IL217708A - Removal after ion transplantation preparation for advanced semiconductor application - Google Patents
Removal after ion transplantation preparation for advanced semiconductor applicationInfo
- Publication number
- IL217708A IL217708A IL217708A IL21770812A IL217708A IL 217708 A IL217708 A IL 217708A IL 217708 A IL217708 A IL 217708A IL 21770812 A IL21770812 A IL 21770812A IL 217708 A IL217708 A IL 217708A
- Authority
- IL
- Israel
- Prior art keywords
- stripper
- ion implant
- advanced semiconductor
- semiconductor application
- post ion
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3757—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions
- C11D3/3765—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions in liquid compositions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US22976009P | 2009-07-30 | 2009-07-30 | |
| PCT/EP2010/060762 WO2011012559A2 (en) | 2009-07-30 | 2010-07-26 | Post ion implant stripper for advanced semiconductor application |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL217708A0 IL217708A0 (en) | 2012-03-29 |
| IL217708A true IL217708A (en) | 2017-07-31 |
Family
ID=43137613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL217708A IL217708A (en) | 2009-07-30 | 2012-01-24 | Removal after ion transplantation preparation for advanced semiconductor application |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US9484218B2 (enExample) |
| EP (1) | EP2460177B1 (enExample) |
| JP (1) | JP6165442B2 (enExample) |
| KR (1) | KR101746879B1 (enExample) |
| CN (1) | CN102473638B (enExample) |
| IL (1) | IL217708A (enExample) |
| MY (1) | MY185453A (enExample) |
| SG (2) | SG10201404328QA (enExample) |
| TW (1) | TWI594088B (enExample) |
| WO (1) | WO2011012559A2 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9329486B2 (en) | 2005-10-28 | 2016-05-03 | Dynaloy, Llc | Dynamic multi-purpose composition for the removal of photoresists and method for its use |
| US7632796B2 (en) | 2005-10-28 | 2009-12-15 | Dynaloy, Llc | Dynamic multi-purpose composition for the removal of photoresists and method for its use |
| KR101934687B1 (ko) | 2011-03-18 | 2019-03-18 | 바스프 에스이 | 50 ㎚ 이하의 라인 스페이스 치수들을 갖는 패터닝된 재료 층들을 가진 집적 회로 디바이스들, 광학 디바이스들, 마이크로머신들 및 기계 정밀 디바이스들의 제조 방법 |
| CN104093790B (zh) * | 2011-11-29 | 2016-10-12 | 涂料外国Ip有限公司 | 非水溶剂组合物及其作为隔离液体的用途 |
| TWI588253B (zh) | 2012-03-16 | 2017-06-21 | 巴地斯顏料化工廠 | 光阻剝除與清潔組合物及其製備方法與用途 |
| US9158202B2 (en) | 2012-11-21 | 2015-10-13 | Dynaloy, Llc | Process and composition for removing substances from substrates |
| JP6233779B2 (ja) * | 2013-11-18 | 2017-11-22 | 富士フイルム株式会社 | 変性レジストの剥離方法、これに用いる変性レジストの剥離液および半導体基板製品の製造方法 |
| JP2015118125A (ja) | 2013-11-18 | 2015-06-25 | 富士フイルム株式会社 | 変性レジストの剥離液、これを用いた変性レジストの剥離方法および半導体基板製品の製造方法 |
| WO2015096068A1 (zh) | 2013-12-25 | 2015-07-02 | 华为海洋网络有限公司 | 一种光分插复用光分支器 |
| US20150219996A1 (en) * | 2014-02-06 | 2015-08-06 | Dynaloy, Llc | Composition for removing substances from substrates |
| KR101958691B1 (ko) | 2014-11-27 | 2019-03-15 | 후지필름 가부시키가이샤 | 제거액, 이를 이용한 제거 방법 및 반도체 기판 제품의 제조 방법 |
