CN101396898B - Manufacture device and method of photosensitive lamination body - Google Patents
Manufacture device and method of photosensitive lamination body Download PDFInfo
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- CN101396898B CN101396898B CN2008101689302A CN200810168930A CN101396898B CN 101396898 B CN101396898 B CN 101396898B CN 2008101689302 A CN2008101689302 A CN 2008101689302A CN 200810168930 A CN200810168930 A CN 200810168930A CN 101396898 B CN101396898 B CN 101396898B
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- heating
- substrate
- temperature
- glass substrate
- photosensitive laminate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
- B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
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- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention provides a device for manufacturing photosensitive laminate and a manufacturing method thereof. A glass substrate (24) is uniformly and quickly heated to a first heating temperature through heating discs (110a, 110b) forming a first heating mechanism (104). Then the glass substrate (24) is provided to a second heating mechanism (106a, 106b) through a substrate feeding mechanism (108). Afterwards the glass substrate is conveyed by conveying parts (134a, 134b) and is executed with heating retaining with a second temperature lower than the first temperature through infrared heaters (136a-136d). The glass substrate is conveyed to a position between the rubber rollers (80a, 80b) forming an adhibiting mechanism (46) along with a strip photosensitive sheet (22). Furthermore a photosensitive resin layer (28) is compressed on the glass substrate (24) thereby manufacturing the photosensitive laminate (24b).
Description
Technical field
The present invention relates to seeing off between heated a pair of crimping roller with substrate at the strip photoelectric sheet that forms photosensitive material layer on the supporter; Through at the said photosensitive material layer of said substrate sticking, make the manufacturing installation and the manufacturing approach of the photosensitive laminate of photosensitive laminate.
Background technology
For example, paste photoelectric sheet body (photoelectric sheet), use substrate and constitute substrate for liquid crystal panel, used for printed circuit substrate, PDP with photo-sensitive resin (photosensitive material layer) at substrate surface.The photoelectric sheet style is like range upon range of in order photo-sensitive resin and diaphragm on the pliability plastic support.
The schematic configuration of the manufacturing installation 1 that Fig. 8 representes to use in the stickup of photoelectric sheet body (opening flat 8-183146 communique) with reference to the spy.At manufacturing installation 1; Pull out from the photoelectric sheet volume; The photoelectric sheet 3 of having peeled off diaphragm offers between crimping roller 4a, the 4b, and the substrate 7 that is heated to fixed temperature by the substrate heating part 6 with far infra-red heater 5 etc. offers between crimping roller 4a, the 4b.The photoelectric sheet and the substrate 7 that add thermo-compressed by crimping roller 4a, 4b; By cooling end 8 coolings, after the photoelectric sheet 3 between cutting machine (カ Star タ) the 9 cut-out separating base plates 7, through pellicle fixture (チ ヤ Star Network) 10; Peel off supporter from photosensitive material layer, thereby make photosensitive laminate.
, the photosensitive laminate of as above, making if substrate 7 is not adjusted to suitable heating-up temperature, is just sneaked into bubble in substrate heating part 6 sometimes between photosensitive material layer and substrate 7, perhaps produces gauffer at photosensitive material layer.
The change of time of the temperature that Fig. 9 and Figure 10 represent to measure by the measuring point A1～A4 of the temperature of the substrate 7 of substrate heating part 6 heating, X1～X3, at each measuring point A1～A4, X1～X3.Measuring point A1～A4 in circumference one side of substrate 7; The heat comparison measuring point heat of supplying with from 5 pairs of substrates of far infra-red heater 7 that X1～X3 supplies with still less is delivered to measuring point A1～A4 from measuring point X1～X3 one side so consider heat on substrate 7, set the thermal value of far infra-red heater 5; Just shown in figure 10; At measuring point A1～A4, become gradually temperature characterisitic near target temperature, and at measuring point X1～X3; Become once significantly above behind the target temperature, near the temperature characterisitic of target temperature.
At this moment; For the temperature difference Δ Tir of the temperature of the measuring point X1～X3 of the temperature of the measuring point A1～A4 of circumference one side of substrate 7 and central portion one side is reduced in the allowed band; And make whole of substrate 7 near the target temperature that constitutes by the Temperature Distribution of homogeneous roughly, be necessary setting the heat time heating time of substrate 7 fully longly.
, if fully guarantee heat time heating time, the needed time of the manufacturing of photosensitive laminate is just elongated, causes productive decline.And,, just can guarantee heat time heating time if strip ground constitutes substrate heating part 6 for the throughput direction of substrate 7, but at this moment, the device maximization that becomes, the problem of generation equipment cost rising.
