JP2002110889A5 - - Google Patents

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Publication number
JP2002110889A5
JP2002110889A5 JP2000296380A JP2000296380A JP2002110889A5 JP 2002110889 A5 JP2002110889 A5 JP 2002110889A5 JP 2000296380 A JP2000296380 A JP 2000296380A JP 2000296380 A JP2000296380 A JP 2000296380A JP 2002110889 A5 JP2002110889 A5 JP 2002110889A5
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JP
Japan
Prior art keywords
tab
semiconductor chip
semiconductor device
exposed
sealing body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000296380A
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English (en)
Japanese (ja)
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JP2002110889A (ja
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Publication date
Application filed filed Critical
Priority to JP2000296380A priority Critical patent/JP2002110889A/ja
Priority claimed from JP2000296380A external-priority patent/JP2002110889A/ja
Publication of JP2002110889A publication Critical patent/JP2002110889A/ja
Publication of JP2002110889A5 publication Critical patent/JP2002110889A5/ja
Withdrawn legal-status Critical Current

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JP2000296380A 2000-09-28 2000-09-28 半導体装置及びその製造方法 Withdrawn JP2002110889A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000296380A JP2002110889A (ja) 2000-09-28 2000-09-28 半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000296380A JP2002110889A (ja) 2000-09-28 2000-09-28 半導体装置及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005195940A Division JP4252563B2 (ja) 2005-07-05 2005-07-05 半導体装置

Publications (2)

Publication Number Publication Date
JP2002110889A JP2002110889A (ja) 2002-04-12
JP2002110889A5 true JP2002110889A5 (enExample) 2005-06-23

Family

ID=18778669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000296380A Withdrawn JP2002110889A (ja) 2000-09-28 2000-09-28 半導体装置及びその製造方法

Country Status (1)

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JP (1) JP2002110889A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258159A (ja) * 2009-04-23 2010-11-11 Renesas Electronics Corp 半導体装置
JP2011014758A (ja) * 2009-07-03 2011-01-20 Renesas Electronics Corp リードフレーム及びこれを用いた電子部品
JP6130238B2 (ja) * 2013-06-14 2017-05-17 ルネサスエレクトロニクス株式会社 半導体装置および電子装置
WO2020095474A1 (ja) * 2018-11-06 2020-05-14 パナソニックＩｐマネジメント株式会社 回路基板
JP7475944B2 (ja) * 2020-04-17 2024-04-30 ルビコン株式会社 コンデンサデバイス、パワーユニット及びコンデンサデバイスの製造方法

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