FR2517885B1 - Fil d'alliage d'or fin pour connecter un dispositif a semi-conducteur - Google Patents

Fil d'alliage d'or fin pour connecter un dispositif a semi-conducteur

Info

Publication number
FR2517885B1
FR2517885B1 FR8216472A FR8216472A FR2517885B1 FR 2517885 B1 FR2517885 B1 FR 2517885B1 FR 8216472 A FR8216472 A FR 8216472A FR 8216472 A FR8216472 A FR 8216472A FR 2517885 B1 FR2517885 B1 FR 2517885B1
Authority
FR
France
Prior art keywords
gold alloy
alloy wire
fine gold
semiconductor device
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8216472A
Other languages
English (en)
French (fr)
Other versions
FR2517885A1 (fr
Inventor
Naoyuki Hosoda
Masayuki Tanaka
Tamotsu Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP56195299A external-priority patent/JPS5896741A/ja
Priority claimed from JP57037580A external-priority patent/JPS58154242A/ja
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Publication of FR2517885A1 publication Critical patent/FR2517885A1/fr
Application granted granted Critical
Publication of FR2517885B1 publication Critical patent/FR2517885B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H10P95/50—
    • H10W72/015—
    • H10W72/50—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/432—Mechanical processes
    • H01L2224/4321—Pulling
    • H10W72/01551—
    • H10W72/5522—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils

Landscapes

  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
FR8216472A 1981-12-04 1982-09-30 Fil d'alliage d'or fin pour connecter un dispositif a semi-conducteur Expired FR2517885B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP56195299A JPS5896741A (ja) 1981-12-04 1981-12-04 半導体素子結線用高張力ａｕ合金細線
JP57037580A JPS58154242A (ja) 1982-03-10 1982-03-10 半導体素子ボンデイング用金合金細線

Publications (2)

Publication Number Publication Date
FR2517885A1 FR2517885A1 (fr) 1983-06-10
FR2517885B1 true FR2517885B1 (fr) 1987-01-30

Family

ID=26376707

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8216472A Expired FR2517885B1 (fr) 1981-12-04 1982-09-30 Fil d'alliage d'or fin pour connecter un dispositif a semi-conducteur

Country Status (10)

