DE60015686T2 - Beschichteter Metallartikel mit mehrlagiger Oberflächenbeschichtung für Porositätsverminderung - Google Patents

Beschichteter Metallartikel mit mehrlagiger Oberflächenbeschichtung für Porositätsverminderung Download PDF

Info

Publication number
DE60015686T2
DE60015686T2 DE60015686T DE60015686T DE60015686T2 DE 60015686 T2 DE60015686 T2 DE 60015686T2 DE 60015686 T DE60015686 T DE 60015686T DE 60015686 T DE60015686 T DE 60015686T DE 60015686 T2 DE60015686 T2 DE 60015686T2
Authority
DE
Germany
Prior art keywords
metal
nickel
article
layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60015686T
Other languages
German (de)
English (en)
Other versions
DE60015686D1 (de
Inventor
Joseph Anthony Abys
Chonglun Bridgewater Fan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia of America Corp
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Application granted granted Critical
Publication of DE60015686D1 publication Critical patent/DE60015686D1/de
Publication of DE60015686T2 publication Critical patent/DE60015686T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
    • B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/619—Amorphous layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/923—Physical dimension
    • Y10S428/924—Composite
    • Y10S428/926—Thickness of individual layer specified
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/929—Electrical contact feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12875—Platinum group metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12889—Au-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12931—Co-, Fe-, or Ni-base components, alternative to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12937—Co- or Ni-base component next to Fe-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12944—Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12951—Fe-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE60015686T 1999-09-23 2000-09-11 Beschichteter Metallartikel mit mehrlagiger Oberflächenbeschichtung für Porositätsverminderung Expired - Lifetime DE60015686T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US404059 1995-03-14
US09/404,059 US6335107B1 (en) 1999-09-23 1999-09-23 Metal article coated with multilayer surface finish for porosity reduction

Publications (2)

Publication Number Publication Date
DE60015686D1 DE60015686D1 (de) 2004-12-16
DE60015686T2 true DE60015686T2 (de) 2005-12-01

Family

ID=23597974

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60015686T Expired - Lifetime DE60015686T2 (de) 1999-09-23 2000-09-11 Beschichteter Metallartikel mit mehrlagiger Oberflächenbeschichtung für Porositätsverminderung

Country Status (7)

Country Link
US (1) US6335107B1 (enExample)
EP (1) EP1086807B1 (enExample)
JP (1) JP2001152385A (enExample)
KR (1) KR100783847B1 (enExample)
DE (1) DE60015686T2 (enExample)
MY (1) MY135997A (enExample)
SG (1) SG87169A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017002472A1 (de) * 2017-03-14 2018-09-20 Diehl Metal Applications Gmbh Steckverbinder

