JP2001035760A - 半導体生産ベイを自動的に管理するためのシステム、方法及び記録媒体 - Google Patents

半導体生産ベイを自動的に管理するためのシステム、方法及び記録媒体

Info

Publication number
JP2001035760A
JP2001035760A JP2000150555A JP2000150555A JP2001035760A JP 2001035760 A JP2001035760 A JP 2001035760A JP 2000150555 A JP2000150555 A JP 2000150555A JP 2000150555 A JP2000150555 A JP 2000150555A JP 2001035760 A JP2001035760 A JP 2001035760A
Authority
JP
Japan
Prior art keywords
cassette
data
lot
equipment
real
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000150555A
Other languages
English (en)
Japanese (ja)
Inventor
Myung-Seung Son
明 昇 孫
湲 秀 ▲チョ▼
Won-Soo Cho
Jin-Ho Jang
鎭 浩 張
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
Original Assignee
Hyundai Electronics Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Electronics Industries Co Ltd filed Critical Hyundai Electronics Industries Co Ltd
Publication of JP2001035760A publication Critical patent/JP2001035760A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32074—History of operation of each machine
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32196—Store audit, history of inspection, control and workpiece data into database
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/35—Nc in input of data, input till input file format
    • G05B2219/35291—Record history, log, journal, audit of machine operation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • General Factory Administration (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control By Computers (AREA)
JP2000150555A 1999-05-20 2000-05-22 半導体生産ベイを自動的に管理するためのシステム、方法及び記録媒体 Pending JP2001035760A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1999/P18261 1999-05-20
KR1019990018261A KR100303322B1 (ko) 1999-05-20 1999-05-20 반도체 라인 관리를 위한 통합 자동화 시스템 및 그 방법

Publications (1)

Publication Number Publication Date
JP2001035760A true JP2001035760A (ja) 2001-02-09

Family

ID=19586791

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000150555A Pending JP2001035760A (ja) 1999-05-20 2000-05-22 半導体生産ベイを自動的に管理するためのシステム、方法及び記録媒体

Country Status (9)

Country Link
JP (1) JP2001035760A (fr)
KR (1) KR100303322B1 (fr)
CN (1) CN1213367C (fr)
DE (1) DE10024735A1 (fr)
FR (1) FR2793916B1 (fr)
GB (1) GB2352058B (fr)
IT (1) IT1317658B1 (fr)
NL (1) NL1015251A1 (fr)
TW (1) TW482967B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006237365A (ja) * 2005-02-25 2006-09-07 Agilent Technol Inc 半導体特性評価装置の管理方法及びそのプログラム

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JP2001176763A (ja) * 1999-12-14 2001-06-29 Nec Corp 製品ウェハを含む非製品ウェハの自動化処理方法ならびにシステム及び同方法が記録された記録媒体
WO2002095515A1 (fr) * 2001-05-24 2002-11-28 Yamatake Corporation Unite de commande de procede, dispositif de recueil d'informations relatives a un produit et programme de traçage de procede
ITBO20010330A1 (it) * 2001-05-25 2002-11-25 Gd Spa Metodo per la stima dell'efficienza di una macchina automatica
US7123974B1 (en) * 2002-11-19 2006-10-17 Rockwell Software Inc. System and methodology providing audit recording and tracking in real time industrial controller environment
KR100520062B1 (ko) * 2003-03-11 2005-10-11 삼성전자주식회사 자동반송시스템 및 그 제어방법
US6931303B2 (en) * 2003-10-02 2005-08-16 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated transport system
JP4673548B2 (ja) * 2003-11-12 2011-04-20 東京エレクトロン株式会社 基板処理装置及びその制御方法
JP2005294754A (ja) * 2004-04-05 2005-10-20 Toshiba Corp 電子ビーム描画装置、電子ビーム描画方法、電子ビーム描画プログラム及び直接描画方式を用いた半導体装置の製造方法
US7206653B1 (en) * 2005-11-29 2007-04-17 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer-based planning methods and systems for batch-based processing tools
KR100755136B1 (ko) 2005-12-28 2007-09-04 동부일렉트로닉스 주식회사 제조실행 시스템에서 그룹별 반도체 제품군의 공정상태파악방법
CN102422233B (zh) * 2010-02-18 2014-04-30 新日铁住金株式会社 操作指导设定支援装置、操作支援系统
TWI571908B (zh) * 2014-08-15 2017-02-21 力晶科技股份有限公司 製程控制方法與製程控制系統
CN109240224B (zh) * 2018-08-17 2022-04-15 张家港康得新光电材料有限公司 一种收料方法、装置、设备及存储介质
CN110290194A (zh) * 2019-06-20 2019-09-27 苏州工业园区恒越自动化科技有限公司 一种基于semi标准的secs通信方法
CN114924536B (zh) * 2022-05-26 2024-01-30 江苏泰治科技股份有限公司 一种光伏电池片生产控制方法

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US4974166A (en) * 1987-05-18 1990-11-27 Asyst Technologies, Inc. Processing systems with intelligent article tracking
JP3309997B2 (ja) * 1991-09-05 2002-07-29 株式会社日立製作所 複合処理装置
JP2724082B2 (ja) * 1992-12-18 1998-03-09 シャープ株式会社 Ｖｌｓｉプロセスのデータ解析支援システム
JPH06203040A (ja) * 1992-12-28 1994-07-22 Honda Motor Co Ltd 製造経歴管理システム
JPH06338552A (ja) * 1993-05-31 1994-12-06 Sony Corp 半導体シミュレーション装置
IT1272036B (it) * 1993-11-05 1997-06-11 Marelli Autronica Sistema di registraziome per una linea di produzione.
US5654896A (en) * 1994-10-31 1997-08-05 Ixys Corp Performance prediction method for semiconductor power modules and ICS
US5591299A (en) * 1995-04-28 1997-01-07 Advanced Micro Devices, Inc. System for providing integrated monitoring, control and diagnostics functions for semiconductor spray process tools
US5659467A (en) * 1996-06-26 1997-08-19 Texas Instruments Incorporated Multiple model supervisor control system and method of operation
JP2800795B2 (ja) * 1996-08-05 1998-09-21 日本電気株式会社 生産制御方法及び生産制御装置
KR100211671B1 (ko) * 1996-11-11 1999-08-02 윤종용 반도체 제조장비의 관리시스템 및 관리방법
US5862054A (en) * 1997-02-20 1999-01-19 Taiwan Semiconductor Manufacturing Company, Ltd. Process monitoring system for real time statistical process control
KR19980068469A (ko) * 1997-02-20 1998-10-15 김광호 반도체 설비 통합 제어시스템
KR19980074797A (ko) * 1997-03-27 1998-11-05 윤종용 반도체 제조용 설비의 관리방법
JPH10335193A (ja) * 1997-05-30 1998-12-18 Toshiba Corp 製造工程仕様作成運営システム、プロセスデータ作成システム及び半導体装置の製造方法
WO2000036479A1 (fr) * 1998-12-16 2000-06-22 Speedfam-Ipec Corporation Gestionnaire virtuel d'equipements

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006237365A (ja) * 2005-02-25 2006-09-07 Agilent Technol Inc 半導体特性評価装置の管理方法及びそのプログラム

Also Published As

Publication number Publication date
TW482967B (en) 2002-04-11
KR100303322B1 (ko) 2001-09-26
NL1015251C2 (fr) 2004-10-19
GB0012374D0 (en) 2000-07-12
GB2352058A (en) 2001-01-17
DE10024735A1 (de) 2001-02-01
ITMI20001128A0 (it) 2000-05-22
FR2793916B1 (fr) 2005-06-03
CN1213367C (zh) 2005-08-03
NL1015251A1 (nl) 2000-11-21
KR20000074361A (ko) 2000-12-15
FR2793916A1 (fr) 2000-11-24
IT1317658B1 (it) 2003-07-15
GB2352058B (en) 2003-08-13
CN1278621A (zh) 2001-01-03
ITMI20001128A1 (it) 2001-11-22

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