JP2001118904A - ロードロック室を備えた基板処理装置および被処理基板の搬送方法 - Google Patents

ロードロック室を備えた基板処理装置および被処理基板の搬送方法

Info

Publication number
JP2001118904A
JP2001118904A JP29609499A JP29609499A JP2001118904A JP 2001118904 A JP2001118904 A JP 2001118904A JP 29609499 A JP29609499 A JP 29609499A JP 29609499 A JP29609499 A JP 29609499A JP 2001118904 A JP2001118904 A JP 2001118904A
Authority
JP
Japan
Prior art keywords
load lock
wafer
atmosphere
substrate
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP29609499A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001118904A5 (https=
Inventor
Makoto Eto
良 江渡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP29609499A priority Critical patent/JP2001118904A/ja
Priority to US09/691,068 priority patent/US6805748B1/en
Publication of JP2001118904A publication Critical patent/JP2001118904A/ja
Publication of JP2001118904A5 publication Critical patent/JP2001118904A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/18—Vacuum control means
    • H01J2237/184—Vacuum locks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/31701—Ion implantation

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Drying Of Semiconductors (AREA)
JP29609499A 1999-10-19 1999-10-19 ロードロック室を備えた基板処理装置および被処理基板の搬送方法 Withdrawn JP2001118904A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP29609499A JP2001118904A (ja) 1999-10-19 1999-10-19 ロードロック室を備えた基板処理装置および被処理基板の搬送方法
US09/691,068 US6805748B1 (en) 1999-10-19 2000-10-19 Substrate processing system with load-lock chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29609499A JP2001118904A (ja) 1999-10-19 1999-10-19 ロードロック室を備えた基板処理装置および被処理基板の搬送方法

Publications (2)

Publication Number Publication Date
JP2001118904A true JP2001118904A (ja) 2001-04-27
JP2001118904A5 JP2001118904A5 (https=) 2004-11-18

Family

ID=17829059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29609499A Withdrawn JP2001118904A (ja) 1999-10-19 1999-10-19 ロードロック室を備えた基板処理装置および被処理基板の搬送方法

Country Status (2)

Country Link
US (1) US6805748B1 (https=)
JP (1) JP2001118904A (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003109995A (ja) * 2001-09-28 2003-04-11 Hitachi Kokusai Electric Inc 基板処理方法
JP2004273646A (ja) * 2003-03-06 2004-09-30 Canon Inc ロードロック室、処理システム及び処理方法
US7024266B2 (en) 2001-07-27 2006-04-04 Canon Kabushiki Kaisha Substrate processing apparatus, method of controlling substrate, and exposure apparatus
US7276097B2 (en) 2003-03-25 2007-10-02 Canon Kabushiki Kaisha Load-lock system, exposure processing system, and device manufacturing method
US7359031B2 (en) 2003-03-11 2008-04-15 Asml Netherlands B.V. Lithographic projection assembly, load lock and method for transferring objects
US7576831B2 (en) 2003-03-11 2009-08-18 Asml Netherlands B.V. Method and apparatus for maintaining a machine part
JP2010161169A (ja) * 2009-01-07 2010-07-22 Ulvac Japan Ltd 真空処理装置、真空処理方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4564742B2 (ja) * 2003-12-03 2010-10-20 キヤノン株式会社 露光装置及びデバイス製造方法
JP2006245257A (ja) * 2005-03-03 2006-09-14 Canon Inc 処理装置、当該処理装置を有する露光装置、保護機構
CN113140483A (zh) * 2021-03-03 2021-07-20 上海璞芯科技有限公司 一种晶圆的传片方法和传片平台
US20250210378A1 (en) * 2023-12-20 2025-06-26 Axcelis Technologies, Inc. System and method for dynamic loadlock pressure control

