SG11201406611QA - Copper-alloy plate for terminal/connector material, and method for producing copper-alloy plate for terminal/connector material - Google Patents
Copper-alloy plate for terminal/connector material, and method for producing copper-alloy plate for terminal/connector materialInfo
- Publication number
- SG11201406611QA SG11201406611QA SG11201406611QA SG11201406611QA SG11201406611QA SG 11201406611Q A SG11201406611Q A SG 11201406611QA SG 11201406611Q A SG11201406611Q A SG 11201406611QA SG 11201406611Q A SG11201406611Q A SG 11201406611QA SG 11201406611Q A SG11201406611Q A SG 11201406611QA
- Authority
- SG
- Singapore
- Prior art keywords
- terminal
- alloy plate
- copper
- connector material
- producing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2013/051602 WO2014115307A1 (fr) | 2013-01-25 | 2013-01-25 | Plaque en alliage de cuivre pour borne ainsi que matériau de connecteur, et procédé de fabrication de celle-ci |
PCT/JP2013/057808 WO2014115342A1 (fr) | 2013-01-25 | 2013-03-19 | Plaque en alliage de cuivre pour borne ainsi que matériau de connecteur, et procédé de fabrication de celle-ci |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201406611QA true SG11201406611QA (en) | 2014-11-27 |
Family
ID=51227122
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201406611QA SG11201406611QA (en) | 2013-01-25 | 2013-03-19 | Copper-alloy plate for terminal/connector material, and method for producing copper-alloy plate for terminal/connector material |
Country Status (8)
Country | Link |
---|---|
US (3) | US9957589B2 (fr) |
KR (1) | KR20140127911A (fr) |
CN (1) | CN104271783B (fr) |
IN (1) | IN2014MN01997A (fr) |
MX (1) | MX342116B (fr) |
SG (1) | SG11201406611QA (fr) |
TW (1) | TWI454585B (fr) |
WO (2) | WO2014115307A1 (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014115307A1 (fr) * | 2013-01-25 | 2014-07-31 | 三菱伸銅株式会社 | Plaque en alliage de cuivre pour borne ainsi que matériau de connecteur, et procédé de fabrication de celle-ci |
JP6213684B2 (ja) * | 2014-11-07 | 2017-10-18 | 住友金属鉱山株式会社 | 銅合金ターゲット |
CN107109534B (zh) * | 2014-12-12 | 2018-11-09 | 新日铁住金株式会社 | 取向铜板、铜箔叠层板、挠性电路板以及电子设备 |
JP2016132816A (ja) * | 2015-01-21 | 2016-07-25 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子 |
KR102116006B1 (ko) | 2018-08-03 | 2020-05-27 | (주)엠티에이 | 대면적의 탄소체 성장용 플랫폼 및 이를 이용한 탄소체 성장방법 |
Family Cites Families (35)
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JPS5153949A (en) | 1974-11-05 | 1976-05-12 | Kajii Mengyo Kk | Shishuyokifuno tenchohoho oyobi tenchoki |
JPS63161135A (ja) | 1986-12-23 | 1988-07-04 | Mitsui Mining & Smelting Co Ltd | 電気部品用銅合金 |
JPH01189805A (ja) * | 1988-01-26 | 1989-07-31 | Dowa Mining Co Ltd | ワイヤーハーネスのターミナル用銅合金 |
JPH06184679A (ja) * | 1992-12-18 | 1994-07-05 | Mitsui Mining & Smelting Co Ltd | 電気部品用銅合金 |
US5893953A (en) * | 1997-09-16 | 1999-04-13 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
JP2000087158A (ja) | 1998-09-11 | 2000-03-28 | Furukawa Electric Co Ltd:The | 半導体リードフレーム用銅合金 |
US6471792B1 (en) | 1998-11-16 | 2002-10-29 | Olin Corporation | Stress relaxation resistant brass |
JP3744810B2 (ja) | 2001-03-30 | 2006-02-15 | 株式会社神戸製鋼所 | 端子・コネクタ用銅合金及びその製造方法 |
CN1177946C (zh) * | 2001-09-07 | 2004-12-01 | 同和矿业株式会社 | 连接器用铜合金及其制造方法 |
JP4166147B2 (ja) * | 2003-12-03 | 2008-10-15 | 株式会社神戸製鋼所 | 高強度電気電子部品用銅合金板の製造方法 |
JP5050226B2 (ja) * | 2005-03-31 | 2012-10-17 | Dowaメタルテック株式会社 | 銅合金材料の製造法 |
US20090116996A1 (en) * | 2005-06-08 | 2009-05-07 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel Ltd.) | Copper alloy, copper alloy plate, and process for producing the same |
KR100792653B1 (ko) * | 2005-07-15 | 2008-01-09 | 닛코킨조쿠 가부시키가이샤 | 전기 전자기기용 동합금 및 그의 제조 방법 |
