JP2000212749A5 - - Google Patents

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Publication number
JP2000212749A5
JP2000212749A5 JP1999013791A JP1379199A JP2000212749A5 JP 2000212749 A5 JP2000212749 A5 JP 2000212749A5 JP 1999013791 A JP1999013791 A JP 1999013791A JP 1379199 A JP1379199 A JP 1379199A JP 2000212749 A5 JP2000212749 A5 JP 2000212749A5
Authority
JP
Japan
Prior art keywords
reaction vessel
reaction
substrate
generated
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1999013791A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000212749A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP11013791A priority Critical patent/JP2000212749A/ja
Priority claimed from JP11013791A external-priority patent/JP2000212749A/ja
Priority to KR1019990062682A priority patent/KR100630647B1/ko
Priority to TW088123340A priority patent/TW579393B/zh
Priority to DE60027935T priority patent/DE60027935T2/de
Priority to EP00100937A priority patent/EP1024210B1/en
Priority to US09/489,338 priority patent/US6312761B1/en
Publication of JP2000212749A publication Critical patent/JP2000212749A/ja
Priority to US09/912,504 priority patent/US20020000199A1/en
Publication of JP2000212749A5 publication Critical patent/JP2000212749A5/ja
Pending legal-status Critical Current

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JP11013791A 1999-01-22 1999-01-22 薄膜形成装置、及び窒化タングステン薄膜製造方法 Pending JP2000212749A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP11013791A JP2000212749A (ja) 1999-01-22 1999-01-22 薄膜形成装置、及び窒化タングステン薄膜製造方法
KR1019990062682A KR100630647B1 (ko) 1999-01-22 1999-12-27 박막형성장치, 및 질화텅스텐 박막 제조방법
TW088123340A TW579393B (en) 1999-01-22 1999-12-30 Thin film forming device and production of tungsten nitride thin film
DE60027935T DE60027935T2 (de) 1999-01-22 2000-01-18 Vorrichtung und Verfahren zur Herstellung einer Wolframnitridschicht
EP00100937A EP1024210B1 (en) 1999-01-22 2000-01-18 Apparatus and method for producing tungsten nitride film
US09/489,338 US6312761B1 (en) 1999-01-22 2000-01-21 Film forming method for processing tungsten nitride film
US09/912,504 US20020000199A1 (en) 1999-01-22 2001-07-26 Film forming apparatus and method for producing tungsten nitride film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11013791A JP2000212749A (ja) 1999-01-22 1999-01-22 薄膜形成装置、及び窒化タングステン薄膜製造方法

Publications (2)

Publication Number Publication Date
JP2000212749A JP2000212749A (ja) 2000-08-02
JP2000212749A5 true JP2000212749A5 (enExample) 2005-11-04

Family

ID=11843083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11013791A Pending JP2000212749A (ja) 1999-01-22 1999-01-22 薄膜形成装置、及び窒化タングステン薄膜製造方法

Country Status (6)

Country Link
US (2) US6312761B1 (enExample)
EP (1) EP1024210B1 (enExample)
JP (1) JP2000212749A (enExample)
KR (1) KR100630647B1 (enExample)
DE (1) DE60027935T2 (enExample)
TW (1) TW579393B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6635570B1 (en) * 1999-09-30 2003-10-21 Carl J. Galewski PECVD and CVD processes for WNx deposition
JP2002085950A (ja) * 2000-09-18 2002-03-26 Horiba Ltd 流体混合装置
WO2004061154A1 (ja) 2002-12-27 2004-07-22 Ulvac Inc. 窒化タングステン膜の成膜方法
CN100370585C (zh) 2004-04-12 2008-02-20 株式会社爱发科 隔离膜的形成方法及电极膜的形成方法
US7420227B2 (en) * 2005-06-22 2008-09-02 National Chiao Tung University Cu-metalized compound semiconductor device
US8148564B2 (en) * 2006-08-30 2012-04-03 Wayne State University Compounds for forming metal nitrides
US7939447B2 (en) 2007-10-26 2011-05-10 Asm America, Inc. Inhibitors for selective deposition of silicon containing films
US7655543B2 (en) 2007-12-21 2010-02-02 Asm America, Inc. Separate injection of reactive species in selective formation of films
JP4523661B1 (ja) * 2009-03-10 2010-08-11 三井造船株式会社 原子層堆積装置及び薄膜形成方法
US8486191B2 (en) 2009-04-07 2013-07-16 Asm America, Inc. Substrate reactor with adjustable injectors for mixing gases within reaction chamber
US9499905B2 (en) * 2011-07-22 2016-11-22 Applied Materials, Inc. Methods and apparatus for the deposition of materials on a substrate
EP2935646A4 (en) * 2012-12-21 2016-10-12 Prasad Narhar Gadgil METHOD FOR LOW TEMPERATURE DEPOSITION OF CERAMIC THIN FILMS
CN109072427B (zh) * 2016-03-25 2020-10-13 应用材料公司 用于高温处理的腔室衬垫
CN114850003B (zh) * 2021-02-03 2023-06-27 芝浦机械电子装置株式会社 加热处理装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59131511A (ja) * 1983-01-17 1984-07-28 Zenko Hirose アモルフアスシリコン膜の成膜方法
JPS62116770A (ja) * 1985-11-15 1987-05-28 Canon Inc 成膜装置
JP2859632B2 (ja) * 1988-04-14 1999-02-17 キヤノン株式会社 成膜装置及び成膜方法
JP2803297B2 (ja) * 1990-03-05 1998-09-24 日本電気株式会社 半導体装置の製造方法
KR930001300A (ko) * 1991-06-10 1993-01-16 김광호 화학 기상 박막 형성 방법 및 그 장치
US5470800A (en) * 1992-04-03 1995-11-28 Sony Corporation Method for forming an interlayer film
US5534072A (en) * 1992-06-24 1996-07-09 Anelva Corporation Integrated module multi-chamber CVD processing system and its method for processing subtrates
JP3590416B2 (ja) * 1993-11-29 2004-11-17 アネルバ株式会社 薄膜形成方法および薄膜形成装置
JP3360098B2 (ja) * 1995-04-20 2002-12-24 東京エレクトロン株式会社 処理装置のシャワーヘッド構造
JP3699504B2 (ja) * 1995-05-30 2005-09-28 アネルバ株式会社 真空処理装置

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