JP2000349300A5 - - Google Patents

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Publication number
JP2000349300A5
JP2000349300A5 JP2000090797A JP2000090797A JP2000349300A5 JP 2000349300 A5 JP2000349300 A5 JP 2000349300A5 JP 2000090797 A JP2000090797 A JP 2000090797A JP 2000090797 A JP2000090797 A JP 2000090797A JP 2000349300 A5 JP2000349300 A5 JP 2000349300A5
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JP
Japan
Prior art keywords
film
contact hole
organic resin
insulating film
conductive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000090797A
Other languages
English (en)
Japanese (ja)
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JP2000349300A (ja
JP4260334B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2000090797A priority Critical patent/JP4260334B2/ja
Priority claimed from JP2000090797A external-priority patent/JP4260334B2/ja
Publication of JP2000349300A publication Critical patent/JP2000349300A/ja
Publication of JP2000349300A5 publication Critical patent/JP2000349300A5/ja
Application granted granted Critical
Publication of JP4260334B2 publication Critical patent/JP4260334B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000090797A 1999-03-29 2000-03-29 半導体装置の作製方法 Expired - Fee Related JP4260334B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000090797A JP4260334B2 (ja) 1999-03-29 2000-03-29 半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11-87017 1999-03-29
JP8701799 1999-03-29
JP2000090797A JP4260334B2 (ja) 1999-03-29 2000-03-29 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2000349300A JP2000349300A (ja) 2000-12-15
JP2000349300A5 true JP2000349300A5 (enrdf_load_stackoverflow) 2005-09-08
JP4260334B2 JP4260334B2 (ja) 2009-04-30

Family

ID=26428335

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000090797A Expired - Fee Related JP4260334B2 (ja) 1999-03-29 2000-03-29 半導体装置の作製方法

Country Status (1)

Country Link
JP (1) JP4260334B2 (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4674994B2 (ja) * 2000-05-29 2011-04-20 株式会社半導体エネルギー研究所 電気光学装置の作製方法
KR100803177B1 (ko) * 2001-05-14 2008-02-14 삼성전자주식회사 액정표시장치용 박막 트랜지스터 및 그 제조방법
JP2005085884A (ja) 2003-09-05 2005-03-31 Rohm Co Ltd 半導体装置およびその製造方法
JP5891846B2 (ja) * 2012-02-24 2016-03-23 富士通セミコンダクター株式会社 半導体装置の製造方法
JP5835696B2 (ja) * 2012-09-05 2015-12-24 株式会社東芝 半導体装置およびその製造方法
CN105470197B (zh) * 2016-01-28 2018-03-06 武汉华星光电技术有限公司 低温多晶硅阵列基板的制作方法
JP7054797B2 (ja) * 2017-11-28 2022-04-15 パナソニックIpマネジメント株式会社 半導体装置およびその製造方法
JP7061941B2 (ja) * 2018-08-06 2022-05-02 東京エレクトロン株式会社 エッチング方法及び半導体デバイスの製造方法
CN210110300U (zh) * 2019-08-16 2020-02-21 北京京东方技术开发有限公司 像素驱动电路、阵列基板和显示装置
CN111679454B (zh) * 2020-06-19 2023-07-07 联合微电子中心有限责任公司 半导体器件的制备方法

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