JP2001313322A5 - - Google Patents

Download PDF

Info

Publication number
JP2001313322A5
JP2001313322A5 JP2000276640A JP2000276640A JP2001313322A5 JP 2001313322 A5 JP2001313322 A5 JP 2001313322A5 JP 2000276640 A JP2000276640 A JP 2000276640A JP 2000276640 A JP2000276640 A JP 2000276640A JP 2001313322 A5 JP2001313322 A5 JP 2001313322A5
Authority
JP
Japan
Prior art keywords
region
charged particle
inspection method
particle beam
resistance value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000276640A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001313322A (ja
JP4015352B2 (ja
Filing date
Publication date
Priority claimed from JP2000276640A external-priority patent/JP4015352B2/ja
Priority to JP2000276640A priority Critical patent/JP4015352B2/ja
Application filed filed Critical
Priority to US09/785,275 priority patent/US6618850B2/en
Publication of JP2001313322A publication Critical patent/JP2001313322A/ja
Priority to US10/419,141 priority patent/US6931620B2/en
Priority to US11/165,250 priority patent/US7526747B2/en
Publication of JP2001313322A5 publication Critical patent/JP2001313322A5/ja
Publication of JP4015352B2 publication Critical patent/JP4015352B2/ja
Application granted granted Critical
Priority to US12/420,273 priority patent/US20090189075A1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2000276640A 2000-02-22 2000-09-07 荷電粒子ビームを用いた検査方法 Expired - Fee Related JP4015352B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2000276640A JP4015352B2 (ja) 2000-02-22 2000-09-07 荷電粒子ビームを用いた検査方法
US09/785,275 US6618850B2 (en) 2000-02-22 2001-02-20 Inspection method and inspection system using charged particle beam
US10/419,141 US6931620B2 (en) 2000-02-22 2003-04-21 Inspection method and inspection system using charged particle beam
US11/165,250 US7526747B2 (en) 2000-02-22 2005-06-24 Inspection method and inspection system using charged particle beam
US12/420,273 US20090189075A1 (en) 2000-02-22 2009-04-08 Inspection method and inspection system using charged particle beam

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-50501 2000-02-22
JP2000050501 2000-02-22
JP2000276640A JP4015352B2 (ja) 2000-02-22 2000-09-07 荷電粒子ビームを用いた検査方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2005176063A Division JP4625376B2 (ja) 2000-02-22 2005-06-16 電子ビームによる検査方法
JP2005176062A Division JP4625375B2 (ja) 2000-02-22 2005-06-16 検査装置

Publications (3)

Publication Number Publication Date
JP2001313322A JP2001313322A (ja) 2001-11-09
JP2001313322A5 true JP2001313322A5 (enExample) 2005-10-20
JP4015352B2 JP4015352B2 (ja) 2007-11-28

Family

ID=26586172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000276640A Expired - Fee Related JP4015352B2 (ja) 2000-02-22 2000-09-07 荷電粒子ビームを用いた検査方法

Country Status (2)

