IL161707A0 - Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness - Google Patents

Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness

Info

Publication number
IL161707A0
IL161707A0 IL16170703A IL16170703A IL161707A0 IL 161707 A0 IL161707 A0 IL 161707A0 IL 16170703 A IL16170703 A IL 16170703A IL 16170703 A IL16170703 A IL 16170703A IL 161707 A0 IL161707 A0 IL 161707A0
Authority
IL
Israel
Prior art keywords
chip card
contactless
producing
contact
improved flatness
Prior art date
Application number
IL16170703A
Other languages
English (en)
Original Assignee
Ask Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ask Sa filed Critical Ask Sa
Publication of IL161707A0 publication Critical patent/IL161707A0/xx

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/04Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/20Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
    • B32B37/203One or more of the layers being plastic
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00Condition, form or state of the layers or laminate
    • B32B2305/34Inserts
    • B32B2305/342Chips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02Temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12Pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00Cards, e.g. identity cards, credit cards
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2519/00Labels, badges
    • B32B2519/02RFID tags
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
IL16170703A 2002-09-13 2003-09-12 Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness IL161707A0 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0211387A FR2844621A1 (fr) 2002-09-13 2002-09-13 Procede de fabrication d'une carte a puce sans contact ou hybride contact-sans contact a planeite renforcee
FR0302258A FR2844620B1 (fr) 2002-09-13 2003-02-25 Procede de fabrication d'une carte a puce sans contact ou hybride contact - sans contact a planeite renforcee
PCT/FR2003/002701 WO2004025553A1 (fr) 2002-09-13 2003-09-12 Procede de fabrication d'une carte a puce sans contact ou hybride contact-sans contact a planete renforcee

Publications (1)

Publication Number Publication Date
IL161707A0 true IL161707A0 (en) 2004-09-27

Family

ID=31947975

Family Applications (2)

Application Number Title Priority Date Filing Date
IL16170703A IL161707A0 (en) 2002-09-13 2003-09-12 Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness
IL161707A IL161707A (en) 2002-09-13 2004-04-29 Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness

Family Applications After (1)

Application Number Title Priority Date Filing Date
IL161707A IL161707A (en) 2002-09-13 2004-04-29 Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness

Country Status (18)

Country Link
US (2) US7116231B2 (xx)
EP (1) EP1442424B1 (xx)
JP (1) JP2005538463A (xx)
KR (1) KR100998605B1 (xx)
CN (1) CN1596419A (xx)
AT (1) ATE424008T1 (xx)
AU (1) AU2003276333B2 (xx)
BR (1) BRPI0306304B1 (xx)
CA (1) CA2466898A1 (xx)
DE (1) DE60326317D1 (xx)
ES (1) ES2323695T3 (xx)
FR (2) FR2844621A1 (xx)
IL (2) IL161707A0 (xx)
MX (1) MXPA04006195A (xx)
RU (2) RU2415027C2 (xx)
TW (2) TWI351645B (xx)
WO (1) WO2004025553A1 (xx)
ZA (1) ZA200403503B (xx)

