JP2002110905A5 - - Google Patents

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Publication number
JP2002110905A5
JP2002110905A5 JP2000301068A JP2000301068A JP2002110905A5 JP 2002110905 A5 JP2002110905 A5 JP 2002110905A5 JP 2000301068 A JP2000301068 A JP 2000301068A JP 2000301068 A JP2000301068 A JP 2000301068A JP 2002110905 A5 JP2002110905 A5 JP 2002110905A5
Authority
JP
Japan
Prior art keywords
wiring
semiconductor chip
insulating
semiconductor
insulating member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000301068A
Other languages
English (en)
Japanese (ja)
Other versions
JP3923716B2 (ja
JP2002110905A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000301068A priority Critical patent/JP3923716B2/ja
Priority claimed from JP2000301068A external-priority patent/JP3923716B2/ja
Priority to US09/953,295 priority patent/US6770964B2/en
Priority to EP01121717A priority patent/EP1193761A3/en
Publication of JP2002110905A publication Critical patent/JP2002110905A/ja
Publication of JP2002110905A5 publication Critical patent/JP2002110905A5/ja
Application granted granted Critical
Publication of JP3923716B2 publication Critical patent/JP3923716B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000301068A 2000-09-29 2000-09-29 半導体装置 Expired - Fee Related JP3923716B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000301068A JP3923716B2 (ja) 2000-09-29 2000-09-29 半導体装置
US09/953,295 US6770964B2 (en) 2000-09-29 2001-09-17 Semiconductor device including intermediate wiring element
EP01121717A EP1193761A3 (en) 2000-09-29 2001-09-17 Semiconductor device including intermediate wiring element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000301068A JP3923716B2 (ja) 2000-09-29 2000-09-29 半導体装置

Publications (3)

Publication Number Publication Date
JP2002110905A JP2002110905A (ja) 2002-04-12
JP2002110905A5 true JP2002110905A5 (enExample) 2005-06-23
JP3923716B2 JP3923716B2 (ja) 2007-06-06

Family

ID=18782654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000301068A Expired - Fee Related JP3923716B2 (ja) 2000-09-29 2000-09-29 半導体装置

Country Status (3)

Country Link
US (1) US6770964B2 (enExample)
EP (1) EP1193761A3 (enExample)
JP (1) JP3923716B2 (enExample)

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US8089145B1 (en) 2008-11-17 2012-01-03 Amkor Technology, Inc. Semiconductor device including increased capacity leadframe
US8072050B1 (en) 2008-11-18 2011-12-06 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including passive device
US7875963B1 (en) 2008-11-21 2011-01-25 Amkor Technology, Inc. Semiconductor device including leadframe having power bars and increased I/O
US7982298B1 (en) 2008-12-03 2011-07-19 Amkor Technology, Inc. Package in package semiconductor device
US8487420B1 (en) 2008-12-08 2013-07-16 Amkor Technology, Inc. Package in package semiconductor device with film over wire
US20170117214A1 (en) 2009-01-05 2017-04-27 Amkor Technology, Inc. Semiconductor device with through-mold via
US8680656B1 (en) 2009-01-05 2014-03-25 Amkor Technology, Inc. Leadframe structure for concentrated photovoltaic receiver package
US8058715B1 (en) 2009-01-09 2011-11-15 Amkor Technology, Inc. Package in package device for RF transceiver module
US8026589B1 (en) 2009-02-23 2011-09-27 Amkor Technology, Inc. Reduced profile stackable semiconductor package
US7960818B1 (en) 2009-03-04 2011-06-14 Amkor Technology, Inc. Conformal shield on punch QFN semiconductor package
US8575742B1 (en) 2009-04-06 2013-11-05 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including power bars
US8674485B1 (en) 2010-12-08 2014-03-18 Amkor Technology, Inc. Semiconductor device including leadframe with downsets
TWI557183B (zh) 2015-12-16 2016-11-11 財團法人工業技術研究院 矽氧烷組成物、以及包含其之光電裝置
US8648450B1 (en) 2011-01-27 2014-02-11 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands
CN103917603B (zh) * 2011-10-06 2016-08-24 道康宁公司 形成具有改善的热稳定性的凝胶的方法
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CN105304619A (zh) * 2014-05-28 2016-02-03 株洲南车时代电气股份有限公司 一种igbt衬板结构及其制作方法
JP6272185B2 (ja) * 2014-08-25 2018-01-31 三菱電機株式会社 配線用コア構造、半導体評価装置及び半導体装置
JP2017162866A (ja) * 2016-03-07 2017-09-14 株式会社東芝 半導体装置
WO2019175950A1 (ja) * 2018-03-13 2019-09-19 新電元工業株式会社 電子モジュール及び電源装置
JP7002994B2 (ja) * 2018-05-15 2022-01-20 株式会社東芝 半導体装置
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