and is divided into a receiving and transporting unit 25, first and second storage and transport units 26 > 27, and a delivery and transport unit 28. The receiving and conveying unit 25 transports the glass substrate 18 that receives the white robot arm to the downstream side. Glass substrate -7- 18 1288426 V. The invention (6) is transported to the delivery transport unit 28 via the first and second storage transport units 26 and 27. The glass substrate 18 is waited by the feeding and conveying unit 28, and is sent to the stacking roller pair of the hot pressing portion 12, which will be described later, in accordance with the instruction of the hot pressing portion. The heaters 21 and 22 are arranged in the vertical direction so as to sandwich the glass substrate 18 t of the substrate transfer device 20, and heat the conveyed glass substrate 18 to a predetermined temperature. Here, the heater can utilize a far-infrared heater, a nickel-aluminum alloy line heater, and a hot air heater. In the receiving and conveying unit 25, the heaters 21 and 22 are configured to suppress the thermal deformation and lower the set temperature, and in the first and second storage and transport units 26 and 27, the glass substrate can be used in a short time. When the temperature is set to a predetermined temperature and the set temperature is raised, in the delivery and transport unit 28, the temperature of the glass substrate 18 that is waiting is not lowered, and only the set temperature is raised. For example, the glass substrate 18 is heated to 1 1 (the respective set temperatures at the time of TC, the heaters 21a, 22a are 100 ° C, the heaters 21b, 22b, 21c, 22c are 180 ° C, the heater 21d and 22d are 120 ° C. Thereby, the glass substrate 18 is heated to a predetermined temperature without causing thermal deformation for a short period of time, and it is not necessary to lower the temperature while waiting. The set temperatures of 2 1 and 22 are not limited thereto, and are appropriately determined depending on the substrate size or the required temperature. The heaters 2 1 and 22 are formed by juxtaposing small-sized surface heating elements. In addition, an individual controller (not shown) is provided. Therefore, in order to uniformize the temperature distribution of the glass substrate 18, it is possible to individually change the set temperature. For example, it is possible to fully accommodate 1288426. The two sides of the glass substrate 18 which are easy to cool are set to a relatively high temperature. Further, each of the conveying portions 25 to 28 is set to the minimum stop time, and the temperature can be surely raised to a predetermined temperature. The substrate transfer device 20 is the third. As shown in the figure It is composed of an air floating seat 30, a conveying roller 3 1 , a rim conveying roller 3 2, a side roller 3 3, a clamping roller 34, a sensor 3 5 to 39, etc. The glass substrate 18 is composed of The conveying roller 3 1 and the edge conveying roller 32 are supported by the both side edges and are conveyed. The air floating seat 30 is configured to face the lower surface of the glass substrate 18 and has a large number of air blows formed on the surface thereof. The outlet 30a is configured such that the clean air is blown toward the glass substrate 18 by the air outlet 30a, and the central portion of the glass substrate 18 that is deflected by its own weight is lifted upward. The transport roller 3 1 and the attached transport roller 32 are attached. The glass substrate is fitted in a direction perpendicular to the transport direction of the glass substrate 18 while being disposed in the cut-away portion 30b formed at both side portions of the air floating mount 30 while being supported in a freely rotatable state. The width of the width of 18 forms a movable state. The respective conveying rollers 3 1 and 32 are rotationally driven by a pulse motor (ριι 1 se mo t 〇r ) 40 , corresponding to each of the sensors 3 5 to 5 described later. 3 9 generated substrate detection signals, The drive of the pulse motor 40 is controlled by the motor drive unit 4 1 by the controller 17. Further, each of the transport rollers 3 1 and 32 is moved along the cut-away portion 30b to match the width dimension of the glass substrate 18, and is compatible with The glass substrate of a plurality of sizes is transported. The transport roller 3 1 and the edge transfer roller ♦ 32 transport the glass substrate 18 while rotating on both sides of the lower side of the contact glass substrate 18. At this time, 1288426 In the description (8), although the surface of the glass substrate 18 (the transferred surface of the photosensitive layer) is formed on the lower side, the periphery of the glass substrate 18 to which the photosensitive layer is not transferred is contacted by the respective transfer rollers 31, 32. Therefore, it does not cause damage to the transfer area TA of the photosensitive layer, or adhesion of the enamel. Further, the edge 32a of the edge transfer roller 32 serves as a function for guiding the glass substrate 18, and controls the position of the glass substrate 18 in the width direction. A backing mechanism 42 is provided on the side roller 33. The controller 17 is selectively set between the corrected position where the side roller 33 is joined to the side surface of the glass substrate 18 and the retracted position separated from the glass substrate 18 via the edge-receiving mechanism 