JP2001298200A - 回路基板組立体 - Google Patents

回路基板組立体

Info

Publication number
JP2001298200A
JP2001298200A JP2001037118A JP2001037118A JP2001298200A JP 2001298200 A JP2001298200 A JP 2001298200A JP 2001037118 A JP2001037118 A JP 2001037118A JP 2001037118 A JP2001037118 A JP 2001037118A JP 2001298200 A JP2001298200 A JP 2001298200A
Authority
JP
Japan
Prior art keywords
circuit board
transceiver module
optical transceiver
flat support
flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001037118A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001298200A5 (OSRAM
Inventor
Kaa Fan Roo
ロー・カー・ファン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of JP2001298200A publication Critical patent/JP2001298200A/ja
Publication of JP2001298200A5 publication Critical patent/JP2001298200A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
JP2001037118A 2000-02-22 2001-02-14 回路基板組立体 Pending JP2001298200A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200000573-6 2000-02-22
SG200000573A SG91855A1 (en) 2000-02-22 2000-02-22 Circuit board assembly

Publications (2)

Publication Number Publication Date
JP2001298200A true JP2001298200A (ja) 2001-10-26
JP2001298200A5 JP2001298200A5 (OSRAM) 2008-02-14

Family

ID=20430523

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001037118A Pending JP2001298200A (ja) 2000-02-22 2001-02-14 回路基板組立体

Country Status (5)

Country Link
US (1) US6717820B1 (OSRAM)
EP (1) EP1128714B9 (OSRAM)
JP (1) JP2001298200A (OSRAM)
DE (1) DE60119194T2 (OSRAM)
SG (1) SG91855A1 (OSRAM)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6877913B2 (en) 2002-08-23 2005-04-12 Nec Corporation Card type optical transceiver module
KR101017975B1 (ko) 2010-06-22 2011-03-02 주식회사 로스윈 휴대단말기용 안테나 및 그 제조 방법
KR20160022346A (ko) * 2013-06-20 2016-02-29 오스람 옵토 세미컨덕터스 게엠베하 광전자 구조체

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4210240B2 (ja) * 2004-06-03 2009-01-14 ローム株式会社 光通信モジュール
JP4455301B2 (ja) * 2004-12-07 2010-04-21 日東電工株式会社 配線回路基板およびその接続構造
JP4646618B2 (ja) * 2004-12-20 2011-03-09 イビデン株式会社 光路変換部材、多層プリント配線板および光通信用デバイス
JP2006228895A (ja) * 2005-02-16 2006-08-31 Alps Electric Co Ltd 立体回路モジュール及びその製造方法
US8737080B2 (en) 2011-01-14 2014-05-27 Qualcomm Incorporated Modular surface mount package for a system on a chip
US9967984B1 (en) * 2015-01-14 2018-05-08 Vlt, Inc. Power adapter packaging
US9936580B1 (en) 2015-01-14 2018-04-03 Vlt, Inc. Method of forming an electrical connection to an electronic module
US10264664B1 (en) 2015-06-04 2019-04-16 Vlt, Inc. Method of electrically interconnecting circuit assemblies
WO2016203774A1 (ja) * 2015-06-19 2016-12-22 日本電信電話株式会社 フレキシブルプリント配線板のはんだ接合構造
US9493083B1 (en) 2015-06-22 2016-11-15 Delphi Technologies, Inc. Electrical plug adapter
US9693459B2 (en) 2015-07-16 2017-06-27 Delphi Technologies, Inc. Circuit board assembly and method of manufacturing same
CN105228345A (zh) * 2015-11-05 2016-01-06 福建众益太阳能科技股份公司 太阳能灯、用于太阳能灯的pcb线路板及其制作方法
TWI733074B (zh) * 2019-01-09 2021-07-11 榮晶生物科技股份有限公司 微型電子裝置及其電路基板
DE202019106231U1 (de) * 2019-11-08 2019-12-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Rotationsfähiger optischer Kurzstrecken-Transceiver

