JP2001156070A5 - - Google Patents

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Publication number
JP2001156070A5
JP2001156070A5 JP2000350865A JP2000350865A JP2001156070A5 JP 2001156070 A5 JP2001156070 A5 JP 2001156070A5 JP 2000350865 A JP2000350865 A JP 2000350865A JP 2000350865 A JP2000350865 A JP 2000350865A JP 2001156070 A5 JP2001156070 A5 JP 2001156070A5
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JP
Japan
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JP2000350865A
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Japanese (ja)
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JP2001156070A (ja
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Priority claimed from US09/443,443 external-priority patent/US6803302B2/en
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Publication of JP2001156070A publication Critical patent/JP2001156070A/ja
Publication of JP2001156070A5 publication Critical patent/JP2001156070A5/ja
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JP2000350865A 1999-11-22 2000-11-17 機械的ロバスト性のあるパッドインターフェースおよび方法 Pending JP2001156070A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US443443 1999-11-22
US09/443,443 US6803302B2 (en) 1999-11-22 1999-11-22 Method for forming a semiconductor device having a mechanically robust pad interface

Publications (2)

Publication Number Publication Date
JP2001156070A JP2001156070A (ja) 2001-06-08
JP2001156070A5 true JP2001156070A5 (enExample) 2008-01-10

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Application Number Title Priority Date Filing Date
JP2000350865A Pending JP2001156070A (ja) 1999-11-22 2000-11-17 機械的ロバスト性のあるパッドインターフェースおよび方法

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US (2) US6803302B2 (enExample)
JP (1) JP2001156070A (enExample)
KR (1) KR100794476B1 (enExample)
CN (1) CN1189930C (enExample)

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