42. After the trailing roller 33 is placed at the correcting position, the position of the glass substrate 18 in the width direction and the inclination are corrected to improve the straightness accuracy of the glass substrate 18. Further, in order to prevent the glass substrate 18 from being damaged, the controller 17 performs the step of attaching the grip roller 34 to the retracted position when the side roller 33 is equipped at the correction position, when the grip roller 34 is mounted. When the transport position is set, the side roller 33 is mounted to the retracted position control. The grip roller 34 is formed of Teflon and is provided with a gripping mechanism 43. The controller 17 is a selective retracting position for holding the holding position of the glass substrate 18 between the holding roller 34 and the conveying roller 31 via the clamping mechanism 43 and separating from the glass substrate 18. Set between. Both side edges of the glass substrate 18 are sandwiched between the grip roller 34 and the transport roller 31 to prevent the glass substrate 18 from slipping during transport. In addition, in order to prevent breakage of the glass substrate 18, when the holding roller -10- 1288426 5 and the invention description (9) 34 are set to the transport position, the grip roller 3 is slowly moved immediately before the glass substrate is contacted. 4 Move. Further, after the glass substrate 18 is held by the stack of the laminated rolls, the holding roller 34 is set to the retracted position. Further, in the present embodiment, although the pinch roller is formed of Teflon, if there is no problem in function, other materials or more elastic rubber-based materials such as fluorine may be used. Rubber, silicone resin, etc. Sensors 35 to 39 formed of a heat-resistant reflective optical fiber sensor are disposed on the cut-away portion 30c formed at the center of the air floating seat 30. Each of the sensors 35 to 39 is disposed along the transport direction of the glass substrate 18, and is connected to a controller 17 (not shown). Further, after the glass substrate 18 is detected, the substrate detection signal is sent to the controller 17 respectively. The controller 17 controls the position of the glass substrate 18 to be specifically transported based on the substrate detection signals emitted from the respective sensors 35 to 39. Fig. 4 is a view showing the arrangement positions of the respective rollers 31 to 34 and the respective sensors 35 to 39 displayed in the respective conveying portions 25 to 28. The stock sensors 35a to 35d are used to detect the presence or absence of the glass substrate 18 of each of the transport units 25 to 28. When the stock sensor 35a of the delivery conveyance unit 28 is switched ON, the hot press portion 1 is prepared to transfer the photosensitive layer. Then, after the feeding start signal is sent out by the hot pressing portion 12, the glass substrate 18 is fed at a feeding speed VI of the joining speed of the stacking roller to be described later. In addition, when either one of the stock sensors 35c and 35d of the receiving and conveying unit 25 is turned ON, the robot does not supply the glass substrate 18 to the receiving and transporting -11-1286426, and the invention description (1) section 25, and It is not necessary to double-place the glass substrate 18. When both the inventory sensors 35c, 35d are formed to be OFF, the next glass substrate 18 is supplied by the robot arm. The stop sensors 36a to 36d are provided at the downstream end portions of the respective transport portions 25 to 28, and when the glass substrate 18 reaches the position and is turned ON, the transport of the glass substrate 18 is stopped. In the delivery conveyance unit 28, when the front end of the glass substrate 18 reaches the position where the sensor 35a is stopped, the conveyance is stopped. In the case where the glass substrate 18 is provided in the transport portion on the downstream side by the transport portion, the front end of the glass substrate 18 reaches the position of each of the stop sensors 35b to 35d. The conveyance of the glass substrate 18 of the conveyance unit is stopped. The gripper sensors 3 7 a to 3 7 h are provided in the vicinity of the respective grip rollers 34, and when the glass substrate 18 reaches the position, the respective grip rollers 34 are set to the transport position. Further, when the rear end of the glass substrate 18 passes through the grip roller 34, the respective grip rollers 34 are set at the retracted position before the rear end passes. The chase start sensor 38 is disposed at a distance L1 from the stop sensor 36b of the second storage transport unit 28. When the glass substrate 18 is sent to the hot-pressing portion 1 2 ' by the delivery/transport unit 28, the trailing start sensor 38 is turned OFF after the trailing end passes the chase start sensor 38. When the tracking start sensor 38 is turned OFF, the glass substrate 18 located in the receiving and transporting unit 25 and the first and second storage and transport units 26 and 27 will have a faster chasing speed V2 than the sending speed V1. Start chasing and transporting separately. -12- 1288426 V. Description of the Invention (11) The chasing and transporting is performed only at the chase time T. The chase speed V2 and the chase time T are set in accordance with the respective substrate sizes, and the interval between the glass substrates 18 in the hot