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5607511A (en) 1992-02-21 1997-03-04 International Business Machines Corporation Method and apparatus for low temperature, low pressure chemical vapor deposition of epitaxial silicon layers
US5044314A (en) 1986-10-15 1991-09-03 Advantage Production Technology, Inc. Semiconductor wafer processing apparatus
JPH01268859A (ja) 1988-04-20 1989-10-26 Casio Comput Co Ltd 透明導電膜の形成方法および形成装置
JPH04277025A (ja) * 1991-03-06 1992-10-02 Hitachi Ltd 真空処理装置
JP2933403B2 (ja) 1991-03-15 1999-08-16 株式会社日立製作所 半導体パッケージ気密封止方法及び半導体パッケージ気密封止装置
JP3054900B2 (ja) 1993-03-10 2000-06-19 セイコーインスツルメンツ株式会社 微細加工装置
KR100267617B1 (ko) 1993-04-23 2000-10-16 히가시 데쓰로 진공처리장치 및 진공처리방법
JP3386651B2 (ja) 1996-04-03 2003-03-17 株式会社東芝 半導体装置の製造方法および半導体製造装置
JP3737570B2 (ja) * 1996-07-30 2006-01-18 大日本スクリーン製造株式会社 基板処理装置
US5943230A (en) * 1996-12-19 1999-08-24 Applied Materials, Inc. Computer-implemented inter-chamber synchronization in a multiple chamber substrate processing system
US5837059A (en) * 1997-07-11 1998-11-17 Brooks Automation, Inc. Automatic positive pressure seal access door
US6275744B1 (en) 1997-08-01 2001-08-14 Kokusai Electric Co., Ltd. Substrate feed control
WO1999022403A1 (en) * 1997-10-24 1999-05-06 Memc Electronic Materials, Inc. Process and apparatus for preparation of epitaxial silicon layers free of grown-in defects
US6086952A (en) 1998-06-15 2000-07-11 Applied Materials, Inc. Chemical vapor deposition of a copolymer of p-xylylene and a multivinyl silicon/oxygen comonomer
US6110232A (en) * 1998-10-01 2000-08-29 Taiwan Semiconductor Manufacturing Company, Ltd. Method for preventing corrosion in load-lock chambers
US6468384B1 (en) 2000-11-09 2002-10-22 Novellus Systems, Inc. Predictive wafer temperature control system and method
JP4616983B2 (ja) 2000-11-22 2011-01-19 キヤノン株式会社 位置検出装置、該検出装置を用いた投影露光装置及びデバイス製造方法
US6508062B2 (en) 2001-01-31 2003-01-21 Applied Materials, Inc. Thermal exchanger for a wafer chuck
US6672864B2 (en) 2001-08-31 2004-01-06 Applied Materials, Inc. Method and apparatus for processing substrates in a system having high and low pressure areas

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7024266B2 (en) 2001-07-27 2006-04-04 Canon Kabushiki Kaisha Substrate processing apparatus, method of controlling substrate, and exposure apparatus
JP2003109995A (ja) * 2001-09-28 2003-04-11 Hitachi Kokusai Electric Inc 基板処理方法
JP2004273646A (ja) * 2003-03-06 2004-09-30 Canon Inc ロードロック室、処理システム及び処理方法
US7236229B2 (en) 2003-03-06 2007-06-26 Canon Kabushiki Kaisha Load lock chamber, processing system
US7359031B2 (en) 2003-03-11 2008-04-15 Asml Netherlands B.V. Lithographic projection assembly, load lock and method for transferring objects
US7576831B2 (en) 2003-03-11 2009-08-18 Asml Netherlands B.V. Method and apparatus for maintaining a machine part
US7878755B2 (en) 2003-03-11 2011-02-01 Asml Netherlands B.V. Load lock and method for transferring objects
US7276097B2 (en) 2003-03-25 2007-10-02 Canon Kabushiki Kaisha Load-lock system, exposure processing system, and device manufacturing method
JP2010161169A (ja) * 2009-01-07 2010-07-22 Ulvac Japan Ltd 真空処理装置、真空処理方法

Also Published As

Publication number Publication date
US6805748B1 (en) 2004-10-19

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