JP2000031185A5 - - Google Patents

Download PDF

Info

Publication number
JP2000031185A5
JP2000031185A5 JP1998195171A JP19517198A JP2000031185A5 JP 2000031185 A5 JP2000031185 A5 JP 2000031185A5 JP 1998195171 A JP1998195171 A JP 1998195171A JP 19517198 A JP19517198 A JP 19517198A JP 2000031185 A5 JP2000031185 A5 JP 2000031185A5
Authority
JP
Japan
Prior art keywords
wafer
flux
solder
semiconductor device
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998195171A
Other languages
English (en)
Japanese (ja)
Other versions
JP4343286B2 (ja
JP2000031185A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP19517198A priority Critical patent/JP4343286B2/ja
Priority claimed from JP19517198A external-priority patent/JP4343286B2/ja
Priority to TW088111432A priority patent/TW429398B/zh
Priority to KR1019990027176A priority patent/KR100572525B1/ko
Priority to US09/350,287 priority patent/US6060373A/en
Publication of JP2000031185A publication Critical patent/JP2000031185A/ja
Publication of JP2000031185A5 publication Critical patent/JP2000031185A5/ja
Application granted granted Critical
Publication of JP4343286B2 publication Critical patent/JP4343286B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP19517198A 1998-07-10 1998-07-10 半導体装置の製造方法 Expired - Lifetime JP4343286B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP19517198A JP4343286B2 (ja) 1998-07-10 1998-07-10 半導体装置の製造方法
TW088111432A TW429398B (en) 1998-07-10 1999-07-06 Method for manufacturing a flip chip semiconductor device
KR1019990027176A KR100572525B1 (ko) 1998-07-10 1999-07-07 플립 칩 반도체 장치를 제조하는 방법
US09/350,287 US6060373A (en) 1998-07-10 1999-07-09 Method for manufacturing a flip chip semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19517198A JP4343286B2 (ja) 1998-07-10 1998-07-10 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2000031185A JP2000031185A (ja) 2000-01-28
JP2000031185A5 true JP2000031185A5 (enExample) 2005-10-27
JP4343286B2 JP4343286B2 (ja) 2009-10-14

Family

ID=16336632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19517198A Expired - Lifetime JP4343286B2 (ja) 1998-07-10 1998-07-10 半導体装置の製造方法

Country Status (4)