stamping portion 1 is appropriately set to a predetermined distance L2 (see FIG. 3). The glass substrate 18 is supplied. As a result, after the elapse of the tracking time T, the interval between the glass substrate 18 fed from the delivery conveyance unit 28 and the glass substrate 18 located in the second support conveyance unit 28 is set to a predetermined distance L2. Then, after the elapse of the tracking time T, the glass substrate 18 that has been transported and transported also becomes the feed speed V1, and is held at the predetermined distance L2 and conveyed toward the hot press portion 12. In this manner, the interval between the glass substrates 18 placed on the transport portion 28 before the hot stamping portion 12 can be adjusted to a predetermined distance L2. Therefore, the hot stamping portion 12 can be accurately and at regular intervals. The glass substrate 18 is supplied. Further, since the interval between the glass substrates located in front of the hot-pressing portion 1 2 is adjusted, there is no problem even if the sliding occurs after the conveyance to the delivery/transport unit 28 is reached. Further, since the position of each of the transport units 25 to 28 is stopped, there is no difference in the time interval between the input of the glass substrate 18 to the transport unit 25 or the size of the substrate, and the hot stamping portion 1 can be used. 2 The glass substrate 18 is supplied in order with high precision and at regular intervals. In addition, by increasing the tracking speed V2, the transport distance of the chase can be shortened, and the object of miniaturizing the entire substrate transport apparatus can be achieved. The collision avoidance sensors 39a to 39f and the stop sensors 36b and 36c prevent the glass substrate 18 on the upstream side from colliding with the glass substrate 18 on the downstream side, and detect whether the interval between the front and rear glass substrates 18 is different. The fixed distance -13 - 1288426 V, invention description (12) from L2. Each of the sensors 39a and 39b, 39c and 39d, 36b and 39e, 3 6 c and 3 9 f are formed as a pair, respectively, and are set at a predetermined distance L2. In the case of the sensor on the upstream side, when the sensor on the upstream side is changed to a glass substrate by the glass-free substrate, and the sensor on the downstream side has the glass substrate, the interval between the front and rear glass substrates 18 is displayed. The distance L2 is equal to or less than the predetermined distance, and the conveyance of the glass substrate 8 that is being transported is stopped. The substrate 1 on the downstream side of the front side is transported, and the distance between the front and rear glass substrates 18 is set to a predetermined distance L2, and the transport of the glass substrate 18 that has been transported and transported is resumed. The conveyance speed at this time is the delivery speed VI of the engagement speed of the stacking drum pair. In Fig. 1, the hot-pressed portion 12 is composed of a stacking roller pair group 50 and a supporting roller 51. The stacking roller pair group 50 is composed of laminating rolls 50a and 50b arranged in the upper and lower directions, and a heater is housed in the stacking rolls 50a and 50b. The stacking roller pair group 50 is formed by sandwiching the glass substrate 18 and the laminated body film 52, and the laminated film 52 is adhered to the glass substrate 18 by heat pressing. The support roller 5 1 is configured to be driven to rotate in contact with the lamination rolls 50a and 50b to suppress the deflection of the lamination rolls 50a and 50b, and can be heat-pressed by uniform force. Further, between the substrate transfer device 20 and the hot-pressing portion 12, an air floating seat table 53 having the same configuration as the air floating seat 30 is also provided. Thereby, the glass substrate 18 can be held horizontally, and when the glass substrate 18 is placed on the stacking roller pair group 50, the deflection of the central portion of the glass substrate 18 can be prevented and the laminated roller 50a of the lower side can be prevented. There is a conflict. -14- 1288426 V. SUMMARY OF THE INVENTION (13) The laminated film supply unit 13 is provided with a shaft 5 4 a, a half cutoff device (ha 1 fcutter ) 5 5 , a surface film The peeling portion 56, the back tension roller 57, and the like are formed. In the laminated film supply unit 13, the surface film 52c is peeled off from the laminated film roll 54, and the base film 52b is supplied to the stacking roller pair 50 with the photosensitive layer facing upward. The laminated film 52 is provided with a layer of the photosensitive layer 52a on the base film 52b via a supplementary layer, an intermediate layer or the like which is not shown, and a surface layer 52c is provided on the layer above the photosensitive layer 52a. The other aspect of the base film 52b is a charging prevention layer or the like. The half cutoff 55 is a half-cut cut of the laminated film 52 in accordance with the length of the glass substrate 18. The half cut cut means that the surface film 52c and the photosensitive layer 52a are cut without cutting the base film 52b. The surface film peeling portion 56 peels off the surface film 52c which is formed by the half cut-off portion which is formed on the surface of the glass substrate 18 from the laminated film 52. The peeling layer is an