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6667629B2 (en) * 2001-09-24 2003-12-23 Rika Electronics International, Inc. Electrical test probes and methods of making the same
JP3519726B1 (ja) 2002-11-26 2004-04-19 Ｆｃｍ株式会社 端子およびそれを有する部品
JP3519727B1 (ja) 2002-12-09 2004-04-19 Ｆｃｍ株式会社 コネクタ端子およびそれを有するコネクタ
JP3442764B1 (ja) 2002-08-22 2003-09-02 エフシーエム株式会社 コネクタ端子およびコネクタ
US6984358B2 (en) * 2002-09-13 2006-01-10 Lockheed Martin Corporation Diffusion bonding process of two-phase metal alloys
JP3519731B1 (ja) 2003-07-29 2004-04-19 Ｆｃｍ株式会社 端子、それを有する部品および製品
JP3985788B2 (ja) * 2004-01-22 2007-10-03 セイコーエプソン株式会社 電気光学装置及び電子機器
US7297397B2 (en) 2004-07-26 2007-11-20 Npa Coatings, Inc. Method for applying a decorative metal layer
US7215014B2 (en) * 2004-07-29 2007-05-08 Freescale Semiconductor, Inc. Solderable metal finish for integrated circuit package leads and method for forming
DE102004047522B3 (de) * 2004-09-28 2006-04-06 Infineon Technologies Ag Halbleiterchip mit einer Metallbeschichtungsstruktur und Verfahren zur Herstellung desselben
DE102006018765A1 (de) * 2006-04-20 2007-10-25 Infineon Technologies Ag Leistungshalbleiterbauelement, Leistungshalbleiterbauteil sowie Verfahren zu deren Herstellung
US7521128B2 (en) * 2006-05-18 2009-04-21 Xtalic Corporation Methods for the implementation of nanocrystalline and amorphous metals and alloys as coatings
US8652649B2 (en) * 2009-07-10 2014-02-18 Xtalic Corporation Coated articles and methods
JP6089341B2 (ja) * 2011-12-22 2017-03-08 オーエム産業株式会社 めっき品及びその製造方法
JP6057285B2 (ja) * 2012-10-26 2017-01-11 Ｓｈマテリアル株式会社 半導体素子搭載用基板
JP5991712B2 (ja) * 2012-10-26 2016-09-14 Ｓｈマテリアル株式会社 半導体素子搭載用基板及びその製造方法
JP6085536B2 (ja) * 2013-08-05 2017-02-22 株式会社Ｓｈカッパープロダクツ 銅条、めっき付銅条、リードフレーム及びｌｅｄモジュール
JP6181581B2 (ja) * 2014-03-10 2017-08-16 トヨタ自動車株式会社 端子接続構造、半導体装置
WO2015154807A1 (de) * 2014-04-10 2015-10-15 Kromberg & Schubert Gmbh Metallisches bauteil und herstellungsverfahren für ein metallisches bauteil
US9070392B1 (en) 2014-12-16 2015-06-30 Hutchinson Technology Incorporated Piezoelectric disk drive suspension motors having plated stiffeners
JP6689294B2 (ja) 2015-06-30 2020-04-28 ハッチンソン テクノロジー インコーポレイテッドＨｕｔｃｈｉｎｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃｏｒｐｏｒａｔｅｄ 金誘電体接合部の信頼性を向上させたディスクドライブヘッドサスペンション構造
US10998657B2 (en) 2016-03-18 2021-05-04 Apple Inc. Precious-metal-alloy contacts
DE202017001425U1 (de) 2016-03-18 2017-07-06 Apple Inc. Kontakte aus Edelmetallegierungen
ITUA20162707A1 (it) * 2016-04-19 2017-10-19 Bluclad S R L Lega Fosforo-Cobalto-Nichel e suo uso nei processi di placcatura con metalli nobili di oggetti in metallo non nobile.
KR101723975B1 (ko) * 2016-12-15 2017-04-07 주식회사 제이미크론 휴대폰 방수용 충전단자 및 이의 제조방법
US20190103693A1 (en) * 2017-09-29 2019-04-04 Apple Inc. Electrical contacts having sacrificial layer for corrosion protection
KR102148316B1 (ko) * 2018-12-11 2020-08-26 히로세코리아 주식회사 전기적 접촉 단자
WO2020217787A1 (ja) * 2019-04-22 2020-10-29 Ｎｇｋエレクトロデバイス株式会社 金属部材およびその製造方法
CN111926354A (zh) * 2020-10-12 2020-11-13 江西科技学院 一种计算机数据处理装置用电气元件及其制造方法
JP2022105401A (ja) * 2021-01-04 2022-07-14 株式会社東芝 コネクタ、コンタクトピンの接続方法、コンタクトピン、及び、記憶媒体

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3617320A (en) 1968-08-06 1971-11-02 Hooker Chemical Corp Metallizing substrates
DE1804152A1 (de) * 1968-10-19 1970-04-30 Telefunken Patent Ferromagnetisches Duennschichtspeicherelement
GB2129441B (en) * 1982-11-05 1985-12-11 Standard Telephones Cables Ltd Gold plating
EP0160761B1 (en) * 1984-05-11 1989-02-08 Burlington Industries, Inc. Amorphous transition metal alloy, thin gold coated, electrical contact
US4808967A (en) 1985-05-29 1989-02-28 Ohmega Electronics Circuit board material
JPH01132072A (ja) * 1987-11-18 1989-05-24 Yazaki Corp 端子、接点等の金メッキ部品
JPH0359972A (ja) * 1989-07-27 1991-03-14 Yazaki Corp 電気接点
US5180482A (en) 1991-07-22 1993-01-19 At&T Bell Laboratories Thermal annealing of palladium alloys
US5631094A (en) * 1994-01-28 1997-05-20 Komag, Incorporated Magnetic alloy for improved corrosion resistance and magnetic performance
US5675177A (en) 1995-06-26 1997-10-07 Lucent Technologies Inc. Ultra-thin noble metal coatings for electronic packaging
US6139977A (en) * 1998-06-10 2000-10-31 Lucent Technologies Inc. Palladium surface coating suitable for wirebonding and process for forming palladium surface coatings