Country Link
US (2) US4885135A (enExample)
KR (1) KR890003143B1 (enExample)
DE (1) DE3237385A1 (enExample)
FR (1) FR2517885B1 (enExample)
GB (1) GB2116208B (enExample)
HK (1) HK17888A (enExample)
IT (1) IT1156088B (enExample)
MY (1) MY8700920A (enExample)
NL (1) NL8203706A (enExample)
SG (1) SG93487G (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4775512A (en) * 1985-10-01 1988-10-04 Tanaka Denshi Kogyo Kabushiki Kaisha Gold line for bonding semiconductor element
JPS62278241A (ja) * 1986-05-26 1987-12-03 Shoei Kagaku Kogyo Kk ボンデイングワイヤ
US5491034A (en) * 1988-05-02 1996-02-13 Nippon Steel Corporation Bonding wire for semiconductor element
DE69009814T2 (de) * 1989-03-24 1994-11-17 Mitsubishi Materials Corp Silberlegierungsblatt zur Verbindung von Sonnenzellen.
GB2231336B (en) * 1989-04-28 1993-09-22 Tanaka Electronics Ind Gold wire for the bonding of a semiconductor device
US5336434A (en) * 1989-10-02 1994-08-09 Allergan, Inc. Methods, compositions and apparatus to disinfect lenses
JPH0647699B2 (ja) * 1991-01-29 1994-06-22 三菱マテリアル株式会社 半導体素子ボンディング用金合金細線
US5518691A (en) * 1993-07-29 1996-05-21 Tanaka Kikinzoku Kogyo K.K. Precious metal material
CN1084795C (zh) * 1995-04-07 2002-05-15 小笠和男 高纯度的硬质金合金及其制造方法
JP3337049B2 (ja) * 1995-05-17 2002-10-21 田中電子工業株式会社 ボンディング用金線
US5966592A (en) * 1995-11-21 1999-10-12 Tessera, Inc. Structure and method for making a compliant lead for a microelectronic device
JP3328135B2 (ja) 1996-05-28 2002-09-24 田中電子工業株式会社 バンプ形成用金合金線及びバンプ形成方法
ATE224961T1 (de) * 1996-06-12 2002-10-15 Kazuo Ogasa Verfahren zur herstellung von einer hochreinen hartgoldlegierung
JP3426473B2 (ja) * 1997-07-01 2003-07-14 新日本製鐵株式会社 半導体素子用金合金細線
EP0890987B1 (de) * 1997-07-07 2003-03-05 W.C. Heraeus GmbH & Co. KG Feinstdraht aus einer Goldlegierung, Verfahren zu seiner Herstellung und seine Verwendung
DE19753055B4 (de) * 1997-11-29 2005-09-15 W.C. Heraeus Gmbh Feinstdraht aus einer Gold-Legierung, Verfahren zu seiner Herstellung und seine Verwendung
DE19821395C2 (de) 1998-05-13 2000-06-29 Heraeus Gmbh W C Verwendung eines Feinstdrahtes aus einer nickelhaltigen Gold-Legierung
US6306516B1 (en) * 1999-12-17 2001-10-23 Agere Systems Guardian Corp. Article comprising oxide-bondable solder
US6319617B1 (en) * 1999-12-17 2001-11-20 Agere Systems Gaurdian Corp. Oxide-bondable solder
JP3382918B2 (ja) * 2000-05-31 2003-03-04 田中電子工業株式会社 半導体素子接続用金線
JP3323185B2 (ja) * 2000-06-19 2002-09-09 田中電子工業株式会社 半導体素子接続用金線
JP2001049364A (ja) 2000-07-03 2001-02-20 Kazuo Ogasa 硬質貴金属合金部材とその製造方法
MY140911A (en) * 2004-11-26 2010-01-29 Tanaka Electronics Ind Au bonding wire for semiconductor device
US7713390B2 (en) * 2005-05-16 2010-05-11 Applied Materials, Inc. Ground shield for a PVD chamber
DE102006006728A1 (de) * 2006-02-13 2007-08-23 W.C. Heraeus Gmbh Bonddraht
KR100796570B1 (ko) 2006-08-22 2008-02-21 헤라우스오리엔탈하이텍 주식회사 본딩용 금합금 세선
CN102127663B (zh) * 2010-12-30 2012-10-17 宁波康强电子股份有限公司 键合金丝及其制备方法
EP2871642B1 (en) 2013-11-06 2019-08-28 Airbus Defence and Space GmbH Solar cell interconnector and manufacturing method thereof
TWI656222B (zh) * 2018-08-23 2019-04-11 香港商駿碼科技（香港）有限公司 金合金封裝線材及其製備方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3211595A (en) * 1959-11-02 1965-10-12 Hughes Aircraft Co P-type alloy bonding of semiconductors using a boron-gold alloy
US3667937A (en) * 1970-10-07 1972-06-06 John A Williams Dental filling
US4018599A (en) * 1975-09-05 1977-04-19 Engelhard Minerals & Chemicals Corporation Electrical contacts of dispersion strengthened gold
JPS5282183A (en) * 1975-12-29 1977-07-09 Nec Corp Connecting wires for semiconductor devices
JPS53105968A (en) * 1977-02-26 1978-09-14 Tanaka Electronics Ind Gold wire for bonding semiconductor
JPS53112060A (en) * 1977-03-11 1978-09-30 Tanaka Electronics Ind Gold wire for bonding semiconductor
DE2741277C3 (de) * 1977-09-14 1980-03-27 Fa. Dr. Th. Wieland, 7530 Pforzheim Kupferfreie Gold-Gußlegierung fur zahnarztliche Zwecke
US4180700A (en) * 1978-03-13 1979-12-25 Medtronic, Inc. Alloy composition and brazing therewith, particularly for _ceramic-metal seals in electrical feedthroughs
US4217137A (en) * 1978-03-13 1980-08-12 Medtronic, Inc. Gold based alloy composition and brazing therewith, particularly for ceramic-metal seals in electrical feedthroughs
JPS5613740A (en) * 1979-07-16 1981-02-10 Tanaka Kikinzoku Kogyo Kk Bonding wire for semiconductor element
JPS5619629A (en) * 1979-07-25 1981-02-24 Tanaka Kikinzoku Kogyo Kk Bonding wire for semiconductor element
JPS5630731A (en) * 1979-08-21 1981-03-27 Tanaka Denshi Kogyo Kk Au solder for semiconductor element
JPS5649534A (en) * 1979-09-28 1981-05-06 Tanaka Kikinzoku Kogyo Kk Bonding wire for semiconductor device
JPS5649535A (en) * 1979-09-28 1981-05-06 Tanaka Kikinzoku Kogyo Kk Bonding wire for semiconductor device
US4330329A (en) * 1979-11-28 1982-05-18 Tanaka Denshi Kogyo Kabushiki Kaisha Gold bonding wire for semiconductor elements and the semiconductor element
US4374668A (en) * 1981-04-29 1983-02-22 The United States Of America As Represented By The Secretary Of The Navy Gold based electrical materials
US4387073A (en) * 1981-09-08 1983-06-07 The United States Of America As Represented By The Secretary Of The Navy Gold based electrical contact materials
JPS5896741A (ja) * 1981-12-04 1983-06-08 Mitsubishi Metal Corp 半導体素子結線用高張力ａｕ合金細線
GB2231336B (en) * 1989-04-28 1993-09-22 Tanaka Electronics Ind Gold wire for the bonding of a semiconductor device

Also Published As

Publication number Publication date
HK17888A (en) 1988-03-11
DE3237385A1 (de) 1983-06-09
MY8700920A (en) 1987-12-31
NL8203706A (nl) 1983-07-01
GB2116208B (en) 1985-12-04
GB2116208A (en) 1983-09-21
IT8268243A0 (it) 1982-10-25
KR840002161A (ko) 1984-06-11
KR890003143B1 (ko) 1989-08-23
IT1156088B (it) 1987-01-28
DE3237385C2 (enExample) 1991-06-20
FR2517885A1 (fr) 1983-06-10
US4885135A (en) 1989-12-05
IT8268243A1 (it) 1984-04-25
US5071619A (en) 1991-12-10
SG93487G (en) 1988-09-16

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Legal Events

Date Code Title Description
ST Notification of lapse