Country Link
US (4) US6618850B2 (enExample)
JP (1) JP4015352B2 (enExample)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100327337B1 (ko) * 1999-08-17 2002-03-06 윤종용 반도체 장치 제조에서 사용되는 플라즈마에 의해서 유기되는전하 대전 정도를 판별하는 방법 및 이에 이용되는 판별장치
JP4015352B2 (ja) * 2000-02-22 2007-11-28 株式会社日立製作所 荷電粒子ビームを用いた検査方法
US7766921B2 (en) * 2000-06-29 2010-08-03 Concentric Medical, Inc. Systems, methods and devices for removing obstructions from a blood vessel
JP4150493B2 (ja) * 2000-08-22 2008-09-17 株式会社東芝 パターン描画装置における温度測定方法
JP3661604B2 (ja) * 2001-04-05 2005-06-15 松下電器産業株式会社 顕微観察装置および顕微観察方法
US6943569B1 (en) * 2002-04-12 2005-09-13 Advanced Micro Devices, Inc. Method, system and apparatus to detect defects in semiconductor devices
US7081625B2 (en) * 2002-11-06 2006-07-25 Hitachi High-Technologies Corporation Charged particle beam apparatus
DE10253717B4 (de) * 2002-11-18 2011-05-19 Applied Materials Gmbh Vorrichtung zum Kontaktieren für den Test mindestens eines Testobjekts, Testsystem und Verfahren zum Testen von Testobjekten
JP3961427B2 (ja) 2003-01-14 2007-08-22 株式会社東芝 配線パターンの埋め込み検査方法、半導体装置の製造方法および検査装置
US7739064B1 (en) * 2003-05-09 2010-06-15 Kla-Tencor Corporation Inline clustered defect reduction
JP4608272B2 (ja) * 2004-09-17 2011-01-12 株式会社リコー 耐絶縁性測定方法および装置および潜像担持体評価方法
KR100562701B1 (ko) * 2004-01-07 2006-03-23 삼성전자주식회사 전자 소스 및 이를 이용한 구멍의 오픈 불량 검사 장치와방법
JP4528014B2 (ja) 2004-04-05 2010-08-18 株式会社日立ハイテクノロジーズ 試料検査方法
US7256606B2 (en) * 2004-08-03 2007-08-14 Applied Materials, Inc. Method for testing pixels for LCD TFT displays
JP4943733B2 (ja) * 2005-04-28 2012-05-30 株式会社日立ハイテクノロジーズ 荷電粒子ビームを用いた検査方法及び検査装置
US8577171B1 (en) * 2006-07-31 2013-11-05 Gatan, Inc. Method for normalizing multi-gain images
JP4920385B2 (ja) * 2006-11-29 2012-04-18 株式会社日立ハイテクノロジーズ 荷電粒子ビーム装置、走査型電子顕微鏡、及び試料観察方法
JP5171101B2 (ja) * 2007-05-01 2013-03-27 株式会社日立ハイテクノロジーズ 電子線照射条件決定支援ユニット、および電子線式試料検査装置
JP4769320B2 (ja) * 2009-09-25 2011-09-07 ルネサスエレクトロニクス株式会社 半導体装置の不良解析方法及び装置並びにそれらのプログラム
JP5624774B2 (ja) * 2010-02-26 2014-11-12 株式会社日立ハイテクノロジーズ 走査電子顕微鏡の光学条件設定方法、及び走査電子顕微鏡
US8951266B2 (en) 2011-01-07 2015-02-10 Restoration Robotics, Inc. Methods and systems for modifying a parameter of an automated procedure
US20130088585A1 (en) * 2011-10-07 2013-04-11 Texas Instruments Incorporated Surface imaging with materials identified by color
US8723115B2 (en) * 2012-03-27 2014-05-13 Kla-Tencor Corporation Method and apparatus for detecting buried defects
US20150028204A1 (en) * 2013-07-25 2015-01-29 Kabushiki Kaisha Toshiba Inspection apparatus and inspection method
CN103489809B (zh) * 2013-09-22 2016-08-10 上海华力微电子有限公司 晶圆表面颗粒物的缺陷检测系统及其工作方法
US9449788B2 (en) 2013-09-28 2016-09-20 Kla-Tencor Corporation Enhanced defect detection in electron beam inspection and review
JP6379018B2 (ja) * 2014-11-20 2018-08-22 株式会社日立ハイテクノロジーズ 荷電粒子線装置および検査方法
US9958501B1 (en) 2015-03-04 2018-05-01 Applieed Materials Israel Ltd. System for electrical measurements of objects in a vacuumed environment
KR102592921B1 (ko) * 2015-12-31 2023-10-23 삼성전자주식회사 패턴 결함 검사 방법
JP6937254B2 (ja) * 2018-02-08 2021-09-22 株式会社日立ハイテク 検査システム、画像処理装置、および検査方法
US10866197B2 (en) * 2018-09-20 2020-12-15 KLA Corp. Dispositioning defects detected on extreme ultraviolet photomasks
US11914307B2 (en) 2019-02-26 2024-02-27 Asml Netherlands B.V. Inspection apparatus lithographic apparatus measurement method
JP7271358B2 (ja) * 2019-07-25 2023-05-11 株式会社日立ハイテク 電気特性を導出するシステム及び非一時的コンピューター可読媒体
JP7173937B2 (ja) * 2019-08-08 2022-11-16 株式会社日立ハイテク 荷電粒子線装置
FR3112393B1 (fr) * 2020-07-10 2022-07-08 Centre Nat Rech Scient Dispositif de détermination de la résistance électrique d’un système et procédé associé
KR102686145B1 (ko) * 2020-09-30 2024-07-19 주식회사 히타치하이테크 검사 방법
JP7458292B2 (ja) * 2020-10-20 2024-03-29 東京エレクトロン株式会社 プラズマ処理装置
JP7507838B2 (ja) 2021-11-30 2024-06-28 イノヴェータム・インストゥルメンツ・インコーポレイテッド 荷電粒子ビームを使用するプローブ先端のx-yロケーションの識別
US12306241B2 (en) 2022-02-14 2025-05-20 Innovatum Instruments Inc. Automated probe landing
CN119339775B (zh) * 2024-09-06 2025-11-21 华中科技大学 一种存储器件电学性能缺陷的原位测量方法及系统

