IT1156088B - Filo sottile in lega d oro per il collegamento di un dispositivo a semiconduttore - Google Patents

Filo sottile in lega d oro per il collegamento di un dispositivo a semiconduttore

Info

Publication number
IT1156088B
IT1156088B IT68243/82A IT6824382A IT1156088B IT 1156088 B IT1156088 B IT 1156088B IT 68243/82 A IT68243/82 A IT 68243/82A IT 6824382 A IT6824382 A IT 6824382A IT 1156088 B IT1156088 B IT 1156088B
Authority
IT
Italy
Prior art keywords
gold alloy
alloy wire
connection
semiconductor device
thin gold
Prior art date
Application number
IT68243/82A
Other languages
English (en)
Italian (it)
Other versions
IT8268243A0 (it
IT8268243A1 (it
Inventor
Hosoda Naoyuki
Tanaka Masayuki
Mori Tamotsu
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP56195299A external-priority patent/JPS5896741A/ja
Priority claimed from JP57037580A external-priority patent/JPS58154242A/ja
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Publication of IT8268243A0 publication Critical patent/IT8268243A0/it
Publication of IT8268243A1 publication Critical patent/IT8268243A1/it
Application granted granted Critical
Publication of IT1156088B publication Critical patent/IT1156088B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils

Landscapes

  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
IT68243/82A 1981-12-04 1982-10-25 Filo sottile in lega d oro per il collegamento di un dispositivo a semiconduttore IT1156088B (it)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP56195299A JPS5896741A (ja) 1981-12-04 1981-12-04 半導体素子結線用高張力ａｕ合金細線
JP57037580A JPS58154242A (ja) 1982-03-10 1982-03-10 半導体素子ボンデイング用金合金細線

Publications (3)

Publication Number Publication Date
IT8268243A0 IT8268243A0 (it) 1982-10-25
IT8268243A1 IT8268243A1 (it) 1984-04-25
IT1156088B true IT1156088B (it) 1987-01-28

Family

ID=26376707

Family Applications (1)

Application Number Title Priority Date Filing Date
IT68243/82A IT1156088B (it) 1981-12-04 1982-10-25 Filo sottile in lega d oro per il collegamento di un dispositivo a semiconduttore

Country Status (10)

