IL84255A - Process for removal of post- baked photoresist layer - Google Patents

Process for removal of post- baked photoresist layer

Info

Publication number
IL84255A
IL84255A IL84255A IL8425587A IL84255A IL 84255 A IL84255 A IL 84255A IL 84255 A IL84255 A IL 84255A IL 8425587 A IL8425587 A IL 8425587A IL 84255 A IL84255 A IL 84255A
Authority
IL
Israel
Prior art keywords
post
removal
photoresist layer
baked photoresist
baked
Prior art date
Application number
IL84255A
Other languages
English (en)
Other versions
IL84255A0 (en
Original Assignee
Galram Technology Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Galram Technology Ind Ltd filed Critical Galram Technology Ind Ltd
Priority to IL84255A priority Critical patent/IL84255A/xx
Publication of IL84255A0 publication Critical patent/IL84255A0/xx
Priority to DE3835636A priority patent/DE3835636A1/de
Priority to NL8802587A priority patent/NL194997C/nl
Priority to GB8824547A priority patent/GB2211629B/en
Priority to FR888813794A priority patent/FR2622352B3/fr
Priority to FR8813936A priority patent/FR2622134B1/fr
Priority to US07/407,141 priority patent/US5114834A/en
Publication of IL84255A publication Critical patent/IL84255A/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
    • B23Q7/003—Cyclically moving conveyors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
    • B23Q7/04—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers
    • B23Q7/041—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers step by step
    • B23Q7/042—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers step by step for the axial transport of long workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • H01L21/31138—Etching organic layers by chemical means by dry-etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/146—Laser beam

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Drying Of Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
IL84255A 1987-10-23 1987-10-23 Process for removal of post- baked photoresist layer IL84255A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
IL84255A IL84255A (en) 1987-10-23 1987-10-23 Process for removal of post- baked photoresist layer
DE3835636A DE3835636A1 (de) 1987-10-23 1988-10-19 Verfahren und system zum vollstaendigen entfernen von fotoresist
NL8802587A NL194997C (nl) 1987-10-23 1988-10-20 Werkwijze voor het verwijderen van fotolak, die is aangebracht op een oppervlak van een dragerlichaam voor elektronische elementen en inrichting voor het verwijderen van fotolak volgens de werkwijze.
GB8824547A GB2211629B (en) 1987-10-23 1988-10-20 Process for the stripping of post baked photoresist from substrates.
FR888813794A FR2622352B3 (fr) 1987-10-23 1988-10-21 Procede et dispositif pour l'enlevement d'un revetement photosensible
FR8813936A FR2622134B1 (fr) 1987-10-23 1988-10-25 Ensemble de machine d'usinage et de transporteur de pieces a usiner
US07/407,141 US5114834A (en) 1987-10-23 1989-09-14 Photoresist removal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL84255A IL84255A (en) 1987-10-23 1987-10-23 Process for removal of post- baked photoresist layer

Publications (2)

Publication Number Publication Date
IL84255A0 IL84255A0 (en) 1988-03-31
IL84255A true IL84255A (en) 1993-02-21

Family

ID=11058263

Family Applications (1)

Application Number Title Priority Date Filing Date
IL84255A IL84255A (en) 1987-10-23 1987-10-23 Process for removal of post- baked photoresist layer

Country Status (6)

Country Link
US (1) US5114834A (fr)
DE (1) DE3835636A1 (fr)
FR (2) FR2622352B3 (fr)
GB (1) GB2211629B (fr)
IL (1) IL84255A (fr)
NL (1) NL194997C (fr)

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US4786358A (en) * 1986-08-08 1988-11-22 Semiconductor Energy Laboratory Co., Ltd. Method for forming a pattern of a film on a substrate with a laser beam
US4731158A (en) * 1986-09-12 1988-03-15 International Business Machines Corporation High rate laser etching technique
US4718974A (en) * 1987-01-09 1988-01-12 Ultraphase Equipment, Inc. Photoresist stripping apparatus using microwave pumped ultraviolet lamp
NL8701176A (nl) * 1987-05-15 1988-12-01 Stork Screens Bv Dessineerdeklaag voor een metalen zeefdruksjabloon; zeefdruksjabloon voorzien van een dessineerdeklaag en werkwijze voor het aanbrengen van een dessineerpatroon in een deklaag welke aanwezig is op een metalen zeefdruksjabloon.
US5007983A (en) * 1988-01-29 1991-04-16 The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration Etching method for photoresists or polymers
US4877644A (en) * 1988-04-12 1989-10-31 Amp Incorporated Selective plating by laser ablation

Also Published As

Publication number Publication date
FR2622134B1 (fr) 1994-04-08
IL84255A0 (en) 1988-03-31
GB8824547D0 (en) 1988-11-23
NL8802587A (nl) 1989-05-16
GB2211629B (en) 1992-02-19
NL194997C (nl) 2003-04-24
US5114834A (en) 1992-05-19
FR2622352A1 (fr) 1989-04-28
GB2211629A (en) 1989-07-05
FR2622134A1 (fr) 1989-04-28
DE3835636A1 (de) 1989-05-03
FR2622352B3 (fr) 1990-02-02

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