JP2009083170A - Production device for photosensitive stacked body, and production method therefor - Google Patents

Production device for photosensitive stacked body, and production method therefor Download PDF

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JP2009083170A
JP2009083170A JP2007252930A JP2007252930A JP2009083170A JP 2009083170 A JP2009083170 A JP 2009083170A JP 2007252930 A JP2007252930 A JP 2007252930A JP 2007252930 A JP2007252930 A JP 2007252930A JP 2009083170 A JP2009083170 A JP 2009083170A
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substrate
heating
photosensitive
heating temperature
temperature
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JP4987656B2 (en
JP2009083170A5 (en
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Keisuke Endo
惠介 遠藤
Naoko Saito
直子 齋藤
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Fujifilm Corp
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Priority to KR1020080074141A priority patent/KR20090032952A/en
Priority to TW097136248A priority patent/TW200922786A/en
Priority to CN2008101689302A priority patent/CN101396898B/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Materials For Photolithography (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a production device for a photosensitive stacked body and a production method therefor, wherein a substrate can be uniformly heated to a desired temperature in a short time without enlarging the device, and further, a photosensitive stacked body of high quality can be produced. <P>SOLUTION: A glass substrate 24 is uniformly and swiftly heated to a first heating temperature by hot plates 110a, 110b composing a first heating mechanism 104, is thereafter fed to second heating mechanisms 106a, 106b by a substrate feeding mechanism 108, is heated and held at a second heating temperature lower than the second heating temperature by infrared heaters 136a to 136d while being carried by carrying parts 134a, 134b, and is subsequently fed to a space between rubber rollers 80a and 80b composing a pasting mechanism 46 together with a long photosensitive web 22, and the photosensitive resin layer 28 is press-fitted to the glass substrate 24, so as to produce a photosensitive stacked body 24b. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、支持体上に感光材料層を形成してなる長尺状感光性ウエブを、加熱された一対の圧着ローラ間に基板とともに送り出し、前記感光材料層を前記基板に貼り付けることで感光性積層体を製造する感光性積層体の製造装置及び製造方法に関する。   In the present invention, a long photosensitive web formed by forming a photosensitive material layer on a support is sent out together with a substrate between a pair of heated pressure rollers, and the photosensitive material layer is attached to the substrate for photosensitivity. The present invention relates to a manufacturing apparatus and a manufacturing method for a photosensitive laminate for producing a conductive laminate.

例えば、液晶パネル用基板、プリント配線用基板、ＰＤＰ用基板は、感光性樹脂層（感光材料層）を有する感光性シート体（感光性ウエブ）を基板表面に貼り付けて構成される。感光性シート体は、例えば、可撓性プラスチック支持体上に感光性樹脂層と保護フイルムとが順に積層されている。   For example, a liquid crystal panel substrate, a printed wiring substrate, and a PDP substrate are configured by attaching a photosensitive sheet body (photosensitive web) having a photosensitive resin layer (photosensitive material layer) to the substrate surface. In the photosensitive sheet body, for example, a photosensitive resin layer and a protective film are sequentially laminated on a flexible plastic support.

図８は、感光性シート体の貼り付けに使用される製造装置１の概略構成を示す（特許文献１参照）。製造装置１では、感光性ウエブロール２から引き出されて保護フイルムが剥離された感光性ウエブ３が圧着ローラ４ａ、４ｂ間に供給されるとともに、遠赤外線ヒータ５等を備えた基板加熱部６によって所定温度に加熱された基板７が圧着ローラ４ａ、４ｂ間に供給される。圧着ローラ４ａ、４ｂによって加熱圧着された感光性ウエブ３及び基板７は、冷却部８で冷却され、カッタ９により基板７間の感光性ウエブ３が切断分離された後、フイルムチャック１０によって支持体が感光材料層から剥離されることで、感光性積層体が製造される。   FIG. 8 shows a schematic configuration of the manufacturing apparatus 1 used for attaching the photosensitive sheet body (see Patent Document 1). In the manufacturing apparatus 1, the photosensitive web 3 pulled out from the photosensitive web roll 2 and from which the protective film is peeled off is supplied between the pressure rollers 4a and 4b, and the substrate heating unit 6 provided with a far infrared heater 5 and the like. The substrate 7 heated to a predetermined temperature is supplied between the pressure rollers 4a and 4b. The photosensitive web 3 and the substrate 7 that are heat-pressed by the pressure-bonding rollers 4a and 4b are cooled by the cooling unit 8, and the photosensitive web 3 between the substrates 7 is cut and separated by the cutter 9, and then the support is supported by the film chuck 10. Is peeled from the photosensitive material layer to produce a photosensitive laminate.

特開平８−１８３１４６号公報JP-A-8-183146

ところで、以上のようにして製造される感光性積層体は、基板加熱部６において基板７が適切な加熱温度に調整されていないと、感光材料層と基板７との間に気泡が混入したり、感光材料層に皺が発生してしまうことがある。   By the way, in the photosensitive laminate manufactured as described above, if the substrate 7 is not adjusted to an appropriate heating temperature in the substrate heating unit 6, bubbles may be mixed between the photosensitive material layer and the substrate 7. In addition, wrinkles may occur in the photosensitive material layer.

図９及び図１０は、基板加熱部６によって加熱される基板７の温度の測定点Ａ１〜Ａ４、Ｘ１〜Ｘ３と、各測定点Ａ１〜Ａ４、Ｘ１〜Ｘ３で測定した温度の時間的変化とを示す。基板７の周縁部側の測定点Ａ１〜Ａ４では、遠赤外線ヒータ５から基板７に供給される熱量が測定点Ｘ１〜Ｘ３に供給される熱量よりも少ないため、基板７上を測定点Ｘ１〜Ｘ３側から測定点Ａ１〜Ａ４側に熱が伝達することを考慮して遠赤外線ヒータ５の発熱量を設定すると、図１０に示すように、測定点Ａ１〜Ａ４では、目標温度に徐々に近づく温度特性となるのに対して、測定点Ｘ１〜Ｘ３では、一旦目標温度を大きく超えた後、目標温度に徐々に近づく温度特性となる。   FIGS. 9 and 10 show measurement points A1 to A4 and X1 to X3 of the temperature of the substrate 7 heated by the substrate heating unit 6, and temporal changes in temperatures measured at the measurement points A1 to A4 and X1 to X3. Indicates. At the measurement points A1 to A4 on the peripheral edge side of the substrate 7, the amount of heat supplied from the far infrared heater 5 to the substrate 7 is less than the amount of heat supplied to the measurement points X1 to X3. When the amount of heat generated by the far infrared heater 5 is set in consideration of heat transfer from the X3 side to the measurement points A1 to A4, as shown in FIG. 10, the measurement points A1 to A4 gradually approach the target temperature. In contrast to the temperature characteristics, at the measurement points X1 to X3, after the target temperature is greatly exceeded, the temperature characteristics gradually approach the target temperature.

この場合、基板７の周縁部側における測定点Ａ１〜Ａ４の温度と、中央部側における測定点Ｘ１〜Ｘ３の温度との温度差ΔＴｉｒが許容範囲内となるように小さくし、基板７の全面を略均一な温度分布からなる目標温度に近づけるためには、基板７の加熱時間を十分に長く設定する必要がある。   In this case, the temperature difference ΔTir between the temperature of the measurement points A1 to A4 on the peripheral edge side of the substrate 7 and the temperature of the measurement points X1 to X3 on the central side is reduced so as to be within an allowable range, In order to approach the target temperature having a substantially uniform temperature distribution, it is necessary to set the heating time of the substrate 7 sufficiently long.

しかしながら、加熱時間を十分に確保しようとすると、感光性積層体の製造に要する時間が長くなってしまい、生産性の低下を惹起してしまう。一方、基板７の搬送方向に対して基板加熱部６を長尺に構成すれば、加熱時間を確保することが可能となるが、この場合、装置が大型になってしまい、設備コストが上昇する不具合が生じてしまう。   However, if sufficient heating time is to be ensured, the time required for producing the photosensitive laminate is lengthened, leading to a decrease in productivity. On the other hand, if the substrate heating unit 6 is configured to be long with respect to the transport direction of the substrate 7, the heating time can be secured, but in this case, the apparatus becomes large and the equipment cost increases. A malfunction will occur.

本発明は、このような不具合に鑑みてなされたものであり、装置を大型化することなく、基板を短時間で所望の温度まで均一に加熱できるとともに、高品質な感光性積層体を製造することができる感光性積層体の製造装置及び製造方法を提供することを目的とする。   The present invention has been made in view of such problems, and can uniformly heat a substrate to a desired temperature in a short time without increasing the size of the apparatus, and manufactures a high-quality photosensitive laminate. An object of the present invention is to provide a manufacturing apparatus and a manufacturing method for a photosensitive laminate.

