JP2000082661A5 - - Google Patents

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Publication number
JP2000082661A5
JP2000082661A5 JP1999081635A JP8163599A JP2000082661A5 JP 2000082661 A5 JP2000082661 A5 JP 2000082661A5 JP 1999081635 A JP1999081635 A JP 1999081635A JP 8163599 A JP8163599 A JP 8163599A JP 2000082661 A5 JP2000082661 A5 JP 2000082661A5
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JP
Japan
Prior art keywords
heating
film thickness
film
substrate
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1999081635A
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English (en)
Japanese (ja)
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JP2000082661A (ja
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Publication date
Application filed filed Critical
Priority to JP11081635A priority Critical patent/JP2000082661A/ja
Priority claimed from JP11081635A external-priority patent/JP2000082661A/ja
Priority to KR1019990025571A priority patent/KR100334301B1/ko
Priority to US09/345,749 priority patent/US6191397B1/en
Publication of JP2000082661A publication Critical patent/JP2000082661A/ja
Priority to US09/734,924 priority patent/US6441351B2/en
Priority to US10/189,480 priority patent/US6603101B2/en
Priority to US10/611,345 priority patent/US6831258B2/en
Publication of JP2000082661A5 publication Critical patent/JP2000082661A5/ja
Pending legal-status Critical Current

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JP11081635A 1998-07-02 1999-03-25 加熱装置，加熱装置の評価法及びパタ―ン形成方法 Pending JP2000082661A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP11081635A JP2000082661A (ja) 1998-07-02 1999-03-25 加熱装置，加熱装置の評価法及びパタ―ン形成方法
KR1019990025571A KR100334301B1 (ko) 1998-07-02 1999-06-30 가열 장치, 가열 장치의 평가법 및 패턴 형성 방법
US09/345,749 US6191397B1 (en) 1998-07-02 1999-07-01 Heating device, method for evaluating heating device and pattern forming method
US09/734,924 US6441351B2 (en) 1998-07-02 2000-12-13 Heating device, method for evaluating heating device and pattern forming method
US10/189,480 US6603101B2 (en) 1998-07-02 2002-07-08 Heating device, method for evaluating heating device and pattern forming method
US10/611,345 US6831258B2 (en) 1998-07-02 2003-06-30 Heating device, method for evaluating heating device and pattern forming method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10-187626 1998-07-02
JP18762698 1998-07-02
JP11081635A JP2000082661A (ja) 1998-07-02 1999-03-25 加熱装置，加熱装置の評価法及びパタ―ン形成方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008157116A Division JP4734376B2 (ja) 1998-07-02 2008-06-16 加熱装置の評価方法とパターン形成方法及び加熱装置の制御方法

Publications (2)

Publication Number Publication Date
JP2000082661A JP2000082661A (ja) 2000-03-21
JP2000082661A5 true JP2000082661A5 (enExample) 2005-08-25

Family

ID=26422639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11081635A Pending JP2000082661A (ja) 1998-07-02 1999-03-25 加熱装置，加熱装置の評価法及びパタ―ン形成方法

Country Status (3)

Country Link
US (4) US6191397B1 (enExample)
JP (1) JP2000082661A (enExample)
KR (1) KR100334301B1 (enExample)

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US7476490B2 (en) * 2004-06-25 2009-01-13 Asml Netherlands B.V. Method for producing a marker on a substrate, lithographic apparatus and device manufacturing method
JP4509820B2 (ja) 2005-02-15 2010-07-21 東京エレクトロン株式会社 熱処理板の温度設定方法，熱処理板の温度設定装置，プログラム及びプログラムを記録したコンピュータ読み取り可能な記録媒体
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KR100867191B1 (ko) * 2006-11-02 2008-11-06 주식회사 유진테크 기판처리장치 및 기판처리방법
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US8157538B2 (en) 2007-07-23 2012-04-17 Emerson Climate Technologies, Inc. Capacity modulation system for compressor and method
US8523427B2 (en) * 2008-02-27 2013-09-03 Analog Devices, Inc. Sensor device with improved sensitivity to temperature variation in a semiconductor substrate
US8150242B2 (en) * 2008-10-31 2012-04-03 Applied Materials, Inc. Use of infrared camera for real-time temperature monitoring and control
BRPI1007407A2 (pt) * 2009-01-27 2016-02-16 Emerson Climate Technologies sistema e método de descarregamento para um compressor
JP5174098B2 (ja) * 2010-08-09 2013-04-03 東京エレクトロン株式会社 熱処理方法及びその熱処理方法を実行させるためのプログラムを記録した記録媒体並びに熱処理装置
US9157730B2 (en) 2012-10-26 2015-10-13 Applied Materials, Inc. PECVD process
TWI839541B (zh) * 2019-07-19 2024-04-21 日商東京威力科創股份有限公司 基板處理裝置及處理條件調整方法
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