JP1641098S - - Google Patents

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Publication number
JP1641098S
JP1641098S JPD2018-14083F JP2018014083F JP1641098S JP 1641098 S JP1641098 S JP 1641098S JP 2018014083 F JP2018014083 F JP 2018014083F JP 1641098 S JP1641098 S JP 1641098S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2018-14083F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2018-14083F priority Critical patent/JP1641098S/ja
Priority to US29/673,188 priority patent/USD913978S1/en
Application granted granted Critical
Publication of JP1641098S publication Critical patent/JP1641098S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JPD2018-14083F 2018-06-26 2018-06-26 Active JP1641098S (US06724976-20040420-M00002.png)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2018-14083F JP1641098S (US06724976-20040420-M00002.png) 2018-06-26 2018-06-26
US29/673,188 USD913978S1 (en) 2018-06-26 2018-12-12 Semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2018-14083F JP1641098S (US06724976-20040420-M00002.png) 2018-06-26 2018-06-26

Publications (1)

Publication Number Publication Date
JP1641098S true JP1641098S (US06724976-20040420-M00002.png) 2019-09-09

Family

ID=67841861

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2018-14083F Active JP1641098S (US06724976-20040420-M00002.png) 2018-06-26 2018-06-26

Country Status (2)

Country Link
US (1) USD913978S1 (US06724976-20040420-M00002.png)
JP (1) JP1641098S (US06724976-20040420-M00002.png)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD971863S1 (en) 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD1021830S1 (en) 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1021829S1 (en) 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1022932S1 (en) 2021-03-16 2024-04-16 Rohm Co., Ltd. Semiconductor module

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD936025S1 (en) * 2018-12-26 2021-11-16 Lg Chem, Ltd. Flexible printed circuit board for battery module
USD937791S1 (en) * 2018-12-26 2021-12-07 Lg Chem, Ltd. Flexible printed circuit board for battery module
TWD202895S (zh) * 2019-03-27 2020-02-21 家登精密工業股份有限公司 光罩盒組裝件
JP1727400S (ja) * 2022-01-28 2022-10-14 半導体素子
JP1727398S (ja) * 2022-01-28 2022-10-14 半導体素子

Family Cites Families (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3602846A (en) 1969-07-14 1971-08-31 Pulse Eng Inc Delay line
US3825876A (en) 1971-08-12 1974-07-23 Augat Inc Electrical component mounting
US3762039A (en) 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US3846734A (en) 1973-02-06 1974-11-05 Amp Inc Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
US4391408A (en) * 1980-09-05 1983-07-05 Augat Inc. Low insertion force connector
JPS60239043A (ja) 1984-05-14 1985-11-27 Oki Electric Ind Co Ltd 半導体装置用パツケ−ジの製造方法
US4987474A (en) * 1987-09-18 1991-01-22 Hitachi, Ltd. Semiconductor device and method of manufacturing the same
US4916519A (en) 1989-05-30 1990-04-10 International Business Machines Corporation Semiconductor package
US5557504A (en) 1993-08-31 1996-09-17 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with detachable module
USD359028S (en) 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD357462S (en) 1993-09-16 1995-04-18 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD360619S (en) * 1993-09-16 1995-07-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD358806S (en) 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD357901S (en) 1993-09-27 1995-05-02 Telefonaktiebolaget Lm Ericsson Power supply unit
US5757070A (en) * 1995-10-24 1998-05-26 Altera Corporation Integrated circuit package
USD401912S (en) 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD394244S (en) 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD396211S (en) 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
EP0884781A3 (en) 1997-06-12 1999-06-30 Hitachi, Ltd. Power semiconductor module
USD448739S1 (en) 2000-09-12 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
JP2003077939A (ja) 2001-09-05 2003-03-14 Mitsubishi Electric Corp 半導体装置およびその製造方法
USD470825S1 (en) * 2001-12-28 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JP2004063688A (ja) * 2002-07-26 2004-02-26 Mitsubishi Electric Corp 半導体装置及び半導体アセンブリモジュール
USD505399S1 (en) 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505400S1 (en) 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD548202S1 (en) 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD539761S1 (en) 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
JP5041798B2 (ja) 2006-12-15 2012-10-03 三菱電機株式会社 半導体装置
USD874411S1 (en) 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
JP2010147116A (ja) 2008-12-17 2010-07-01 Mitsubishi Electric Corp 半導体装置
USD648682S1 (en) * 2011-03-31 2011-11-15 Cheng Uei Precision Industry Co., Ltd. Double-card connector
USD674760S1 (en) * 2011-04-01 2013-01-22 Fuji Electric Co., Ltd. Semiconductor device
USD717256S1 (en) 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717255S1 (en) 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719537S1 (en) * 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
USD705184S1 (en) 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
USD754084S1 (en) 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD754083S1 (en) * 2013-10-17 2016-04-19 Vlt, Inc. Electric terminal
USD772182S1 (en) 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD767516S1 (en) 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD766851S1 (en) 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
JP1533793S (US06724976-20040420-M00002.png) 2015-02-04 2015-09-28
JP6362560B2 (ja) 2015-03-24 2018-07-25 三菱電機株式会社 半導体モジュール、電力変換装置および半導体モジュールの製造方法
USD814431S1 (en) 2015-05-15 2018-04-03 Mitsubishi Electric Corporation Power semiconductor device
JP1551590S (US06724976-20040420-M00002.png) 2015-11-30 2016-06-13
JP1565636S (US06724976-20040420-M00002.png) 2016-03-11 2016-12-19
JP1578687S (US06724976-20040420-M00002.png) 2016-11-08 2017-06-12
USD853342S1 (en) 2017-02-28 2019-07-09 Infineon Technologies Ag High-performance semiconductor module
JP1603359S (US06724976-20040420-M00002.png) * 2017-10-19 2018-05-07
USD864884S1 (en) 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD859334S1 (en) 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD877102S1 (en) 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD874412S1 (en) 2018-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD873226S1 (en) 2018-04-13 2020-01-21 Rohm Co., Ltd. Semiconductor module
JP1632173S (US06724976-20040420-M00002.png) 2018-06-01 2019-05-27
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD971863S1 (en) 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD1021830S1 (en) 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1021829S1 (en) 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1022932S1 (en) 2021-03-16 2024-04-16 Rohm Co., Ltd. Semiconductor module

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