本発明は、支持体上に感光材料層を形成してなる長尺状感光性ウエブを、加熱された一対の圧着ローラ間に基板とともに送り出し、前記感光材料層を前記基板に貼り付けることで感光性積層体を製造する感光性積層体の製造装置において、
前記一対の圧着ローラの前段に配設され、前記基板を所定の加熱温度に調整して前記圧着ローラ間に供給する基板加熱部を備え、
前記基板加熱部は、
第１加熱手段を前記基板の全面に接触させ、前記基板を第１加熱温度まで加熱する第１加熱機構と、
前記第１加熱温度まで加熱された前記基板を、第２加熱手段により非接触状態で第２加熱温度に加熱保持し、搬送手段により前記圧着ローラ間に搬送する第２加熱機構と、
前記第１加熱機構から前記第２加熱機構に前記基板を供給する基板供給機構と、
を備えることを特徴とする。 In the present invention, a long photosensitive web formed by forming a photosensitive material layer on a support is sent out together with a substrate between a pair of heated pressure rollers, and the photosensitive material layer is attached to the substrate for photosensitivity. In the manufacturing apparatus of the photosensitive laminated body which manufactures a conductive laminated body,
A substrate heating unit that is disposed in front of the pair of pressure-bonding rollers, adjusts the substrate to a predetermined heating temperature, and supplies the substrate between the pressure-bonding rollers;
The substrate heating unit is
A first heating mechanism for bringing the first heating means into contact with the entire surface of the substrate and heating the substrate to a first heating temperature;
A second heating mechanism in which the substrate heated to the first heating temperature is heated and held at a second heating temperature in a non-contact state by a second heating unit, and conveyed between the pressing rollers by a conveying unit;
A substrate supply mechanism for supplying the substrate from the first heating mechanism to the second heating mechanism;
It is characterized by providing.

また、本発明は、支持体上に感光材料層を形成してなる長尺状感光性ウエブを、加熱された一対の圧着ローラ間に基板とともに送り出し、前記感光材料層を前記基板に貼り付けることで感光性積層体を製造する感光性積層体の製造方法において、
第１加熱手段を前記基板の全面に接触させ、前記基板を第１加熱温度まで加熱するステップと、
前記第１加熱温度まで加熱された前記基板を、第２加熱手段により非接触状態で第２加熱温度に加熱保持するステップと、
前記第２加熱温度に加熱保持された前記基板を前記圧着ローラ間に搬送するステップと、
を有することを特徴とする。 According to the present invention, a long photosensitive web formed by forming a photosensitive material layer on a support is fed together with a substrate between a pair of heated pressure rollers, and the photosensitive material layer is attached to the substrate. In the method for producing a photosensitive laminate in which a photosensitive laminate is produced with
Bringing the first heating means into contact with the entire surface of the substrate and heating the substrate to a first heating temperature;
Heating and holding the substrate heated to the first heating temperature at a second heating temperature in a non-contact state by a second heating means;
Transporting the substrate heated and held at the second heating temperature between the pressure rollers;
It is characterized by having.

本発明では、第１加熱手段を基板の全面に接触させることにより、基板を迅速に均一な温度まで加熱することができる。次いで、第２加熱手段により非接触状態で基板を加熱保持して圧着ローラ間に搬送することにより、所望の加熱状態にある基板に対して感光材料層を貼り付け、高品質な感光性積層体を製造することができる。この場合、第１加熱手段により基板の温度を迅速に加熱することができるため、第２加熱手段を構成する第２加熱機構を大型に構成する必要がなく、設備コストを低減させることができるとともに、感光性積層体の生産性を向上させることができる。   In the present invention, the substrate can be quickly heated to a uniform temperature by bringing the first heating means into contact with the entire surface of the substrate. Next, the substrate is heated and held in a non-contact state by the second heating means and conveyed between the pressure rollers, whereby a photosensitive material layer is attached to the substrate in a desired heating state, and a high-quality photosensitive laminate Can be manufactured. In this case, since the temperature of the substrate can be quickly heated by the first heating means, it is not necessary to configure the second heating mechanism constituting the second heating means in a large size, and the equipment cost can be reduced. The productivity of the photosensitive laminate can be improved.

図１は、本実施形態に係る感光性積層体の製造装置２０の概略構成図であり、この製造装置２０は、液晶又は有機ＥＬ用カラーフィルタ等の製作工程で、所定の幅寸法からなる長尺状感光性ウエブ２２の感光性樹脂層２８（後述する）をガラス基板２４に熱転写（ラミネート）する作業を行う。   FIG. 1 is a schematic configuration diagram of a photosensitive laminate manufacturing apparatus 20 according to the present embodiment. This manufacturing apparatus 20 is a length having a predetermined width dimension in a manufacturing process of a liquid crystal or an organic EL color filter or the like. An operation of thermally transferring (laminating) a photosensitive resin layer 28 (described later) of the long photosensitive web 22 to the glass substrate 24 is performed.

図２は、製造装置２０に使用される長尺状感光性ウエブ２２の断面図である。この長尺状感光性ウエブ２２は、可撓性ベースフイルム（支持体）２６と、感光性樹脂層（感光材料層）２８と、保護フイルム３０とを積層して構成される。   FIG. 2 is a cross-sectional view of the long photosensitive web 22 used in the manufacturing apparatus 20. The long photosensitive web 22 is formed by laminating a flexible base film (support) 26, a photosensitive resin layer (photosensitive material layer) 28, and a protective film 30.

図１に示すように、製造装置２０は、長尺状感光性ウエブ２２をロール状に巻回した感光性ウエブロール２３を収容し、感光性ウエブロール２３から前記長尺状感光性ウエブ２２を送り出し可能なウエブ送り出し機構３２と、送り出された長尺状感光性ウエブ２２の保護フイルム３０及び感光性樹脂層２８の幅方向に切断可能な２個所の境界部分であるハーフカット部位（加工部位）３４ａ、３４ｂ（図２参照）を形成する加工機構３６と、一部に非接着部３８ａを有する接着ラベル３８（図３参照）を保護フイルム３０に接着させるラベル接着機構４０とを備える。   As shown in FIG. 1, the manufacturing apparatus 20 accommodates a photosensitive web roll 23 in which a long photosensitive web 22 is wound into a roll, and the long photosensitive web 22 is removed from the photosensitive web roll 23. A web feed mechanism 32 that can be fed out, a protective film 30 of the long photosensitive web 22 that has been fed out, and a half cut site (processed site) that is a boundary between two portions that can be cut in the width direction of the photosensitive resin layer 28. A processing mechanism 36 for forming 34a and 34b (see FIG. 2) and a label adhesion mechanism 40 for adhering an adhesive label 38 (see FIG. 3) partially having a non-adhesive portion 38a to the protective film 30 are provided.

ラベル接着機構４０の下流には、長尺状感光性ウエブ２２をタクト送りから連続送りに変更するためのリザーバ機構４２と、長尺状感光性ウエブ２２から保護フイルム３０を所定の長さ間隔で剥離させる剥離機構４４と、ガラス基板２４を所定の温度に加熱する第１加熱機構１０４と、第１加熱機構１０４で加熱されたガラス基板２４を、加熱保持した状態で貼り付け位置に供給する第２加熱機構１０６ａ、１０６ｂと、ガラス基板２４を第１加熱機構１０４から第２加熱機構１０６ａに供給する基板供給機構１０８と、前記保護フイルム３０の剥離により露出した感光性樹脂層２８を前記ガラス基板２４に一体的に貼り付ける貼り付け機構４６とが配設される。なお、第１加熱機構１０４及び第２加熱機構１０６ａ、１０６ｂは、基板加熱部を構成する。   Downstream of the label adhering mechanism 40, a reservoir mechanism 42 for changing the long photosensitive web 22 from tact feed to continuous feed, and a protective film 30 from the long photosensitive web 22 at predetermined length intervals. A peeling mechanism 44 that peels off, a first heating mechanism 104 that heats the glass substrate 24 to a predetermined temperature, and a glass substrate 24 that is heated by the first heating mechanism 104 is supplied to the attachment position in a heated state. 2 heating mechanisms 106a and 106b, a substrate supply mechanism 108 for supplying the glass substrate 24 from the first heating mechanism 104 to the second heating mechanism 106a, and the photosensitive resin layer 28 exposed by peeling of the protective film 30 as the glass substrate. An affixing mechanism 46 for affixing to 24 is integrally provided. The first heating mechanism 104 and the second heating mechanisms 106a and 106b constitute a substrate heating unit.

貼り付け機構４６における貼り付け位置の上流近傍には、ハーフカット部位３４ａ、３４ｂを含む長尺状感光性ウエブ２２の画像を撮影する撮影部４７が配設される。製造装置２０は、撮影部４７によって撮影されたハーフカット部位３４ａ、３４ｂの画像に基づき、貼り付け機構４６に対するハーフカット部位３４ａ、３４ｂの位置ずれ量を算出し、長尺状感光性ウエブ２２の送り量の補正を行う。   In the vicinity of the upstream of the attaching position in the attaching mechanism 46, an imaging unit 47 for taking an image of the long photosensitive web 22 including the half cut portions 34a and 34b is disposed. The manufacturing apparatus 20 calculates the amount of positional deviation of the half-cut portions 34a and 34b with respect to the pasting mechanism 46 based on the images of the half-cut portions 34a and 34b photographed by the photographing unit 47, and the long photosensitive web 22 Correct the feed amount.

