ATE251325T1 - Herstellungsverfahren einer laminierten karte mit einer zwischenschicht aus petg - Google Patents

Herstellungsverfahren einer laminierten karte mit einer zwischenschicht aus petg

Info

Publication number
ATE251325T1
ATE251325T1 AT00949618T AT00949618T ATE251325T1 AT E251325 T1 ATE251325 T1 AT E251325T1 AT 00949618 T AT00949618 T AT 00949618T AT 00949618 T AT00949618 T AT 00949618T AT E251325 T1 ATE251325 T1 AT E251325T1
Authority
AT
Austria
Prior art keywords
layer
petg
intermediate layer
production process
laminated card
Prior art date
Application number
AT00949618T
Other languages
English (en)
Inventor
Denis Vere
Eric Daniel
Original Assignee
Schlumberger Systems & Service
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlumberger Systems & Service filed Critical Schlumberger Systems & Service
Application granted granted Critical
Publication of ATE251325T1 publication Critical patent/ATE251325T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Laminated Bodies (AREA)
AT00949618T 1999-07-01 2000-07-03 Herstellungsverfahren einer laminierten karte mit einer zwischenschicht aus petg ATE251325T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9908506A FR2795846B1 (fr) 1999-07-01 1999-07-01 PROCEDE DE FABRICATION DE CARTES LAMINEES MUNIES D'UNE COUCHE INTERMEDIAIRES DE petg
PCT/FR2000/001896 WO2001003061A1 (fr) 1999-07-01 2000-07-03 Procede de fabrication de cartes laminees munies d'une couche intermediaire de petg

Publications (1)

Publication Number Publication Date
ATE251325T1 true ATE251325T1 (de) 2003-10-15

Family

ID=9547611

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00949618T ATE251325T1 (de) 1999-07-01 2000-07-03 Herstellungsverfahren einer laminierten karte mit einer zwischenschicht aus petg

Country Status (6)

Country Link
US (1) US6803114B1 (de)
EP (1) EP1192594B1 (de)
AT (1) ATE251325T1 (de)
DE (1) DE60005671T9 (de)
FR (1) FR2795846B1 (de)
WO (1) WO2001003061A1 (de)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6923378B2 (en) * 2000-12-22 2005-08-02 Digimarc Id Systems Identification card
WO2003052680A1 (en) 2001-12-18 2003-06-26 Digimarc Id System, Llc Multiple image security features for identification documents and methods of making same
WO2003056507A1 (en) 2001-12-24 2003-07-10 Digimarc Id Systems, Llc Systems, compositions, and methods for full color laser engraving of id documents
US7815124B2 (en) 2002-04-09 2010-10-19 L-1 Secure Credentialing, Inc. Image processing techniques for printing identification cards and documents
US7728048B2 (en) 2002-12-20 2010-06-01 L-1 Secure Credentialing, Inc. Increasing thermal conductivity of host polymer used with laser engraving methods and compositions
EP1467834A4 (de) 2001-12-24 2005-04-06 Digimarc Id Systems Llc Lasergeätzte sicherheitsmerkmale zur identifikation von dokumenten und herstellungsverfahren dafür
WO2003056499A2 (en) * 2001-12-24 2003-07-10 Digimarc Id Systems Llc Pet based multi-multi-layer smart cards
US7694887B2 (en) 2001-12-24 2010-04-13 L-1 Secure Credentialing, Inc. Optically variable personalized indicia for identification documents
ATE552120T1 (de) 2001-12-24 2012-04-15 L 1 Secure Credentialing Inc Verdeckte variableninformationen auf id- dokumenten und verfahren zu ihrer herstellung
US7824029B2 (en) 2002-05-10 2010-11-02 L-1 Secure Credentialing, Inc. Identification card printer-assembler for over the counter card issuing
FR2844621A1 (fr) * 2002-09-13 2004-03-19 A S K Procede de fabrication d'une carte a puce sans contact ou hybride contact-sans contact a planeite renforcee
WO2004049242A2 (en) 2002-11-26 2004-06-10 Digimarc Id Systems Systems and methods for managing and detecting fraud in image databases used with identification documents
ATE491190T1 (de) 2003-04-16 2010-12-15 L 1 Secure Credentialing Inc Dreidimensionale datenspeicherung
US7422794B2 (en) * 2003-10-21 2008-09-09 Digimarc Corporation Document laminate formed from different polyester materials
US7744002B2 (en) 2004-03-11 2010-06-29 L-1 Secure Credentialing, Inc. Tamper evident adhesive and identification document including same
FR2867882B1 (fr) * 2004-03-19 2007-03-30 Richard Edme Henri Bado Support pour cartes a puce
US20050231922A1 (en) * 2004-04-16 2005-10-20 Jung-Chien Chang Functional printed circuit board module with an embedded chip
US7383999B2 (en) 2004-12-28 2008-06-10 Digimarc Corporation ID document structure with pattern coating providing variable security features
WO2007031609A1 (fr) * 2005-09-09 2007-03-22 Richard Bado Support pour carte d'aide a la communication
EP2042576A1 (de) * 2007-09-20 2009-04-01 Agfa-Gevaert Sicherheitslaminat mit eingeprägtem transparentem Zwischenschicht-Polymerhologramm
WO2009037332A1 (en) * 2007-09-20 2009-03-26 Agfa-Gevaert N.V. Security laminates with interlaminated transparent embossed polymer hologram
CN102123873A (zh) * 2008-04-01 2011-07-13 爱克发-格法特公司 具有安全特征的安全层压材料
WO2009121793A2 (en) * 2008-04-01 2009-10-08 Agfa Gevaert Lamination process for producung security laminates
EP2262641A1 (de) * 2008-04-01 2010-12-22 Agfa-Gevaert N.V. Sicherheitsbeschichtungen mit einer durch berührung erkennbaren sicherheitsfunktion
EP2181858A1 (de) * 2008-11-04 2010-05-05 Agfa-Gevaert N.V. Sicherheitsdokument und Herstellungsverfahren
EP2199100A1 (de) * 2008-12-22 2010-06-23 Agfa-Gevaert N.V. Sicherheitslaminate für Sicherheitsdokumente
EP2332738B1 (de) 2009-12-10 2012-07-04 Agfa-Gevaert Sicherheitsdokument mit Sicherheitsmerkmal auf Rand
EP2335938B1 (de) 2009-12-18 2013-02-20 Agfa-Gevaert Lasermarkierbarer Sicherheitsfilm
EP2335937B1 (de) 2009-12-18 2013-02-20 Agfa-Gevaert Lasermarkierbarer Sicherheitsfilm
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
US9533473B2 (en) * 2014-04-03 2017-01-03 Infineon Technologies Ag Chip card substrate and method of forming a chip card substrate
DE102016106698A1 (de) * 2016-04-12 2017-10-12 Infineon Technologies Ag Chipkarte und Verfahren zum Herstellen einer Chipkarte
DE102016109654A1 (de) 2016-05-25 2017-11-30 Ovd Kinegram Ag Bogen für ein Sicherheitsdokument, Verfahren zur Herstellung des Bogens und daraus hergestelltes Sicherheitsdokument

