IN2014MN01997A - - Google Patents

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Publication number
IN2014MN01997A
IN2014MN01997A IN1997MUN2014A IN2014MN01997A IN 2014MN01997 A IN2014MN01997 A IN 2014MN01997A IN 1997MUN2014 A IN1997MUN2014 A IN 1997MUN2014A IN 2014MN01997 A IN2014MN01997 A IN 2014MN01997A
Authority
IN
India
Prior art keywords
mass
particle diameter
relationship
stress relaxation
precipitate
Prior art date
Application number
Other languages
English (en)
Inventor
Keiichiro Oishi
Takashi Hokazono
Michio Takasaki
Yosuke Nakasato
Original Assignee
Mitsubishi Shindo Kk
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindo Kk, Mitsubishi Materials Corp filed Critical Mitsubishi Shindo Kk
Publication of IN2014MN01997A publication Critical patent/IN2014MN01997A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
IN1997MUN2014 2013-01-25 2013-03-19 IN2014MN01997A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2013/051602 WO2014115307A1 (fr) 2013-01-25 2013-01-25 Plaque en alliage de cuivre pour borne ainsi que matériau de connecteur, et procédé de fabrication de celle-ci
PCT/JP2013/057808 WO2014115342A1 (fr) 2013-01-25 2013-03-19 Plaque en alliage de cuivre pour borne ainsi que matériau de connecteur, et procédé de fabrication de celle-ci

Publications (1)

Publication Number Publication Date
IN2014MN01997A true IN2014MN01997A (fr) 2015-08-14

Family

ID=51227122

Family Applications (1)

Application Number Title Priority Date Filing Date
IN1997MUN2014 IN2014MN01997A (fr) 2013-01-25 2013-03-19

Country Status (8)

Country Link
US (3) US9957589B2 (fr)
KR (1) KR20140127911A (fr)
CN (1) CN104271783B (fr)
IN (1) IN2014MN01997A (fr)
MX (1) MX342116B (fr)
SG (1) SG11201406611QA (fr)
TW (1) TWI454585B (fr)
WO (2) WO2014115307A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014115307A1 (fr) * 2013-01-25 2014-07-31 三菱伸銅株式会社 Plaque en alliage de cuivre pour borne ainsi que matériau de connecteur, et procédé de fabrication de celle-ci
WO2016072297A1 (fr) * 2014-11-07 2016-05-12 住友金属鉱山株式会社 Cible en alliage de cuivre
JP6358340B2 (ja) * 2014-12-12 2018-07-18 新日鐵住金株式会社 配向銅板、銅張積層板、可撓性回路基板、及び電子機器
JP2016132816A (ja) * 2015-01-21 2016-07-25 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子
KR102116004B1 (ko) 2018-08-03 2020-05-27 (주)엠티에이 다양한 형상의 탄소체 성장용 금형 및 이를 이용한 탄소체 성장방법

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US20080190523A1 (en) * 2007-02-13 2008-08-14 Weilin Gao Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
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MX2013015230A (es) 2011-09-16 2014-02-19 Mitsubishi Shindo Kk Lamina de aleacion de cobre y metodo para producir lamina de aleacion de cobre.
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WO2014115307A1 (fr) * 2013-01-25 2014-07-31 三菱伸銅株式会社 Plaque en alliage de cuivre pour borne ainsi que matériau de connecteur, et procédé de fabrication de celle-ci

Also Published As

Publication number Publication date
US20150122380A1 (en) 2015-05-07
US9957589B2 (en) 2018-05-01
WO2014115342A1 (fr) 2014-07-31
MX2014012441A (es) 2015-01-14
US10020088B2 (en) 2018-07-10
MX342116B (es) 2016-09-14
US20160104550A1 (en) 2016-04-14
TWI454585B (zh) 2014-10-01
TW201430150A (zh) 2014-08-01
SG11201406611QA (en) 2014-11-27
US20150318068A1 (en) 2015-11-05
CN104271783B (zh) 2016-10-26
KR20140127911A (ko) 2014-11-04
WO2014115307A1 (fr) 2014-07-31
CN104271783A (zh) 2015-01-07

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