Summary of the invention
The objective of the invention is to, not handle assembly maximization is provided, can be heated to temperature desired to substrate equably in the short time, and can make the manufacturing installation and the manufacturing approach of the photosensitive laminate of high-quality photosensitive laminate.
In addition, the objective of the invention is to, provide and to reduce equipment cost, and can improve the manufacturing installation and the manufacturing approach of the productive photosensitive laminate of photosensitive laminate.
The present invention is a kind of manufacturing installation of photosensitive laminate; Seeing off between a pair of crimping roller of heating with substrate at the strip photoelectric sheet that forms photosensitive material layer on the supporter; Through at the said photosensitive material layer of said substrate sticking; Make the manufacturing installation of the photosensitive laminate of photosensitive laminate, it is characterized in that
Have: be configured in the prime of said a pair of crimping roller, adjust to given heating-up temperature to said substrate, offer the substrate heating part between the said crimping roller;
The substrate heating part has:
Make the comprehensive engagement of first heater block and said substrate, be heated to said substrate first heating arrangements of first heating-up temperature;
Remain to the said substrate that is heated to first heating-up temperature than near second heating-up temperature said first heating-up temperature heating-up temperature low, said a pair of crimping roller in heating under the contactless state through second heater block, be transported to second heating arrangements between the said crimping roller through transfer unit;
Supply with the substrate feed mechanism of said substrate to said second heating arrangements from said first heating arrangements.
In addition; The present invention is a kind of manufacturing approach of photosensitive laminate, between a pair of crimping roller of heating, seeing off with substrate at the strip photoelectric sheet that forms photosensitive material layer on the supporter, through at the said photosensitive material layer of said substrate sticking; Make the photosensitive laminate of photosensitive laminate; It is characterized in that, comprising: make the comprehensive engagement of first heater block and said substrate, be heated to said substrate the step of first heating-up temperature;
Remain to through second heater block said substrate that is heated to first heating-up temperature in heating under the contactless state near the step of second heating-up temperature the heating-up temperature low, said a pair of crimping roller (80a, 80b) than said first heating-up temperature;
The said substrate that remains to heating second heating-up temperature is transported to the step between the said crimping roller.
In the present invention, through making the comprehensive engagement of first heater block and substrate, can be heated to substrate rapidly the temperature of homogeneous.Then, under contactless state, heat the maintenance substrate, be transported between the crimping roller,, can make high-quality photosensitive laminate being in the substrate sticking photosensitive material layer of desirable heated condition through second heater block.At this moment, can so need not constitute second heating arrangements of forming second heater block large-scalely, can reduce equipment cost, and can improve the productivity of photosensitive laminate through the temperature of the rapid heated substrates of first heater block.
From with the explanation of the collaborative following embodiment that is fit to of accompanying drawing, said purpose, feature and advantage can become clearer.
Fig. 1 is the summary construction diagram of manufacturing installation of the photosensitive laminate of this embodiment.
Description of drawings
Fig. 2 is the cut-open view of the strip photoelectric sheet that uses in the manufacturing installation of this embodiment.
Fig. 3 is the key diagram at the state of strip photoelectric sheet engage label.
Fig. 4 is the structural drawing of first heating arrangements.
Fig. 5 is the graph of a relation of the temperature and time of the glass substrate between first heating arrangements, substrate feed mechanism and second heating arrangements.
Fig. 6 is the graph of a relation of the temperature and time of the glass substrate between first heating arrangements, substrate feed mechanism and second heating arrangements when first heating arrangements is set given Temperature Distribution.
Fig. 7 is the summary construction diagram of the manufacturing installation of other embodiments.
Fig. 8 is the structural drawing of manufacturing installation of technology in the past.
Fig. 9 is in manufacturing installation shown in Figure 8, by the key diagram of the measuring point for the temperature of the substrate of substrate heating part heating.
Figure 10 is the graph of a relation of the temperature and time of each measuring point for the temperature shown in Figure 9.
Embodiment
Fig. 1 is the summary construction diagram of manufacturing installation 20 of the photosensitive laminate of this embodiment.This manufacturing installation 20 carries out that (lamination: ラ ミ ネ-ト) is to the operation of glass substrate 24 the hot transfer printing of the photo-sensitive resin 28 of the strip photoelectric sheet (ウ エ Block) 22 that is made up of given width dimensions (back is described) in liquid crystal or the organic EL manufacturing step with color filter etc.