adhesive tape 56c that is pulled out from the adhesive tape roll 56a, and is attached to the surface film 52c by pressing the roller 56b, and the adhesive tape 56c attached to the surface film 52c is taken up to the tape roll. The shaft 56d is taken for recycling. Further, the surface film thin film 52c is formed so as not to peel off and remains on the laminated thin film 52 formed between the glass substrate 18 and the glass substrate 18. After the half cut-off line passes through the predetermined position on the hot-pressing portion 12, the feed start signal is sent to the substrate transfer device 20. By this, the photosensitive layer 52a of the laminated film 52 is attached to the glass substrate 18 in a state where the position of the glass substrate 18 and the half cut line is aligned in the state of -15-1286426. Further, the base film 52b is also conveyed toward the downstream side in the conveying direction of the stacking drum pair group 50 in accordance with the movement of the glass substrate 18. The cooling unit 14 is composed of a cooling air blowing plate 60 and a conveying roller 61. The cooling air blowing plate 60 is blown out from the clean cooling air toward the glass substrate 18 by the HEPA filter, and the temperature of the glass substrate 18 conveyed by the conveying roller 61 is cooled to about room temperature (30 ° C). the following). The peeling portion 15 is composed of a peeling roller 62 and a base film take-up mechanism 63, and is used to peel the base film 52b from the glass substrate 18, and the base film 62b is wound into a roll shape on the recovery shaft 63a. The recovery shaft 63a is rotationally driven by a take-up motor (not shown). The take-up motor is controlled by the torque, and the tension of the base film 52b after the stacking drum pair 50 is kept constant to avoid slack in the base film 52b. On the downstream side of the peeling portion 15 is provided a substrate take-out portion 16 formed by the air floating seat 65. The air floating seat 65 is configured in the same manner as the air floating seat 30 of the preliminary heating unit 11. The glass substrate 18, which is sent out by the peeling portion 15, is sucked by the robot arm (not shown) for taking out. Next, the action of the above configuration will be described. When the first glass substrate 18 is placed in the receiving and transporting unit 25 by the robot arm, the glass substrate 18 is transported in the order of the first storage transport unit 26, the second storage transport unit 27, and the delivery transport unit 28. And by the heater, 22 heated to -16 - 1288426 five, the temperature specified in the description (15). When the front end of the glass substrate 18 reaches the stop sensor 36a of the delivery conveyance unit, the conveyance is stopped. Then, the glass sheets 18 of the second, third, and fourth sheets are sequentially loaded and transported, and are stopped at the positions of the stop sensors 36b to 36d of the respective transport units 25 to 27, respectively. In the hot-pressing portion 12, the stacking roller rotates the group 50 to transport the laminated body film 52, and when the half cut-off line of the laminated film 52 comes to a predetermined position, the feed start signal is directed to the substrate transfer device. 20 sent out. The substrate transfer device 20 feeds the first glass substrate 18 from the delivery conveyance unit 28 by the input of the feed start signal to match the feed speed VI of the stacking speed of the stacking roller pair group 50. When the rear end of the glass substrate 18 passes through the tracking start sensor 38, the second glass substrate 18 starts chasing and transporting at a faster tracking speed V2 than the delivery speed VI. After the elapsed time T, the second glass substrate 18 is also conveyed at the feed speed VI. At this time, the interval between the first glass substrate 18 and the second glass substrate 18 is a predetermined distance L2. In the same manner, the third and fourth glass substrates 18 are similarly chased by the chasing speed V2 which is sent to the feeding speed V1 of the glass substrate 18 of the stacking roller pair 50, and is chased. The interval between the glass substrates 18 fed to the stacking roller pair group 50 is set to a predetermined distance L2, and then fed to the stacking roller pair group 50. Further, the glass substrate 18 stopped at the receiving and conveying unit 25 is transported to the downstream side, and when both of the stock sensors 35c and 35d are turned OFF, the robot arm is put into the next glass substrate 1 and repeats the same as described above. The glass substrate 18 is transported. -17- 1288426 V. INSTRUCTION OF THE INVENTION (16) The laminated roller pair group 50 is hot-pressed on the glass substrate 18 in a state in which the position between the glass substrate 18 and the half cut-off line is aligned. The photosensitive layer 52a of the laminated film 52 is attached. The glass substrate 18 is peeled off by the peeling portion 15 after the cooling portion 18 is cooled to about room temperature. Thus, the photosensitive layer is transferred onto the transfer area TA of the lower surface (surface) of the transparent glass substrate 18. Thereafter, the glass substrate 18 is sent out to the substrate take-out portion 18, and the upper surface (back surface) is sucked by the robot arm for taking out. Further, in the above-described embodiment, all of the transport rollers