| KR101850192B1 (ko) * | 2015-12-02 | 2018-04-19 | 연세대학교 산학협력단 | 유기용매를 이용한 포토레지스트 제거방법 |
| JP6536464B2 (ja) | 2016-04-26 | 2019-07-03 | 信越化学工業株式会社 | 洗浄剤組成物及び薄型基板の製造方法 |
| SI3374443T1 (sl) | 2016-05-10 | 2020-06-30 | Atotech Deutschland Gmbh | Nevodni odstranjevalni sestavek in postopek za odstravnjevanje organskega premaza s substrata |
| TWI768144B (zh) * | 2018-02-14 | 2022-06-21 | 德商馬克專利公司 | 化學剝離劑組合物及移除光阻之方法 |
| CN116285995A (zh) * | 2021-12-20 | 2023-06-23 | 李长荣化学工业股份有限公司 | 用于移除硅的蚀刻组成物及使用其移除硅的方法 |
| JP7752541B2 (ja) | 2022-01-21 | 2025-10-10 | 関東化学株式会社 | フォトレジスト剥離組成物 |
| JP7290195B1 (ja) * | 2022-10-19 | 2023-06-13 | Jsr株式会社 | 半導体処理用組成物及び処理方法 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5091103A (en) * | 1990-05-01 | 1992-02-25 | Alicia Dean | Photoresist stripper |
| US6825156B2 (en) * | 2002-06-06 | 2004-11-30 | Ekc Technology, Inc. | Semiconductor process residue removal composition and process |
| US5612304A (en) * | 1995-07-07 | 1997-03-18 | Olin Microelectronic Chemicals, Inc. | Redox reagent-containing post-etch residue cleaning composition |
| US5811358A (en) | 1997-01-03 | 1998-09-22 | Mosel Vitelic Inc. | Low temperature dry process for stripping photoresist after high dose ion implantation |
| JPH1184686A (ja) | 1997-09-01 | 1999-03-26 | Mitsubishi Gas Chem Co Inc | レジスト剥離剤組成物 |
| US6417112B1 (en) * | 1998-07-06 | 2002-07-09 | Ekc Technology, Inc. | Post etch cleaning composition and process for dual damascene system |
| US7135445B2 (en) * | 2001-12-04 | 2006-11-14 | Ekc Technology, Inc. | Process for the use of bis-choline and tris-choline in the cleaning of quartz-coated polysilicon and other materials |
| KR100288769B1 (ko) | 1998-07-10 | 2001-09-17 | 윤종용 | 포토레지스트용스트리퍼조성물 |
| US6368421B1 (en) * | 1998-07-10 | 2002-04-09 | Clariant Finance (Bvi) Limited | Composition for stripping photoresist and organic materials from substrate surfaces |
| JP2001215736A (ja) | 2000-02-04 | 2001-08-10 | Jsr Corp | フォトレジスト用剥離液組成物、剥離方法及び回路基板 |
| JP3738996B2 (ja) * | 2002-10-10 | 2006-01-25 | 東京応化工業株式会社 | ホトリソグラフィー用洗浄液および基板の処理方法 |
| US6524936B2 (en) | 2000-12-22 | 2003-02-25 | Axcelis Technologies, Inc. | Process for removal of photoresist after post ion implantation |
| WO2002095500A1 (en) * | 2001-05-21 | 2002-11-28 | Dongjin Semichem Co., Ltd. | Resist remover composition |
| JP2002357908A (ja) * | 2001-05-31 | 2002-12-13 | Tokyo Ohka Kogyo Co Ltd | ホトレジスト用剥離液 |
| WO2003007085A1 (en) * | 2001-07-13 | 2003-01-23 | Ekc Technology, Inc. | Sulfoxide pyrolid(in)one alkanolamine stripping and cleaning composition |
| US6551973B1 (en) * | 2001-10-09 | 2003-04-22 | General Chemical Corporation | Stable metal-safe stripper for removing cured negative-tone novolak and acrylic photoresists and post-etch residue |
| JP2003228179A (ja) | 2002-01-31 | 2003-08-15 | Mitsubishi Gas Chem Co Inc | 銅配線基板向けアミン含有レジスト剥離液および剥離方法 |
| US20030148624A1 (en) | 2002-01-31 | 2003-08-07 | Kazuto Ikemoto | Method for removing resists |
