JP2001520803A - 一貫生産型のベイ内バッファ・デリベリ・ストッカシステム - Google Patents
一貫生産型のベイ内バッファ・デリベリ・ストッカシステムInfo
- Publication number
- JP2001520803A JP2001520803A JP54393098A JP54393098A JP2001520803A JP 2001520803 A JP2001520803 A JP 2001520803A JP 54393098 A JP54393098 A JP 54393098A JP 54393098 A JP54393098 A JP 54393098A JP 2001520803 A JP2001520803 A JP 2001520803A
- Authority
- JP
- Japan
- Prior art keywords
- tool
- bay
- processing
- pod
- tools
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/14—Stack holders or separators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Memory System Of A Hierarchy Structure (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.半導体ツールベイ内で複数のポッドを複数の半導体プロセスツールの入力/ 出力(I/O)ポートに供給するシステムであって、 プロセスツールを収納したツールベイの壁に沿って設けられた複数の保管場所 を有し、 前記複数の保管場所は各々、ポッドをツールベイ内の任意のプロセスツールに 供給できることを特徴とするシステム。 2.半導体ツールベイ内で複数のポッドを複数の半導体プロセスツールの入力/ 出力(I/O)ポートに供給するシステムであって、プロセスツールを収納した ツールベイの壁に沿って設けられた搬送機構を有し、前記搬送機構は、ポッドを ツールベイ内の任意のプロセスツールに供給できることを特徴とするシステム。 3.複数のポッドを複数の半導体プロセスツールの入力/出力(I/O)ポート に配送し、ポッドを半導体プロセスツールを収納したツールベイ内に保管するシ ステムであって、 ポッドをツールベイ内のあちこちに搬送する搬送システムと、 ツールベイ内に設けられていて、複数のポッドを載置状態で保管できる複数の 棚とを有し、 前記搬送システム及び前記複数の棚は、プロセスツールのI/Oポートの位置 とは無関係にツールベイ内に設置されていることを特徴とするシステム。 4.ツールベイは、ストッカを備えていないことを特徴とする請求項3に記載の 複数のポッドの配送保管システム。 5.ツールベイは、処理能力の高いプロセスツールに取り付けられるローカルツ ールバッファを備えていないことを特徴とする請求項3に記載の複数のポッドの 配送保管システム。 6.少なくとも第1の処理ツールベイ及び第2の処理ツールベイを含む半導体製 造施設内に設置された搬送システムであって、第1及び第2の処理ツールベイが 、複数の半導体処理ツール及び複数の保管場所を有し、 前記搬送システムは、 第1の処理ツールベイと連携していて、基板運搬容器を第2の処理ツールベイ から受け取り、該容器を第1の処理ツールベイ内の複数の処理ツールまで移送し 、前記容器を第1の処理ツールベイ内の複数の保管場所まで移送する搬送機構を 有し、 前記搬送機構は、前記容器を手渡しすることなく第1の処理ツールベイ内の複 数の処理ツール及び保管場所まで移送できることを特徴とするシステム。 7.前記搬送機構は更に、前記容器を第1の処理ツールベイ内で複数の処理ツー ルと保管場所との間で移送できることを特徴とする請求項6に記載の搬送システ ム。 8.前記搬送システムは、鉛直面内で並進できるシャットルを有することを特徴 とする請求項6記載の搬送システム。 9.半導体製造施設内に設けられた処理ツールベイであって、 半導体ウェーハを処理する複数の処理ツールを有し、該複数の処理ツールは各 々、基板運搬容器を前記処理ツールの各々に出し入れするための入力/出力ポー トを備え、 前記処理ツールベイは更に、基板運搬容器を保管する複数の保管場所を有し、 前記複数の処理ツールの入力/出力ポート及び前記複数の保管場所は、共通平 面内に配置され、 前記複数の保管場所の位置は、前記複数の処理ツールの入力/出力ポートの位 置とは無関係に前記共通平面内にあることを特徴とする処理ツールベイ。 10.処理ツールベイは、ストッカを備えていないことを特徴とする請求項9に記 載の半導体製造施設内に設けられた処理ツールベイ。 11.処理ツールベイは、ローカルツールバッファを備えていないことを特徴とす る請求項9に記載の半導体製造施設内に設けられた処理ツールベイ。 12.前記共通平面は、鉛直面であることを特徴とする請求項9に記載の半導体製 造施設内に設けられた処理ツールベイ。 13.複数のツールベイ及び基板運搬容器を複数の処理ツールベイ相互間で移送す るベイ間搬送システムを含む半導体製造施設内に設けられた搬送システムであっ て、前記複数の処理ツールベイは各々、複数の半導体処理ツール及び複数の保管 場所を有し、 前記搬送システムは、 処理ツールベイと連携した少なくとも1つのシャットルを有し、前記少なくと も1つのシャットルは、前記容器を把持し、垂直方向及び水平方向に並進できる 手段を有し、前記少なくとも1つのシャットルは、前記容器をベイ間搬送システ ムと前記複数の処理ツールと前記複数の保管場所との間で移送できることを特徴 とする搬送システム。 14.前記少なくとも1つのシャットルは、2つのシャットルから成ることを特徴 とする請求項13に記載の半導体製造施設内の搬送システム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/843,245 US5980183A (en) | 1997-04-14 | 1997-04-14 | Integrated intrabay buffer, delivery, and stocker system |
US08/843,245 | 1997-04-14 | ||
PCT/US1998/005961 WO1998046503A1 (en) | 1997-04-14 | 1998-03-26 | Integrated intrabay buffer, delivery, and stocker system |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2001520803A true JP2001520803A (ja) | 2001-10-30 |
JP2001520803A5 JP2001520803A5 (ja) | 2005-08-11 |
JP4068160B2 JP4068160B2 (ja) | 2008-03-26 |
Family
ID=25289443
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP54393098A Expired - Fee Related JP4068160B2 (ja) | 1997-04-14 | 1998-03-26 | 一貫生産型のベイ内バッファ・デリベリ・ストッカシステム |
Country Status (7)
Country | Link |
---|---|
US (1) | US5980183A (ja) |
EP (1) | EP1028905B1 (ja) |
JP (1) | JP4068160B2 (ja) |
KR (1) | KR100608391B1 (ja) |
AT (1) | ATE361551T1 (ja) |
DE (1) | DE69837718T2 (ja) |
WO (1) | WO1998046503A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2005530361A (ja) * | 2002-06-19 | 2005-10-06 | ブルックス オートメーション インコーポレイテッド | 縦型輪状コンベヤ及びオーバーヘッドホイストを基にした半導体製造のためのマテリアルの自動化処理システム |
JP2006066893A (ja) * | 2004-07-14 | 2006-03-09 | Applied Materials Inc | 基板キャリアを支持する場所を変更するための方法および装置 |
JP2006261548A (ja) * | 2005-03-18 | 2006-09-28 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2007096140A (ja) * | 2005-09-30 | 2007-04-12 | Asyst Shinko Inc | 懸垂式昇降搬送台車における物品の授受方法並びに装置 |
WO2009057758A1 (ja) * | 2007-10-31 | 2009-05-07 | Asahi Glass Co., Ltd. | 容器交換装置および容器交換方法 |
KR101446511B1 (ko) * | 2002-10-11 | 2014-10-07 | 무라다기카이가부시끼가이샤 | 자동 재료 핸들링 시스템 |
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Also Published As
Publication number | Publication date |
---|---|
JP4068160B2 (ja) | 2008-03-26 |
WO1998046503A1 (en) | 1998-10-22 |
KR20010006331A (ko) | 2001-01-26 |
DE69837718D1 (de) | 2007-06-14 |
EP1028905A4 (en) | 2004-09-15 |
KR100608391B1 (ko) | 2006-08-09 |
US5980183A (en) | 1999-11-09 |
EP1028905B1 (en) | 2007-05-02 |
ATE361551T1 (de) | 2007-05-15 |
DE69837718T2 (de) | 2007-09-06 |
EP1028905A1 (en) | 2000-08-23 |
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