are rotationally driven by being connected to the pulse motor. However, it is also necessary to arrange the motor in each of the blocks, and to drive the roller by the belt, or The freewheel, the trending drive roller, or the torque motor drive roller that are freely rotatable by the drive source are arranged in combination, and the installation interval of the transfer roller or the like is preferably to stably transport the multi-size glass substrate. . Moreover, the friction between the transport roller and the peeling substrate is sufficiently ensured, and there is no need to provide a grip roller when the glass substrate is slipped during transport, and in this case, while forming a transport series that is easy to control, It can reduce the concern of dust. Further, although the edge transfer roller is used in the receiving and transporting unit and the first and second storage and transport units, as shown in Fig. 5, the same transport roller 7 1 and the restricting glass substrate 18 as the delivery and transport unit can be used. The guide roller 72 at the position in the width direction carries and guides the glass substrate 18. In the above-described embodiment, the interval between the glass substrates of the delivery and transport unit is adjusted to a predetermined distance L2. However, as shown in Fig. -18 to 1288426, the invention (17) can also be sent out. The downstream end portion of the transport unit is provided with a freely movable abutting portion 85 between a stop position at which the glass substrate 18 is prohibited from being transported and a retracted position at which the transfer is prohibited, and the substrate is adjusted by the movement of the abutting portion 85. At the time of the conveyance, the interval between the respective glass substrates 18 supplied to the hot-pressing portion 12 is a predetermined distance L2. In this case, the distance between each of the glass substrates 18 after the chasing and transporting is a shorter distance L3 than the predetermined distance L2. In the above embodiment, the two sides of the glass substrate are supported by the transport rollers. In the case where the plurality of glass substrates 18 are spaced apart at a constant interval to form the plurality of transfer surfaces TA, or the back surface of the non-transfer surface is directed to the lower side, In the case of support, a plurality of transport rollers 9 1 may be disposed on the support shaft 90 for supporting the glass substrate 18. Further, the interval and number of the transport rollers 9 1 can be arbitrarily set, and the glass substrates of various sizes can be used. Further, although the transport substrate is a glass substrate, the present invention is not limited thereto, and may be formed of other materials such as metal or resin. [Effect of the Invention] As described above, the substrate transfer apparatus according to the present invention is provided with a receiving and transporting unit for receiving a substrate, and the storage and transporting unit is configured to store a substrate from the transporting and transporting unit, and to carry out the transport; And receiving the substrate from the storage and transport unit to deliver the substrate at a speed at which the stacking roller is fed, and the substrate detecting unit is configured to detect the position of the substrate for each of the conveying portions; and the control unit The substrate detecting unit detects the position of the -19- 1288426. The invention (18) sends the substrate to the delivery and transport unit, and the substrate is sent from the storage and transport unit and then the substrate is transported and picked up and transported. Since the interval between the substrates in the middle is constant and the substrate transfer speed is the same, the glass substrate can be efficiently transported at a constant interval by a simple mechanism. Further, it is easy to correspond to a multi-size glass substrate. Further, according to the substrate transfer method of the present invention, the substrate detecting unit detects the substrate transported by the transport and transport, and the substrate is transported from the storage transport unit and the subsequent transport unit to perform the transport and delivery. Since the interval between the substrates is constant and the substrate transfer speed is the same, the glass substrate can be efficiently transported at a constant interval in a similarly simple mechanism. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the transfer of a photosensitive layer carried out by the present invention. Fig. 2 is a plan view showing a transfer surface of a photosensitive layer of a glass substrate. Fig. 3 is a schematic perspective view of the substrate transfer device. Fig. 4 is a plan view showing the position at which the sensor is mounted on the substrate transfer device. Fig. 5 is a schematic perspective view showing the substrate transfer apparatus of the second embodiment. Fig. 6 is a schematic perspective view showing the substrate transfer apparatus of the third embodiment. Fig. 7 is a schematic perspective view showing the substrate transfer apparatus of the fourth embodiment. [Description of Symbols] 10 ·· Lamination mechanism 17 ·· Controller 18, 98 : Glass substrate -20- 1288426 V. Invention description (19) 20, 70, 80: Substrate conveying device 25: Receiving and conveying unit 26: The first storage conveyance unit 27: the second storage conveyance unit 28: the delivery conveyance unit 30, 53, 65: the air floating seat 31, 71, 81, 91: the conveyance roller 32: the attachment conveyance roller 33, 83: the side roller 34,84 : 35 : 36 : 3 7 ·· 38 : 39 : 40 : 41 : 42 : 43 : 5 0 ·· Clamping wheel inventory sensor stop sensor gripper sensor chasing start sensor to prevent collision perception Pulse motor motor drive section edge mechanism clamping mechanism stacking roller pair 52: laminated film • 21 -