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06334298A (ja) * 1993-05-27 1994-12-02 Fujitsu Ltd 表面実装部品の搭載構造
US5506445A (en) * 1994-06-24 1996-04-09 Hewlett-Packard Company Optical transceiver module
JPH1041540A (ja) * 1996-07-22 1998-02-13 Shichizun Denshi:Kk 赤外線送受信モジュールの構造
JPH10233471A (ja) * 1997-02-19 1998-09-02 Citizen Electron Co Ltd 赤外線データ通信モジュール及びその製造方法
JPH11502065A (ja) * 1995-11-08 1999-02-16 シーメンス マイクロエレクトロニクス インコーポレイテッド 多数の取付形態を有する薄型光学装置
JPH11214795A (ja) * 1998-01-21 1999-08-06 Oki Electric Ind Co Ltd 光半導体モジュール
JP2000031511A (ja) * 1998-02-26 2000-01-28 Vishay Semiconductor Gmbh 光学的デ―タ伝送を行なう構成部分

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4119427A1 (de) * 1991-06-13 1992-12-17 H Albert Tu Kompaktschaltplatte eines computers
TW346687B (en) * 1997-09-15 1998-12-01 Ind Tech Res Inst Package of semiconductor laser diode and compact disk with two-wavelength read/write head
JP3198332B2 (ja) * 1997-12-16 2001-08-13 ローム株式会社 表示装置のマザーボードへの実装方法、および表示装置の実装構造
US5977567A (en) * 1998-01-06 1999-11-02 Lightlogic, Inc. Optoelectronic assembly and method of making the same
US6252252B1 (en) * 1998-04-16 2001-06-26 Sanyo Electric Co., Ltd. Optical semiconductor device and optical semiconductor module equipped with the same
DE19816794A1 (de) * 1998-04-16 1999-10-21 Bosch Gmbh Robert Leiterplattenverbund

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06334298A (ja) * 1993-05-27 1994-12-02 Fujitsu Ltd 表面実装部品の搭載構造
US5506445A (en) * 1994-06-24 1996-04-09 Hewlett-Packard Company Optical transceiver module
JPH11502065A (ja) * 1995-11-08 1999-02-16 シーメンス マイクロエレクトロニクス インコーポレイテッド 多数の取付形態を有する薄型光学装置
JPH1041540A (ja) * 1996-07-22 1998-02-13 Shichizun Denshi:Kk 赤外線送受信モジュールの構造
JPH10233471A (ja) * 1997-02-19 1998-09-02 Citizen Electron Co Ltd 赤外線データ通信モジュール及びその製造方法
JPH11214795A (ja) * 1998-01-21 1999-08-06 Oki Electric Ind Co Ltd 光半導体モジュール
JP2000031511A (ja) * 1998-02-26 2000-01-28 Vishay Semiconductor Gmbh 光学的デ―タ伝送を行なう構成部分

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6877913B2 (en) 2002-08-23 2005-04-12 Nec Corporation Card type optical transceiver module
KR101017975B1 (ko) 2010-06-22 2011-03-02 주식회사 로스윈 휴대단말기용 안테나 및 그 제조 방법
KR20160022346A (ko) * 2013-06-20 2016-02-29 오스람 옵토 세미컨덕터스 게엠베하 광전자 구조체
JP2016524331A (ja) * 2013-06-20 2016-08-12 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ オプトエレクトロニクス装置
US9991621B2 (en) 2013-06-20 2018-06-05 Osram Opto Semiconductors Gmbh Optoelectronic arrangement
KR102180735B1 (ko) 2013-06-20 2020-11-19 오스람 옵토 세미컨덕터스 게엠베하 광전자 구조체

Also Published As

Publication number Publication date
SG91855A1 (en) 2002-10-15
DE60119194T2 (de) 2006-08-31
EP1128714B9 (en) 2006-07-26
US6717820B1 (en) 2004-04-06
DE60119194D1 (de) 2006-06-08
EP1128714A1 (en) 2001-08-29
EP1128714B1 (en) 2006-05-03

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