JP2001313322A5 - - Google Patents
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- Publication number
- JP2001313322A5 JP2001313322A5 JP2000276640A JP2000276640A JP2001313322A5 JP 2001313322 A5 JP2001313322 A5 JP 2001313322A5 JP 2000276640 A JP2000276640 A JP 2000276640A JP 2000276640 A JP2000276640 A JP 2000276640A JP 2001313322 A5 JP2001313322 A5 JP 2001313322A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- charged particle
- inspection method
- particle beam
- resistance value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002245 particle Substances 0.000 claims 11
- 238000007689 inspection Methods 0.000 claims 10
- 238000000034 method Methods 0.000 claims 10
- 230000001678 irradiating effect Effects 0.000 claims 2
- 230000007547 defect Effects 0.000 claims 1
- 238000001514 detection method Methods 0.000 claims 1
- 238000010894 electron beam technology Methods 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000276640A JP4015352B2 (ja) | 2000-02-22 | 2000-09-07 | 荷電粒子ビームを用いた検査方法 |
| US09/785,275 US6618850B2 (en) | 2000-02-22 | 2001-02-20 | Inspection method and inspection system using charged particle beam |
| US10/419,141 US6931620B2 (en) | 2000-02-22 | 2003-04-21 | Inspection method and inspection system using charged particle beam |
| US11/165,250 US7526747B2 (en) | 2000-02-22 | 2005-06-24 | Inspection method and inspection system using charged particle beam |
| US12/420,273 US20090189075A1 (en) | 2000-02-22 | 2009-04-08 | Inspection method and inspection system using charged particle beam |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000-50501 | 2000-02-22 | ||
| JP2000050501 | 2000-02-22 | ||
| JP2000276640A JP4015352B2 (ja) | 2000-02-22 | 2000-09-07 | 荷電粒子ビームを用いた検査方法 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005176063A Division JP4625376B2 (ja) | 2000-02-22 | 2005-06-16 | 電子ビームによる検査方法 |
| JP2005176062A Division JP4625375B2 (ja) | 2000-02-22 | 2005-06-16 | 検査装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001313322A JP2001313322A (ja) | 2001-11-09 |
| JP2001313322A5 true JP2001313322A5 (enExample) | 2005-10-20 |
| JP4015352B2 JP4015352B2 (ja) | 2007-11-28 |
Family
ID=26586172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000276640A Expired - Fee Related JP4015352B2 (ja) | 2000-02-22 | 2000-09-07 | 荷電粒子ビームを用いた検査方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (4) | US6618850B2 (enExample) |
| JP (1) | JP4015352B2 (enExample) |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100327337B1 (ko) * | 1999-08-17 | 2002-03-06 | 윤종용 | 반도체 장치 제조에서 사용되는 플라즈마에 의해서 유기되는전하 대전 정도를 판별하는 방법 및 이에 이용되는 판별장치 |
| JP4015352B2 (ja) * | 2000-02-22 | 2007-11-28 | 株式会社日立製作所 | 荷電粒子ビームを用いた検査方法 |
| US7766921B2 (en) * | 2000-06-29 | 2010-08-03 | Concentric Medical, Inc. | Systems, methods and devices for removing obstructions from a blood vessel |
| JP4150493B2 (ja) * | 2000-08-22 | 2008-09-17 | 株式会社東芝 | パターン描画装置における温度測定方法 |
| JP3661604B2 (ja) * | 2001-04-05 | 2005-06-15 | 松下電器産業株式会社 | 顕微観察装置および顕微観察方法 |
| US6943569B1 (en) * | 2002-04-12 | 2005-09-13 | Advanced Micro Devices, Inc. | Method, system and apparatus to detect defects in semiconductor devices |
| US7081625B2 (en) * | 2002-11-06 | 2006-07-25 | Hitachi High-Technologies Corporation | Charged particle beam apparatus |