Claims (1)

12884261288426 六、申請專利範圍 第90 1 29944號「基板搬送裝置及其方法」專利案 (2007年3月15日修正) 、申請專利範圍: 1. 一種基板搬送裝置,係爲將基板送入至疊層滾筒之基 板搬送裝置中,其特徵在於具備有, 受取搬送部,係用以承接前述基板; 儲存搬送部,係用以儲存自前述受取搬送部的基板 而進行搬送; 送出搬送部,係承接來自前述儲存搬送部的基板, 以配合前述疊層滾筒的基板送出速度,而將基板送出 f 基板檢測部,係用以檢測出於各個搬送部之前述基 板之位置; 以及控制部,藉由前述基板檢測部檢測出位於前述 送出搬送部的基板送出,自儲存搬送部、以及接下來 自受取搬送部基板送出進行追送搬送使得與送出中的 基板的間隔成爲所定値,且成爲相同之基板送出速度 ,於前述送出搬送部,設置有用以檢測前述基板之送 出之追送開始感知器,當追送開始感知器檢測出基板 的送出後,便以超越前述基板送出速度,將儲存搬送 部、受取搬送部的基板送出進行追送搬送,控制各個 基板搬送部,使得與先前基板的間隔成爲所定値,且 成爲基板送出速度。 1288426 六、申請專利範 圍 2.如 甲 請 專 利 範 圍 第 1項之基 :板 :搬 :送 :裝 置 > 其 中 基 板 與 感 光 層 薄 膜 係 被 送 至前述疊 層 滾 筒 J /·· 刖 述 感 光 層 薄 膜 j 係 爲 以 對 .U· 刖 述 朝 基板之轉 印 部 分 之 表 層 薄 膜 剝 離 的 狀 態 下 傳 送 至 疊 層 滾筒;前 述 送 出 搬 送 部 係 將 刖 述 表 層 薄 膜 之剝 離 部 分的前端 位 置 對 準 於前述 基 板之 轉 印 開 始位 置 而 將 基板送出 者 〇 3.如 串 請 專 利 範 圍 第 1項之基 板 搬 送 裝 置 其 中 刖 述各 個 搬 送 部 係 具 備 有使前述 基 板停止於各 個 搬 送 部 之 停 止 感 知 器 基 於 該停止感 知 器 的 基 板 檢 測 信 號 用 以 決定於各 個 搬 送 部之基板位 置 Ο 4.如 串 Ξ主 6円 專 利 範 圍 第 1項之基 板 搬 送 裝 置 其 中 於 刖 述 各 個 做 送 部 > 係在 基板搬送 方 向 分 離 所 定 間 隔 設 置 有 上 游 側 基 板 檢 測 感 知器、以 及下 游 側 基 板 感 知 器 而 構 成防止追 撞 感 知 器 ,當前述 上 游 側 基 板 檢 測 感 知 器 由 々1「‘ ιΠΓ J\\\ 基 板 變 化 爲 有 基 板時,且 下 游 側 基 板 感 知 器 爲 有 基 板時 即判 定有追 撞可能性 y 便停止 判 定有 此 種 追 撞 可 能 性之 上 游 側 之 基板搬送 〇 5.如 串 請 專 利 範 圍 第 1項之基 板 搬 送 裝 置 其 中 於 刖 述 基 板 受 取部 > 係 設 置有用以 檢 測 是 否有無 基 板 之存 貨 感 知 器 藉 由 存 貨 感知器之 Μ j\\\ 基 板 信 號 而 白 刖 作 業 程 序承 接 基 板 0 6 ·如 串 請 專 利 範 圍 第 1〜4項 中 任 一 項 之 基 板 搬 送 裝 置 其 中 刖 述 各 搬 送 部係由支 -2- 撐 刖 述 基 板 之 兩 側 緣 部 而 1288426 六、申請專利範圍 旋轉之傳送元件以及藉由吹出氣體使由前述傳送元件 所支撐之基板的中央部浮升之基板浮起面板所構成, 前述傳送元件係以基板之寬度方向,配合基板之寬度 尺寸而構成可移動。 7 .如申請專利範圍第1〜4項中任一項之基板搬送裝置 ,其中前述各搬送部係由支撐避開前述基板之兩側緣 以及前述感光層薄膜之轉印區域之部分而進行旋轉之 傳送元件所構成,前述傳送元件係在基板之寬度方向 配合避開轉印區域之部分的位置而構成可移動。 8 .如申請專利範圍第6項之基板搬送裝置,其中於前述 各個搬送部,在與前述搬送元件之間設置有夾持基板 以進行搬送之夾持元件。 9 .如申請專利範圍第8項之基板搬送裝置,其中於前述 送出搬出部上,於前述夾持元件附近設置靠邊元件,用 以將前述夾持元件變成夾持解除狀態而進行基板之靠邊 〇 1 〇 .如申請專利範圍第1、3、9項中任一項之基板搬送 裝置,其中設置複數個前述儲存搬送部,於前述各個搬 送部設置加熱器,將各個基板預熱至基板送出時的目標 溫度,且在前述受取搬送部係設定爲較前述目標溫度爲 低之溫度,於前述儲存搬送部則是設定爲用以達到前述 目標溫度之爲高的溫度,而於前述送出搬送部則設定爲 稍微較前述目標溫度爲高之溫度。 1288426 六、申請專利範圍 11 .如申請專利範圍第6項之基板搬送裝置,其中設置複 數個前述儲存搬送部,於前述各個搬送部設置加熱器, 將各個基板預熱至基板送出時的目標溫度,且在前述受 取搬送部係設定爲較前述目標溫度爲低之溫度,於前述 儲存搬送部則是設定爲用以達到前述目標溫度之爲高的 溫度,而於前述送出搬送部則設定爲稍微較前述目標溫 度爲高之溫度。 1 2 .如申請專利範圍第7項之基板搬送裝置,其中設置複 數個前述儲存搬送部,於前述各個搬送部設置加熱器, 將各個基板預熱至基板送出時的目標溫度,且在前述受 取搬送部係設定爲較前述目標溫度爲低之溫度,於前述 儲存搬送部則是設定爲用以達到前述目標溫度之爲高的 溫度,而於前述送出搬送部則設定爲稍微較前述目標溫 度爲高之溫度。 1 3 .如申請專利範圍第1 0項之基板搬送裝置,其中將設 置於前述各個搬送部之加熱器區分爲小的區塊,而在 每個區塊中可進行其溫度設定。 1 4 .如申請專利範圍第1 1項之基板搬送裝置,其中將設 置於前述各個搬送部之加熱器區分爲小的區塊,而在 每個區塊中可進行其溫度設定。 1 5 .如申請專利範圍第1 2項之基板搬送裝置,其中將設 置於前述各個搬送部之加熱器區分爲小的區塊,而在 每個區塊中可進行其溫度設定。 1288426 -六、申請專利範圍 1 6 . —種基板搬送方法,係將基板送入至疊層滾筒之基 板搬送方法中’其特徵在於係爲使用, 受取搬送部,係用以接收前述基板; 儲存搬送部,係爲用以儲存來自前述受取搬送部之 基板而進行搬送; 送出搬送部,係承接來自前述支撐搬送部之基板, 以配合前述疊層滾筒之基板傳送速度之基板送出速度 而送出基板; 基板檢測部,係用以檢測於各個搬送部之前述基板 之位置; 以及控制部,對應於以前述基板檢測部所檢測的前 述基板位置而控制各個搬送部; 且藉由前述基板檢測部檢測在前述送出搬送部之前 述基板送出,自儲存搬送部、及接下來自受取搬送部 將基板送出進行追送搬送,使得與送出中之基板自儲 存的間隔成爲所定値、且成爲相同之基板送出速度, 於前述送出搬送部,設置有用以檢測前述基板之送出 之追送開始感知器,當追送開始感知器檢測出基板的 送出後,便以超越前述基板送出速度,將儲存搬送部 、受取搬送部的基板送出進行追送搬送控制各個基板 搬送部,使得與先前基板的間隔成爲所定値,且成爲 基板送出速度。Patent Application No. 90 1 29944 "Substrate Transfer Device and Method" Patent (Revised on March 15, 2007), Patent Application Range: 1. A substrate transfer device for feeding a substrate to a laminate In the substrate transfer apparatus of the drum, the receiving and conveying unit is configured to receive the substrate; the storage and transport unit is configured to store the substrate from the receiving and transporting unit, and the transporting unit is configured to receive the transporting unit. The substrate of the storage and transport unit is configured to send the substrate to the f-substrate detecting portion to detect the position of the substrate for each of the transport portions, and to control the substrate, by the substrate The detecting unit detects that the substrate is transported by the transporting and transporting unit, and the self-storing and transporting unit and the subsequent transporting from the receiving and transporting unit substrate to perform the chasing and transporting so that the distance from the substrate being fed is determined, and the same substrate feeding speed is obtained. Providing, in the delivery and delivery unit, a tracking start sensing for detecting the delivery of the substrate When the tracking start sensor detects the delivery of the substrate, the substrate transporting the transport unit and the transport unit is sent out and transported, and the substrate transport unit is controlled so as to be spaced apart from the previous substrate. It becomes the predetermined crucible and becomes the substrate delivery speed. 1288426 VI. Application for Patent Range 2. For example, the basis of the first item of the patent scope: board: moving: sending: device> wherein the substrate and the photosensitive layer film are sent to the aforementioned laminating roller J /·· The film j is conveyed to the lamination roller in a state in which the surface film of the transfer portion of the substrate is peeled off, and the transfer conveyance portion is aligned with the front end of the peeled portion of the surface film. In the substrate transfer device of the first aspect of the invention, the substrate transfer device of the first aspect of the present invention includes a stop sensor that stops the substrate from being stopped by each of the transfer units. The substrate detection signal of the sensor is used to determine the substrate position of each of the transport sections. 