ウエブ送り出し機構３２の下流近傍には、略使用済みの長尺状感光性ウエブ２２の後端と、新たに使用される長尺状感光性ウエブ２２の先端とを貼り付ける貼り付け台４９が配設される。貼り付け台４９の下流には、感光性ウエブロール２３の巻きずれによる幅方向のずれを制御するために、フイルム端末位置検出器５１が配設される。ここで、フイルム端末位置調整は、ウエブ送り出し機構３２を幅方向に移動させて行うが、ローラを組み合わせた位置調整機構を付設して行ってもよい。   In the vicinity of the downstream side of the web delivery mechanism 32, an affixing table 49 is provided to attach the rear end of the substantially used long photosensitive web 22 and the front end of the newly used long photosensitive web 22. Established. A film terminal position detector 51 is disposed downstream of the attachment table 49 in order to control the shift in the width direction due to the winding shift of the photosensitive web roll 23. Here, the film terminal position adjustment is performed by moving the web feed mechanism 32 in the width direction, but may be performed by attaching a position adjustment mechanism combined with a roller.

加工機構３６は、ウエブ送り出し機構３２に収容巻回されている感光性ウエブロール２３のロール径を算出するためのローラ対５０の下流に配置される。加工機構３６は、距離Ｍ（図２）だけ離間した一対の丸刃５２ａ、５２ｂを備える。丸刃５２ａ、５２ｂは、長尺状感光性ウエブ２２の幅方向に走行して、保護フイルム３０の残存部分３０ｂを挟んだ所定の２個所の位置にハーフカット部位３４ａ、３４ｂを形成する。なお、残存部分３０ｂの前後の保護フイルム３０は、保護フイルム３０が剥離される剥離部分３０ａである。   The processing mechanism 36 is disposed downstream of the roller pair 50 for calculating the roll diameter of the photosensitive web roll 23 accommodated and wound in the web feed mechanism 32. The processing mechanism 36 includes a pair of round blades 52a and 52b separated by a distance M (FIG. 2). The round blades 52 a and 52 b travel in the width direction of the long photosensitive web 22 to form half-cut portions 34 a and 34 b at two predetermined positions sandwiching the remaining portion 30 b of the protective film 30. The protective film 30 before and after the remaining portion 30b is a peeling portion 30a from which the protective film 30 is peeled off.

図２に示すように、ハーフカット部位３４ａ、３４ｂは、少なくとも保護フイルム３０及び感光性樹脂層２８を切断する必要があり、実際上、可撓性ベースフイルム２６まで切り込むように丸刃５２ａ、５２ｂの切り込み深さが設定される。丸刃５２ａ、５２ｂは、回転することなく固定された状態で、長尺状感光性ウエブ２２の幅方向に移動してハーフカット部位３４ａ、３４ｂを形成する方式や、前記長尺状感光性ウエブ２２上を滑ることなく回転しながら前記幅方向に移動して前記ハーフカット部位３４ａ、３４ｂを形成する方式が採用される。このハーフカット部位３４ａ、３４ｂは、丸刃５２ａ、５２ｂに代替して、例えば、レーザ光や超音波を用いたカット方式の他、ナイフ刃、押し切り刃（トムソン刃）等で形成する方式を採用してもよい。   As shown in FIG. 2, the half-cut portions 34a and 34b are required to cut at least the protective film 30 and the photosensitive resin layer 28. In practice, the round blades 52a and 52b are cut so as to cut to the flexible base film 26. The depth of cut is set. The round blades 52a and 52b are fixed without rotating, and move in the width direction of the long photosensitive web 22 to form the half-cut portions 34a and 34b, or the long photosensitive web. A method of moving in the width direction while rotating without sliding on 22 to form the half-cut portions 34a and 34b is adopted. In place of the round blades 52a and 52b, for example, the half-cut portions 34a and 34b employ a method of forming with a knife blade, a push cutting blade (Thomson blade) or the like in addition to a cutting method using laser light or ultrasonic waves. May be.

ハーフカット部位３４ａ、３４ｂは、感光性樹脂層２８をガラス基板２４に貼り付けた際、例えば、前記ガラス基板２４の両端部からそれぞれ１０ｍｍずつ内側に入り込んだ位置となるように設定される。なお、ガラス基板２４間の保護フイルム３０の残存部分３０ｂは、後述する貼り付け機構４６において感光性樹脂層２８を前記ガラス基板２４に額縁状に貼り付ける際のマスクとして機能するものである。   When the photosensitive resin layer 28 is attached to the glass substrate 24, the half-cut portions 34a and 34b are set, for example, so as to be in a position that enters into the inside by 10 mm from both ends of the glass substrate 24, respectively. The remaining portion 30b of the protective film 30 between the glass substrates 24 functions as a mask when the photosensitive resin layer 28 is attached to the glass substrate 24 in a frame shape in an attaching mechanism 46 described later.

ラベル接着機構４０は、ガラス基板２４間に対応して保護フイルム３０の残存部分３０ｂを残すため、ハーフカット部位３４ｂ側の剥離部分３０ａとハーフカット部位３４ａ側の剥離部分３０ａとを連結する接着ラベル３８を供給する。   Since the label adhesion mechanism 40 leaves the remaining part 30b of the protective film 30 correspondingly between the glass substrates 24, an adhesive label that connects the peeling part 30a on the half-cut part 34b side and the peeling part 30a on the half-cut part 34a side. 38 is supplied.

図３に示すように、接着ラベル３８は、短冊状に構成されており、例えば、保護フイルム３０と同一の樹脂材で形成される。接着ラベル３８は、中央部に粘着剤が塗布されない非接着部（微粘着を含む）３８ａを有するとともに、この非接着部３８ａの両側、すなわち、前記接着ラベル３８の長手方向両端部に、前方の剥離部分３０ａに接着される第１接着部３８ｂと、後方の剥離部分３０ａに接着される第２接着部３８ｃとを有する。   As shown in FIG. 3, the adhesive label 38 is formed in a strip shape, and is formed of, for example, the same resin material as the protective film 30. The adhesive label 38 has a non-adhesive portion (including a slight adhesion) 38a to which a pressure-sensitive adhesive is not applied at the center, and the front side of the non-adhesive portion 38a, that is, both ends in the longitudinal direction of the adhesive label 38 It has the 1st adhesion part 38b adhered to exfoliation part 30a, and the 2nd adhesion part 38c adhering to back exfoliation part 30a.

図１に示すように、ラベル接着機構４０は、最大７枚の接着ラベル３８を所定間隔ずつ離間して貼り付け可能な吸着パッド５４ａ〜５４ｇを備えるとともに、前記吸着パッド５４ａ〜５４ｇによる前記接着ラベル３８の貼り付け位置には、長尺状感光性ウエブ２２を下方から保持するための受け台５６が昇降自在に配置される。   As shown in FIG. 1, the label bonding mechanism 40 includes suction pads 54 a to 54 g to which a maximum of seven adhesive labels 38 can be pasted at predetermined intervals, and the adhesive labels by the suction pads 54 a to 54 g. A pedestal 56 for holding the elongate photosensitive web 22 from below is disposed at the attachment position 38 so as to be movable up and down.

リザーバ機構４２は、上流側の長尺状感光性ウエブ２２のタクト搬送と、下流側の前記長尺状感光性ウエブ２２の連続搬送との速度差を吸収するために、矢印方向に揺動自在なダンサーローラ６０を備える。   The reservoir mechanism 42 is swingable in the direction of the arrow in order to absorb the speed difference between the tact conveyance of the long photosensitive web 22 on the upstream side and the continuous conveyance of the long photosensitive web 22 on the downstream side. The dancer roller 60 is provided.

リザーバ機構４２の下流に配置される剥離機構４４は、長尺状感光性ウエブ２２の送り出し側のテンション変動を遮断し、ラミネート時のテンションを安定化させるためのサクションドラム６２を備える。サクションドラム６２の近傍には、剥離ローラ６３が配置されるとともに、この剥離ローラ６３を介して長尺状感光性ウエブ２２から鋭角の剥離角で剥離される保護フイルム３０は、残存部分３０ｂを除いて保護フイルム巻き取り部６４に巻き取られる。   The peeling mechanism 44 disposed downstream of the reservoir mechanism 42 includes a suction drum 62 that blocks tension fluctuation on the delivery side of the long photosensitive web 22 and stabilizes the tension during lamination. A peeling roller 63 is disposed in the vicinity of the suction drum 62, and the protective film 30 that is peeled off from the long photosensitive web 22 at an acute peeling angle via the peeling roller 63, except for the remaining portion 30b. Then, the film is wound around the protective film winding section 64.

剥離機構４４の下流側には、長尺状感光性ウエブ２２にテンションを付与可能なテンション制御機構６６が配設される。テンション制御機構６６は、シリンダ６８の駆動作用下にテンションダンサー７０が揺動変位することにより、長尺状感光性ウエブ２２のテンションが調整可能である。なお、テンション制御機構６６は、必要に応じて使用すればよく、削除することもできる。   A tension control mechanism 66 that can apply tension to the long photosensitive web 22 is disposed on the downstream side of the peeling mechanism 44. The tension control mechanism 66 can adjust the tension of the long photosensitive web 22 when the tension dancer 70 swings and displaces under the driving action of the cylinder 68. The tension control mechanism 66 may be used as necessary and can be deleted.

