IL99591A - שיטה לבדיקת מעגלים משולבים - Google Patents

שיטה לבדיקת מעגלים משולבים

Info

Publication number
IL99591A
IL99591A IL9959191A IL9959191A IL99591A IL 99591 A IL99591 A IL 99591A IL 9959191 A IL9959191 A IL 9959191A IL 9959191 A IL9959191 A IL 9959191A IL 99591 A IL99591 A IL 99591A
Authority
IL
Israel
Prior art keywords
probe
test
contact
pads
membrane
Prior art date
Application number
IL9959191A
Other languages
English (en)
Other versions
IL99591A0 (en
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Priority to IL10689091A priority Critical patent/IL106890A/he
Publication of IL99591A0 publication Critical patent/IL99591A0/xx
Publication of IL99591A publication Critical patent/IL99591A/he

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
IL9959191A 1990-10-31 1991-09-27 שיטה לבדיקת מעגלים משולבים IL99591A (he)

Priority Applications (1)

Application Number Priority Date Filing Date Title
IL10689091A IL106890A (he) 1990-10-31 1991-09-27 שיטה והתקן לבדיקת מעגלים משולבים

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/606,676 US5148103A (en) 1990-10-31 1990-10-31 Apparatus for testing integrated circuits

Publications (2)

Publication Number Publication Date
IL99591A0 IL99591A0 (en) 1992-08-18
IL99591A true IL99591A (he) 1996-10-16

Family

ID=24428999

Family Applications (1)

Application Number Title Priority Date Filing Date
IL9959191A IL99591A (he) 1990-10-31 1991-09-27 שיטה לבדיקת מעגלים משולבים

Country Status (4)

Country Link
US (3) US5148103A (he)
EP (1) EP0484141A3 (he)
JP (1) JPH04266043A (he)
IL (1) IL99591A (he)

