JP2001234394A5 - - Google Patents

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Publication number
JP2001234394A5
JP2001234394A5 JP2000050948A JP2000050948A JP2001234394A5 JP 2001234394 A5 JP2001234394 A5 JP 2001234394A5 JP 2000050948 A JP2000050948 A JP 2000050948A JP 2000050948 A JP2000050948 A JP 2000050948A JP 2001234394 A5 JP2001234394 A5 JP 2001234394A5
Authority
JP
Japan
Prior art keywords
plating
wafer
plating solution
contact
target surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000050948A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001234394A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000050948A priority Critical patent/JP2001234394A/ja
Priority claimed from JP2000050948A external-priority patent/JP2001234394A/ja
Priority to US09/791,841 priority patent/US20010017105A1/en
Publication of JP2001234394A publication Critical patent/JP2001234394A/ja
Publication of JP2001234394A5 publication Critical patent/JP2001234394A5/ja
Pending legal-status Critical Current

Links

JP2000050948A 2000-02-28 2000-02-28 ウェハーめっき装置 Pending JP2001234394A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000050948A JP2001234394A (ja) 2000-02-28 2000-02-28 ウェハーめっき装置
US09/791,841 US20010017105A1 (en) 2000-02-28 2001-02-26 Wafer plating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000050948A JP2001234394A (ja) 2000-02-28 2000-02-28 ウェハーめっき装置

Publications (2)

Publication Number Publication Date
JP2001234394A JP2001234394A (ja) 2001-08-31
JP2001234394A5 true JP2001234394A5 (enExample) 2007-04-19

Family

ID=18572669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000050948A Pending JP2001234394A (ja) 2000-02-28 2000-02-28 ウェハーめっき装置

Country Status (2)

Country Link
US (1) US20010017105A1 (enExample)
JP (1) JP2001234394A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4425801B2 (ja) * 2002-11-15 2010-03-03 株式会社荏原製作所 基板処理装置
CN102912406B (zh) * 2012-11-12 2015-06-24 上海华力微电子有限公司 工艺腔体保护罩
CN111032923B (zh) * 2017-08-30 2021-12-28 盛美半导体设备(上海)股份有限公司 电镀装置
JP6531232B1 (ja) * 2019-01-10 2019-06-12 陽一朗 河合 転動体用冶具
CN116623270A (zh) * 2023-04-28 2023-08-22 崇辉半导体(江门)有限公司 一种led支架光亮银面局部粗化设备及其粗化方法

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