Fig. 2 is the cut-open view of the strip photoelectric sheet 22 of use in the manufacturing installation 20.Range upon range of pliability basement membrane (supporter) 26, photo-sensitive resin (photosensitive material layer) 28, diaphragm 30 constitute this strip photoelectric sheet 22.
As shown in Figure 1, manufacturing installation 20 has: thin plate delivering mechanism 32, and it holds the photoelectric sheet volume 23 that is wound as strip photoelectric sheet 22 (ロ-Le) shape, and can roll up 23 from photoelectric sheet and see said strip photoelectric sheet 22 off; Organisation of working 36, it forms the boundary member at 2 places that hemisect position (working position) 34a, 34b (with reference to Fig. 2) promptly can cut off at the Width of the diaphragm 30 of the strip photoelectric sheet of seeing off 22 and photo-sensitive resin 28; Label engages (following) mechanism 40, and it engages with diaphragm 30 at the joint label 38 (with reference to Fig. 3) that a part has disengaged 38a.
In the downstream of label engaging mechanism 40, configuration: carry strip photoelectric sheet 22 from intermittently (タ Network ト) to change to the accumulating of the continuous conveying (mechanism 42 of レ ザ-バ); Peel off the mechanism for stripping 44 of diaphragm 30 with given intervals of lengths from strip photoelectric sheet 22; Be heated to first heating arrangements 104 to glass substrate 24 to fixed temperature; The second heating arrangements 106a, the 106b that under the state that heating keeps, are provided to paste position by first heating arrangements, 104 heated glass substrates 24; Offer glass substrate 24 from first heating arrangements 104 the substrate feed mechanism 108 of the second heating arrangements 106a; Paste the photo-sensitive resin that exposes owing to peeling off of said diaphragm 30 28 integratedly the labelling machine 46 of said glass substrate 24.In addition, the 1st heating arrangements 104 and the 2nd heating arrangements 106a, 106b constitute the substrate heating part.
The photography portion 47 of the image of the strip photoelectric sheet 22 that comprises hemisect position 34a, 34b is taken in configuration near the upper reaches of the paste position of labelling machine 46.Manufacturing installation 20 is according to the hemisect position 34a that is taken by photography portion 47, the image of 34b, calculates hemisect position 34a, the 34b position offset with respect to labelling machine 46, carries out the correction of the operational throughput of strip photoelectric sheet 22.
Near the downstream of thin plate delivering mechanism 32, the stickup platform 49 that configuration is pasted the rear end of the strip photoelectric sheet 22 of roughly finishing using and the top of the new strip photoelectric sheet 22 that uses.In the downstream of pasting platform 49, the skew of the Width that causes for the winding skew of controlling by photoelectric sheet volume 23, configuration film terminal position detecting device 51.Here, make thin plate delivering mechanism 32 move and carry out film terminal position adjustment, made up roller (position adjusting mechanism of ロ-ラ) carries out but also can be provided with at Width.
Organisation of working 36 be configured in be used for calculating hold coiling at thin plate delivering mechanism 32 the roller of coil diameter of photoelectric sheet volume 23 to 50 downstream.Organisation of working 36 has a pair of dise knife 52a, the 52b of distance of separation M (Fig. 2).Dise knife 52a, 52b move at the Width of strip photoelectric sheet 22, form hemisect position 34a, 34b in the position at the 2 given places of the remnant 30b that clips diaphragm 30.In addition, the diaphragm 30 before and after the remnant 30b is the released part 30a that peel off diaphragm 30.
As shown in Figure 2, hemisect position 34a, 34b have necessary tripping protection film 30 and photo-sensitive resin 28 at least, in fact set the penetraction depth of dise knife 52a, 52b with the mode that is cut into pliability basement membrane 26.Adopt under dise knife 52a, the 52b state fixing, move and form the mode of hemisect position 34a, 34b at the Width of strip photoelectric sheet 22 not rotating; Or be employed on the said strip photoelectric sheet 22 and do not slide, while and rotate at said Width and move, form the mode of hemisect position 34a, 34b.Also can replace dise knife 52a, 52b; ト system ソ Application
) etc. employing is except for example using laser or hyperacoustic cutting mode, with blade, push cutting knife (thomson cutter: the mode that forms hemisect position 34a, 34b.
Label engaging mechanism 40 for and glass substrate 24 between the remnant 30b of remaining accordingly diaphragm 30, supply with the joint label 38 of the released part 30a of the released part 30a that connects hemisect position 34b one side and hemisect position 34a one side.