Families Citing this family (172)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5589781A (en) * 1990-09-20 1996-12-31 Higgins; H. Dan Die carrier apparatus
US5495179A (en) * 1991-06-04 1996-02-27 Micron Technology, Inc. Carrier having interchangeable substrate used for testing of semiconductor dies
US5304922A (en) * 1991-08-26 1994-04-19 Hughes Aircraft Company Electrical circuit with resilient gasket support for raised connection features
EP0532926B1 (en) * 1991-08-26 1997-01-22 Hughes Aircraft Company Electrical circuit with resilient gasket support for raised connection features
JP2606554Y2 (ja) * 1992-01-17 2000-11-27 株式会社東京精密 プロービング装置
JP3307470B2 (ja) * 1993-04-05 2002-07-24 三菱電機株式会社 半導体検査装置
US5371654A (en) 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
US20050062492A1 (en) * 2001-08-03 2005-03-24 Beaman Brian Samuel High density integrated circuit apparatus, test probe and methods of use thereof
JPH06140484A (ja) * 1992-10-28 1994-05-20 Nippon Telegr & Teleph Corp <Ntt> プローブカード
US6058497A (en) 1992-11-20 2000-05-02 Micron Technology, Inc. Testing and burn-in of IC chips using radio frequency transmission
US5983363A (en) * 1992-11-20 1999-11-09 Micron Communications, Inc. In-sheet transceiver testing
JPH06232233A (ja) * 1992-12-23 1994-08-19 Honeywell Inc 裸ダイの試験装置
US5395253A (en) * 1993-04-29 1995-03-07 Hughes Aircraft Company Membrane connector with stretch induced micro scrub
JP3290760B2 (ja) * 1993-06-30 2002-06-10 川崎マイクロエレクトロニクス株式会社 プローブテスト装置およびプローブテスト方法
US5412866A (en) * 1993-07-01 1995-05-09 Hughes Aircraft Company Method of making a cast elastomer/membrane test probe assembly
US5550482A (en) * 1993-07-20 1996-08-27 Tokyo Electron Kabushiki Kaisha Probe device
JP3133872B2 (ja) * 1993-09-02 2001-02-13 富士通株式会社 ロータリ・プローブ、プリント板および接続装置
US5744974A (en) * 1993-09-17 1998-04-28 Xilinx, Inc. Test head interface with vacuum-activated interconnection components
US5469072A (en) * 1993-11-01 1995-11-21 Motorola, Inc. Integrated circuit test system
US20030199179A1 (en) * 1993-11-16 2003-10-23 Formfactor, Inc. Contact tip structure for microelectronic interconnection elements and method of making same
US6525555B1 (en) * 1993-11-16 2003-02-25 Formfactor, Inc. Wafer-level burn-in and test
US6624648B2 (en) 1993-11-16 2003-09-23 Formfactor, Inc. Probe card assembly
US20020053734A1 (en) * 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US6246247B1 (en) 1994-11-15 2001-06-12 Formfactor, Inc. Probe card assembly and kit, and methods of using same
US5455518A (en) * 1993-11-23 1995-10-03 Hughes Aircraft Company Test apparatus for integrated circuit die
KR0140034B1 (ko) * 1993-12-16 1998-07-15 모리시다 요이치 반도체 웨이퍼 수납기, 반도체 웨이퍼의 검사용 집적회로 단자와 프로브 단자와의 접속방법 및 그 장치, 반도체 집적회로의 검사방법, 프로브카드 및 그 제조방법
JP2828410B2 (ja) * 1993-12-21 1998-11-25 松下電器産業株式会社 プローブカード及び半導体チップの検査方法
US5583445A (en) * 1994-02-04 1996-12-10 Hughes Aircraft Company Opto-electronic membrane probe
US5416429A (en) * 1994-05-23 1995-05-16 Wentworth Laboratories, Inc. Probe assembly for testing integrated circuits
US5500604A (en) * 1994-07-15 1996-03-19 Hughes Aircraft Company Radial tensioning lamination fixture for membrane test probe
TW273635B (he) * 1994-09-01 1996-04-01 Aesop
US5508630A (en) * 1994-09-09 1996-04-16 Board Of Regents, University Of Texas Systems Probe having a power detector for use with microwave or millimeter wave device
EP0707214A3 (en) * 1994-10-14 1997-04-16 Hughes Aircraft Co Multiport membrane probe to test complete semiconductor plates