Family Cites Families (12)

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Publication number Priority date Publication date Assignee Title
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
US5534372A (en) * 1993-07-28 1996-07-09 Konica Corporation IC card having image information
NL9301457A (nl) * 1993-08-23 1995-03-16 Nedap Nv Contactloze identificatiekaart of smart card.
DE19507144A1 (de) * 1994-10-18 1996-04-25 Giesecke & Devrient Gmbh Mehrschichtiger Datenträger mit Deckschichten aus modifiziertem PET
EP0706152B1 (de) * 1994-11-03 1998-06-10 Fela Holding AG Basis Folie für Chip Karte
US5671525A (en) * 1995-02-13 1997-09-30 Gemplus Card International Method of manufacturing a hybrid chip card
JPH09156267A (ja) * 1995-12-06 1997-06-17 Watada Insatsu Kk プラスチックカード
US5846900A (en) * 1996-07-31 1998-12-08 Eastman Kodak Company Composite thermal dye transfer ID card stock
WO1998006063A1 (fr) * 1996-08-02 1998-02-12 Solaic Carte a circuit integre a connexion mixte
DE19710144C2 (de) * 1997-03-13 1999-10-14 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte
EP0942392A3 (de) * 1998-03-13 2000-10-18 Kabushiki Kaisha Toshiba Chipkarte
JP2000094874A (ja) * 1998-09-22 2000-04-04 Canon Inc 電子部品内蔵カードとその製造方法

Also Published As

Publication number Publication date
DE60005671D1 (de) 2003-11-06
WO2001003061A1 (fr) 2001-01-11
FR2795846B1 (fr) 2001-08-31
US6803114B1 (en) 2004-10-12
EP1192594B1 (de) 2003-10-01
DE60005671T9 (de) 2005-07-07
EP1192594A1 (de) 2002-04-03
FR2795846A1 (fr) 2001-01-05
DE60005671T2 (de) 2004-07-29

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties