JP2001351947A - 半導体装置の製造方法およびその実装方法 - Google Patents

半導体装置の製造方法およびその実装方法

Info

Publication number
JP2001351947A
JP2001351947A JP2000170082A JP2000170082A JP2001351947A JP 2001351947 A JP2001351947 A JP 2001351947A JP 2000170082 A JP2000170082 A JP 2000170082A JP 2000170082 A JP2000170082 A JP 2000170082A JP 2001351947 A JP2001351947 A JP 2001351947A
Authority
JP
Japan
Prior art keywords
semiconductor device
electrode
insulating film
manufacturing
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000170082A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001351947A5 (https=
Inventor
Noboru Taguchi
昇 田口
Takashi Toida
孝志 戸井田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP2000170082A priority Critical patent/JP2001351947A/ja
Publication of JP2001351947A publication Critical patent/JP2001351947A/ja
Publication of JP2001351947A5 publication Critical patent/JP2001351947A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP2000170082A 2000-06-07 2000-06-07 半導体装置の製造方法およびその実装方法 Pending JP2001351947A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000170082A JP2001351947A (ja) 2000-06-07 2000-06-07 半導体装置の製造方法およびその実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000170082A JP2001351947A (ja) 2000-06-07 2000-06-07 半導体装置の製造方法およびその実装方法

Publications (2)

Publication Number Publication Date
JP2001351947A true JP2001351947A (ja) 2001-12-21
JP2001351947A5 JP2001351947A5 (https=) 2007-03-22

Family

ID=18672848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000170082A Pending JP2001351947A (ja) 2000-06-07 2000-06-07 半導体装置の製造方法およびその実装方法

Country Status (1)

Country Link
JP (1) JP2001351947A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008244277A (ja) * 2007-03-28 2008-10-09 Nec Corp 半導体装置及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008244277A (ja) * 2007-03-28 2008-10-09 Nec Corp 半導体装置及びその製造方法

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