Country Link
US (2) US4885135A (enExample)
KR (1) KR890003143B1 (enExample)
DE (1) DE3237385A1 (enExample)
FR (1) FR2517885B1 (enExample)
GB (1) GB2116208B (enExample)
HK (1) HK17888A (enExample)
IT (1) IT1156088B (enExample)
MY (1) MY8700920A (enExample)
NL (1) NL8203706A (enExample)
SG (1) SG93487G (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4775512A (en) * 1985-10-01 1988-10-04 Tanaka Denshi Kogyo Kabushiki Kaisha Gold line for bonding semiconductor element
JPS62278241A (ja) * 1986-05-26 1987-12-03 Shoei Kagaku Kogyo Kk ボンデイングワイヤ
US5491034A (en) * 1988-05-02 1996-02-13 Nippon Steel Corporation Bonding wire for semiconductor element
DE69009814T2 (de) * 1989-03-24 1994-11-17 Mitsubishi Materials Corp Silberlegierungsblatt zur Verbindung von Sonnenzellen.
GB2231336B (en) * 1989-04-28 1993-09-22 Tanaka Electronics Ind Gold wire for the bonding of a semiconductor device
US5336434A (en) * 1989-10-02 1994-08-09 Allergan, Inc. Methods, compositions and apparatus to disinfect lenses
JPH0647699B2 (ja) * 1991-01-29 1994-06-22 三菱マテリアル株式会社 半導体素子ボンディング用金合金細線
US5518691A (en) * 1993-07-29 1996-05-21 Tanaka Kikinzoku Kogyo K.K. Precious metal material
DE69618944T2 (de) * 1995-04-07 2002-10-31 Kazuo Ogasa Verfahren zur Herstellung einer hochreinen Goldlegierung
JP3337049B2 (ja) * 1995-05-17 2002-10-21 田中電子工業株式会社 ボンディング用金線
US5966592A (en) * 1995-11-21 1999-10-12 Tessera, Inc. Structure and method for making a compliant lead for a microelectronic device
JP3328135B2 (ja) 1996-05-28 2002-09-24 田中電子工業株式会社 バンプ形成用金合金線及びバンプ形成方法
CN1085738C (zh) * 1996-06-12 2002-05-29 小笠和男 高纯度金合金及其制造方法
JP3426473B2 (ja) * 1997-07-01 2003-07-14 新日本製鐵株式会社 半導体素子用金合金細線
EP0890987B1 (de) * 1997-07-07 2003-03-05 W.C. Heraeus GmbH & Co. KG Feinstdraht aus einer Goldlegierung, Verfahren zu seiner Herstellung und seine Verwendung
DE19753055B4 (de) * 1997-11-29 2005-09-15 W.C. Heraeus Gmbh Feinstdraht aus einer Gold-Legierung, Verfahren zu seiner Herstellung und seine Verwendung
DE19821395C2 (de) 1998-05-13 2000-06-29 Heraeus Gmbh W C Verwendung eines Feinstdrahtes aus einer nickelhaltigen Gold-Legierung
US6306516B1 (en) * 1999-12-17 2001-10-23 Agere Systems Guardian Corp. Article comprising oxide-bondable solder
US6319617B1 (en) * 1999-12-17 2001-11-20 Agere Systems Gaurdian Corp. Oxide-bondable solder
JP3382918B2 (ja) 2000-05-31 2003-03-04 田中電子工業株式会社 半導体素子接続用金線
JP3323185B2 (ja) * 2000-06-19 2002-09-09 田中電子工業株式会社 半導体素子接続用金線
JP2001049364A (ja) 2000-07-03 2001-02-20 Kazuo Ogasa 硬質貴金属合金部材とその製造方法
KR100929432B1 (ko) * 2004-11-26 2009-12-03 타나카 덴시 코오교오 카부시키가이샤 반도체 소자용 Ａｕ 본딩 와이어
US7713390B2 (en) * 2005-05-16 2010-05-11 Applied Materials, Inc. Ground shield for a PVD chamber
DE102006006728A1 (de) * 2006-02-13 2007-08-23 W.C. Heraeus Gmbh Bonddraht
KR100796570B1 (ko) 2006-08-22 2008-02-21 헤라우스오리엔탈하이텍 주식회사 본딩용 금합금 세선
CN102127663B (zh) * 2010-12-30 2012-10-17 宁波康强电子股份有限公司 键合金丝及其制备方法
EP2871642B1 (en) 2013-11-06 2019-08-28 Airbus Defence and Space GmbH Solar cell interconnector and manufacturing method thereof
TWI656222B (zh) * 2018-08-23 2019-04-11 香港商駿碼科技（香港）有限公司 金合金封裝線材及其製備方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3211595A (en) * 1959-11-02 1965-10-12 Hughes Aircraft Co P-type alloy bonding of semiconductors using a boron-gold alloy
US3667937A (en) * 1970-10-07 1972-06-06 John A Williams Dental filling
US4018599A (en) * 1975-09-05 1977-04-19 Engelhard Minerals & Chemicals Corporation Electrical contacts of dispersion strengthened gold
JPS5282183A (en) * 1975-12-29 1977-07-09 Nec Corp Connecting wires for semiconductor devices
JPS53105968A (en) * 1977-02-26 1978-09-14 Tanaka Electronics Ind Gold wire for bonding semiconductor
JPS53112060A (en) * 1977-03-11 1978-09-30 Tanaka Electronics Ind Gold wire for bonding semiconductor
DE2741277C3 (de) * 1977-09-14 1980-03-27 Fa. Dr. Th. Wieland, 7530 Pforzheim Kupferfreie Gold-Gußlegierung fur zahnarztliche Zwecke
US4217137A (en) * 1978-03-13 1980-08-12 Medtronic, Inc. Gold based alloy composition and brazing therewith, particularly for ceramic-metal seals in electrical feedthroughs
US4180700A (en) * 1978-03-13 1979-12-25 Medtronic, Inc. Alloy composition and brazing therewith, particularly for _ceramic-metal seals in electrical feedthroughs
JPS5613740A (en) * 1979-07-16 1981-02-10 Tanaka Kikinzoku Kogyo Kk Bonding wire for semiconductor element
JPS5619629A (en) * 1979-07-25 1981-02-24 Tanaka Kikinzoku Kogyo Kk Bonding wire for semiconductor element
JPS5630731A (en) * 1979-08-21 1981-03-27 Tanaka Denshi Kogyo Kk Au solder for semiconductor element
JPS5649535A (en) * 1979-09-28 1981-05-06 Tanaka Kikinzoku Kogyo Kk Bonding wire for semiconductor device
JPS5649534A (en) * 1979-09-28 1981-05-06 Tanaka Kikinzoku Kogyo Kk Bonding wire for semiconductor device
US4330329A (en) * 1979-11-28 1982-05-18 Tanaka Denshi Kogyo Kabushiki Kaisha Gold bonding wire for semiconductor elements and the semiconductor element
US4374668A (en) * 1981-04-29 1983-02-22 The United States Of America As Represented By The Secretary Of The Navy Gold based electrical materials
US4387073A (en) * 1981-09-08 1983-06-07 The United States Of America As Represented By The Secretary Of The Navy Gold based electrical contact materials
JPS5896741A (ja) * 1981-12-04 1983-06-08 Mitsubishi Metal Corp 半導体素子結線用高張力ａｕ合金細線
GB2231336B (en) * 1989-04-28 1993-09-22 Tanaka Electronics Ind Gold wire for the bonding of a semiconductor device

Also Published As

Publication number Publication date
IT8268243A0 (it) 1982-10-25
FR2517885A1 (fr) 1983-06-10
DE3237385C2 (enExample) 1991-06-20
US5071619A (en) 1991-12-10
US4885135A (en) 1989-12-05
GB2116208A (en) 1983-09-21
NL8203706A (nl) 1983-07-01
KR890003143B1 (ko) 1989-08-23
KR840002161A (ko) 1984-06-11
IT8268243A1 (it) 1984-04-25
FR2517885B1 (fr) 1987-01-30
GB2116208B (en) 1985-12-04
SG93487G (en) 1988-09-16
MY8700920A (en) 1987-12-31
HK17888A (en) 1988-03-11
DE3237385A1 (de) 1983-06-09

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