JP3376731B2 (ja) * 1994-11-09 2003-02-10 東京エレクトロン株式会社 高周波用のプリント基板及びこれを用いたプローブカード
CN1118099C (zh) * 1994-11-15 2003-08-13 佛姆法克特股份有限公司 将中间连接元件装设至电子组件的端子上的方法
US5557212A (en) * 1994-11-18 1996-09-17 Isaac; George L. Semiconductor test socket and contacts
US5629630A (en) * 1995-02-27 1997-05-13 Motorola, Inc. Semiconductor wafer contact system and method for contacting a semiconductor wafer
US5773986A (en) * 1995-04-03 1998-06-30 Motorola, Inc Semiconductor wafer contact system and method for contacting a semiconductor wafer
US5532608A (en) * 1995-04-06 1996-07-02 International Business Machines Corporation Ceramic probe card and method for reducing leakage current
US6232789B1 (en) 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
US5642054A (en) * 1995-08-08 1997-06-24 Hughes Aircraft Company Active circuit multi-port membrane probe for full wafer testing
US5600257A (en) * 1995-08-09 1997-02-04 International Business Machines Corporation Semiconductor wafer test and burn-in
JP3135825B2 (ja) * 1995-09-27 2001-02-19 株式会社東芝 プローブカードおよびそのプローブカードを使用した半導体集積回路のプロービング試験方法
US6118286A (en) * 1995-10-10 2000-09-12 Xilinx, Inc. Semiconductor device tester-to-handler Interface board with large test area
US5945837A (en) * 1995-10-10 1999-08-31 Xilinx, Inc. Interface structure for an integrated circuit device tester
US5705932A (en) * 1995-10-10 1998-01-06 Xilinx, Inc. System for expanding space provided by test computer to test multiple integrated circuits simultaneously
JP3096234B2 (ja) * 1995-10-30 2000-10-10 日東電工株式会社 プローブ構造の製造方法
US6483328B1 (en) 1995-11-09 2002-11-19 Formfactor, Inc. Probe card for probing wafers with raised contact elements
US5917330A (en) * 1996-01-17 1999-06-29 Miley; David M. Probe ring having electrical components affixed thereto and related apparatus and processes
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US6236445B1 (en) 1996-02-22 2001-05-22 Hughes Electronics Corporation Method for making topographic projections
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US5707881A (en) * 1996-09-03 1998-01-13 Motorola, Inc. Test structure and method for performing burn-in testing of a semiconductor product wafer
US6603322B1 (en) 1996-12-12 2003-08-05 Ggb Industries, Inc. Probe card for high speed testing
US5949246A (en) * 1997-01-28 1999-09-07 International Business Machines Test head for applying signals in a burn-in test of an integrated circuit
US6201402B1 (en) 1997-04-08 2001-03-13 Celadon Systems, Inc. Probe tile and platform for large area wafer probing
US6586954B2 (en) * 1998-02-10 2003-07-01 Celadon Systems, Inc. Probe tile for probing semiconductor wafer
US6137299A (en) * 1997-06-27 2000-10-24 International Business Machines Corporation Method and apparatus for testing integrated circuit chips
WO1999004273A1 (en) * 1997-07-15 1999-01-28 Wentworth Laboratories, Inc. Probe station with multiple adjustable probe supports
US6181145B1 (en) * 1997-10-13 2001-01-30 Matsushita Electric Industrial Co., Ltd. Probe card
US6518779B1 (en) * 1997-10-20 2003-02-11 Matsushita Electrical Industrial Do., Ltd. Probe card
US5990695A (en) * 1998-01-16 1999-11-23 Packard Hughes Interconnect Co. Membrane test probe
US6119255A (en) 1998-01-21 2000-09-12 Micron Technology, Inc. Testing system for evaluating integrated circuits, a burn-in testing system, and a method for testing an integrated circuit
US5973394A (en) * 1998-01-23 1999-10-26 Kinetrix, Inc. Small contactor for test probes, chip packaging and the like
