JP2000282033A5 - - Google Patents

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Publication number
JP2000282033A5
JP2000282033A5 JP1999342802A JP34280299A JP2000282033A5 JP 2000282033 A5 JP2000282033 A5 JP 2000282033A5 JP 1999342802 A JP1999342802 A JP 1999342802A JP 34280299 A JP34280299 A JP 34280299A JP 2000282033 A5 JP2000282033 A5 JP 2000282033A5
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JP
Japan
Prior art keywords
metal
metal layer
metal surface
treating agent
aqueous solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1999342802A
Other languages
English (en)
Japanese (ja)
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JP2000282033A (ja
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Publication date
Application filed filed Critical
Priority to JP34280299A priority Critical patent/JP2000282033A/ja
Priority claimed from JP34280299A external-priority patent/JP2000282033A/ja
Publication of JP2000282033A publication Critical patent/JP2000282033A/ja
Publication of JP2000282033A5 publication Critical patent/JP2000282033A5/ja
Pending legal-status Critical Current

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JP34280299A 1999-01-25 1999-12-02 金属表面処理剤及び金属層の表面処理方法 Pending JP2000282033A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34280299A JP2000282033A (ja) 1999-01-25 1999-12-02 金属表面処理剤及び金属層の表面処理方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11-15134 1999-01-25
JP1513499 1999-01-25
JP34280299A JP2000282033A (ja) 1999-01-25 1999-12-02 金属表面処理剤及び金属層の表面処理方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2007237141A Division JP2008063662A (ja) 1999-01-25 2007-09-12 金属表面処理剤及び金属層の表面処理方法
JP2007237140A Division JP2008045215A (ja) 1999-01-25 2007-09-12 金属表面処理剤及び金属層の表面処理方法

Publications (2)

Publication Number Publication Date
JP2000282033A JP2000282033A (ja) 2000-10-10
JP2000282033A5 true JP2000282033A5 (enrdf_load_stackoverflow) 2008-01-17

Family

ID=26351234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34280299A Pending JP2000282033A (ja) 1999-01-25 1999-12-02 金属表面処理剤及び金属層の表面処理方法

Country Status (1)

Country Link
JP (1) JP2000282033A (enrdf_load_stackoverflow)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4489409B2 (ja) * 2003-11-10 2010-06-23 大日本印刷株式会社 Ｉｃカード用ｉｃモジュールの形成方法とｉｃカード用ｉｃモジュール
KR100817973B1 (ko) * 2004-02-05 2008-03-31 닛코킨조쿠 가부시키가이샤 금속의 표면처리제
JP4706690B2 (ja) 2007-11-05 2011-06-22 パナソニック電工株式会社 回路基板及びその製造方法
TWI453301B (zh) * 2007-11-08 2014-09-21 Enthone 浸鍍銀塗層上的自組分子
DE102007059726B4 (de) * 2007-12-12 2010-01-07 Excor Korrosionsforschung Gmbh Dampfphasen-Korrosionsinhibitoren, Verfahren zu deren Herstellung und deren Verwendung
JP5463539B2 (ja) * 2008-10-31 2014-04-09 国立大学法人東京工業大学 導電性の液体中における電極の電流測定方法及び電流測定装置
JP5464284B1 (ja) 2013-01-10 2014-04-09 株式会社オートネットワーク技術研究所 コネクタ端子及びコネクタ端子の製造方法
WO2015159328A1 (ja) 2014-04-15 2015-10-22 株式会社Ｊｏｌｅｄ 薄膜トランジスタ基板の製造方法
JP6149811B2 (ja) * 2014-06-27 2017-06-21 住友金属鉱山株式会社 Ｌｅｄパッケージ用金属部材の製造方法
JP7608918B2 (ja) * 2021-03-24 2025-01-07 株式会社オートネットワーク技術研究所 電気接続部材用材料および電気接続部材
CN113106460B (zh) * 2021-04-15 2022-09-20 深圳市钝化技术有限公司 一种耐高温可导电的铜合金保护剂及制备方法和铜合金钝化方法

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