As shown in Figure 3, engage label 38 and constitute rectangle (short volume) shape, for example by forming with diaphragm 30 identical resin materials.Engage label 38 and have not disengaged (comprising little bonding) 38a of applying adhesive, and be that vertical both ends of said joint label 38 have the first junction surface 38b that engages with the released part 30a in the place ahead, the second junction surface 38c that engages with the released part 30a at rear in the both sides of this disengaged 38a at central portion.
As shown in Figure 1; Label engaging mechanism 40 has and can engage absorption layer 54a～54g that label 38 separates the stickup of given interval respectively to maximum 7; And at paste position based on the said joint label 38 of said absorption layer 54a～54g, but the configuration of free lifting ground be used for keeping strip photoelectric sheet 22 from the below bear platform 56.
(ダ Application サ-ロ-ラ) 60 in order to carry the velocity contrast with the continuous conveying of the said strip photoelectric sheet 22 of downstream one side the intermittence (タ Network ト) of the strip photoelectric sheet 22 that absorbs the upper reaches one side, have the dancer roll that freely shake in direction of arrow ability to accumulate mechanism 42.
The mechanism for stripping 44 that is configured in the downstream of accumulating mechanism 42 has the tension change of seeing a side off that is used to interdict strip photoelectric sheet 22, suction drum (the サ Network シ ヨ Application De ラ system) 62 of the tension stabilityization when making lamination.Near configuration stripper roll 63 suction drum 62, and the diaphragm of peeling off with the peel angle of acute angle from strip photoelectric sheet 22 through this stripper roll 63 30 is reeled by diaphragm coiling portion 64 except remnant.
Side configuration can be paid the tension control mechanism 66 of tension force to strip photoelectric sheet 22 in the downstream of mechanism for stripping 44.Tension control mechanism 66 is under the driving action of cylinder, and tension force dancer 70 shakes displacement, can adjust the tension force of strip photoelectric sheet 22.In addition, tension control mechanism 66 can use according to necessity, also can remove.
The second heating arrangements 106a, 106b have: carry glass substrate 24, offer rubber rollers 80a, the delivery section 134a between the 80b, the 134b of labelling machine 46; Be configured in delivery section 134a, 134b about, with the infrared heater 136a～136d of contactless state glass substrate 24.In addition, also can replace infrared heater 136a～136d to use far infra-red heater, nickel chromium triangle (two Network ロ system) alloy wire well heater, storage heater etc.
One side is configured in the receptacle 94 of depositing a plurality of photosensitive laminate 24a under the range upon range of state in the downstream of substrate conveying roller 90d, moves the photosensitive laminate 24a that is separated by cutting mechanism 48 through robot 96 and is placed to this receptacle 94.Stripping portion 98 adjacent with receptacle 94, configuration is peeled off pliability basement membrane 26 remaining among the photosensitive laminate 24a with the remnant 30b of diaphragm 30.Stripping portion 98 has the clamper 100 that absorption keeps the suction tray 102 of glass substrate 24, peels off pliability basement membrane 26 from the photo-sensitive resin of being pasted by the glass substrate 24 of suction tray 102 maintenances 28.The photosensitive laminate 24b that is peeled off pliability basement membrane 26 by clamper 100 offers next step, for example step of exposure.
In addition; In the manufacturing installation 20 that as above, constitutes; Thin plate delivering mechanism 32, organisation of working 36, label engaging mechanism 40, accumulate the top that mechanism 42, mechanism for stripping 44, tension control mechanism 66 and photography portion 47 are configured in labelling machine 46; But also can be in contrast; To said photography portion 47, becoming up and down of strip photoelectric sheet 22 is opposite, the structure of pasting photo-sensitive resin 28 at the downside of glass substrate 24 from said thin plate delivering mechanism 32 in configuration below said labelling machine 46.In addition, also can constitute linearity to the landline of strip photoelectric sheet 22.
Be divided into first 124a of decontamination chamber and second 124b of decontamination chamber through partition wall 122 in the manufacturing installation 20.Hold from thin plate delivering mechanism 32 to tension control mechanism 66 at first 124a of decontamination chamber, hold the mechanism of photography portion below 47 at second 124b of decontamination chamber.First 124a of decontamination chamber and second 124b of decontamination chamber are communicated with through breakthrough part 126.
Below, use related with manufacturing approach of the present invention, the action of the manufacturing installation 20 that as above, constitutes is described.
At first, see strip photoelectric sheet 22 off from the photoelectric sheet volume 23 that is installed in thin plate delivering mechanism 32.Strip photoelectric sheet 22 is transported to organisation of working 36.
At organisation of working 36; Dise knife 52a, 52b move at the Width of strip photoelectric sheet 22; Be cut into photo-sensitive resin 28 and even pliability basement membrane 26 to said strip photoelectric sheet 22 from diaphragm 30, form hemisect position 34a, 34b (with reference to Fig. 2) that the width M with the remnant 30b of diaphragm 30 leaves.In view of the above,, clip remnant 30b, the released part 30a in the place ahead and the released part 30a at rear (with reference to Fig. 2) are set at strip photoelectric sheet 22.
In addition, not elongated with strip photoelectric sheet 22 is prerequisite, is benchmark with the distance between the rubber rollers 80a that offers labelling machine 46, the glass substrate 24 between the 80b, sets the amplitude M of remnant 30b.In addition, one group hemisect position 34a, 34b forming with amplitude M, the interval with the datum length of the photo-sensitive resin 28 pasted at glass substrate 24 is formed on the strip photoelectric sheet 22.
Then, strip photoelectric sheet 22 is transported to label engaging mechanism 40, and the given stickup position of diaphragm 30 is configured in bears on the platform 56.At label engaging mechanism 40, the joint label 38 of given number adsorbs maintenance by absorption layer 54b～54g, and each engages the remnant 30b that label 38 is striden diaphragm 30, engages (with reference to Fig. 3) with the released part 30a in the place ahead and the released part 30a one at rear.
For example, it is as shown in Figure 1 to engage 7 strip photoelectric sheets 22 that engage labels 38, through accumulating after mechanism 42 prevents to see the tension change of a side off, is transported to mechanism for stripping 44 continuously.At mechanism for stripping 44, the pliability basement membrane 26 of strip photoelectric sheet 22 is kept by 62 absorption of suction drum, and diaphragm 30 remaining remnant 30b, peels off from strip photoelectric sheet 22.This diaphragm 30 is peeled off through stripper roll 63, by diaphragm coiling portion 64 coilings (with reference to Fig. 1).
Under the effect of mechanism for stripping 44; Diaphragm 30 remaining remnant 30b; After peeling off from pliability basement membrane 26, strip photoelectric sheet 22 carries out tension adjustment by tension control mechanism 66, then; In photography portion 47, comprise the image of the strip photoelectric sheet 22 of hemisect position 34a, 34b at given BR.
Strip photoelectric sheet 22 through after the photography portion 47 is transported to labelling machine 46, thereby carries out the transfer process (lamination) to the photo-sensitive resin 28 of glass substrate 24.At this moment, according to by the hemisect position 34a of photography portion 47 photographies, the image of 34b, adjust the hemisect position 34a of labelling machine 46, the position of 34b.
At labelling machine 46; Originally be set at state separately to rubber rollers 80a, 80b; Under the state that the hemisect position 34a with strip photoelectric sheet 22 locatees, temporarily stop the conveying of strip photoelectric sheet 22 at the given position between rubber rollers 80a, the 80b.Under this state, the glass substrate 24 that is heated to fixed temperature by the second heating arrangements 106b is transported between rubber rollers 80a, the 80b by delivery section 134b, and begins the stickup processing to the strip photoelectric sheet 22 of glass substrate 24.
Here, heat treated based on the glass substrate 24 of first heating arrangements 104, substrate feed mechanism 108, the second heating arrangements 106a, 106b is described.
At first, substrate feed mechanism 108 never illustrated transport etc. is obtained the glass substrate 24 before the heating, is placed to the heating plate 110a that constitutes first heating arrangements 104, the substrate-placing face 114 (Fig. 4) of 110b.At this moment, locate glass substrate 24 by substrate-guided the 116a～116d that is configured on the substrate-placing face 114.After substrate-placing face 114 is laid glass substrate 24, open valve 132b, through pipeline 120 and hole portion 118, beginning is based on the attraction of the air of vacuum pump 130.As a result, glass substrate 24 comprehensively with substrate-placing face 114 state of contact of heating plate 110a, 110b under, the beginning positioning and fixing.
And heating plate 110a, 110b are through (electric power that the drive source 112 of ホ Star ト プ レ-ト) is supplied with is heated to first heating-up temperature higher than the heating-up temperature of labelling machine 46 (below be called the HP temperature) to substrate-placing face 114 from heating plate.At this moment, glass substrate 24 becomes comprehensively the state of being close to substrate-placing face 114, so ability homogeneous and be heated to the HP temperature rapidly comprehensively.
After glass substrate 24 was heated to the HP temperature, valve-off 132b opened valve 132a, through the air of supplying with through 120 pairs of hole portions of pipeline 118 from air supply source 128, and the adsorbed state of releasing glass substrate 24.Then, substrate feed mechanism 108 takes out heated glass substrate 24 from first heating arrangements 104, along the rotation of arrow theta direction, offers the delivery section 134a of the second heating arrangements 106a.