US6720501B1 (en) 1998-04-14 2004-04-13 Formfactor, Inc. PC board having clustered blind vias
US5992242A (en) * 1998-05-04 1999-11-30 Lsi Logic Corporation Silicon wafer or die strength test fixture using high pressure fluid
US6130546A (en) * 1998-05-11 2000-10-10 Lsi Logic Corporation Area array (flip chip) probe card
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6252414B1 (en) 1998-08-26 2001-06-26 International Business Machines Corporation Method and apparatus for testing circuits having different configurations with a single test fixture
US6441315B1 (en) * 1998-11-10 2002-08-27 Formfactor, Inc. Contact structures with blades having a wiping motion
US6233184B1 (en) * 1998-11-13 2001-05-15 International Business Machines Corporation Structures for wafer level test and burn-in
US6420884B1 (en) * 1999-01-29 2002-07-16 Advantest Corp. Contact structure formed by photolithography process
US6399958B1 (en) * 1998-12-09 2002-06-04 Advanced Micro Devices, Inc. Apparatus for visual inspection during device analysis
JP2000180469A (ja) * 1998-12-18 2000-06-30 Fujitsu Ltd 半導体装置用コンタクタ及び半導体装置用コンタクタを用いた試験装置及び半導体装置用コンタクタを用いた試験方法及び半導体装置用コンタクタのクリーニング方法
JP3565086B2 (ja) * 1999-04-16 2004-09-15 富士通株式会社 プローブカード及び半導体装置の試験方法
US7382142B2 (en) 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US6710609B2 (en) * 2002-07-15 2004-03-23 Nanonexus, Inc. Mosaic decal probe
US7349223B2 (en) 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
US6812718B1 (en) * 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US7247035B2 (en) * 2000-06-20 2007-07-24 Nanonexus, Inc. Enhanced stress metal spring contactor
US6578264B1 (en) 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US6714121B1 (en) * 1999-08-09 2004-03-30 Micron Technology, Inc. RFID material tracking method and apparatus
US6262582B1 (en) 1999-10-15 2001-07-17 International Business Machines Corporation Mechanical fixture for holding electronic devices under test showing adjustments in multiple degrees of freedom
US6255834B1 (en) * 1999-10-21 2001-07-03 Dell Usa, L.P. Test fixture having a floating self-centering connector
US6838890B2 (en) 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
US7262611B2 (en) * 2000-03-17 2007-08-28 Formfactor, Inc. Apparatuses and methods for planarizing a semiconductor contactor
US6734690B1 (en) 2000-04-29 2004-05-11 Hewlett-Packard Development Company, L.P. Back pressure test fixture to allow probing of integrated circuit package signals
US7579848B2 (en) 2000-05-23 2009-08-25 Nanonexus, Inc. High density interconnect system for IC packages and interconnect assemblies
US7952373B2 (en) 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US6603323B1 (en) * 2000-07-10 2003-08-05 Formfactor, Inc. Closed-grid bus architecture for wafer interconnect structure
US6515499B1 (en) * 2000-09-28 2003-02-04 Teradyne, Inc. Modular semiconductor tester interface assembly for high performance coaxial connections
US6466008B1 (en) * 2000-10-06 2002-10-15 Hewlett-Packard Company Method for matching the lengths of signal traces
US6441607B1 (en) * 2000-12-01 2002-08-27 N&K Technology, Inc. Apparatus for docking a floating test stage in a terrestrial base
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech, Inc., Beaverton, Oreg. Wafersonde
US6856150B2 (en) * 2001-04-10 2005-02-15 Formfactor, Inc. Probe card with coplanar daughter card
US6729019B2 (en) * 2001-07-11 2004-05-04 Formfactor, Inc. Method of manufacturing a probe card
JP2004534957A (ja) * 2001-07-11 2004-11-18 フォームファクター，インコーポレイテッド プローブ・カードの製造方法