第１加熱機構１０４は、上下２段で構成されるホットプレート１１０ａ、１１０ｂを備える。図４に示すように、ホットプレート１１０ａ、１１０ｂは、ホットプレート駆動源１１２から供給される電力によって所定温度（第１加熱温度）に均一加熱される基板載置面１１４を有する。基板載置面１１４には、基板ガイド１１６ａ〜１１６ｄによって位置決めされた状態でガラス基板２４が載置される。また、基板載置面１１４には、ガラス基板２４を基板載置面１１４に吸着し、また、吸着を解除するための複数の孔部１１８が形成される。孔部１１８には、管路１２０を介してエア供給源１２８及び真空ポンプ１３０が接続される。管路１２０とエア供給源１２８との間、及び、管路１２０と真空ポンプ１３０との間には、エア供給源１２８及び真空ポンプ１３０の接続状態を切り替えるためのバルブ１３２ａ、１３２ｂが連結される。   The first heating mechanism 104 includes hot plates 110a and 110b configured in two upper and lower stages. As shown in FIG. 4, the hot plates 110 a and 110 b have a substrate mounting surface 114 that is uniformly heated to a predetermined temperature (first heating temperature) by electric power supplied from the hot plate drive source 112. The glass substrate 24 is placed on the substrate placement surface 114 while being positioned by the substrate guides 116a to 116d. The substrate mounting surface 114 is formed with a plurality of holes 118 for adsorbing the glass substrate 24 to the substrate mounting surface 114 and releasing the adsorption. An air supply source 128 and a vacuum pump 130 are connected to the hole 118 via a pipe line 120. Valves 132 a and 132 b for switching the connection state of the air supply source 128 and the vacuum pump 130 are connected between the pipe line 120 and the air supply source 128 and between the pipe line 120 and the vacuum pump 130. .

基板供給機構１０８は、第１加熱機構１０４のホットプレート１１０ａ、１１０ｂに載置されているガラス基板２４を保持し、図１の矢印θ方向に旋回して、ガラス基板２４を第２加熱機構１０６ａに供給するハンドリングロボットにより構成される。   The substrate supply mechanism 108 holds the glass substrate 24 placed on the hot plates 110a and 110b of the first heating mechanism 104, rotates in the direction of the arrow θ in FIG. 1, and moves the glass substrate 24 to the second heating mechanism 106a. It consists of a handling robot that supplies to

第２加熱機構１０６ａ、１０６ｂは、ガラス基板２４を搬送して貼り付け機構４６のゴムローラ８０ａ、８０ｂ間に供給する搬送部１３４ａ、１３４ｂと、搬送部１３４ａ、１３４ｂの上下の配設され、ガラス基板２４を非接触状態で加熱する赤外線ヒータ１３６ａ〜１３６ｄとを備える。なお、赤外線ヒータ１３６ａ〜１３６ｄに代えて、遠赤外線ヒータ、ニクロム線ヒータ、熱風ヒータ等を用いてもよい。   The second heating mechanisms 106a and 106b are arranged above and below the conveyance units 134a and 134b that convey the glass substrate 24 and supply it between the rubber rollers 80a and 80b of the pasting mechanism 46, and the conveyance units 134a and 134b. Infrared heaters 136a to 136d for heating 24 in a non-contact state. In place of the infrared heaters 136a to 136d, a far infrared heater, a nichrome wire heater, a hot air heater, or the like may be used.

貼り付け機構４６は、上下に配設されるとともに、所定温度に加熱されるゴムローラ（圧着ローラ）８０ａ、８０ｂを備える。ゴムローラ８０ａ、８０ｂには、バックアップローラ８２ａ、８２ｂが摺接する。一方のバックアップローラ８２ｂは、ローラクランプ部８３を構成する加圧シリンダ８４によりゴムローラ８０ｂ側に押圧される。   The affixing mechanism 46 includes rubber rollers (compression rollers) 80a and 80b that are arranged vertically and heated to a predetermined temperature. Backup rollers 82a and 82b are in sliding contact with the rubber rollers 80a and 80b. One backup roller 82 b is pressed toward the rubber roller 80 b by a pressure cylinder 84 that constitutes a roller clamp portion 83.

ガラス基板２４は、貼り付け機構４６から矢印Ｙ方向に延在する搬送路を構成する複数の基板搬送ローラ９０ａ〜９０ｄによって搬送される。基板搬送ローラ９０ｂ、９０ｃ間には、ガラス基板２４間の長尺状感光性ウエブ２２を切断することで、ガラス基板２４に感光材料層が貼り付けられた感光性積層体２４ａを分離するカッタ機構４８が配設される。   The glass substrate 24 is transported by a plurality of substrate transport rollers 90a to 90d constituting a transport path extending in the arrow Y direction from the attaching mechanism 46. A cutter mechanism for separating the photosensitive laminate 24a in which the photosensitive material layer is bonded to the glass substrate 24 by cutting the long photosensitive web 22 between the glass substrates 24 between the substrate transport rollers 90b and 90c. 48 is arranged.

基板搬送ローラ９０ｄの下流側には、複数の感光性積層体２４ａを積層した状態でストックするストッカ９４が配置されており、このストッカ９４には、カッタ機構４８により分離された感光性積層体２４ａがロボット９６によって移載される。ストッカ９４に隣接して、感光性積層体２４ａに残存する可撓性ベースフイルム２６を保護フイルム３０の残存部分３０ｂとともに剥離する剥離部９８が配置される。剥離部９８は、ガラス基板２４を吸着保持する吸着盤１０２と、吸着盤１０２によって保持されたガラス基板２４に貼り付けられている感光性樹脂層２８から可撓性ベースフイルム２６を剥離するクランパ１００とを有する。クランパ１００によって可撓性ベースフイルム２６が剥離された感光性積層体２４ｂは、次工程、例えば、露光工程に供給される。   On the downstream side of the substrate transport roller 90d, a stocker 94 for stocking a plurality of photosensitive laminates 24a in a stacked state is disposed. In this stocker 94, the photosensitive laminate 24a separated by the cutter mechanism 48 is disposed. Is transferred by the robot 96. Adjacent to the stocker 94, a peeling portion 98 for peeling the flexible base film 26 remaining in the photosensitive laminate 24a together with the remaining portion 30b of the protective film 30 is disposed. The peeling unit 98 peels the flexible base film 26 from the suction plate 102 that holds the glass substrate 24 by suction and the photosensitive resin layer 28 that is attached to the glass substrate 24 held by the suction plate 102. And have. The photosensitive laminate 24b from which the flexible base film 26 has been peeled off by the clamper 100 is supplied to the next process, for example, the exposure process.

なお、以上のように構成される製造装置２０では、ウエブ送り出し機構３２、加工機構３６、ラベル接着機構４０、リザーバ機構４２、剥離機構４４、テンション制御機構６６並びに撮影部４７が、貼り付け機構４６の上方に配置されているが、これとは逆に、前記ウエブ送り出し機構３２から前記撮影部４７までを前記貼り付け機構４６の下方に配置し、長尺状感光性ウエブ２２の上下が逆になって感光性樹脂層２８をガラス基板２４の下側に貼り付ける構成であってもよく、また、長尺状感光性ウエブ２２の搬送路を直線状に構成してもよい。   In the manufacturing apparatus 20 configured as described above, the web feed mechanism 32, the processing mechanism 36, the label adhesion mechanism 40, the reservoir mechanism 42, the peeling mechanism 44, the tension control mechanism 66, and the photographing unit 47 are included in the pasting mechanism 46. However, on the contrary, the web feeding mechanism 32 to the photographing unit 47 are arranged below the pasting mechanism 46, and the long photosensitive web 22 is turned upside down. Thus, the photosensitive resin layer 28 may be attached to the lower side of the glass substrate 24, or the conveying path of the long photosensitive web 22 may be configured linearly.

製造装置２０内は、仕切り壁１２２を介して第１クリーンルーム１２４ａと第２クリーンルーム１２４ｂとに仕切られる。第１クリーンルーム１２４ａには、ウエブ送り出し機構３２からテンション制御機構６６までが収容され、第２クリーンルーム１２４ｂには、撮影部４７以降の機構が収容される。第１クリーンルーム１２４ａと第２クリーンルーム１２４ｂとは、貫通部１２６を介して連通する。   The inside of the manufacturing apparatus 20 is partitioned into a first clean room 124a and a second clean room 124b through a partition wall 122. The first clean room 124a accommodates the web feed mechanism 32 to the tension control mechanism 66, and the second clean room 124b accommodates the mechanism after the photographing unit 47. The first clean room 124a and the second clean room 124b communicate with each other through the penetration part 126.

次に、以上のように構成される製造装置２０の動作について、本発明に係る製造方法との関連で説明する。   Next, operation | movement of the manufacturing apparatus 20 comprised as mentioned above is demonstrated in relation to the manufacturing method which concerns on this invention.

先ず、ウエブ送り出し機構３２に取り付けられている感光性ウエブロール２３から長尺状感光性ウエブ２２が送り出される。長尺状感光性ウエブ２２は、加工機構３６に搬送される。   First, the long photosensitive web 22 is fed from the photosensitive web roll 23 attached to the web feed mechanism 32. The long photosensitive web 22 is conveyed to the processing mechanism 36.

加工機構３６では、丸刃５２ａ、５２ｂが長尺状感光性ウエブ２２の幅方向に移動して、前記長尺状感光性ウエブ２２を保護フイルム３０から感光性樹脂層２８乃至可撓性ベースフイルム２６まで切り込み、保護フイルム３０の残存部分３０ｂの幅Ｍだけ離間するハーフカット部位３４ａ、３４ｂを形成する（図２参照）。これにより、長尺状感光性ウエブ２２には、残存部分３０ｂを挟んで前方の剥離部分３０ａと後方の剥離部分３０ａとが設けられる（図２参照）。   In the processing mechanism 36, the round blades 52a and 52b move in the width direction of the long photosensitive web 22, and the long photosensitive web 22 is moved from the protective film 30 to the photosensitive resin layer 28 to the flexible base film. Cut to 26 to form half-cut portions 34a and 34b separated by a width M of the remaining portion 30b of the protective film 30 (see FIG. 2). As a result, the long photosensitive web 22 is provided with a front peeling portion 30a and a rear peeling portion 30a with the remaining portion 30b interposed therebetween (see FIG. 2).

なお、残存部分３０ｂの幅Ｍは、長尺状感光性ウエブ２２が延びないことを前提として、貼り付け機構４６のゴムローラ８０ａ、８０ｂ間に供給されるガラス基板２４間の距離を基準として設定される。また、幅Ｍで形成される一組のハーフカット部位３４ａ、３４ｂは、ガラス基板２４に貼り付けられる感光性樹脂層２８の基準長さの間隔で長尺状感光性ウエブ２２に形成される。   The width M of the remaining portion 30b is set based on the distance between the glass substrates 24 supplied between the rubber rollers 80a and 80b of the attaching mechanism 46 on the assumption that the long photosensitive web 22 does not extend. The A pair of half-cut portions 34 a and 34 b formed with a width M are formed on the long photosensitive web 22 at intervals of a reference length of the photosensitive resin layer 28 attached to the glass substrate 24.

次いで、長尺状感光性ウエブ２２は、ラベル接着機構４０に搬送されて、保護フイルム３０の所定の貼り付け部位が受け台５６上に配置される。ラベル接着機構４０では、所定枚数の接着ラベル３８が吸着パッド５４ｂ〜５４ｇにより吸着保持され、各接着ラベル３８が保護フイルム３０の残存部分３０ｂを跨いで、前方の剥離部分３０ａと後方の剥離部分３０ａとに一体的に接着される（図３参照）。   Next, the long photosensitive web 22 is conveyed to the label adhering mechanism 40, and a predetermined pasting portion of the protective film 30 is arranged on the cradle 56. In the label adhering mechanism 40, a predetermined number of adhesive labels 38 are adsorbed and held by the adsorbing pads 54b to 54g, and each adhering label 38 straddles the remaining portion 30b of the protective film 30, and the front peeling portion 30a and the rear peeling portion 30a. Are integrally bonded to each other (see FIG. 3).

例えば、７枚の接着ラベル３８が接着された長尺状感光性ウエブ２２は、図１に示すように、リザーバ機構４２を介して送り出し側のテンション変動を防いだ後、剥離機構４４に連続的に搬送される。剥離機構４４では、長尺状感光性ウエブ２２の可撓性ベースフイルム２６がサクションドラム６２に吸着保持されるとともに、保護フイルム３０が残存部分３０ｂを残して前記長尺状感光性ウエブ２２から剥離される。この保護フイルム３０は、剥離ローラ６３を介して剥離されて保護フイルム巻き取り部６４に巻き取られる（図１参照）。   For example, as shown in FIG. 1, the long photosensitive web 22 to which seven adhesive labels 38 are bonded is continuously connected to the peeling mechanism 44 after the tension on the delivery side is prevented via the reservoir mechanism 42. It is conveyed to. In the peeling mechanism 44, the flexible base film 26 of the long photosensitive web 22 is adsorbed and held by the suction drum 62, and the protective film 30 is peeled off from the long photosensitive web 22 leaving a remaining portion 30b. Is done. The protective film 30 is peeled off via the peeling roller 63 and wound around the protective film take-up portion 64 (see FIG. 1).

剥離機構４４の作用下に、保護フイルム３０が残存部分３０ｂを残して可撓性ベースフイルム２６から剥離された後、長尺状感光性ウエブ２２は、テンション制御機構６６によってテンション調整が行われ、次いで、撮影部４７において、所定の撮影タイミングでハーフカット部位３４ａ、３４ｂを含む長尺状感光性ウエブ２２の画像が撮影される。   Under the action of the peeling mechanism 44, after the protective film 30 is peeled off from the flexible base film 26 leaving the remaining portion 30b, the long photosensitive web 22 is tension-adjusted by the tension control mechanism 66, Next, in the photographing unit 47, an image of the long photosensitive web 22 including the half cut portions 34a and 34b is photographed at a predetermined photographing timing.

撮影部４７を通過した長尺状感光性ウエブ２２は、貼り付け機構４６に搬送されることで、ガラス基板２４に対する感光性樹脂層２８の転写処理（ラミネート）が行われる。この場合、撮影部４７によって撮影されたハーフカット部位３４ａ、３４ｂの画像に基づき、貼り付け機構４６におけるハーフカット部位３４ａ、３４ｂの位置が調整される。   The long photosensitive web 22 that has passed through the photographing section 47 is conveyed to the attaching mechanism 46, whereby the photosensitive resin layer 28 is transferred (laminated) to the glass substrate 24. In this case, the positions of the half cut portions 34a and 34b in the attaching mechanism 46 are adjusted based on the images of the half cut portions 34a and 34b photographed by the photographing unit 47.

貼り付け機構４６では、当初、ゴムローラ８０ａ、８０ｂが離間した状態に設定されており、ゴムローラ８０ａ、８０ｂ間の所定位置に長尺状感光性ウエブ２２のハーフカット部位３４ａが位置決めされた状態において、長尺状感光性ウエブ２２の搬送が一旦停止される。この状態において、第２加熱機構１０６ｂから所定温度に加熱されたガラス基板２４が搬送部１３４ｂによってゴムローラ８０ａ、８０ｂ間に搬入され、ガラス基板２４に対する長尺状感光性ウエブ２２の貼り付け処理が開始される。   In the pasting mechanism 46, the rubber rollers 80a and 80b are initially set in a separated state, and the half-cut portion 34a of the long photosensitive web 22 is positioned at a predetermined position between the rubber rollers 80a and 80b. The conveyance of the long photosensitive web 22 is temporarily stopped. In this state, the glass substrate 24 heated to a predetermined temperature from the second heating mechanism 106b is carried between the rubber rollers 80a and 80b by the transport unit 134b, and the process of attaching the long photosensitive web 22 to the glass substrate 24 is started. Is done.

ここで、第１加熱機構１０４、基板供給機構１０８、第２加熱機構１０６ａ、１０６ｂによるガラス基板２４の加熱処理について説明する。   Here, the heat treatment of the glass substrate 24 by the first heating mechanism 104, the substrate supply mechanism 108, and the second heating mechanisms 106a and 106b will be described.

先ず、基板供給機構１０８は、加熱前のガラス基板２４を図示しないコンベア等から取得し、第１加熱機構１０４を構成するホットプレート１１０ａ、１１０ｂの基板載置面１１４に載置する（図４）。この場合、基板載置面１１４に配設された基板ガイド１１６ａ〜１１６ｄによってガラス基板２４が位置決めされる。基板載置面１１４にガラス基板２４が載置された後、バルブ１３２ｂが開成され、管路１２０及び孔部１１８を介して真空ポンプ１３０によるエアの吸引が開始される。この結果、ガラス基板２４の全面がホットプレート１１０ａ、１１０ｂの基板載置面１１４に接触した状態で位置決め固定される。   First, the substrate supply mechanism 108 obtains the glass substrate 24 before heating from a conveyor or the like (not shown), and places it on the substrate placement surface 114 of the hot plates 110a and 110b constituting the first heating mechanism 104 (FIG. 4). . In this case, the glass substrate 24 is positioned by the substrate guides 116 a to 116 d disposed on the substrate mounting surface 114. After the glass substrate 24 is placed on the substrate placement surface 114, the valve 132 b is opened, and suction of air by the vacuum pump 130 is started via the conduit 120 and the hole 118. As a result, the glass substrate 24 is positioned and fixed in a state where the entire surface of the glass substrate 24 is in contact with the substrate placement surfaces 114 of the hot plates 110a and 110b.

