TW482967B - System and method for automatically managing semiconductor production bays - Google Patents

System and method for automatically managing semiconductor production bays Download PDF

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Publication number
TW482967B
TW482967B TW089109913A TW89109913A TW482967B TW 482967 B TW482967 B TW 482967B TW 089109913 A TW089109913 A TW 089109913A TW 89109913 A TW89109913 A TW 89109913A TW 482967 B TW482967 B TW 482967B
Authority
TW
Taiwan
Prior art keywords
batch
data
cassette
equipment
control device
Prior art date
Application number
TW089109913A
Other languages
English (en)
Chinese (zh)
Inventor
Myung-Seung Son
Won-Soo Cho
Jin-Ho Jang
Original Assignee
Hyundai Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Electronics Ind filed Critical Hyundai Electronics Ind
Application granted granted Critical
Publication of TW482967B publication Critical patent/TW482967B/zh

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Classifications

    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32074History of operation of each machine
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32196Store audit, history of inspection, control and workpiece data into database
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/35Nc in input of data, input till input file format
    • G05B2219/35291Record history, log, journal, audit of machine operation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • General Factory Administration (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control By Computers (AREA)
TW089109913A 1999-05-20 2000-05-23 System and method for automatically managing semiconductor production bays TW482967B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019990018261A KR100303322B1 (ko) 1999-05-20 1999-05-20 반도체 라인 관리를 위한 통합 자동화 시스템 및 그 방법

Publications (1)

Publication Number Publication Date
TW482967B true TW482967B (en) 2002-04-11

Family

ID=19586791

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089109913A TW482967B (en) 1999-05-20 2000-05-23 System and method for automatically managing semiconductor production bays

Country Status (9)

Country Link
JP (1) JP2001035760A (fr)
KR (1) KR100303322B1 (fr)
CN (1) CN1213367C (fr)
DE (1) DE10024735A1 (fr)
FR (1) FR2793916B1 (fr)
GB (1) GB2352058B (fr)
IT (1) IT1317658B1 (fr)
NL (1) NL1015251A1 (fr)
TW (1) TW482967B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI571908B (zh) * 2014-08-15 2017-02-21 力晶科技股份有限公司 製程控制方法與製程控制系統

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JP2001176763A (ja) * 1999-12-14 2001-06-29 Nec Corp 製品ウェハを含む非製品ウェハの自動化処理方法ならびにシステム及び同方法が記録された記録媒体
EP1391796A4 (fr) * 2001-05-24 2007-08-08 Yamatake Corp Unite de commande de procede, dispositif de recueil d'informations relatives a un produit et programme de tra age de procede
ITBO20010330A1 (it) 2001-05-25 2002-11-25 Gd Spa Metodo per la stima dell'efficienza di una macchina automatica
US7123974B1 (en) 2002-11-19 2006-10-17 Rockwell Software Inc. System and methodology providing audit recording and tracking in real time industrial controller environment
KR100520062B1 (ko) * 2003-03-11 2005-10-11 삼성전자주식회사 자동반송시스템 및 그 제어방법
US6931303B2 (en) * 2003-10-02 2005-08-16 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated transport system
JP4673548B2 (ja) * 2003-11-12 2011-04-20 東京エレクトロン株式会社 基板処理装置及びその制御方法
JP2005294754A (ja) * 2004-04-05 2005-10-20 Toshiba Corp 電子ビーム描画装置、電子ビーム描画方法、電子ビーム描画プログラム及び直接描画方式を用いた半導体装置の製造方法
JP2006237365A (ja) * 2005-02-25 2006-09-07 Agilent Technol Inc 半導体特性評価装置の管理方法及びそのプログラム
US7206653B1 (en) * 2005-11-29 2007-04-17 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer-based planning methods and systems for batch-based processing tools
KR100755136B1 (ko) 2005-12-28 2007-09-04 동부일렉트로닉스 주식회사 제조실행 시스템에서 그룹별 반도체 제품군의 공정상태파악방법
KR101251855B1 (ko) * 2010-02-18 2013-04-10 신닛테츠스미킨 카부시키카이샤 조업 가이던스 설정 지원 장치, 조업 지원 시스템, 및 컴퓨터 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체
CN109240224B (zh) * 2018-08-17 2022-04-15 张家港康得新光电材料有限公司 一种收料方法、装置、设备及存储介质
CN110290194A (zh) * 2019-06-20 2019-09-27 苏州工业园区恒越自动化科技有限公司 一种基于semi标准的secs通信方法
CN114924536B (zh) * 2022-05-26 2024-01-30 江苏泰治科技股份有限公司 一种光伏电池片生产控制方法

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JP3309997B2 (ja) * 1991-09-05 2002-07-29 株式会社日立製作所 複合処理装置
JP2724082B2 (ja) * 1992-12-18 1998-03-09 シャープ株式会社 Vlsiプロセスのデータ解析支援システム
JPH06203040A (ja) * 1992-12-28 1994-07-22 Honda Motor Co Ltd 製造経歴管理システム
JPH06338552A (ja) * 1993-05-31 1994-12-06 Sony Corp 半導体シミュレーション装置
IT1272036B (it) * 1993-11-05 1997-06-11 Marelli Autronica Sistema di registraziome per una linea di produzione.
US5654896A (en) * 1994-10-31 1997-08-05 Ixys Corp Performance prediction method for semiconductor power modules and ICS
US5591299A (en) * 1995-04-28 1997-01-07 Advanced Micro Devices, Inc. System for providing integrated monitoring, control and diagnostics functions for semiconductor spray process tools
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JP2800795B2 (ja) * 1996-08-05 1998-09-21 日本電気株式会社 生産制御方法及び生産制御装置
KR100211671B1 (ko) * 1996-11-11 1999-08-02 윤종용 반도체 제조장비의 관리시스템 및 관리방법
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JPH10335193A (ja) * 1997-05-30 1998-12-18 Toshiba Corp 製造工程仕様作成運営システム、プロセスデータ作成システム及び半導体装置の製造方法
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI571908B (zh) * 2014-08-15 2017-02-21 力晶科技股份有限公司 製程控制方法與製程控制系統
US9864363B2 (en) 2014-08-15 2018-01-09 Powerchip Technology Corporation Process control method and process control system

Also Published As

Publication number Publication date
JP2001035760A (ja) 2001-02-09
GB0012374D0 (en) 2000-07-12
KR20000074361A (ko) 2000-12-15
NL1015251C2 (fr) 2004-10-19
CN1213367C (zh) 2005-08-03
KR100303322B1 (ko) 2001-09-26
ITMI20001128A1 (it) 2001-11-22
NL1015251A1 (nl) 2000-11-21
FR2793916A1 (fr) 2000-11-24
IT1317658B1 (it) 2003-07-15
ITMI20001128A0 (it) 2000-05-22
DE10024735A1 (de) 2001-02-01
CN1278621A (zh) 2001-01-03
GB2352058A (en) 2001-01-17
FR2793916B1 (fr) 2005-06-03
GB2352058B (en) 2003-08-13

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