JP4798595B2 (ja) * 2001-08-07 2011-10-19 東京エレクトロン株式会社 プローブカード搬送装置及びプローブカード搬送方法
AU2002327490A1 (en) 2001-08-21 2003-06-30 Cascade Microtech, Inc. Membrane probing system
US6867607B2 (en) * 2002-01-22 2005-03-15 Sychip, Inc. Membrane test method and apparatus for integrated circuit testing
US6965244B2 (en) * 2002-05-08 2005-11-15 Formfactor, Inc. High performance probe system
US6815963B2 (en) 2002-05-23 2004-11-09 Cascade Microtech, Inc. Probe for testing a device under test
US6867608B2 (en) * 2002-07-16 2005-03-15 Aehr Test Systems Assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component
EP1523685A2 (en) * 2002-07-16 2005-04-20 AEHR Test Systems Assembly for connecting a test device to an object to be tested
US20040012405A1 (en) * 2002-07-19 2004-01-22 Chipmos Technologies (Bermuda) Ltd. Probe card with full wafer contact configuration
US7102367B2 (en) * 2002-07-23 2006-09-05 Fujitsu Limited Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof
US20040055893A1 (en) * 2002-09-23 2004-03-25 Applied Materials, Inc. Wafer backside electrical contact for electrochemical deposition and electrochemical mechanical polishing
US6724205B1 (en) 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7122760B2 (en) * 2002-11-25 2006-10-17 Formfactor, Inc. Using electric discharge machining to manufacture probes
US6945827B2 (en) * 2002-12-23 2005-09-20 Formfactor, Inc. Microelectronic contact structure
US20040177995A1 (en) * 2003-03-12 2004-09-16 Nexcleon, Inc. Structures for testing circuits and methods for fabricating the structures
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US6853205B1 (en) * 2003-07-17 2005-02-08 Chipmos Technologies (Bermuda) Ltd. Probe card assembly
JP2007517231A (ja) 2003-12-24 2007-06-28 カスケード マイクロテック インコーポレイテッド アクティブ・ウェハプローブ
US20050162177A1 (en) * 2004-01-28 2005-07-28 Chou Arlen L. Multi-signal single beam probe
JP4980903B2 (ja) 2004-07-07 2012-07-18 カスケード マイクロテック インコーポレイテッド 膜懸垂プローブを具えるプローブヘッド
US7626404B2 (en) * 2004-09-03 2009-12-01 Celadon Systems, Inc. Replaceable probe apparatus for probing semiconductor wafer
KR20070058522A (ko) 2004-09-13 2007-06-08 캐스케이드 마이크로테크 인코포레이티드 양측 프루빙 구조
CN100360943C (zh) * 2004-11-29 2008-01-09 华硕电脑股份有限公司 具有防止压力过大的测试装置
US7088118B2 (en) * 2004-12-15 2006-08-08 Chipmos Technologies (Bermuda) Ltd. Modularized probe card for high frequency probing
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7170277B2 (en) * 2005-04-12 2007-01-30 Texas Instruments Incorporated Shield for tester load boards
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
US7619419B2 (en) 2005-06-13 2009-11-17 Cascade Microtech, Inc. Wideband active-passive differential signal probe
US7511588B2 (en) * 2005-07-19 2009-03-31 Lctank Llc Flux linked LC tank circuits forming distributed clock networks
CN100424512C (zh) * 2005-08-25 2008-10-08 南茂科技股份有限公司 模组化高频探测卡
US7733106B2 (en) * 2005-09-19 2010-06-08 Formfactor, Inc. Apparatus and method of testing singulated dies
US20070089540A1 (en) * 2005-10-26 2007-04-26 Motorola, Inc. Method and apparatus to facilitate testing of printed semiconductor devices
WO2007086064A2 (en) * 2006-01-27 2007-08-02 Camtek Ltd Diced wafer adaptor and a method for transferring a diced wafer
US7562617B2 (en) * 2006-05-15 2009-07-21 Centipede Systems, Inc. Mounting apparatus
WO2007146285A2 (en) 2006-06-09 2007-12-21 Cascade Microtech, Inc. Differential signal probe with integral balun
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US8034526B2 (en) * 2006-09-07 2011-10-11 Ricoh Company Limited Method for manufacturing toner and toner