次いで、ホットプレート駆動源１１２から供給される電力により、基板載置面１１４が貼り付け機構４６における加熱温度よりも高い第１加熱温度（以下、ＨＰ温度という。）まで加熱される。この場合、ガラス基板２４は、全面が基板載置面１１４に密着した状態とされているため、全面がＨＰ温度に均一且つ迅速に加熱される。   Next, the substrate mounting surface 114 is heated to a first heating temperature (hereinafter referred to as HP temperature) higher than the heating temperature in the attaching mechanism 46 by the electric power supplied from the hot plate drive source 112. In this case, since the entire surface of the glass substrate 24 is in close contact with the substrate mounting surface 114, the entire surface is uniformly and rapidly heated to the HP temperature.

ガラス基板２４がＨＰ温度に加熱された後、バルブ１３２ｂが閉成される一方、バルブ１３２ａが開成され、エア供給源１２８から管路１２０を介して孔部１１８に供給されるエアによりガラス基板２４の吸着状態が解除される。そして、基板供給機構１０８は、加熱されたガラス基板２４を第１加熱機構１０４から取り出し、矢印θ方向に旋回することで第２加熱機構１０６ａの搬送部１３４ａに供給する。   After the glass substrate 24 is heated to the HP temperature, the valve 132b is closed, while the valve 132a is opened, and the glass substrate 24 is supplied by air supplied from the air supply source 128 to the hole 118 through the pipe line 120. The suction state is released. Then, the substrate supply mechanism 108 takes the heated glass substrate 24 out of the first heating mechanism 104 and supplies it to the transport section 134a of the second heating mechanism 106a by turning in the arrow θ direction.

第２加熱機構１０６ａは、非接触の赤外線ヒータ１３６ａ、１３６ｂにより、ＨＰ温度よりも低くゴムローラ８０ａ、８０ｂでの加熱温度に近い第２加熱温度にガラス基板２４を加熱保持しながら、搬送部１３４ａによって第２加熱機構１０６ｂに搬送する。第２加熱機構１０６ｂは、第２加熱機構１０６ａと同様に、赤外線ヒータ１３６ｃ、１３６ｄによりガラス基板２４を第２加熱温度で加熱保持しながら、搬送部１３４ｂによって貼り付け機構４６に搬送する。   The second heating mechanism 106a uses a non-contact infrared heater 136a, 136b to heat and hold the glass substrate 24 at a second heating temperature lower than the HP temperature and close to the heating temperature at the rubber rollers 80a, 80b. It conveys to the 2nd heating mechanism 106b. Similarly to the second heating mechanism 106a, the second heating mechanism 106b transports the glass substrate 24 to the pasting mechanism 46 by the transport unit 134b while heating and holding the glass substrate 24 at the second heating temperature by the infrared heaters 136c and 136d.

図５は、基板供給機構１０８が第１加熱機構１０４から加熱されたガラス基板２４を取り出し、１８０゜旋回してガラス基板２４の前後を反転させて第２加熱機構１０６ａに供給する場合において、図９に示す測定点Ｘ１及びＸ３でのガラス基板２４の温度と加熱時間との関係を示す。なお、ＨＰは、第１加熱機構１０４、Ｒ／Ｂは、基板供給機構１０８、ｉＲは、第２加熱機構１０６ａ、１０６ｂの各位置にガラス基板２４があることを示すものとする。   FIG. 5 shows a case where the substrate supply mechanism 108 takes out the heated glass substrate 24 from the first heating mechanism 104, rotates 180 °, reverses the front and back of the glass substrate 24, and supplies the glass substrate 24 to the second heating mechanism 106a. 9 shows the relationship between the temperature of the glass substrate 24 and the heating time at the measurement points X1 and X3 shown in FIG. Note that HP indicates the first heating mechanism 104, R / B indicates the substrate supply mechanism 108, and iR indicates that the glass substrate 24 is located at each position of the second heating mechanisms 106a and 106b.

ガラス基板２４は、第１加熱機構１０４のホットプレート１１０ａ、１１０ｂによりＨＰ温度まで均一且つ迅速に加熱された後、基板供給機構１０８により第２加熱機構１０６ａに供給されるまでの間、温度が徐々に低下する。次いで、第２加熱機構１０６ａに供給されたガラス基板２４は、搬送部１３４ａによって搬送され、測定点Ｘ３側の加熱が測定点Ｘ１側よりも先に開始される。従って、測定点Ｘ３側は、少ない温度低下で第２加熱温度である目標温度に近づく。これに対して、測定点Ｘ１側は、第２加熱機構１０６ａに搬入されるまでに要する時間が測定点Ｘ３側よりも長いため、温度が目標温度以下まで低下し、その後、第２加熱機構１０６ａに搬入されて加熱されることで徐々に目標温度に近づいていく。   The glass substrate 24 is heated gradually and uniformly to the HP temperature by the hot plates 110a and 110b of the first heating mechanism 104, and then the temperature gradually increases until the glass substrate 24 is supplied to the second heating mechanism 106a by the substrate supply mechanism 108. To drop. Next, the glass substrate 24 supplied to the second heating mechanism 106a is transported by the transport unit 134a, and heating on the measurement point X3 side is started before the measurement point X1 side. Therefore, the measurement point X3 side approaches the target temperature that is the second heating temperature with a small temperature drop. On the other hand, since the time required for the measurement point X1 side to be carried into the second heating mechanism 106a is longer than the measurement point X3 side, the temperature drops below the target temperature, and then the second heating mechanism 106a. The target temperature is gradually approached by being carried in and heated.

この場合、ガラス基板２４が第２加熱機構１０６ａ、１０６ｂから貼り付け機構４６に供給される時点において、測定点Ｘ１、Ｘ３間に温度差ΔＴ１が残存しているが、ガラス基板２４が第１加熱機構１０４によってＨＰ温度まで予め加熱されているため、第２加熱機構１０６ａ、１０６ｂによって温度差ΔＴ１が許容範囲内となるまでに要する時間は短い。従って、ガラス基板２４を第２加熱機構１０６ａ、１０６ｂに長時間滞在させることなく、あるいは、第２加熱機構１０６ａ、１０６ｂをガラス基板２４の搬送方向に沿って長尺に構成することなく、ガラス基板２４を所望の目標温度近傍に調整して貼り付け機構４６に速やかに供給することができる。   In this case, when the glass substrate 24 is supplied from the second heating mechanisms 106a and 106b to the pasting mechanism 46, the temperature difference ΔT1 remains between the measurement points X1 and X3. Since the mechanism 104 is preheated to the HP temperature, the time required for the temperature difference ΔT1 to be within the allowable range by the second heating mechanisms 106a and 106b is short. Accordingly, the glass substrate 24 is not allowed to stay in the second heating mechanisms 106a and 106b for a long time, or the second heating mechanisms 106a and 106b are not configured to be elongated along the conveyance direction of the glass substrate 24. 24 can be adjusted to the vicinity of the desired target temperature and supplied to the pasting mechanism 46 promptly.

なお、図６に示すように、第２加熱機構１０６ａに先に搬入される測定点Ｘ３側のＨＰ温度Ｔ３よりも、遅れて搬入される測定点Ｘ１側のＨＰ温度Ｔ１が高くなるように、ホットプレート１１０ａ、１１０ｂの温度分布を設定することにより、基板供給機構１０８によるガラス基板２４の供給動作中に、測定点Ｘ１側の温度が過剰に低下することを回避することができる。この結果、ガラス基板２４が貼り付け機構４６に供給される時点での測定点Ｘ１、Ｘ３間の温度差ΔＴ２を温度差ΔＴ１よりも小さくし、あるいは、第２加熱機構１０６ａ、１０６ｂにおける加熱に要する時間を短縮し、さらには、第２加熱機構１０６ａ、１０６ｂの搬送路長さを短くすることができる。この場合、第２加熱機構１０６ａ、１０６ｂの一方を省略してもよい。   In addition, as shown in FIG. 6, the HP temperature T1 on the measurement point X1 side that is carried in later than the HP temperature T3 on the measurement point X3 side that is carried into the second heating mechanism 106a first becomes higher. By setting the temperature distribution of the hot plates 110a and 110b, it is possible to avoid the temperature on the measurement point X1 side from being excessively lowered during the operation of supplying the glass substrate 24 by the substrate supply mechanism 108. As a result, the temperature difference ΔT2 between the measurement points X1 and X3 at the time when the glass substrate 24 is supplied to the attaching mechanism 46 is made smaller than the temperature difference ΔT1 or required for heating in the second heating mechanisms 106a and 106b. The time can be shortened, and further, the length of the transport path of the second heating mechanisms 106a and 106b can be shortened. In this case, one of the second heating mechanisms 106a and 106b may be omitted.

以上のようにして温度調整されたガラス基板２４は、貼り付け機構４６を構成するゴムローラ８０ａ、８０ｂ間に搬入され、ガラス基板２４に対する長尺状感光性ウエブ２２の貼り付け処理が行われる。   The glass substrate 24 whose temperature has been adjusted as described above is carried between the rubber rollers 80a and 80b constituting the attaching mechanism 46, and the process of attaching the long photosensitive web 22 to the glass substrate 24 is performed.