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FR2844621A1 (fr) * 2002-09-13 2004-03-19 A S K Procede de fabrication d'une carte a puce sans contact ou hybride contact-sans contact a planeite renforcee
JP4471971B2 (ja) * 2003-03-12 2010-06-02 ブンデスドゥルッケレイ・ゲーエムベーハー ブックカバーインサートとブック型セキュリティ文書、及びブックカバーインサートとブック型セキュリティ文書の製造方法
US7209039B2 (en) * 2003-05-08 2007-04-24 Illinois Tool Works Inc. Decorative surface covering with embedded RF antenna and RF shield and method for making the same
EP1706857A4 (en) * 2004-01-22 2011-03-09 Mikoh Corp Modular High Frequency Identification Labeling Method
FR2877462B1 (fr) * 2004-10-29 2007-01-26 Arjowiggins Security Soc Par A Structure comportant un dispositif electronique pour la fabrication d'un document de securite.
JP2006244317A (ja) * 2005-03-04 2006-09-14 Nippon Sheet Glass Co Ltd パネル用中間膜体、パネル、および、電子タグ
JP2006277178A (ja) * 2005-03-29 2006-10-12 Aruze Corp ゲーム用カード
JP2006271596A (ja) * 2005-03-29 2006-10-12 Aruze Corp ゲーム用カード
US7571862B2 (en) * 2005-06-02 2009-08-11 Avery Dennison Corporation RFID tag that provides a flat print area and a pinch roller that enables the same
US20060276157A1 (en) * 2005-06-03 2006-12-07 Chen Zhi N Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
FR2890212B1 (fr) * 2005-08-30 2009-08-21 Smart Packaging Solutions Sps Module electronique a double interface de communication, notamment pour carte a puce
US7224278B2 (en) * 2005-10-18 2007-05-29 Avery Dennison Corporation Label with electronic components and method of making same
US7535356B2 (en) * 2005-11-29 2009-05-19 Bartronics America, Inc. Identification band using a conductive fastening for enhanced security and functionality
JP4825522B2 (ja) * 2005-12-26 2011-11-30 共同印刷株式会社 Icカード、インレットシート及びicカードの製造方法
US7646304B2 (en) * 2006-04-10 2010-01-12 Checkpoint Systems, Inc. Transfer tape strap process
US7701352B2 (en) * 2006-11-22 2010-04-20 Avery Dennison Corporation RFID label with release liner window, and method of making
US20080180255A1 (en) * 2007-01-25 2008-07-31 Michael James Isabell RFID tag
WO2008103870A1 (en) 2007-02-23 2008-08-28 Newpage Wisconsin System Inc. Multifunctional paper identification label
JP2008246104A (ja) * 2007-03-30 2008-10-16 Angel Shoji Kk Rfidを内蔵したゲームカードおよびその製造方法
DE102007038318A1 (de) * 2007-08-14 2009-02-19 Giesecke & Devrient Gmbh Hochgeprägter kartenförmiger Datenträger
JP5040551B2 (ja) * 2007-09-20 2012-10-03 大日本印刷株式会社 非接触型データキャリア用導電部材とその製造方法及び装置
FR2922342B1 (fr) * 2007-10-11 2010-07-30 Ask Sa Support de dispositif d'identification radiofrequence renforce et son procede de fabrication
JP5476663B2 (ja) * 2007-12-17 2014-04-23 トヨタ自動車株式会社 コード凹凸照合式キーシステム
US20100288436A1 (en) * 2008-02-04 2010-11-18 Solido 3D, Ltd. Depicting interior details in a three-dimensional object
WO2009104303A1 (ja) * 2008-02-22 2009-08-27 凸版印刷株式会社 トランスポンダ及び冊子体
KR101006870B1 (ko) * 2008-05-02 2011-01-12 유인종 안테나 코일과 집적회로 칩을 구비한 카드에 칩을인레이하는 방법
EP2218579A1 (de) * 2009-02-13 2010-08-18 Bayer MaterialScience AG Verbessertes Verfahren zur Herstellung eines laminierten Schichtverbundes
FR2944122B1 (fr) * 2009-04-01 2011-05-06 Imprimerie Nationale Insert formant antenne et carte a puce le comportant.
FR2948796A1 (fr) * 2009-07-28 2011-02-04 Ask Sa Support de dispositif d'identification radiofrequence pour carte hybride et son procede de fabrication
US8789762B2 (en) 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
EP2461275A1 (en) * 2010-12-02 2012-06-06 Gemalto SA Security Document and method of manufacturing security document
FR2973915B1 (fr) * 2011-04-05 2013-11-22 Smart Packaging Solutions Sps Procede de fabrication d'inserts pour passeport electronique
FR3020548B1 (fr) * 2014-04-24 2020-02-14 Linxens Holding Procede de fabrication d'une structure pour carte a puce et structure de carte a puce obtenue par ce procede
EP3719707B1 (en) * 2014-11-07 2021-11-10 Murata Manufacturing Co., Ltd. Wireless communication device and method for manufacturing same
RU2685973C2 (ru) * 2015-02-20 2019-04-23 Нид Са Способ изготовления устройства, содержащего по меньшей мере один электронный элемент, связанный с подложкой и антенной
DE102016106698A1 (de) * 2016-04-12 2017-10-12 Infineon Technologies Ag Chipkarte und Verfahren zum Herstellen einer Chipkarte
FR3058545B1 (fr) * 2016-11-04 2018-10-26 Smart Packaging Solutions Procede de fabrication d'un module electronique pour carte a puce
CN111126541A (zh) * 2018-11-01 2020-05-08 葛兰菲安全有限公司 Rfid智能卡的构造及其制造方法
EP3825126B1 (en) * 2019-11-25 2023-03-15 Linxens Holding Laminated foil structure and method of forming the same
CN112446455B (zh) * 2020-11-18 2021-09-07 广州展丰智能科技有限公司 一种非接触式智能卡生产工艺及系统
WO2022147502A1 (en) * 2020-12-31 2022-07-07 Credit Card Supplies Corporation Method for manufacturing electronic transaction cards
TWI804158B (zh) * 2022-01-17 2023-06-01 宏通數碼科技股份有限公司 卡片結構

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Also Published As

Publication number Publication date
RU2324976C2 (ru) 2008-05-20
KR20050039713A (ko) 2005-04-29
EP1442424B1 (fr) 2009-02-25
FR2844620B1 (fr) 2005-01-07
TW200404261A (en) 2004-03-16
ZA200403503B (en) 2005-06-29
RU2415027C2 (ru) 2011-03-27
CN1596419A (zh) 2005-03-16
AU2003276333B2 (en) 2010-01-21
ES2323695T3 (es) 2009-07-23
IL161707A (en) 2008-12-29
EP1442424A1 (fr) 2004-08-04
FR2844620A1 (fr) 2004-03-19
JP2005538463A (ja) 2005-12-15
DE60326317D1 (de) 2009-04-09
RU2004123973A (ru) 2006-01-20
CA2466898A1 (fr) 2004-03-25
MXPA04006195A (es) 2004-12-06
KR100998605B1 (ko) 2010-12-07
WO2004025553A1 (fr) 2004-03-25
US7116231B2 (en) 2006-10-03
AU2003276333A1 (en) 2004-04-30
TW200705282A (en) 2007-02-01
FR2844621A1 (fr) 2004-03-19
BRPI0306304B1 (pt) 2015-10-27
TWI340919B (en) 2011-04-21
US20050066513A1 (en) 2005-03-31
ATE424008T1 (de) 2009-03-15
BR0306304A (pt) 2004-09-28
TWI351645B (en) 2011-11-01
RU2006132772A (ru) 2008-03-20
US20070001859A1 (en) 2007-01-04

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