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017002472A1 (de) * 2017-03-14 2018-09-20 Diehl Metal Applications Gmbh Steckverbinder

Also Published As

Publication number Publication date
JP2001152385A (ja) 2001-06-05
KR100783847B1 (ko) 2007-12-10
KR20010050575A (ko) 2001-06-15
HK1032562A1 (en) 2001-07-27
EP1086807A3 (en) 2001-10-31
MY135997A (en) 2008-07-31
DE60015686D1 (de) 2004-12-16
US6335107B1 (en) 2002-01-01
EP1086807B1 (en) 2004-11-10
SG87169A1 (en) 2002-03-19
EP1086807A2 (en) 2001-03-28

Similar Documents

Publication Publication Date Title
DE60015686T2 (de) Beschichteter Metallartikel mit mehrlagiger Oberflächenbeschichtung für Porositätsverminderung
DE60200154T2 (de) Metallischer Gegenstand mit mehrlagigem Belag
DE602004012910T2 (de) Kupferfolie für gedruckte Leiterplatten mit feinen Strukturen und Herstellungsverfahren
DE69023563T2 (de) Elektrischer Kontakt.
DE3401065A1 (de) Kupferlegierungen mit verbesserter loetfaehigkeits-haltbarkeit
DE102010012609B4 (de) Sn-plattiertes Kupfer oder Sn-plattierte Kupferlegierung mit hervorragender Wärmebeständigkeit und Herstellungsverfahren dafür
DE60201542T2 (de) Verbesserte weichlötwerkstoffe
DE69722476T2 (de) Schnittstelle für Anzeigevorrichtung
DE69834768T2 (de) Universelle Oberflächenendbeschichtung für DCA, SMT und Kontaktfläche-auf-Kontaktfläche-Zwischenverbindungen
DE69408432T2 (de) Keramisches Mehrschichtschaltungssubstrat, Verfahren zu seiner Herstellung und elektrisch leitfähiges Material zur Verwendung in keramischem Mehrschichtschaltungssubstrat
DE102006017042B4 (de) Zuleitungsrahmen für ein Halbleiterbauteil
DE69705262T2 (de) Verfahren zur Beschichtung eines Gegenstandes mit einer konformen Nickelbeschichtung
DE69121143T2 (de) Kupferfolie für Innenlageschaltung einer mehrlagigen Leiterplatte, Verfahren zu ihrer Herstellung und diese enthaltende mehrlagige Leiterplatte
DE3016132A1 (de) Verfahren zur herstellung von gegen hitzeschockeinwirkung widerstandsfaehigen gedruckten schaltungen
DE602004001790T2 (de) Kupferfolie für Chip-on-Film-Verwendung
DE69830091T2 (de) Chip-Vielschichtlaminat-Varistor und Verfahren zu seiner Herstellung
DE3838971C2 (enExample)
EP1047523B1 (de) Verfahren zur herstellung eines bleifreien substrates
EP0033644A1 (en) Intermetallic connector finishes
DE3341522C2 (de) Gold-Metallisierungs-Zusammensetzung für dicke Filme
EP0088220B1 (de) Kontaktelement und Verfahren zu dessen Herstellung
DE112022004206T5 (de) Anschlussmaterial mit Plattierungsschicht und Kupferblech für das Anschlussmaterial
DE102006032074B3 (de) Bauelement und zugehöriger Anschlussdraht
DE69030458T2 (de) Gerät mit elektrischen Kontakten
DE69601021T2 (de) Anschlussrahmen für elektroakustische Wandler und elektroakustischer Wandler

Legal Events

Date Code Title Description
8364 No opposition during term of opposition