JP2002075783A - 温度補償用薄膜コンデンサ - Google Patents
温度補償用薄膜コンデンサInfo
- Publication number
- JP2002075783A JP2002075783A JP2000256405A JP2000256405A JP2002075783A JP 2002075783 A JP2002075783 A JP 2002075783A JP 2000256405 A JP2000256405 A JP 2000256405A JP 2000256405 A JP2000256405 A JP 2000256405A JP 2002075783 A JP2002075783 A JP 2002075783A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- dielectric
- dielectric thin
- capacitor
- temperature compensation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 144
- 239000003990 capacitor Substances 0.000 title claims abstract description 56
- 239000010408 film Substances 0.000 claims description 34
- 239000013078 crystal Substances 0.000 claims description 17
- 230000005684 electric field Effects 0.000 claims description 14
- 229910020286 SiOxNy Inorganic materials 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 11
- 229910002971 CaTiO3 Inorganic materials 0.000 claims description 5
- 229910003087 TiOx Inorganic materials 0.000 claims description 3
- HLLICFJUWSZHRJ-UHFFFAOYSA-N tioxidazole Chemical compound CCCOC1=CC=C2N=C(NC(=O)OC)SC2=C1 HLLICFJUWSZHRJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 41
- 239000000203 mixture Substances 0.000 description 24
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 16
- 239000000919 ceramic Substances 0.000 description 13
- 238000005259 measurement Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 229910004304 SiNy Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 229910003440 dysprosium oxide Inorganic materials 0.000 description 2
- NLQFUUYNQFMIJW-UHFFFAOYSA-N dysprosium(iii) oxide Chemical compound O=[Dy]O[Dy]=O NLQFUUYNQFMIJW-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910001940 europium oxide Inorganic materials 0.000 description 1
- AEBZCFFCDTZXHP-UHFFFAOYSA-N europium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Eu+3].[Eu+3] AEBZCFFCDTZXHP-UHFFFAOYSA-N 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- CMIHHWBVHJVIGI-UHFFFAOYSA-N gadolinium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[Gd+3].[Gd+3] CMIHHWBVHJVIGI-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- FKTOIHSPIPYAPE-UHFFFAOYSA-N samarium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[Sm+3].[Sm+3] FKTOIHSPIPYAPE-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Inorganic Insulating Materials (AREA)
- Semiconductor Integrated Circuits (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Ceramic Capacitors (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000256405A JP2002075783A (ja) | 2000-08-25 | 2000-08-25 | 温度補償用薄膜コンデンサ |
| EP01306733A EP1182696A3 (en) | 2000-08-25 | 2001-08-07 | Temperature compensating thinfilm capacitor |
| CNB011239670A CN1197103C (zh) | 2000-08-25 | 2001-08-09 | 温度补偿用薄膜电容器 |
| KR10-2001-0048689A KR100450101B1 (ko) | 2000-08-25 | 2001-08-13 | 온도 보상용 박막 콘덴서 |
| US09/930,862 US6477036B2 (en) | 2000-08-25 | 2001-08-16 | Temperature compensating thin-film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000256405A JP2002075783A (ja) | 2000-08-25 | 2000-08-25 | 温度補償用薄膜コンデンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002075783A true JP2002075783A (ja) | 2002-03-15 |
| JP2002075783A5 JP2002075783A5 (enExample) | 2004-09-09 |
Family
ID=18745021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000256405A Withdrawn JP2002075783A (ja) | 2000-08-25 | 2000-08-25 | 温度補償用薄膜コンデンサ |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6477036B2 (enExample) |
| EP (1) | EP1182696A3 (enExample) |
| JP (1) | JP2002075783A (enExample) |
| KR (1) | KR100450101B1 (enExample) |
| CN (1) | CN1197103C (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008136461A1 (ja) * | 2007-04-27 | 2008-11-13 | Nec Corporation | 広帯域容量素子 |
| JP2016075597A (ja) * | 2014-10-07 | 2016-05-12 | 国立大学法人 岡山大学 | 薄膜型水素ガスセンサ |
| JP2023051426A (ja) * | 2021-09-30 | 2023-04-11 | Tdk株式会社 | 薄膜キャパシタ、電源モジュールおよび電子機器 |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004095638A (ja) * | 2002-08-29 | 2004-03-25 | Fujitsu Ltd | 薄膜デカップリングキャパシタとその製造方法 |
| US20040061990A1 (en) * | 2002-09-26 | 2004-04-01 | Dougherty T. Kirk | Temperature-compensated ferroelectric capacitor device, and its fabrication |
| US20060000542A1 (en) * | 2004-06-30 | 2006-01-05 | Yongki Min | Metal oxide ceramic thin film on base metal electrode |
| US7216406B2 (en) * | 2004-09-29 | 2007-05-15 | Intel Corporation | Method forming split thin film capacitors with multiple voltages |
| US7290315B2 (en) * | 2004-10-21 | 2007-11-06 | Intel Corporation | Method for making a passive device structure |
| US20060099803A1 (en) * | 2004-10-26 | 2006-05-11 | Yongki Min | Thin film capacitor |
| US9572258B2 (en) * | 2004-12-30 | 2017-02-14 | Intel Corporation | Method of forming a substrate core with embedded capacitor and structures formed thereby |
| US7372126B2 (en) * | 2005-03-31 | 2008-05-13 | Intel Corporation | Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same |
| US7375412B1 (en) * | 2005-03-31 | 2008-05-20 | Intel Corporation | iTFC with optimized C(T) |
| US7629269B2 (en) * | 2005-03-31 | 2009-12-08 | Intel Corporation | High-k thin film grain size control |
| US20060220177A1 (en) * | 2005-03-31 | 2006-10-05 | Palanduz Cengiz A | Reduced porosity high-k thin film mixed grains for thin film capacitor applications |
| US7288459B2 (en) * | 2005-03-31 | 2007-10-30 | Intel Corporation | Organic substrates with integral thin-film capacitors, methods of making same, and systems containing same |
| US7453144B2 (en) * | 2005-06-29 | 2008-11-18 | Intel Corporation | Thin film capacitors and methods of making the same |
| KR101420773B1 (ko) * | 2009-07-15 | 2014-07-17 | 주성엔지니어링(주) | 전기광학소자 및 이의 제작 방법 |
| JP5120406B2 (ja) * | 2010-03-31 | 2013-01-16 | Ｔｄｋ株式会社 | セラミック電子部品及びセラミック電子部品の製造方法 |
| WO2013009772A1 (en) | 2011-07-11 | 2013-01-17 | Quantumscape Corporation | Solid state energy storage devices |
| US9087645B2 (en) | 2012-01-30 | 2015-07-21 | QuantrumScape Corporation | Solid state energy storage devices |
| JP5441020B1 (ja) * | 2012-08-29 | 2014-03-12 | Ｔｏｔｏ株式会社 | 静電チャック |
| US10115527B2 (en) * | 2015-03-09 | 2018-10-30 | Blackberry Limited | Thin film dielectric stack |
| US10122357B2 (en) * | 2016-11-14 | 2018-11-06 | Ford Global Technologies, Llc | Sensorless temperature compensation for power switching devices |
| US11942418B2 (en) * | 2021-07-23 | 2024-03-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor structure and method for making the same |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US88216A (en) * | 1869-03-23 | Improved crushing and q-rindino-machine | ||
| JPS4870855A (enExample) * | 1971-12-29 | 1973-09-26 | ||
| JPS5873908A (ja) | 1981-10-28 | 1983-05-04 | ティーディーケイ株式会社 | 高周波用誘電体磁器組成物 |
| US4423087A (en) * | 1981-12-28 | 1983-12-27 | International Business Machines Corporation | Thin film capacitor with a dual bottom electrode structure |
| JPS62222512A (ja) * | 1986-03-20 | 1987-09-30 | キヤノン株式会社 | 誘電体材料 |
| JPS63110618A (ja) * | 1986-10-28 | 1988-05-16 | 沖電気工業株式会社 | 積層型マイクロ波用誘電体磁器組成物 |
| EP0356212B1 (en) | 1988-08-25 | 1993-04-28 | Matsushita Electric Industrial Co., Ltd. | Thin-film capacitor and method of manufacturing a hybrid microwave integrated circuit |
| JPH03252160A (ja) * | 1990-02-28 | 1991-11-11 | Nec Corp | コンデンサ、コンデンサネットワーク及び抵抗―コンデンサネットワーク |
| US6088216A (en) * | 1995-04-28 | 2000-07-11 | International Business Machines Corporation | Lead silicate based capacitor structures |
| US5638252A (en) * | 1995-06-14 | 1997-06-10 | Hughes Aircraft Company | Electrical device and method utilizing a positive-temperature-coefficient ferroelectric capacitor |
| EP0749134B1 (en) | 1995-06-16 | 2002-10-02 | AT&T IPM Corp. | Dielectric material comprising Ta2O5 doped with TiO2 and devices employing same |
| US5978207A (en) * | 1996-10-30 | 1999-11-02 | The Research Foundation Of The State University Of New York | Thin film capacitor |
| JP3123448B2 (ja) * | 1996-11-13 | 2001-01-09 | 日本電気株式会社 | 薄膜キャパシタ |
| US6236102B1 (en) * | 1997-12-13 | 2001-05-22 | Samsung Electro-Mechanics Co., Ltd. | Chip type thin film capacitor, and manufacturing method therefor |
| JP2000183289A (ja) * | 1998-12-18 | 2000-06-30 | Murata Mfg Co Ltd | 誘電体素子の特性制御方法 |
-
2000
- 2000-08-25 JP JP2000256405A patent/JP2002075783A/ja not_active Withdrawn
-
2001
- 2001-08-07 EP EP01306733A patent/EP1182696A3/en not_active Withdrawn
- 2001-08-09 CN CNB011239670A patent/CN1197103C/zh not_active Expired - Fee Related
- 2001-08-13 KR KR10-2001-0048689A patent/KR100450101B1/ko not_active Expired - Fee Related
- 2001-08-16 US US09/930,862 patent/US6477036B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008136461A1 (ja) * | 2007-04-27 | 2008-11-13 | Nec Corporation | 広帯域容量素子 |
| JP2016075597A (ja) * | 2014-10-07 | 2016-05-12 | 国立大学法人 岡山大学 | 薄膜型水素ガスセンサ |
| JP2023051426A (ja) * | 2021-09-30 | 2023-04-11 | Tdk株式会社 | 薄膜キャパシタ、電源モジュールおよび電子機器 |
| JP7682759B2 (ja) | 2021-09-30 | 2025-05-26 | Tdk株式会社 | 薄膜キャパシタ、電源モジュールおよび電子機器 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100450101B1 (ko) | 2004-09-24 |
| EP1182696A2 (en) | 2002-02-27 |
| KR20020016508A (ko) | 2002-03-04 |
| CN1197103C (zh) | 2005-04-13 |
| EP1182696A3 (en) | 2005-05-25 |
| US20020080551A1 (en) | 2002-06-27 |
| US6477036B2 (en) | 2002-11-05 |
| CN1340832A (zh) | 2002-03-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20051114 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20060213 |
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060221 |
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| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20060406 |