The second heating arrangements 106a is through non-contacting infrared heater 136a, 136b; On one side remain to glass substrate 24 heating lower and approach second heating-up temperature of the heating-up temperature of rubber rollers 80a, 80b than HP temperature, one side be transported to the second heating arrangements 106b through delivery section 134a.The second heating arrangements 106b and the second heating arrangements 106a are same, through infrared heater 136c, 136d, with second heating-up temperature heating keep glass substrate 24 on one side, be transported to labelling machine 46 through delivery section 134b on one side.
Fig. 5 representes that substrate feed mechanism 108 takes out heated glass substrate 24 from first heating arrangements 104; Rotate 180 °; Make putting the cart before the horse of glass substrate 24, when offering the second heating arrangements 106a, in the temperature of the glass substrate 24 of measuring point X1 shown in Figure 9 and X3 and the relation of heat time heating time.In addition, HP representes that glass substrate 24 is positioned at first heating arrangements 104, and R/B representes that glass substrate 24 is positioned at substrate feed mechanism 108, and iR representes that glass substrate 24 is positioned at each position of the second heating arrangements 106a, 106b.
At this moment; Offer the moment of labelling machine 46 from the second heating arrangements 106a, 106b at glass substrate 24; Remaining temperature difference △ T1 between measuring point X1, X3; But glass substrate 24 is heated to the HP temperature in advance by first heating arrangements 104, so through the second heating arrangements 106a, 106b, temperature difference △ T1 becomes the needed time period in the allowed band.Therefore; Glass substrate 24 is not detained at the second heating arrangements 106a, 106b for a long time; Perhaps need not be along the throughput direction of glass substrate 24; Longly constitute the second heating arrangements 106a, 106b (fear chi), just can adjust to glass substrate 24 near the desirable target temperature, can offer labelling machine 46 fast.
In addition; As shown in Figure 6; The HP temperature T 1 higher mode of measuring point X1 one side of carrying late to compare with the HP temperature T 3 of carrying measuring point X3 one side among the second heating arrangements 106a is earlier set the Temperature Distribution of heating plate 110a, 110b; In supply action, can avoid the temperature of measuring point X1 one side to descend based on the glass substrate 24 of substrate feed mechanism 108 superfluously.The result; Measuring point X1, the temperature difference △ T2 between the X3 that glass substrate 24 offers the moment of labelling machine 46 are littler than temperature difference △ T1; Perhaps shorten the required time of heating, can shorten the landline length of the second heating arrangements 106a, 106b based on the second heating arrangements 106a, 106b.At this moment, also can omit the side of the second heating arrangements 106a, 106b.
As above, between the rubber rollers 80a of the glass substrate 24 conveying formation labelling machines 46 of adjustment temperature, the 80b, carry out stickup processing to the strip photoelectric sheet 22 of glass substrate 24.
Therefore, if the top ends of glass substrate 24 is carried between rubber rollers 80a, the 80b, under the effect that adds air cylinder 84, spare roll 82b and rubber rollers 80b rise, and between rubber rollers 80a, 80b, sandwich strip photoelectric sheet 22 with given pressure.In addition, rubber rollers 80a, 80b are heated to given laminating temperature.
Then, rubber rollers 80a, 80b rotation, glass substrate 24 is carried along arrow Y direction with strip photoelectric sheet 22.At this moment, the glass substrate 24 that offers labelling machine 46 is heated to the roughly temperature of homogeneous in the second heating arrangements 106b, one side in the scope of the temperature difference that allows.Therefore, can between photo-sensitive resin 28 and glass substrate 24, not sneak into bubble or produce gauffer at photo-sensitive resin 28, under good state, photo-sensitive resin 28 is heated fusing, and transfer printing (lamination) is to glass substrate 24.
In addition; As lamination, speed is 1.0m/min～10.0m/min, and the temperature of rubber rollers 80a, 80b is 80 ℃～150 ℃; The rubber hardness of said rubber rollers 80a, 80b is 40 degree～90 degree, and the pressure (linear pressure) of this rubber rollers 80a, 80b is 50N/cm～400N/cm.
For glass substrate 24, if a slice lamination of a strip photoelectric sheet 22 finishes, just stop the rotation of rubber rollers 80a, 80b, and lamination the top ends of glass substrate 24 of strip photoelectric sheet 22 clamp by substrate conveying roller 90a.At this moment, the configuration of the given position between rubber rollers 80a, 80b hemisect position 34b.
