JP2000036502A5 - - Google Patents
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- Publication number
- JP2000036502A5 JP2000036502A5 JP1998203106A JP20310698A JP2000036502A5 JP 2000036502 A5 JP2000036502 A5 JP 2000036502A5 JP 1998203106 A JP1998203106 A JP 1998203106A JP 20310698 A JP20310698 A JP 20310698A JP 2000036502 A5 JP2000036502 A5 JP 2000036502A5
- Authority
- JP
- Japan
- Prior art keywords
- joint
- bonding
- joining
- bonding material
- spherical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 description 81
- 239000000126 substance Substances 0.000 description 20
- 239000000853 adhesive Substances 0.000 description 18
- 230000001070 adhesive Effects 0.000 description 18
- 238000005304 joining Methods 0.000 description 18
- 239000004065 semiconductor Substances 0.000 description 17
- 239000002184 metal Substances 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
- 239000011347 resin Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 239000000377 silicon dioxide Substances 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 229920001721 Polyimide Polymers 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 2
- 230000003287 optical Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 210000001503 Joints Anatomy 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10203106A JP2000036502A (ja) | 1998-07-17 | 1998-07-17 | 接合材及びその接合物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10203106A JP2000036502A (ja) | 1998-07-17 | 1998-07-17 | 接合材及びその接合物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000036502A JP2000036502A (ja) | 2000-02-02 |
| JP2000036502A5 true JP2000036502A5 (fr) | 2005-09-08 |
Family
ID=16468500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10203106A Pending JP2000036502A (ja) | 1998-07-17 | 1998-07-17 | 接合材及びその接合物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000036502A (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6806309B2 (en) * | 2002-02-28 | 2004-10-19 | Henkel Corporation | Adhesive compositions containing organic spacers and methods for use thereof |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6481237A (en) * | 1987-09-22 | 1989-03-27 | Seiko Epson Corp | Semiconductor device |
| JPH06244225A (ja) * | 1993-02-16 | 1994-09-02 | Hitachi Ltd | 半導体装置とその製法 |
| JPH06322350A (ja) * | 1993-03-17 | 1994-11-22 | Fujitsu Ltd | 導電性接着剤及びその製造方法並びに半導体チップの接着方法 |
| JP3739488B2 (ja) * | 1996-06-25 | 2006-01-25 | リンテック株式会社 | 粘接着テープおよびその使用方法 |
| JP3620156B2 (ja) * | 1996-08-07 | 2005-02-16 | 日立化成工業株式会社 | 低温接着性のフィルム状接着剤、それを用いたリードフレーム及び半導体装置 |
| JP3765331B2 (ja) * | 1996-08-07 | 2006-04-12 | 日立化成工業株式会社 | 低応力のフィルム状接着剤、それを用いたリードフレーム及び半導体装置 |
| JP3988058B2 (ja) * | 1997-02-07 | 2007-10-10 | 日立化成工業株式会社 | 半導体用樹脂組成物、半導体用接着剤、接着フィルム、これを用いたリードフレーム及び半導体装置 |
| JP4174088B2 (ja) * | 1997-07-14 | 2008-10-29 | 住友ベークライト株式会社 | 導電性樹脂ペースト及びこれを用いて製造された半導体装置 |
| JP3972440B2 (ja) * | 1998-01-30 | 2007-09-05 | 日立化成工業株式会社 | 樹脂組成物及びこれを用いた半導体装置 |
-
1998
- 1998-07-17 JP JP10203106A patent/JP2000036502A/ja active Pending
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