JP2001234394A - ウェハーめっき装置 - Google Patents

ウェハーめっき装置

Info

Publication number
JP2001234394A
JP2001234394A JP2000050948A JP2000050948A JP2001234394A JP 2001234394 A JP2001234394 A JP 2001234394A JP 2000050948 A JP2000050948 A JP 2000050948A JP 2000050948 A JP2000050948 A JP 2000050948A JP 2001234394 A JP2001234394 A JP 2001234394A
Authority
JP
Japan
Prior art keywords
plating
wafer
target surface
vent hole
air vent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000050948A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001234394A5 (enExample
Inventor
Yoshiyuki Harima
喜之 播磨
Hirobumi Ishida
博文 石田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
EEJA Ltd
Original Assignee
Electroplating Engineers of Japan Ltd
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroplating Engineers of Japan Ltd, Tokyo Electron Ltd filed Critical Electroplating Engineers of Japan Ltd
Priority to JP2000050948A priority Critical patent/JP2001234394A/ja
Priority to US09/791,841 priority patent/US20010017105A1/en
Publication of JP2001234394A publication Critical patent/JP2001234394A/ja
Publication of JP2001234394A5 publication Critical patent/JP2001234394A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
    • B05C3/18—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material only one side of the work coming into contact with the liquid or other fluent material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2000050948A 2000-02-28 2000-02-28 ウェハーめっき装置 Pending JP2001234394A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000050948A JP2001234394A (ja) 2000-02-28 2000-02-28 ウェハーめっき装置
US09/791,841 US20010017105A1 (en) 2000-02-28 2001-02-26 Wafer plating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000050948A JP2001234394A (ja) 2000-02-28 2000-02-28 ウェハーめっき装置

Publications (2)

Publication Number Publication Date
JP2001234394A true JP2001234394A (ja) 2001-08-31
JP2001234394A5 JP2001234394A5 (enExample) 2007-04-19

Family

ID=18572669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000050948A Pending JP2001234394A (ja) 2000-02-28 2000-02-28 ウェハーめっき装置

Country Status (2)

Country Link
US (1) US20010017105A1 (enExample)
JP (1) JP2001234394A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI591705B (zh) * 2002-11-15 2017-07-11 荏原製作所股份有限公司 基板處理裝置
CN102912406B (zh) * 2012-11-12 2015-06-24 上海华力微电子有限公司 工艺腔体保护罩
SG11202001659PA (en) * 2017-08-30 2020-03-30 Acm Research Shanghai Inc Plating apparatus
JP6531232B1 (ja) * 2019-01-10 2019-06-12 陽一朗 河合 転動体用冶具

Also Published As

Publication number Publication date
US20010017105A1 (en) 2001-08-30

Similar Documents

Publication Publication Date Title
KR100958557B1 (ko) 기판 처리 방법 및 기판 처리 장치
KR101027489B1 (ko) 도금장치 및 도금방법
JP7604088B2 (ja) 電気メッキのための幅広リップシール
US7374646B2 (en) Electrolytic processing apparatus and substrate processing method
JP2001234395A (ja) ウェハーめっき装置
KR102479088B1 (ko) 반도체 프로세싱에서의 유체 회수
US20030070695A1 (en) N2 splash guard for liquid injection on the rotating substrate
JP3341727B2 (ja) ウエット装置
JP2001234394A (ja) ウェハーめっき装置
TW202314899A (zh) 基板處理裝置及基板處理方法
JP2004250785A (ja) 電解処理装置及び基板処理装置
JP3698596B2 (ja) めっき装置及びめっき方法
KR20020044090A (ko) 컵식 도금장치 및 그것을 구비하는 자동웨이퍼 도금장치
JP2007335587A (ja) 基板処理装置
JP2002294495A (ja) 液処理装置
TW201912254A (zh) 基板處理裝置
JP6862882B2 (ja) 液処理装置及び液処理方法
US11107671B2 (en) Method of processing semiconductor substrate
TW202025269A (zh) 基板處理裝置及基板處理方法
JP2001323398A (ja) 基板のめっき装置およびめっき方法
JP2000058731A (ja) 電着処理装置
JP2000008192A (ja) カップ式めっき装置
JPH11238704A (ja) 半導体基板の配線溝メッキ方法およびメッキ装置
JP2004269993A (ja) メッキ装置
JP6039304B2 (ja) 半導体加工装置およびそれを用いた半導体装置の製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070227

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070305

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090416

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090507

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20090910