Then; Rubber rollers 80b avoids to the direction of leaving from rubber rollers 80a; Remove clamping; Carry the corresponding distance of width M with the remnant 30b of diaphragm 30 at the photosensitive laminate of glass substrate 24 lamination strip photoelectric sheets 22 along arrow Y direction, next hemisect position 34a stops the rotation of rubber rollers 80a, 80b after being transported near the given position in the below of rubber rollers 80a.In addition, handle below only carries the processing of strip photoelectric sheet 22 to be called " carrying between substrate " between hemisect position 34a, 34b.
On the other hand, under described state, next glass substrate 24 is carried to paste position from the second heating arrangements 106b.Through repeating above action, make photosensitive laminate continuously.
At this moment, photosensitive laminate covers separately the end remnant by diaphragm shown in Figure 2 30.Therefore, when photo-sensitive resin 28 was transferred to glass substrate 24, rubber rollers 80a, 80b can not polluted by said photo-sensitive resin 28.
Pasted the glass substrate 24 of photo-sensitive resin 28 through labelling machine 46; After being undertaken strip photoelectric sheet 22 between substrate to carry by labelling machine 46; When temporarily being in halted state; Through being configured in the cutting mechanism 48 between substrate conveying roller 90b, the 90c, cut off the strip photoelectric sheet 22 between the glass substrate 24, become photosensitive laminate 24a.In addition, in the front and back of this photosensitive laminate 24a, the diaphragm 30 of remnant 30b is remaining.
Photosensitive laminate 24a after the separation temporarily is laminated in the receptacle 94 through robot 96.Then; Receptacle 94 range upon range of photosensitive laminate 24a move be placed to stripping portion 98 after; Glass substrate 24 is kept by suction tray 102 absorption; The pliability basement membrane 26 of end is controlled by clamper 100, and 24a peels off from photosensitive laminate, thereby is manufactured on 24 photosensitive laminate 24b that paste photo-sensitive resin 28 of glass substrate.
Fig. 7 is the summary construction diagram of the manufacturing installation 200 of other embodiments.In addition, to paying identical reference marks, omit its explanation with manufacturing installation 20 identical inscapes shown in Figure 1.
At manufacturing installation 200, be pasted with the glass substrate 24 of strip photoelectric sheet 22 through labelling machine 46, not disjunction is transported to cooling end 202 (disjunction), after the cooling, offers stripping portion 204., upwards push away the strip photoelectric sheet 22 between the glass substrate 24 through pusher in stripping portion 204, become diaphragm 30 peel off the state of being easy to after, peel off diaphragm 30 from photo-sensitive resin 28, reel by take up roll 208.In view of the above, separate between the glass substrate 24, make photosensitive laminate 24b.
In addition; In above-mentioned embodiment; The mode of making the photosensitive laminate 24b that so-called 1 (fourth) paste to paste the strip photoelectric sheet of supplying with from a slice photoelectric sheet volume 23 22 at glass substrate 24 constitutes; But, for example also can constitute in 2 stickups of what is called of glass substrate 24 stickups, the mode of 3 photosensitive laminate 24b such as stickup according to supplying with strip photoelectric sheet 22 from 2 photoelectric sheet volumes or the volume of the photoelectric sheet more than 3.
Claims (4)
1. the manufacturing installation of a photosensitive laminate; Between supporter (26) a pair of crimping roller (80a, 80b) of strip photoelectric sheet (22) after substrate (24) sends to heating that upward formation photosensitive material layer (28) forms; Through pasting said photosensitive material layer (28) at said substrate (24); Make photosensitive laminate (24a), it is characterized in that
The manufacturing installation of this photosensitive laminate has:
Substrate heating part (104,106a, 106b), it is configured in the prime of said a pair of crimping roller (80a, 80b), adjusts to given heating-up temperature to said substrate (24), and is provided between the said crimping roller (80a, 80b);
Said substrate heating part (104,106a, 106b) has:
Make whole of first heater block (110a, 110b) and said substrate (24) to contact, be heated to said substrate (24) first heating arrangements (104) of first heating-up temperature;
(136a～136d) remains near second heating-up temperature the heating-up temperature low, said a pair of crimping roller (80a, 80b) than said first heating-up temperature in heating under the contactless state, and is transported to second heating arrangements (106a, 106b) between the said crimping roller (80a, 80b) by transfer unit (134a, 134b) by second heater block the said substrate (24) that is heated to first heating-up temperature; And
Supply with the substrate feed mechanism (108) of said substrate (24) to said second heating arrangements (106a, 106b) from said first heating arrangements (104).