| DE10253717B4 (de) * | 2002-11-18 | 2011-05-19 | Applied Materials Gmbh | Vorrichtung zum Kontaktieren für den Test mindestens eines Testobjekts, Testsystem und Verfahren zum Testen von Testobjekten |
| JP3961427B2 (ja) | 2003-01-14 | 2007-08-22 | 株式会社東芝 | 配線パターンの埋め込み検査方法、半導体装置の製造方法および検査装置 |
| US7739064B1 (en) * | 2003-05-09 | 2010-06-15 | Kla-Tencor Corporation | Inline clustered defect reduction |
| JP4608272B2 (ja) * | 2004-09-17 | 2011-01-12 | 株式会社リコー | 耐絶縁性測定方法および装置および潜像担持体評価方法 |
| KR100562701B1 (ko) * | 2004-01-07 | 2006-03-23 | 삼성전자주식회사 | 전자 소스 및 이를 이용한 구멍의 오픈 불량 검사 장치와방법 |
| JP4528014B2 (ja) | 2004-04-05 | 2010-08-18 | 株式会社日立ハイテクノロジーズ | 試料検査方法 |
| US7256606B2 (en) * | 2004-08-03 | 2007-08-14 | Applied Materials, Inc. | Method for testing pixels for LCD TFT displays |
| JP4943733B2 (ja) * | 2005-04-28 | 2012-05-30 | 株式会社日立ハイテクノロジーズ | 荷電粒子ビームを用いた検査方法及び検査装置 |
| US8577171B1 (en) * | 2006-07-31 | 2013-11-05 | Gatan, Inc. | Method for normalizing multi-gain images |
| JP4920385B2 (ja) * | 2006-11-29 | 2012-04-18 | 株式会社日立ハイテクノロジーズ | 荷電粒子ビーム装置、走査型電子顕微鏡、及び試料観察方法 |
| JP5171101B2 (ja) * | 2007-05-01 | 2013-03-27 | 株式会社日立ハイテクノロジーズ | 電子線照射条件決定支援ユニット、および電子線式試料検査装置 |
| JP4769320B2 (ja) * | 2009-09-25 | 2011-09-07 | ルネサスエレクトロニクス株式会社 | 半導体装置の不良解析方法及び装置並びにそれらのプログラム |
| JP5624774B2 (ja) * | 2010-02-26 | 2014-11-12 | 株式会社日立ハイテクノロジーズ | 走査電子顕微鏡の光学条件設定方法、及び走査電子顕微鏡 |
| US8951266B2 (en) | 2011-01-07 | 2015-02-10 | Restoration Robotics, Inc. | Methods and systems for modifying a parameter of an automated procedure |
| US20130088585A1 (en) * | 2011-10-07 | 2013-04-11 | Texas Instruments Incorporated | Surface imaging with materials identified by color |
| US8723115B2 (en) * | 2012-03-27 | 2014-05-13 | Kla-Tencor Corporation | Method and apparatus for detecting buried defects |
| US20150028204A1 (en) * | 2013-07-25 | 2015-01-29 | Kabushiki Kaisha Toshiba | Inspection apparatus and inspection method |
| CN103489809B (zh) * | 2013-09-22 | 2016-08-10 | 上海华力微电子有限公司 | 晶圆表面颗粒物的缺陷检测系统及其工作方法 |
| US9449788B2 (en) | 2013-09-28 | 2016-09-20 | Kla-Tencor Corporation | Enhanced defect detection in electron beam inspection and review |
| JP6379018B2 (ja) * | 2014-11-20 | 2018-08-22 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置および検査方法 |
| US9958501B1 (en) | 2015-03-04 | 2018-05-01 | Applieed Materials Israel Ltd. | System for electrical measurements of objects in a vacuumed environment |
| KR102592921B1 (ko) * | 2015-12-31 | 2023-10-23 | 삼성전자주식회사 | 패턴 결함 검사 방법 |
| JP6937254B2 (ja) * | 2018-02-08 | 2021-09-22 | 株式会社日立ハイテク | 検査システム、画像処理装置、および検査方法 |
| US10866197B2 (en) * | 2018-09-20 | 2020-12-15 | KLA Corp. | Dispositioning defects detected on extreme ultraviolet photomasks |
| US11914307B2 (en) | 2019-02-26 | 2024-02-27 | Asml Netherlands B.V. | Inspection apparatus lithographic apparatus measurement method |
| JP7271358B2 (ja) * | 2019-07-25 | 2023-05-11 | 株式会社日立ハイテク | 電気特性を導出するシステム及び非一時的コンピューター可読媒体 |
| JP7173937B2 (ja) * | 2019-08-08 | 2022-11-16 | 株式会社日立ハイテク | 荷電粒子線装置 |
| FR3112393B1 (fr) * | 2020-07-10 | 2022-07-08 | Centre Nat Rech Scient | Dispositif de détermination de la résistance électrique d’un système et procédé associé |
| KR102686145B1 (ko) * | 2020-09-30 | 2024-07-19 | 주식회사 히타치하이테크 | 검사 방법 |
| JP7458292B2 (ja) * | 2020-10-20 | 2024-03-29 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP7507838B2 (ja) | 2021-11-30 | 2024-06-28 | イノヴェータム・インストゥルメンツ・インコーポレイテッド | 荷電粒子ビームを使用するプローブ先端のx-yロケーションの識別 |