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3036734A1 (de) * 1980-09-29 1982-05-06 Siemens AG, 1000 Berlin und 8000 München Verfahren zur messung von widerstaenden und kapazitaeten von elektronischen bauelementen
US4629898A (en) * 1981-10-02 1986-12-16 Oregon Graduate Center Electron and ion beam apparatus and passivation milling
JPS59155941A (ja) 1983-02-25 1984-09-05 Hitachi Ltd 電子ビーム検査方法および装置
JP3148353B2 (ja) 1991-05-30 2001-03-19 ケーエルエー・インストルメンツ・コーポレーション 電子ビーム検査方法とそのシステム
US5404110A (en) 1993-03-25 1995-04-04 International Business Machines Corporation System using induced current for contactless testing of wiring networks
GB2282895B (en) * 1993-09-21 1998-04-08 Advantest Corp IC analysis system having charged particle beam apparatus
US5523694A (en) * 1994-04-08 1996-06-04 Cole, Jr.; Edward I. Integrated circuit failure analysis by low-energy charge-induced voltage alteration
US5430305A (en) * 1994-04-08 1995-07-04 The United States Of America As Represented By The United States Department Of Energy Light-induced voltage alteration for integrated circuit analysis
JPH07288096A (ja) 1994-04-20 1995-10-31 Jeol Ltd 試料の帯電検出方法および走査電子顕微鏡
JPH08160109A (ja) 1994-12-02 1996-06-21 Hitachi Ltd 電子素子評価装置
US5781017A (en) * 1996-04-26 1998-07-14 Sandia Corporation Capacitive charge generation apparatus and method for testing circuits
JP3045111B2 (ja) * 1997-07-14 2000-05-29 日本電気株式会社 Lsi不良自動解析装置及びその解析方法並びにその方法をコンピュータに実行させるためのプログラムを記憶した記憶媒体
US6504393B1 (en) 1997-07-15 2003-01-07 Applied Materials, Inc. Methods and apparatus for testing semiconductor and integrated circuit structures
JP3356056B2 (ja) * 1998-05-15 2002-12-09 日本電気株式会社 配線不良検出回路、配線不良検出用半導体ウェハ及びこれらを用いた配線不良検出方法
US6566885B1 (en) * 1999-12-14 2003-05-20 Kla-Tencor Multiple directional scans of test structures on semiconductor integrated circuits
US6445199B1 (en) * 1999-12-14 2002-09-03 Kla-Tencor Corporation Methods and apparatus for generating spatially resolved voltage contrast maps of semiconductor test structures
JP4015352B2 (ja) * 2000-02-22 2007-11-28 株式会社日立製作所 荷電粒子ビームを用いた検査方法
US6515282B1 (en) * 2000-03-28 2003-02-04 Applied Materials, Inc. Testing of interconnection circuitry using two modulated charged particle beams
US6627884B2 (en) * 2001-03-19 2003-09-30 Kla-Tencor Technologies Corporation Simultaneous flooding and inspection for charge control in an electron beam inspection machine

Similar Documents

Publication Publication Date Title
JP2001313322A5 (enExample)
US7927895B1 (en) Varying capacitance voltage contrast structures to determine defect resistance
KR100388690B1 (ko) 반도체장치 테스터
Saito et al. Study of ADI (after develop inspection) using electron beam
JP2002289128A (ja) 荷電粒子線を用いた基板検査装置および基板検査方法
JP2005164451A5 (enExample)
JP2007500954A (ja) 高電流電子ビーム検査
KR20230043835A (ko) 샘플의 다양한 화학적 및 전기적 특성을 결정하기 위한 전자 분광법 기반 기술
JP5308624B2 (ja) 基準構造素子を使用して構造素子の断面特徴を決定するためのシステム及び方法
US20080296496A1 (en) Method and apparatus of wafer surface potential regulation
TWI795838B (zh) 檢查系統
CN1668915B (zh) 用于判定具有次微米截面积的结构元件的界面特征的系统和方法
US7235794B2 (en) System and method for inspecting charged particle responsive resist
US6690010B1 (en) Chemical analysis of defects using electron appearance spectroscopy
JP3708763B2 (ja) 欠陥検出方法
Dotan Method for enhancing topography and material contrast in automatic SEM review
JP2959529B2 (ja) 荷電粒子ビームによる半導体ウエハー検査装置及び検査方法
US20040075458A1 (en) Apparatus and method for enhanced voltage contrast analysis
JP2006024921A5 (enExample)
JP2005333161A5 (enExample)
KR940000735B1 (ko) 전자비임 길이 측정장치
JP2002176084A (ja) 半導体基板検査装置および半導体基板検査方法
US6573736B1 (en) Primary ion or electron current adjustment to enhance voltage contrast effect
TWI880212B (zh) 帶電粒子束系統,及試料評估資訊生成方法
WO2025162675A1 (en) Dosage-controlled voltage contrast inspection in charged-particle beam systems and methods thereof