Country Link
US (1) US6060373A (enExample)
JP (1) JP4343286B2 (enExample)
KR (1) KR100572525B1 (enExample)
TW (1) TW429398B (enExample)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6437591B1 (en) 1999-03-25 2002-08-20 Micron Technology, Inc. Test interconnect for bumped semiconductor components and method of fabrication
JP3423245B2 (ja) 1999-04-09 2003-07-07 沖電気工業株式会社 半導体装置及びその実装方法
US6258703B1 (en) * 1999-07-21 2001-07-10 International Business Machines Corporation Reflow of low melt solder tip C4's
US6352881B1 (en) 1999-07-22 2002-03-05 National Semiconductor Corporation Method and apparatus for forming an underfill adhesive layer
US6338980B1 (en) * 1999-08-13 2002-01-15 Citizen Watch Co., Ltd. Method for manufacturing chip-scale package and manufacturing IC chip
JP2001094005A (ja) * 1999-09-22 2001-04-06 Oki Electric Ind Co Ltd 半導体装置及び半導体装置の製造方法
KR100674501B1 (ko) * 1999-12-24 2007-01-25 삼성전자주식회사 플립 칩 본딩 기술을 이용한 반도체 칩 실장 방법
US6656765B1 (en) * 2000-02-02 2003-12-02 Amkor Technology, Inc. Fabricating very thin chip size semiconductor packages
US6190943B1 (en) * 2000-06-08 2001-02-20 United Test Center Inc. Chip scale packaging method
TW452873B (en) * 2000-06-21 2001-09-01 Advanced Semiconductor Eng Manufacturing method of wafer scale semiconductor package structure
JP3485525B2 (ja) * 2000-07-06 2004-01-13 沖電気工業株式会社 半導体装置の製造方法
KR100394377B1 (ko) * 2000-09-07 2003-08-14 이진구 플립칩용 범프 제조 방법
JP2002093831A (ja) * 2000-09-14 2002-03-29 Shinko Electric Ind Co Ltd 半導体装置およびその製造方法
US20020100600A1 (en) * 2001-01-26 2002-08-01 Albert Douglas M. Stackable microcircuit layer formed from a plastic encapsulated microcircuit and method of making the same
US7174627B2 (en) * 2001-01-26 2007-02-13 Irvine Sensors Corporation Method of fabricating known good dies from packaged integrated circuits
US20030221313A1 (en) * 2001-01-26 2003-12-04 Gann Keith D. Method for making stacked integrated circuits (ICs) using prepackaged parts
US6949158B2 (en) * 2001-05-14 2005-09-27 Micron Technology, Inc. Using backgrind wafer tape to enable wafer mounting of bumped wafers
US6794751B2 (en) * 2001-06-29 2004-09-21 Intel Corporation Multi-purpose planarizing/back-grind/pre-underfill arrangements for bumped wafers and dies
WO2003005782A2 (en) * 2001-07-02 2003-01-16 Irvine Sensors Corporation Stackable microcircuit and method of making the same
JP3649169B2 (ja) * 2001-08-08 2005-05-18 松下電器産業株式会社 半導体装置
JP3530158B2 (ja) * 2001-08-21 2004-05-24 沖電気工業株式会社 半導体装置及びその製造方法
US6624048B1 (en) * 2001-12-05 2003-09-23 Lsi Logic Corporation Die attach back grinding
US6908784B1 (en) 2002-03-06 2005-06-21 Micron Technology, Inc. Method for fabricating encapsulated semiconductor components
US6753482B1 (en) 2002-05-06 2004-06-22 Micron Technology, Inc. Semiconductor component with adjustment circuitry
US7423337B1 (en) 2002-08-19 2008-09-09 National Semiconductor Corporation Integrated circuit device package having a support coating for improved reliability during temperature cycling
US6903442B2 (en) 2002-08-29 2005-06-07 Micron Technology, Inc. Semiconductor component having backside pin contacts
US6638837B1 (en) * 2002-09-20 2003-10-28 Taiwan Semiconductor Manufacturing Company Method for protecting the front side of semiconductor wafers
US20050176233A1 (en) * 2002-11-15 2005-08-11 Rajeev Joshi Wafer-level chip scale package and method for fabricating and using the same
US7388294B2 (en) 2003-01-27 2008-06-17 Micron Technology, Inc. Semiconductor components having stacked dice
US7301222B1 (en) 2003-02-12 2007-11-27 National Semiconductor Corporation Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages
US6841883B1 (en) 2003-03-31 2005-01-11 Micron Technology, Inc. Multi-dice chip scale semiconductor components and wafer level methods of fabrication
JP4049035B2 (ja) * 2003-06-27 2008-02-20 株式会社デンソー 半導体装置の製造方法
JP4260617B2 (ja) * 2003-12-24 2009-04-30 株式会社ルネサステクノロジ 半導体装置の製造方法
US20050147489A1 (en) * 2003-12-24 2005-07-07 Tian-An Chen Wafer supporting system for semiconductor wafers
WO2005088696A1 (en) * 2004-02-11 2005-09-22 Infineon Technologies Ag Semiconductor package with contact support layer and method to produce the package
US7282375B1 (en) 2004-04-14 2007-10-16 National Semiconductor Corporation Wafer level package design that facilitates trimming and testing
JP4547187B2 (ja) * 2004-05-24 2010-09-22 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
KR100618543B1 (ko) * 2004-06-15 2006-08-31 삼성전자주식회사 웨이퍼 레벨 적층 패키지용 칩 스케일 패키지 제조 방법
SG130055A1 (en) 2005-08-19 2007-03-20 Micron Technology Inc Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
SG130066A1 (en) 2005-08-26 2007-03-20 Micron Technology Inc Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
CN100435300C (zh) * 2005-09-28 2008-11-19 相丰科技股份有限公司 晶片封装方式
JP2007123362A (ja) * 2005-10-25 2007-05-17 Disco Abrasive Syst Ltd デバイスの製造方法
JP2007266191A (ja) * 2006-03-28 2007-10-11 Nec Electronics Corp ウェハ処理方法
US20070238222A1 (en) 2006-03-28 2007-10-11 Harries Richard J Apparatuses and methods to enhance passivation and ILD reliability
US7838424B2 (en) * 2007-07-03 2010-11-23 Taiwan Semiconductor Manufacturing Company, Ltd. Enhanced reliability of wafer-level chip-scale packaging (WLCSP) die separation using dry etching
US9064716B2 (en) * 2009-09-30 2015-06-23 Virtium Technology, Inc. Stacking devices at finished package level
US9136144B2 (en) * 2009-11-13 2015-09-15 Stats Chippac, Ltd. Method of forming protective material between semiconductor die stacked on semiconductor wafer to reduce defects during singulation
US8642390B2 (en) 2010-03-17 2014-02-04 Taiwan Semiconductor Manufacturing Company, Ltd. Tape residue-free bump area after wafer back grinding
JP2012079910A (ja) * 2010-10-01 2012-04-19 Disco Abrasive Syst Ltd 板状物の加工方法
JP2012079911A (ja) * 2010-10-01 2012-04-19 Disco Abrasive Syst Ltd 板状物の加工方法
CN105097481A (zh) * 2014-04-24 2015-11-25 中芯国际集成电路制造(上海)有限公司 一种半导体器件的封装方法
JP7470411B2 (ja) * 2020-09-30 2024-04-18 フジコピアン株式会社 ウェーハ加工用積層体、それを用いた薄型ウェーハの製造方法及び薄型ウェーハ個片化の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2715002B1 (fr) * 1994-01-07 1996-02-16 Commissariat Energie Atomique Détecteur de rayonnement électromagnétique et son procédé de fabrication.
US5989939A (en) * 1996-12-13 1999-11-23 Tessera, Inc. Process of manufacturing compliant wirebond packages
US5909634A (en) * 1996-12-20 1999-06-01 Texas Instruments Method and apparatus for forming solder on a substrate
US5953623A (en) * 1997-04-10 1999-09-14 International Business Machines Corporation Ball limiting metal mask and tin enrichment of high melting point solder for low temperature interconnection