4. The substrate transport apparatus of the first aspect of the patent range is described in the above description. An upstream side substrate detecting sensor and a downstream side substrate sensor are provided at predetermined intervals in the substrate transport direction to constitute a collision avoidance sensor, and the upstream substrate detecting sensor is changed by 々1"' ιΠΓ J\\\ substrate When there is a substrate and the downstream substrate sensor is a substrate, it is determined that there is a possibility of collision y. Then, the substrate transporting 判定 on the upstream side of the possibility of collision is stopped. In the substrate transfer device, the substrate receiving portion is provided to detect whether or not the substrate is present, and the inventory sensor is used to receive the substrate by the inventory sensor. In the substrate transfer apparatus according to any one of the first to fourth aspects of the invention, the description of each of the transfer parts is performed by the side of the substrate, and the two sides of the substrate are 1288426. a rotating transfer element and a substrate floating panel that floats a central portion of the substrate supported by the transfer element by blowing a gas, wherein the transfer element is movable in a width direction of the substrate and a width dimension of the substrate . The substrate transfer device according to any one of claims 1 to 4, wherein each of the transfer portions is rotated by supporting a portion of the transfer region of the photosensitive layer film while avoiding both side edges of the substrate The transport element is configured such that the transport element is movable in a position in which the width of the substrate is offset from the portion of the transfer region. 8. The substrate transfer device according to claim 6, wherein each of the transfer portions is provided with a sandwiching member that sandwiches the substrate and transports the transfer member. 9. The substrate transfer apparatus according to claim 8, wherein a side edge member is provided in the feeding/unloading portion in the vicinity of the holding member, and the holding member is brought into a grip release state to perform a side edge of the substrate. The substrate transfer apparatus according to any one of the preceding claims, wherein the plurality of storage and transport units are provided, and a heater is provided in each of the transport units to preheat each substrate to a substrate. The target temperature is set to a temperature lower than the target temperature, and the storage and transport unit is set to a temperature at which the target temperature is high, and the delivery/transport unit is Set to a temperature slightly higher than the aforementioned target temperature. The substrate transfer device of claim 6, wherein a plurality of the storage and transport units are provided, and a heater is provided in each of the transport units to preheat each substrate to a target temperature at which the substrate is sent out. In the storage and conveyance unit, the temperature is set to be lower than the target temperature, and the storage and conveyance unit is set to a temperature higher than the target temperature, and is set to be slightly higher in the delivery and conveyance unit. A temperature higher than the aforementioned target temperature. The substrate transfer device according to claim 7, wherein a plurality of the storage and transport units are provided, and a heater is provided in each of the transport units, and each of the substrates is preheated to a target temperature at the time of substrate transfer, and the above-mentioned acquisition is performed. The transport unit is set to a temperature lower than the target temperature, and the storage transport unit is set to a temperature higher than the target temperature, and the delivery transport unit is set to be slightly higher than the target temperature. High temperature. 1 . The substrate transfer apparatus of claim 10, wherein the heaters disposed in the respective transport sections are divided into small blocks, and the temperature setting is performed in each of the blocks. The substrate transfer apparatus of claim 11, wherein the heaters provided in the respective transport sections are divided into small blocks, and the temperature setting is performed in each of the blocks. The substrate transfer apparatus of claim 12, wherein the heaters disposed in the respective transport sections are divided into small blocks, and the temperature setting is performed in each of the blocks. 