US7764076B2 (en) * 2007-02-20 2010-07-27 Centipede Systems, Inc. Method and apparatus for aligning and/or leveling a test head
US7728609B2 (en) 2007-05-25 2010-06-01 Celadon Systems, Inc. Replaceable probe apparatus for probing semiconductor wafer
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7888955B2 (en) * 2007-09-25 2011-02-15 Formfactor, Inc. Method and apparatus for testing devices using serially controlled resources
US7977959B2 (en) 2007-09-27 2011-07-12 Formfactor, Inc. Method and apparatus for testing devices using serially controlled intelligent switches
US20090164931A1 (en) * 2007-12-19 2009-06-25 Formfactor, Inc. Method and Apparatus for Managing Test Result Data Generated by a Semiconductor Test System
US20090224793A1 (en) * 2008-03-07 2009-09-10 Formfactor, Inc. Method And Apparatus For Designing A Custom Test System
US8122309B2 (en) * 2008-03-11 2012-02-21 Formfactor, Inc. Method and apparatus for processing failures during semiconductor device testing
US8095841B2 (en) * 2008-08-19 2012-01-10 Formfactor, Inc. Method and apparatus for testing semiconductor devices with autonomous expected value generation
US7944225B2 (en) 2008-09-26 2011-05-17 Formfactor, Inc. Method and apparatus for providing a tester integrated circuit for testing a semiconductor device under test
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8674715B2 (en) 2010-01-20 2014-03-18 Celadon Systems, Inc. Test apparatus having a probe core with a twist lock mechanism
TWI613453B (zh) 2011-07-06 2018-02-01 Celadon Systems, Inc. 具有一探針裝置之測試系統及轉位機構
TWI570413B (zh) * 2011-07-06 2017-02-11 色拉頓系統公司 具有一探針卡之測試設備及連接器機構
US20140312475A1 (en) * 2013-04-19 2014-10-23 Lsi Corporation Die reuse in electrical circuits
TWI481876B (zh) * 2013-12-13 2015-04-21 Mpi Corp Probe module (3)
JP6757748B2 (ja) 2015-02-26 2020-09-23 クサレント リミテッド ライアビリティー カンパニー ナノ電気機械システム探針を製造するシステム及び方法
EP3722816B1 (en) 2015-02-26 2023-02-01 Xallent Inc. Methods of aligning at least two probe tips in a scanning adapter
US9656420B2 (en) * 2015-04-30 2017-05-23 International Business Machines Corporation Bondline control fixture and method of affixing first and second components
JP6770798B2 (ja) * 2015-11-20 2020-10-21 日本電子材料株式会社 コンタクトプローブ
US10254312B2 (en) * 2016-01-13 2019-04-09 Avago Technologies International Sales Pte. Limited Transmission line coupler for testing of integrated circuits
WO2017156245A1 (en) 2016-03-09 2017-09-14 Xallent, LLC Functional prober chip
US9934415B1 (en) 2017-04-20 2018-04-03 Xerox Corporation Handheld reader having transparent circuit board for alignment of multiple electrical contacts
US11914287B2 (en) * 2017-07-21 2024-02-27 Entegris, Inc. Container for holding and transporting reticles having a transparent window assembly
US10663484B2 (en) * 2018-02-14 2020-05-26 Xallent, LLC Multiple integrated tips scanning probe microscope with pre-alignment components
TWI681495B (zh) * 2018-08-15 2020-01-01 致茂電子股份有限公司 晶片旋轉暫置台
TWI831844B (zh) * 2018-10-05 2024-02-11 美商色拉頓系統公司 高電壓探針卡系統
CN112002652B (zh) * 2020-07-21 2023-10-20 中电科工程建设有限公司 一种芯片制造过程中电镀工艺成品率的控制方法
US11792933B2 (en) * 2021-07-29 2023-10-17 Fermi Research Alliance, Llc Connector interface assembly for enclosed vessels and associated systems and methods
CN115479685B (zh) * 2022-08-09 2026-02-10 深圳市智微智能科技股份有限公司 一种带吸盘式探针的检测装置
US12248003B2 (en) * 2022-12-06 2025-03-11 International Business Machines Corporation Clustered rigid wafer test probe