| JP4045408B2 (ja) * | 2002-01-31 | 2008-02-13 | 三菱瓦斯化学株式会社 | 銅配線基板向け洗浄液およびこれを使用したレジスト剥離方法 |
| US8003587B2 (en) * | 2002-06-06 | 2011-08-23 | Ekc Technology, Inc. | Semiconductor process residue removal composition and process |
| JP2004117889A (ja) | 2002-09-26 | 2004-04-15 | Jsr Corp | フォトレジスト用剥離液組成物 |
| US20050089489A1 (en) * | 2003-10-22 | 2005-04-28 | Carter Melvin K. | Composition for exfoliation agent effective in removing resist residues |
| KR20070120609A (ko) * | 2005-04-15 | 2007-12-24 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | 마이크로전자 소자로부터 이온 주입 포토레지스트층을세정하기 위한 배합물 |
| KR20070121845A (ko) * | 2005-04-15 | 2007-12-27 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | 용매계 내 자기 조립 단층을 이용한 고용량 이온 주입포토레지스트의 제거 |
| JP4678673B2 (ja) * | 2005-05-12 | 2011-04-27 | 東京応化工業株式会社 | ホトレジスト用剥離液 |
| CN101421386B (zh) * | 2005-10-13 | 2011-08-10 | 高级技术材料公司 | 金属相容的光致抗蚀剂和/或牺牲性抗反射涂层去除组合物 |
| US7632796B2 (en) | 2005-10-28 | 2009-12-15 | Dynaloy, Llc | Dynamic multi-purpose composition for the removal of photoresists and method for its use |
| US8263539B2 (en) * | 2005-10-28 | 2012-09-11 | Dynaloy, Llc | Dynamic multi-purpose composition for the removal of photoresists and methods for its use |
| EP2206140A2 (en) * | 2007-10-31 | 2010-07-14 | EKC Technology, INC. | Compounds for photoresist stripping |
| WO2010127941A1 (en) * | 2009-05-07 | 2010-11-11 | Basf Se | Resist stripping compositions and methods for manufacturing electrical devices |
-
2010
- 2010-07-26 JP JP2012522125A patent/JP6165442B2/ja not_active Expired - Fee Related
- 2010-07-26 CN CN201080033645.5A patent/CN102473638B/zh active Active
- 2010-07-26 EP EP10736715.3A patent/EP2460177B1/en active Active
- 2010-07-26 US US13/387,787 patent/US9484218B2/en active Active
- 2010-07-26 SG SG10201404328QA patent/SG10201404328QA/en unknown
- 2010-07-26 SG SG2012005443A patent/SG177755A1/en unknown
- 2010-07-26 WO PCT/EP2010/060762 patent/WO2011012559A2/en not_active Ceased
- 2010-07-26 MY MYPI2012000352A patent/MY185453A/en unknown
- 2010-07-26 KR KR1020127005545A patent/KR101746879B1/ko active Active
- 2010-07-29 TW TW099125180A patent/TWI594088B/zh active
-
2012
- 2012-01-24 IL IL217708A patent/IL217708A/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| IL217708A0 (en) | 2012-03-29 |
| US20120129747A1 (en) | 2012-05-24 |
| CN102473638B (zh) | 2015-02-18 |
| EP2460177A2 (en) | 2012-06-06 |
| TWI594088B (zh) | 2017-08-01 |
| SG177755A1 (en) | 2012-03-29 |
| EP2460177B1 (en) | 2016-03-23 |
| WO2011012559A2 (en) | 2011-02-03 |
| WO2011012559A3 (en) | 2011-03-24 |
| KR101746879B1 (ko) | 2017-06-14 |
| JP2013500503A (ja) | 2013-01-07 |
| KR20120041777A (ko) | 2012-05-02 |
| US9484218B2 (en) | 2016-11-01 |
| CN102473638A (zh) | 2012-05-23 |
| TW201128327A (en) | 2011-08-16 |
| SG10201404328QA (en) | 2014-10-30 |
| MY185453A (en) | 2021-05-19 |
| JP6165442B2 (ja) | 2017-07-19 |
| RU2012107135A (ru) | 2013-09-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FF | Patent granted | ||
| KB | Patent renewed | ||
| KB | Patent renewed |