2. the manufacturing installation of photosensitive laminate according to claim 1 is characterized in that,
Said first heater block (110a, 110b) is made up of heating plate.
3. the manufacturing installation of photosensitive laminate according to claim 1 is characterized in that,
(136a～136d) is an infrared heater to said second heater block.
4. the manufacturing approach of a photosensitive laminate; Between a pair of crimping roller (80a, 80b) of substrate (24) after being heated, see the strip photoelectric sheet (22) that forms at supporter (26) last formation photosensitive material layer (28) off; Through pasting said photosensitive material layer (28) at said substrate (24); Make photosensitive laminate (24a), it is characterized in that
The manufacturing approach of this photosensitive laminate has:
Make whole of first heater block (110a, 110b) and said substrate (24) to contact, and be heated to the step of first heating-up temperature to said substrate (24);
(136a～136d) remains near the step of second heating-up temperature the heating-up temperature low, said a pair of crimping roller (80a, 80b) than said first heating-up temperature in heating under the contactless state by second heater block the said substrate (24) that is heated to said first heating-up temperature;
The said substrate (24) that remains to heating said second heating-up temperature is transported to the step between the said crimping roller (80a, 80b).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007252930A JP4987656B2 (en) | 2007-09-28 | 2007-09-28 | Photosensitive laminate manufacturing apparatus and manufacturing method |
| JP2007-252930 | 2007-09-28 | ||
| JP2007252930 | 2007-09-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101396898A CN101396898A (en) | 2009-04-01 |
| CN101396898B true CN101396898B (en) | 2012-10-10 |
Family
ID=40515854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101689302A Expired - Fee Related CN101396898B (en) | 2007-09-28 | 2008-09-27 | Manufacture device and method of photosensitive lamination body |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4987656B2 (en) |
| KR (1) | KR20090032952A (en) |
| CN (1) | CN101396898B (en) |
| TW (1) | TW200922786A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6916641B2 (en) * | 2017-03-15 | 2021-08-11 | 株式会社Ｓｃｒｅｅｎホールディングス | Base material processing equipment and base material processing method |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0622199B2 (en) * | 1988-03-25 | 1994-03-23 | ソマール株式会社 | Thin film crimping method and thin film crimping apparatus |
| JP3195123B2 (en) * | 1993-06-11 | 2001-08-06 | 富士写真フイルム株式会社 | Photosensitive layer laminating method and apparatus |
| JP3042970B2 (en) * | 1994-12-28 | 2000-05-22 | シャープ株式会社 | Dry resist film lamination method |
| JP2000181080A (en) * | 1998-12-21 | 2000-06-30 | Fuji Photo Film Co Ltd | Method for laminating photosensitive resin layer |
| JP2002127250A (en) * | 2000-10-20 | 2002-05-08 | Nec Corp | Dry film laminator |
| JP3756402B2 (en) * | 2000-12-08 | 2006-03-15 | 富士写真フイルム株式会社 | Substrate transfer apparatus and method |
| JP4744713B2 (en) * | 2001-04-05 | 2011-08-10 | 東芝モバイルディスプレイ株式会社 | Laminating apparatus and laminating method |
| JP4774243B2 (en) * | 2004-07-06 | 2011-09-14 | 富士フイルム株式会社 | Photosensitive laminate manufacturing apparatus and manufacturing method |
| JP2006088511A (en) * | 2004-09-24 | 2006-04-06 | Eco & Engineering Co Ltd | Laminator |
| JP4741307B2 (en) * | 2005-05-20 | 2011-08-03 | 富士フイルム株式会社 | Heating apparatus and heating method |
-
2007
- 2007-09-28 JP JP2007252930A patent/JP4987656B2/en not_active Expired - Fee Related
-
2008
- 2008-07-29 KR KR1020080074141A patent/KR20090032952A/en not_active Application Discontinuation
- 2008-09-22 TW TW097136248A patent/TW200922786A/en unknown
- 2008-09-27 CN CN2008101689302A patent/CN101396898B/en not_active Expired - Fee Related
Non-Patent Citations (4)
| Title |
|---|
| JP平1-244467A 1989.09.28 |
| JP特开2000-181080A 2000.06.30 |
| JP特开平6-349727A 1994.12.22 |
| JP特开平8-183146A 1996.07.16 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090032952A (en) | 2009-04-01 |
| TW200922786A (en) | 2009-06-01 |
| JP4987656B2 (en) | 2012-07-25 |
| CN101396898A (en) | 2009-04-01 |
| JP2009083170A (en) | 2009-04-23 |
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