| US12306241B2 (en) | 2022-02-14 | 2025-05-20 | Innovatum Instruments Inc. | Automated probe landing |
| CN119339775B (zh) * | 2024-09-06 | 2025-11-21 | 华中科技大学 | 一种存储器件电学性能缺陷的原位测量方法及系统 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3036734A1 (de) * | 1980-09-29 | 1982-05-06 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur messung von widerstaenden und kapazitaeten von elektronischen bauelementen |
| US4629898A (en) * | 1981-10-02 | 1986-12-16 | Oregon Graduate Center | Electron and ion beam apparatus and passivation milling |
| JPS59155941A (ja) | 1983-02-25 | 1984-09-05 | Hitachi Ltd | 電子ビーム検査方法および装置 |
| JP3148353B2 (ja) | 1991-05-30 | 2001-03-19 | ケーエルエー・インストルメンツ・コーポレーション | 電子ビーム検査方法とそのシステム |
| US5404110A (en) | 1993-03-25 | 1995-04-04 | International Business Machines Corporation | System using induced current for contactless testing of wiring networks |
| GB2282895B (en) * | 1993-09-21 | 1998-04-08 | Advantest Corp | IC analysis system having charged particle beam apparatus |
| US5523694A (en) * | 1994-04-08 | 1996-06-04 | Cole, Jr.; Edward I. | Integrated circuit failure analysis by low-energy charge-induced voltage alteration |
| US5430305A (en) * | 1994-04-08 | 1995-07-04 | The United States Of America As Represented By The United States Department Of Energy | Light-induced voltage alteration for integrated circuit analysis |
| JPH07288096A (ja) | 1994-04-20 | 1995-10-31 | Jeol Ltd | 試料の帯電検出方法および走査電子顕微鏡 |
| JPH08160109A (ja) | 1994-12-02 | 1996-06-21 | Hitachi Ltd | 電子素子評価装置 |
| US5781017A (en) * | 1996-04-26 | 1998-07-14 | Sandia Corporation | Capacitive charge generation apparatus and method for testing circuits |
| JP3045111B2 (ja) * | 1997-07-14 | 2000-05-29 | 日本電気株式会社 | Lsi不良自動解析装置及びその解析方法並びにその方法をコンピュータに実行させるためのプログラムを記憶した記憶媒体 |
| US6504393B1 (en) | 1997-07-15 | 2003-01-07 | Applied Materials, Inc. | Methods and apparatus for testing semiconductor and integrated circuit structures |
| JP3356056B2 (ja) * | 1998-05-15 | 2002-12-09 | 日本電気株式会社 | 配線不良検出回路、配線不良検出用半導体ウェハ及びこれらを用いた配線不良検出方法 |
| US6566885B1 (en) * | 1999-12-14 | 2003-05-20 | Kla-Tencor | Multiple directional scans of test structures on semiconductor integrated circuits |
| US6445199B1 (en) * | 1999-12-14 | 2002-09-03 | Kla-Tencor Corporation | Methods and apparatus for generating spatially resolved voltage contrast maps of semiconductor test structures |
| JP4015352B2 (ja) * | 2000-02-22 | 2007-11-28 | 株式会社日立製作所 | 荷電粒子ビームを用いた検査方法 |
| US6515282B1 (en) * | 2000-03-28 | 2003-02-04 | Applied Materials, Inc. | Testing of interconnection circuitry using two modulated charged particle beams |
| US6627884B2 (en) * | 2001-03-19 | 2003-09-30 | Kla-Tencor Technologies Corporation | Simultaneous flooding and inspection for charge control in an electron beam inspection machine |
-
2000
- 2000-09-07 JP JP2000276640A patent/JP4015352B2/ja not_active Expired - Fee Related
-
2001
- 2001-02-20 US US09/785,275 patent/US6618850B2/en not_active Expired - Fee Related
-
2003
- 2003-04-21 US US10/419,141 patent/US6931620B2/en not_active Expired - Fee Related
-
2005
- 2005-06-24 US US11/165,250 patent/US7526747B2/en not_active Expired - Fee Related
-
2009
- 2009-04-08 US US12/420,273 patent/US20090189075A1/en not_active Abandoned
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