JP2001152385A5 - - Google Patents

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Publication number
JP2001152385A5
JP2001152385A5 JP2000286389A JP2000286389A JP2001152385A5 JP 2001152385 A5 JP2001152385 A5 JP 2001152385A5 JP 2000286389 A JP2000286389 A JP 2000286389A JP 2000286389 A JP2000286389 A JP 2000286389A JP 2001152385 A5 JP2001152385 A5 JP 2001152385A5
Authority
JP
Japan
Prior art keywords
metal
nickel
layer
product
phosphorus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000286389A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001152385A (ja
Filing date
Publication date
Priority claimed from US09/404,059 external-priority patent/US6335107B1/en
Application filed filed Critical
Publication of JP2001152385A publication Critical patent/JP2001152385A/ja
Publication of JP2001152385A5 publication Critical patent/JP2001152385A5/ja
Pending legal-status Critical Current

Links

JP2000286389A 1999-09-23 2000-09-21 コーティングされた金属製品 Pending JP2001152385A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/404,059 US6335107B1 (en) 1999-09-23 1999-09-23 Metal article coated with multilayer surface finish for porosity reduction
US09/404059 1999-09-23

Publications (2)

Publication Number Publication Date
JP2001152385A JP2001152385A (ja) 2001-06-05
JP2001152385A5 true JP2001152385A5 (enExample) 2004-10-14

Family

ID=23597974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000286389A Pending JP2001152385A (ja) 1999-09-23 2000-09-21 コーティングされた金属製品

Country Status (7)

Country Link
US (1) US6335107B1 (enExample)
EP (1) EP1086807B1 (enExample)
JP (1) JP2001152385A (enExample)
KR (1) KR100783847B1 (enExample)
DE (1) DE60015686T2 (enExample)
MY (1) MY135997A (enExample)
SG (1) SG87169A1 (enExample)

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US6667629B2 (en) * 2001-09-24 2003-12-23 Rika Electronics International, Inc. Electrical test probes and methods of making the same
JP3519726B1 (ja) 2002-11-26 2004-04-19 Ｆｃｍ株式会社 端子およびそれを有する部品
JP3519727B1 (ja) 2002-12-09 2004-04-19 Ｆｃｍ株式会社 コネクタ端子およびそれを有するコネクタ
JP3442764B1 (ja) 2002-08-22 2003-09-02 エフシーエム株式会社 コネクタ端子およびコネクタ
US6984358B2 (en) * 2002-09-13 2006-01-10 Lockheed Martin Corporation Diffusion bonding process of two-phase metal alloys
JP3519731B1 (ja) 2003-07-29 2004-04-19 Ｆｃｍ株式会社 端子、それを有する部品および製品
JP3985788B2 (ja) * 2004-01-22 2007-10-03 セイコーエプソン株式会社 電気光学装置及び電子機器
US7297397B2 (en) 2004-07-26 2007-11-20 Npa Coatings, Inc. Method for applying a decorative metal layer
US7215014B2 (en) * 2004-07-29 2007-05-08 Freescale Semiconductor, Inc. Solderable metal finish for integrated circuit package leads and method for forming
DE102004047522B3 (de) * 2004-09-28 2006-04-06 Infineon Technologies Ag Halbleiterchip mit einer Metallbeschichtungsstruktur und Verfahren zur Herstellung desselben
DE102006018765A1 (de) * 2006-04-20 2007-10-25 Infineon Technologies Ag Leistungshalbleiterbauelement, Leistungshalbleiterbauteil sowie Verfahren zu deren Herstellung
US7521128B2 (en) * 2006-05-18 2009-04-21 Xtalic Corporation Methods for the implementation of nanocrystalline and amorphous metals and alloys as coatings
US8652649B2 (en) * 2009-07-10 2014-02-18 Xtalic Corporation Coated articles and methods
JP6089341B2 (ja) * 2011-12-22 2017-03-08 オーエム産業株式会社 めっき品及びその製造方法
JP6057285B2 (ja) * 2012-10-26 2017-01-11 Ｓｈマテリアル株式会社 半導体素子搭載用基板
JP5991712B2 (ja) * 2012-10-26 2016-09-14 Ｓｈマテリアル株式会社 半導体素子搭載用基板及びその製造方法
JP6085536B2 (ja) * 2013-08-05 2017-02-22 株式会社Ｓｈカッパープロダクツ 銅条、めっき付銅条、リードフレーム及びｌｅｄモジュール
JP6181581B2 (ja) * 2014-03-10 2017-08-16 トヨタ自動車株式会社 端子接続構造、半導体装置
WO2015154807A1 (de) * 2014-04-10 2015-10-15 Kromberg & Schubert Gmbh Metallisches bauteil und herstellungsverfahren für ein metallisches bauteil
US9070392B1 (en) 2014-12-16 2015-06-30 Hutchinson Technology Incorporated Piezoelectric disk drive suspension motors having plated stiffeners
JP6689294B2 (ja) 2015-06-30 2020-04-28 ハッチンソン テクノロジー インコーポレイテッドＨｕｔｃｈｉｎｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃｏｒｐｏｒａｔｅｄ 金誘電体接合部の信頼性を向上させたディスクドライブヘッドサスペンション構造
US10998657B2 (en) 2016-03-18 2021-05-04 Apple Inc. Precious-metal-alloy contacts
DE202017001425U1 (de) 2016-03-18 2017-07-06 Apple Inc. Kontakte aus Edelmetallegierungen
ITUA20162707A1 (it) * 2016-04-19 2017-10-19 Bluclad S R L Lega Fosforo-Cobalto-Nichel e suo uso nei processi di placcatura con metalli nobili di oggetti in metallo non nobile.
KR101723975B1 (ko) * 2016-12-15 2017-04-07 주식회사 제이미크론 휴대폰 방수용 충전단자 및 이의 제조방법
DE102017002472A1 (de) * 2017-03-14 2018-09-20 Diehl Metal Applications Gmbh Steckverbinder
US20190103693A1 (en) * 2017-09-29 2019-04-04 Apple Inc. Electrical contacts having sacrificial layer for corrosion protection
KR102148316B1 (ko) * 2018-12-11 2020-08-26 히로세코리아 주식회사 전기적 접촉 단자
WO2020217787A1 (ja) * 2019-04-22 2020-10-29 Ｎｇｋエレクトロデバイス株式会社 金属部材およびその製造方法
CN111926354A (zh) * 2020-10-12 2020-11-13 江西科技学院 一种计算机数据处理装置用电气元件及其制造方法
JP2022105401A (ja) * 2021-01-04 2022-07-14 株式会社東芝 コネクタ、コンタクトピンの接続方法、コンタクトピン、及び、記憶媒体

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US5631094A (en) * 1994-01-28 1997-05-20 Komag, Incorporated Magnetic alloy for improved corrosion resistance and magnetic performance
US5675177A (en) 1995-06-26 1997-10-07 Lucent Technologies Inc. Ultra-thin noble metal coatings for electronic packaging
US6139977A (en) * 1998-06-10 2000-10-31 Lucent Technologies Inc. Palladium surface coating suitable for wirebonding and process for forming palladium surface coatings

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