Similar Documents

Publication Publication Date Title
JP2000031185A5 (enExample)
JP4343286B2 (ja) 半導体装置の製造方法
KR100337412B1 (ko) 저면보호막을가진반도체웨이퍼,집적회로디바이스및그제조방법
TW511272B (en) Semiconductor device and method for fabricating the same
KR101504461B1 (ko) 반도체 웨이퍼를 개개의 반도체 다이로 개별화하는 방법
US20230057803A1 (en) Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers
JP2005533376A (ja) ウエハ上に超清浄なボンディングパッドを保つための方法およびウエハ
GB2322970A (en) Process for single mask C4 solder bump fabrication
TW200411853A (en) Semiconductor device manufacturing method
TW200522180A (en) Process for backside grinding a bumped wafer
TWI521650B (zh) 具自組彈性導線之晶圓級封裝裝置
TWI601218B (zh) 具有高溫塗層之晶片封裝構造之製造方法
JP2012015191A5 (enExample)
JPH11260808A5 (enExample)
US6500764B1 (en) Method for thinning a semiconductor substrate
CN102034720A (zh) 芯片封装方法
TW200409229A (en) Apparatus and method for fabricating semiconductor devices
JP2003124388A (ja) ウェハレベルチップスケールパッケージおよびそれを製造する方法
JP4529388B2 (ja) 半導体装置の製造方法
US20030099907A1 (en) Process of rectifying a wafer thickness
JP7592938B2 (ja) 半導体パッケージングのための構造及び方法
CN114823590A (zh) 一种扇出型晶圆级芯片的封装方法及其封装结构
JP3173464B2 (ja) 半導体装置の製造方法
JPS52104870A (en) Manufacture for semiconductor device
JP2643392B2 (ja) 半導体装置の製造方法