1288426 - s. Patent Application No. 16. The substrate transfer method is a substrate transfer method for feeding a substrate to a stacking drum, which is characterized in that it is used, and the receiving and transporting portion is for receiving the substrate; The conveying unit is configured to store the substrate from the receiving and conveying unit, and the conveying unit is configured to receive the substrate from the supporting and conveying unit and to feed the substrate at a substrate feeding speed of the substrate transfer speed of the stacking roller. The substrate detecting unit is configured to detect the position of the substrate in each of the conveying units, and the control unit controls each of the conveying units in accordance with the substrate position detected by the substrate detecting unit; and the substrate detecting unit detects The substrate is sent out from the storage and transport unit, and the substrate is fed and transported from the storage and transport unit from the storage and transport unit, so that the substrate is separated from the storage and the substrate is delivered. The speed is provided in the delivery and transport unit to detect the delivery of the substrate When the tracking start sensor detects the delivery of the substrate, the substrate is sent out of the substrate of the storage and transport unit and the transport unit to be transported, and the substrate transport unit is controlled to advance the substrate transfer speed. The interval between the substrates becomes a predetermined enthalpy and becomes a substrate delivery speed.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI415210B (en) * 2008-06-12 2013-11-11 Semes Co Ltd Substrate transfer apparatus and method, and a substrate manufacturing apparatus having the same

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100596054B1 (en) * 2002-10-31 2006-07-03 삼성코닝정밀유리 주식회사 Glass substrate inspecting system
KR100596050B1 (en) * 2002-10-31 2006-07-03 삼성코닝정밀유리 주식회사 Glass substrate transferring system
JP2004244141A (en) * 2003-02-12 2004-09-02 Kawasaki Heavy Ind Ltd Robot system
TWI327985B (en) 2003-04-14 2010-08-01 Daifuku Kk Apparatus for transporting plate-shaped work piece
JP2005047675A (en) * 2003-07-29 2005-02-24 Daifuku Co Ltd Carrying device
TWI295659B (en) 2003-08-29 2008-04-11 Daifuku Kk Transporting apparatus
JP4497972B2 (en) * 2004-03-23 2010-07-07 株式会社オーク製作所 Substrate transport mechanism of drawing apparatus
JP4608954B2 (en) * 2004-06-09 2011-01-12 株式会社Ihi Transport device
JP4774243B2 (en) * 2004-07-06 2011-09-14 富士フイルム株式会社 Photosensitive laminate manufacturing apparatus and manufacturing method
JP4881585B2 (en) * 2004-07-06 2012-02-22 富士フイルム株式会社 Photosensitive laminate manufacturing apparatus and manufacturing method
JP2006245110A (en) * 2005-03-01 2006-09-14 Tokyo Electron Ltd Heat-treating apparatus
JP4497005B2 (en) * 2005-03-28 2010-07-07 株式会社ダイフク Conversion equipment
JP2007091397A (en) * 2005-09-28 2007-04-12 Shinko Electric Ind Co Ltd Substrate conveying device
JP2007250871A (en) * 2006-03-16 2007-09-27 Olympus Corp Substrate transport apparatus
KR100834734B1 (en) * 2006-04-06 2008-06-05 주식회사 에스에프에이 Apparatus for transferring substrate
JP5095166B2 (en) * 2006-09-15 2012-12-12 日清紡ホールディングス株式会社 Method and apparatus for laminating solar cell module by preheating
JP4753313B2 (en) * 2006-12-27 2011-08-24 東京エレクトロン株式会社 Substrate processing equipment
JP4987656B2 (en) * 2007-09-28 2012-07-25 富士フイルム株式会社 Photosensitive laminate manufacturing apparatus and manufacturing method
JP5167999B2 (en) * 2008-07-16 2013-03-21 株式会社Ihi Substrate transfer system and substrate transfer method
KR101296659B1 (en) 2008-11-14 2013-08-14 엘지디스플레이 주식회사 Washing device
CN102216815B (en) * 2009-01-16 2014-02-05 凸版印刷株式会社 Color filter production line, line control system, and line control method
KR101691879B1 (en) * 2010-09-01 2017-01-02 엘지디스플레이 주식회사 Substrate supporting apparatus
JP5635378B2 (en) * 2010-11-30 2014-12-03 日東電工株式会社 Semiconductor wafer transfer method and semiconductor wafer transfer apparatus
NL2007114C2 (en) * 2011-07-14 2013-01-15 Levitech B V Floating substrate monitoring and control device, and method for the same.
CN102530536B (en) * 2011-11-21 2013-12-18 杭州长川科技有限公司 Collector for integrated circuit (IC)
JP5941155B2 (en) * 2012-10-04 2016-06-29 平田機工株式会社 Transport system and control method
KR101284665B1 (en) * 2012-12-11 2013-07-10 주식회사 쓰리디플러스 Carrying apparatus for substrate
JP3183651U (en) * 2013-03-13 2013-05-30 揚博科技股▲ふん▼有限公司 Full flat circuit board processing and transportation equipment
KR102147687B1 (en) * 2013-08-13 2020-08-27 세메스 주식회사 Substrate treating apparatus and transporting method
CN110937793B (en) * 2019-12-25 2022-08-02 中国建材国际工程集团有限公司 Glass dynamic grouping control system and method for float glass production line

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0617168B2 (en) * 1981-05-08 1994-03-09 エ−・ツェ−・ハ−・ウイル・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング Sheet layer transport device
JPS599168A (en) * 1982-07-09 1984-01-18 Ulvac Corp Control device for continuous vacuum treatment device
CA1261368A (en) * 1985-10-28 1989-09-26 Donald C. Crawford Computer controlled non-contact feeder
JP3330441B2 (en) * 1993-12-24 2002-09-30 川崎製鉄株式会社 Steel sheet transfer control method
JPH09124147A (en) * 1995-10-31 1997-05-13 Dainippon Screen Mfg Co Ltd Substrate conveying device
JP3711189B2 (en) * 1997-05-23 2005-10-26 大日本スクリーン製造株式会社 Substrate transfer device
TW385488B (en) * 1997-08-15 2000-03-21 Tokyo Electron Ltd substrate processing device
JP3988805B2 (en) * 1997-10-02 2007-10-10 大日本スクリーン製造株式会社 Substrate transfer method and apparatus
JP3300697B2 (en) * 2000-02-15 2002-07-08 南機械株式会社 Veneer feeding device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI415210B (en) * 2008-06-12 2013-11-11 Semes Co Ltd Substrate transfer apparatus and method, and a substrate manufacturing apparatus having the same

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