そこで、ガラス基板２４の先端部がゴムローラ８０ａ、８０ｂ間に搬入されると、加圧シリンダ８４の作用下にバックアップローラ８２ｂ及びゴムローラ８０ｂが上昇し、ゴムローラ８０ａ、８０ｂ間にガラス基板２４及び長尺状感光性ウエブ２２が所定のプレス圧力で挟み込まれる。なお、ゴムローラ８０ａ、８０ｂは、所定のラミネート温度に加熱されている。   Therefore, when the front end portion of the glass substrate 24 is carried between the rubber rollers 80a and 80b, the backup roller 82b and the rubber roller 80b are lifted under the action of the pressure cylinder 84, and the glass substrate 24 and the long length are interposed between the rubber rollers 80a and 80b. The photosensitive web 22 is sandwiched with a predetermined pressing pressure. The rubber rollers 80a and 80b are heated to a predetermined laminating temperature.

次いで、ゴムローラ８０ａ、８０ｂが回転し、ガラス基板２４及び長尺状感光性ウエブ２２が矢印Ｙ方向に搬送される。この場合、貼り付け機構４６に供給されるガラス基板２４は、第２加熱機構１０６ｂ側において、許容される温度差の範囲内で略均一な温度に加熱されている。従って、感光性樹脂層２８とガラス基板２４との間に気泡が混入したり、感光性樹脂層２８に皺が発生してしまうことがなく、良好な状態で感光性樹脂層２８が加熱溶融されてガラス基板２４に転写（ラミネート）される。   Next, the rubber rollers 80a and 80b rotate, and the glass substrate 24 and the long photosensitive web 22 are conveyed in the arrow Y direction. In this case, the glass substrate 24 supplied to the attaching mechanism 46 is heated to a substantially uniform temperature within the allowable temperature difference range on the second heating mechanism 106b side. Therefore, bubbles are not mixed between the photosensitive resin layer 28 and the glass substrate 24 or wrinkles are not generated in the photosensitive resin layer 28, and the photosensitive resin layer 28 is heated and melted in a good state. Then, it is transferred (laminated) to the glass substrate 24.

なお、ラミネート条件としては、速度が１．０ｍ／ｍｉｎ〜１０．０ｍ／ｍｉｎ、ゴムローラ８０ａ、８０ｂの温度が８０℃〜１５０℃、前記ゴムローラ８０ａ、８０ｂのゴム硬度が４０度〜９０度、該ゴムローラ８０ａ、８０ｂのプレス圧（線圧）が５０Ｎ／ｃｍ〜４００Ｎ／ｃｍである。   The laminating conditions include a speed of 1.0 m / min to 10.0 m / min, a temperature of the rubber rollers 80a and 80b of 80 ° C to 150 ° C, a rubber hardness of the rubber rollers 80a and 80b of 40 ° to 90 °, The pressing pressure (linear pressure) of the rubber rollers 80a and 80b is 50 N / cm to 400 N / cm.

ガラス基板２４に対して長尺状感光性ウエブ２２の一枚分のラミネートが終了すると、ゴムローラ８０ａ、８０ｂの回転が停止される一方、長尺状感光性ウエブ２２がラミネートされたガラス基板２４の先端部が基板搬送ローラ９０ａによりクランプされる。このとき、ゴムローラ８０ａ、８０ｂ間の所定位置には、ハーフカット部位３４ｂが配置される。   When the lamination of one sheet of the long photosensitive web 22 is completed on the glass substrate 24, the rotation of the rubber rollers 80a and 80b is stopped, while the glass substrate 24 on which the long photosensitive web 22 is laminated is stopped. The leading end is clamped by the substrate transport roller 90a. At this time, a half-cut portion 34b is disposed at a predetermined position between the rubber rollers 80a and 80b.

そして、ゴムローラ８０ｂが、ゴムローラ８０ａから離間する方向に退避してクランプが解除されるとともに、基板搬送ローラ９０ａの回転が低速で再び開始され、長尺状感光性ウエブ２２がガラス基板２４にラミネートされた感光性積層体が矢印Ｙ方向に保護フイルム３０の残存部分３０ｂの幅Ｍに対応する距離だけ搬送され、次のハーフカット部位３４ａがゴムローラ８０ａの下方付近の所定位置に搬送された後、ゴムローラ８０ａ、８０ｂの回転が停止される。なお、長尺状感光性ウエブ２２をハーフカット部位３４ａ、３４ｂ間だけ搬送する処理を、以下において「基板間送り」という。   Then, the rubber roller 80b is retracted in a direction away from the rubber roller 80a to release the clamp, and the rotation of the substrate transport roller 90a is started again at a low speed, and the long photosensitive web 22 is laminated on the glass substrate 24. After the photosensitive laminate is conveyed in the arrow Y direction by a distance corresponding to the width M of the remaining portion 30b of the protective film 30, the next half-cut portion 34a is conveyed to a predetermined position near the lower portion of the rubber roller 80a, and then the rubber roller. The rotation of 80a and 80b is stopped. In addition, the process which conveys the elongate photosensitive web 22 only between the half cut site | parts 34a and 34b is called "inter-substrate feeding" below.

一方、前記の状態において、第２加熱機構１０６ｂから次なるガラス基板２４が貼り付け位置に向かって搬送される。以上の動作が繰り返されることにより、感光性積層体が連続的に製造される。   On the other hand, in the above state, the next glass substrate 24 is conveyed from the second heating mechanism 106b toward the attaching position. By repeating the above operation, the photosensitive laminate is continuously manufactured.

その際、感光性積層体は、それぞれの端部が図２に示す保護フイルム３０の残存部分３０ｂによって覆われている。従って、感光性樹脂層２８がガラス基板２４に転写される際、ゴムローラ８０ａ、８０ｂが前記感光性樹脂層２８により汚れることがない。   At that time, each end of the photosensitive laminate is covered with a remaining portion 30b of the protective film 30 shown in FIG. Therefore, when the photosensitive resin layer 28 is transferred to the glass substrate 24, the rubber rollers 80a and 80b are not soiled by the photosensitive resin layer 28.

貼り付け機構４６によって感光性樹脂層２８が貼り付けられたガラス基板２４は、貼り付け機構４６で長尺状感光性ウエブ２２が基板間送りされた後、一旦停止状態にあるとき、基板搬送ローラ９０ｂ、９０ｃ間に配設されているカッタ機構４８によってガラス基板２４間の長尺状感光性ウエブ２２が切断され、感光性積層体２４ａとされる。なお、この感光性積層体２４ａの前後には、残存部分３０ｂの保護フイルム３０が残存している。   The glass substrate 24 to which the photosensitive resin layer 28 is attached by the attaching mechanism 46 is temporarily stopped after the long photosensitive web 22 is fed between the substrates by the attaching mechanism 46. The long photosensitive web 22 between the glass substrates 24 is cut by the cutter mechanism 48 disposed between 90b and 90c to form a photosensitive laminate 24a. The protective film 30 of the remaining portion 30b remains before and after the photosensitive laminate 24a.

分離された感光性積層体２４ａは、ロボット９６によって一旦ストッカ９４に積層される。次いで、ストッカ９４に積層された感光性積層体２４ａは、剥離部９８に移載された後、ガラス基板２４が吸着盤１０２によって吸着保持され、端部の可撓性ベースフイルム２６がクランパ１００によって把持されて感光性積層体２４ａから剥離されることで、ガラス基板２４に感光性樹脂層２８のみが貼り付けられた感光性積層体２４ｂが製造される。   The separated photosensitive laminate 24 a is once laminated on the stocker 94 by the robot 96. Next, after the photosensitive laminate 24 a laminated on the stocker 94 is transferred to the peeling unit 98, the glass substrate 24 is sucked and held by the suction disk 102, and the flexible base film 26 at the end is held by the clamper 100. By being gripped and peeled from the photosensitive laminate 24a, a photosensitive laminate 24b in which only the photosensitive resin layer 28 is attached to the glass substrate 24 is manufactured.

図７は、他の実施形態である製造装置２００の概略構成図である。なお、図１に示す製造装置２０と同一の構成要素には、同一の参照符号を付し、その説明を省略する。   FIG. 7 is a schematic configuration diagram of a manufacturing apparatus 200 according to another embodiment. The same components as those of the manufacturing apparatus 20 shown in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted.

製造装置２００では、貼り付け機構４６によって長尺状感光性ウエブ２２が貼り付けられたガラス基板２４が、分断されることなく冷却部２０２に搬送されて冷却された後、剥離部２０４に供給される。剥離部２０４では、プッシャ２０６によってガラス基板２４間の長尺状感光性ウエブ２２が上方向に押し上げられることで、保護フイルム３０の剥離が容易な状態とされた後、保護フイルム３０が感光性樹脂層２８から剥離され、巻き取りローラ２０８により巻き取られる。これにより、ガラス基板２４間が分離され、感光性積層体２４ｂが製造される。   In the manufacturing apparatus 200, the glass substrate 24 to which the long photosensitive web 22 is pasted by the pasting mechanism 46 is transported to the cooling unit 202 without being divided and cooled, and then supplied to the peeling unit 204. The In the peeling unit 204, the long photosensitive web 22 between the glass substrates 24 is pushed upward by the pusher 206, so that the protective film 30 can be easily peeled off. It is peeled off from the layer 28 and taken up by a take-up roller 208. Thereby, between the glass substrates 24 is isolate | separated and the photosensitive laminated body 24b is manufactured.