JP2007056365A (ja) | 2005-07-27 | 2007-03-08 | Mitsui Mining & Smelting Co Ltd | 銅−亜鉛−錫合金及びその製造方法 |
JP4810703B2 (ja) | 2005-09-30 | 2011-11-09 | Dowaメタルテック株式会社 | 銅合金の製造法 |
JP4984108B2 (ja) | 2005-09-30 | 2012-07-25 | Dowaメタルテック株式会社 | プレス打抜き性の良いCu−Ni−Sn−P系銅合金およびその製造法 |
JP4810704B2 (ja) * | 2006-01-10 | 2011-11-09 | Dowaメタルテック株式会社 | 耐応力腐食割れ性に優れたCu−Ni−Si−Zn系銅合金の製造法 |
JP5040140B2 (ja) | 2006-03-31 | 2012-10-03 | Dowaメタルテック株式会社 | Cu−Ni−Si−Zn系銅合金 |
JP4247922B2 (ja) * | 2006-09-12 | 2009-04-02 | 古河電気工業株式会社 | 電気・電子機器用銅合金板材およびその製造方法 |
JP4157898B2 (ja) * | 2006-10-02 | 2008-10-01 | 株式会社神戸製鋼所 | プレス打ち抜き性に優れた電気電子部品用銅合金板 |
US20080190523A1 (en) * | 2007-02-13 | 2008-08-14 | Weilin Gao | Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same |
JP4357536B2 (ja) * | 2007-02-16 | 2009-11-04 | 株式会社神戸製鋼所 | 強度と成形性に優れる電気電子部品用銅合金板 |
JP5075438B2 (ja) * | 2007-03-20 | 2012-11-21 | Dowaメタルテック株式会社 | Cu−Ni−Sn−P系銅合金板材およびその製造法 |
JP5191725B2 (ja) * | 2007-08-13 | 2013-05-08 | Dowaメタルテック株式会社 | Cu−Zn−Sn系銅合金板材およびその製造法並びにコネクタ |
US7928541B2 (en) | 2008-03-07 | 2011-04-19 | Kobe Steel, Ltd. | Copper alloy sheet and QFN package |
JP5311860B2 (ja) | 2008-03-28 | 2013-10-09 | 株式会社神戸製鋼所 | Pbフリーはんだ付け性に優れるPCBオス端子用Snめっき付き銅合金板 |
US9455058B2 (en) | 2009-01-09 | 2016-09-27 | Mitsubishi Shindoh Co., Ltd. | High-strength and high-electrical conductivity copper alloy rolled sheet and method of manufacturing the same |
JP5466879B2 (ja) * | 2009-05-19 | 2014-04-09 | Dowaメタルテック株式会社 | 銅合金板材およびその製造方法 |
CN102597283B (zh) * | 2009-12-02 | 2014-04-09 | 古河电气工业株式会社 | 铜合金板材、使用该铜合金板材的连接器、以及制造连接器的铜合金板材的制造方法 |
JP5490594B2 (ja) | 2010-03-31 | 2014-05-14 | Jx日鉱日石金属株式会社 | 電池接続タブ材料用Cu−Zn系合金条 |
JP5432201B2 (ja) * | 2011-03-30 | 2014-03-05 | Jx日鉱日石金属株式会社 | 放熱性及び繰り返し曲げ加工性に優れた銅合金板 |
CA2837854C (fr) | 2011-09-16 | 2015-09-29 | Mitsubishi Shindoh Co., Ltd. | Feuille d'alliage de cuivre et procede de fabrication |
MX2014002319A (es) | 2011-09-20 | 2014-04-10 | Mitsubishi Shindo Kk | Chapa de aleacion de cobre y metodo para fabricar chapa de aleacion de cobre. |
JP5153949B1 (ja) * | 2012-03-30 | 2013-02-27 | Jx日鉱日石金属株式会社 | Cu−Zn−Sn−Ni−P系合金 |
WO2014115307A1 (fr) * | 2013-01-25 | 2014-07-31 | 三菱伸銅株式会社 | Plaque en alliage de cuivre pour borne ainsi que matériau de connecteur, et procédé de fabrication de celle-ci |
-
2013
- 2013-01-25 WO PCT/JP2013/051602 patent/WO2014115307A1/fr active Application Filing
- 2013-03-19 KR KR1020147027070A patent/KR20140127911A/ko active Search and Examination
- 2013-03-19 CN CN201380023308.1A patent/CN104271783B/zh active Active
- 2013-03-19 IN IN1997MUN2014 patent/IN2014MN01997A/en unknown
- 2013-03-19 MX MX2014012441A patent/MX342116B/es active IP Right Grant
- 2013-03-19 TW TW102109712A patent/TWI454585B/zh active
- 2013-03-19 US US14/395,430 patent/US9957589B2/en active Active
- 2013-03-19 SG SG11201406611QA patent/SG11201406611QA/en unknown
- 2013-03-19 WO PCT/JP2013/057808 patent/WO2014115342A1/fr active Application Filing
-
2014
- 2014-10-17 US US14/517,703 patent/US20150122380A1/en not_active Abandoned
-
2015
- 2015-11-19 US US14/946,108 patent/US10020088B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TWI454585B (zh) | 2014-10-01 |
US20150318068A1 (en) | 2015-11-05 |
US10020088B2 (en) | 2018-07-10 |
MX342116B (es) | 2016-09-14 |
IN2014MN01997A (fr) | 2015-08-14 |
US20160104550A1 (en) | 2016-04-14 |
WO2014115342A1 (fr) | 2014-07-31 |
KR20140127911A (ko) | 2014-11-04 |
CN104271783B (zh) | 2016-10-26 |
US20150122380A1 (en) | 2015-05-07 |
US9957589B2 (en) | 2018-05-01 |
MX2014012441A (es) | 2015-01-14 |
TW201430150A (zh) | 2014-08-01 |
WO2014115307A1 (fr) | 2014-07-31 |
CN104271783A (zh) | 2015-01-07 |
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