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS499976A (he) * 1972-05-15 1974-01-29
JPS5339843Y2 (he) * 1974-07-29 1978-09-27
JPS5333504U (he) * 1976-08-26 1978-03-24
US4161692A (en) * 1977-07-18 1979-07-17 Cerprobe Corporation Probe device for integrated circuit wafers
JPS5440082A (en) * 1977-09-05 1979-03-28 Toshiba Corp Semiconductor test device
JPS5599734A (en) * 1979-01-26 1980-07-30 Hitachi Ltd Pattern-sheet for characteristic test of semiconductor element
JPS5929151B2 (ja) * 1981-08-03 1984-07-18 日本電子材料株式会社 半導体ウエハ−試験装置
JPS5932740A (ja) * 1981-10-30 1984-02-22 Matsushita Electric Works Ltd 掘こたつの袋枠構造
JPS593581U (ja) * 1982-06-30 1984-01-11 宇呂電子工業株式会社 有線テレビジヨン用高周波遮蔽金属ケ−ス
EP0107323A1 (en) * 1982-09-14 1984-05-02 Accutest Corporation Connector apparatus
US4649339A (en) * 1984-04-25 1987-03-10 Honeywell Inc. Integrated circuit interface
US4697143A (en) * 1984-04-30 1987-09-29 Cascade Microtech, Inc. Wafer probe
JPH0666030B2 (ja) * 1984-07-04 1994-08-24 工業技術院長 スクリ−ン製版用感光性樹脂組成物
US4721198A (en) * 1985-11-13 1988-01-26 Ando Electric Co., Ltd. Probe card clamping and changing mechanism
EP0230348A2 (en) * 1986-01-07 1987-07-29 Hewlett-Packard Company Test probe
JPS62169341A (ja) * 1986-01-21 1987-07-25 Tokyo Electron Ltd プロ−ブカ−ド自動交換プロ−バ
US4733172A (en) * 1986-03-08 1988-03-22 Trw Inc. Apparatus for testing I.C. chip
JPS62263647A (ja) * 1986-05-12 1987-11-16 Tokyo Electron Ltd ウエハプロ−バ
US4943767A (en) * 1986-08-21 1990-07-24 Tokyo Electron Limited Automatic wafer position aligning method for wafer prober
US4783625A (en) * 1986-08-21 1988-11-08 Tektronix, Inc. Wideband high impedance card mountable probe
JPS6362245A (ja) * 1986-09-02 1988-03-18 Canon Inc ウエハプロ−バ
US4891585A (en) * 1986-09-05 1990-01-02 Tektronix, Inc. Multiple lead probe for integrated circuits in wafer form
EP0259163A3 (en) * 1986-09-05 1989-07-12 Tektronix, Inc. Semiconductor wafer probe
JPH0740578B2 (ja) * 1987-05-30 1995-05-01 東京エレクトロン株式会社 ウエハプロ−バ
US4912399A (en) * 1987-06-09 1990-03-27 Tektronix, Inc. Multiple lead probe for integrated circuits in wafer form
JP2703904B2 (ja) * 1987-08-26 1998-01-26 日本電気株式会社 半導体集積回路測定用探針基板
EP0304868A3 (en) * 1987-08-28 1990-10-10 Tektronix Inc. Multiple lead probe for integrated circuits in wafer form
US4791363A (en) * 1987-09-28 1988-12-13 Logan John K Ceramic microstrip probe blade
US4820976A (en) * 1987-11-24 1989-04-11 Advanced Micro Devices, Inc. Test fixture capable of electrically testing an integrated circuit die having a planar array of contacts
JPH0833433B2 (ja) * 1987-11-30 1996-03-29 東京エレクトロン株式会社 プローブ装置
US5034685A (en) * 1988-05-16 1991-07-23 Leedy Glenn J Test device for testing integrated circuits
US4924589A (en) * 1988-05-16 1990-05-15 Leedy Glenn J Method of making and testing an integrated circuit
US4922192A (en) * 1988-09-06 1990-05-01 Unisys Corporation Elastic membrane probe
US4849689A (en) * 1988-11-04 1989-07-18 Cascade Microtech, Inc. Microwave wafer probe having replaceable probe tip
US4972143A (en) * 1988-11-30 1990-11-20 Hughes Aircraft Company Diaphragm test probe
US4928061A (en) * 1989-03-29 1990-05-22 International Business Machines Corporation Multi-layer printed circuit board
US5012187A (en) * 1989-11-03 1991-04-30 Motorola, Inc. Method for parallel testing of semiconductor devices
US5027063A (en) * 1990-04-24 1991-06-25 John Fluke Mfg. Co., Inc. Vacuum-actuated test fixture for testing electronic components
US5090118A (en) * 1990-07-31 1992-02-25 Texas Instruments Incorporated High performance test head and method of making

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US5313157A (en) 1994-05-17
EP0484141A3 (en) 1992-12-16
US5148103A (en) 1992-09-15
EP0484141A2 (en) 1992-05-06
US5872459A (en) 1999-02-16
JPH04266043A (ja) 1992-09-22
IL99591A0 (en) 1992-08-18

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