なお、上述した実施形態では、１本の感光性ウエブロール２３から供給される長尺状感光性ウエブ２２をガラス基板２４に貼り付けることにより、いわゆる、１丁貼りの感光性積層体２４ｂを製造するように構成しているが、例えば、２本の感光性ウエブロールや、３本以上の感光性ウエブロールから長尺状感光性ウエブ２２を供給してガラス基板２４に貼り付け、いわゆる、２丁貼り、３丁貼り等の感光性積層体２４ｂを製造するように構成してもよい。   In the above-described embodiment, the long photosensitive web 22 supplied from one photosensitive web roll 23 is attached to the glass substrate 24 to manufacture a so-called single-stick photosensitive laminate 24b. For example, the long photosensitive web 22 is supplied from two photosensitive web rolls or three or more photosensitive web rolls and is attached to the glass substrate 24. You may comprise so that the photosensitive laminated body 24b, such as a sticking and 3 sticking, may be manufactured.

本実施形態に係る感光性積層体の製造装置の概略構成図である。It is a schematic block diagram of the manufacturing apparatus of the photosensitive laminated body which concerns on this embodiment. 本実施形態に係る製造装置に使用される長尺状感光性ウエブの断面図である。It is sectional drawing of the elongate photosensitive web used for the manufacturing apparatus which concerns on this embodiment. 長尺状感光性ウエブに接着ラベルが接着された状態の説明図である。It is explanatory drawing of the state by which the adhesive label was adhere | attached on the elongate photosensitive web. 第１加熱機構の構成図である。It is a block diagram of a 1st heating mechanism. 第１加熱機構、基板供給機構及び第２加熱機構間でのガラス基板の温度と時間との関係図である。It is a related figure of the temperature and time of a glass substrate between a 1st heating mechanism, a substrate supply mechanism, and a 2nd heating mechanism. 第１加熱機構において所定の温度分布を設定した場合における第１加熱機構、基板供給機構及び第２加熱機構間でのガラス基板の温度と時間との関係図である。It is a relationship diagram of the temperature and time of the glass substrate among the 1st heating mechanism, the substrate supply mechanism, and the 2nd heating mechanism when predetermined temperature distribution is set up in the 1st heating mechanism. 他の実施形態に係る製造装置の概略構成図である。It is a schematic block diagram of the manufacturing apparatus which concerns on other embodiment. 従来技術に係る製造装置の構成図である。It is a block diagram of the manufacturing apparatus which concerns on a prior art. 図８に示す製造装置おいて、基板加熱部によって加熱される基板の温度測定点の説明図である。In the manufacturing apparatus shown in FIG. 8, it is explanatory drawing of the temperature measurement point of the board | substrate heated by the board | substrate heating part. 図９に示す各温度測定点における温度と時間との関係図である。FIG. 10 is a relationship diagram of temperature and time at each temperature measurement point shown in FIG. 9.

符号の説明Explanation of symbols

２０、２００…製造装置
２２…長尺状感光性ウエブ
２４…ガラス基板
２４ａ、２４ｂ…感光性積層体
２６…可撓性ベースフイルム
２８…感光性樹脂層
３０…保護フイルム
３０ａ…剥離部分
３０ｂ…残存部分
３４ａ、３４ｂ…加工部位
４６…貼り付け機構
８０ａ、８０ｂ…ゴムローラ
９８、２０４…剥離部
１０４…第１加熱機構
１０６ａ、１０６ｂ…第２加熱機構
１０８…基板供給機構
１１０ａ、１１０ｂ…ホットプレート
１３４ａ、１３４ｂ…搬送部
１３６ａ〜１３６ｄ…赤外線ヒータ DESCRIPTION OF SYMBOLS 20,200 ... Manufacturing apparatus 22 ... Elongate photosensitive web 24 ... Glass substrate 24a, 24b ... Photosensitive laminated body 26 ... Flexible base film 28 ... Photosensitive resin layer 30 ... Protective film 30a ... Peeling part 30b ... Remaining Portions 34a, 34b ... processing part 46 ... pasting mechanism 80a, 80b ... rubber roller 98, 204 ... peeling part 104 ... first heating mechanism 106a, 106b ... second heating mechanism 108 ... substrate supply mechanism 110a, 110b ... hot plate 134a, 134b ... Conveying parts 136a to 136d ... Infrared heater

Claims (8)

支持体上に感光材料層を形成してなる長尺状感光性ウエブを、加熱された一対の圧着ローラ間に基板とともに送り出し、前記感光材料層を前記基板に貼り付けることで感光性積層体を製造する感光性積層体の製造装置において、
前記一対の圧着ローラの前段に配設され、前記基板を所定の加熱温度に調整して前記圧着ローラ間に供給する基板加熱部を備え、
前記基板加熱部は、
第１加熱手段を前記基板の全面に接触させ、前記基板を第１加熱温度まで加熱する第１加熱機構と、
前記第１加熱温度まで加熱された前記基板を、第２加熱手段により非接触状態で第２加熱温度に加熱保持し、搬送手段により前記圧着ローラ間に搬送する第２加熱機構と、
前記第１加熱機構から前記第２加熱機構に前記基板を供給する基板供給機構と、
を備えることを特徴とする感光性積層体の製造装置。 A long photosensitive web formed by forming a photosensitive material layer on a support is sent together with a substrate between a pair of heated pressure rollers, and the photosensitive material layer is attached to the substrate to form a photosensitive laminate. In the manufacturing apparatus for the photosensitive laminate to be manufactured,
A substrate heating unit that is disposed in front of the pair of pressure-bonding rollers, adjusts the substrate to a predetermined heating temperature, and supplies the substrate between the pressure-bonding rollers;
The substrate heating unit is
A first heating mechanism for bringing the first heating means into contact with the entire surface of the substrate and heating the substrate to a first heating temperature;
A second heating mechanism in which the substrate heated to the first heating temperature is heated and held at a second heating temperature in a non-contact state by a second heating unit, and conveyed between the pressing rollers by a conveying unit;
A substrate supply mechanism for supplying the substrate from the first heating mechanism to the second heating mechanism;
An apparatus for producing a photosensitive laminate, comprising: 請求項１記載の装置において、
前記第１加熱手段は、ホットプレートからなることを特徴とする感光性積層体の製造装置。 The apparatus of claim 1.
The said 1st heating means consists of hot plates, The manufacturing apparatus of the photosensitive laminated body characterized by the above-mentioned. 請求項１記載の装置において、
前記第２加熱手段は、赤外線ヒータであることを特徴とする感光性積層体の製造装置。 The apparatus of claim 1.
The apparatus for manufacturing a photosensitive laminate, wherein the second heating means is an infrared heater. 請求項１記載の装置において、
前記第１加熱温度は、前記第２加熱温度よりも高く設定されることを特徴とする感光性積層体の製造装置。 The apparatus of claim 1.
The apparatus for manufacturing a photosensitive laminate, wherein the first heating temperature is set higher than the second heating temperature. 請求項１記載の装置において、
前記第２加熱温度は、前記一対の圧着ローラの加熱温度近傍に設定されることを特徴とする感光性積層体の製造装置。 The apparatus of claim 1.
The apparatus for manufacturing a photosensitive laminate, wherein the second heating temperature is set in the vicinity of the heating temperature of the pair of pressure rollers. 支持体上に感光材料層を形成してなる長尺状感光性ウエブを、加熱された一対の圧着ローラ間に基板とともに送り出し、前記感光材料層を前記基板に貼り付けることで感光性積層体を製造する感光性積層体の製造方法において、
第１加熱手段を前記基板の全面に接触させ、前記基板を第１加熱温度まで加熱するステップと、
前記第１加熱温度まで加熱された前記基板を、第２加熱手段により非接触状態で第２加熱温度に加熱保持するステップと、
前記第２加熱温度に加熱保持された前記基板を前記圧着ローラ間に搬送するステップと、
を有することを特徴とする感光性積層体の製造方法。 A long photosensitive web formed by forming a photosensitive material layer on a support is sent together with a substrate between a pair of heated pressure rollers, and the photosensitive material layer is attached to the substrate to form a photosensitive laminate. In the manufacturing method of the photosensitive laminate to be manufactured,
Bringing the first heating means into contact with the entire surface of the substrate and heating the substrate to a first heating temperature;
Heating and holding the substrate heated to the first heating temperature at a second heating temperature in a non-contact state by a second heating means;
Transporting the substrate heated and held at the second heating temperature between the pressure rollers;
The manufacturing method of the photosensitive laminated body characterized by having. 請求項１記載の方法において、
前記第１加熱温度は、前記第２加熱温度よりも高く設定されることを特徴とする感光性積層体の製造方法。 The method of claim 1, wherein
The method for producing a photosensitive laminate, wherein the first heating temperature is set higher than the second heating temperature. 請求項１記載の方法において、
前記第２加熱温度は、前記一対の圧着ローラの加熱温度近傍に設定されることを特徴とする感光性積層体の製造方法。 The method of claim 1, wherein
The method for producing a photosensitive laminate, wherein the second heating temperature is set in the vicinity of a heating temperature of the pair of pressure rollers.
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